Semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses semiconductor processing equipment. Comprising a bottom plate and a support, the support is fixedly connected to the upper surface of the bottom plate, a rotating shaft is rotationally connected into the bottom plate, a rotating disc is fixedly connected to the top end of the rotating shaft, an air cylinder is fixedly connected to the inner wall of the top end of the support, and a connecting plate is fixedly connected to the end of a piston rod of the air cylinder. The output shaft of the motor rotates to drive the small gear to rotate and simultaneously drive the large gear meshed with the small gear to rotate, the large gear rotates to drive the rotating shaft and the rotating disc to rotate, the small gear drives the large gear to rotate, speed reduction transmission is more labor-saving, and resistance generated when the output shaft of the motor rotates can be reduced. The semiconductor material is placed in the groove, when the rotating disc rotates, the semiconductor material can be adjusted and processed, the semiconductor material is loaded, unloaded and replaced while the semiconductor is processed, and the processing efficiency is not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing device. Background Art

[0002] A semiconductor is a material that lies between a conductor and an insulator. A semiconductor exhibits conductivity at higher temperatures but insulation at lower temperatures. Semiconductors have important applications in electronics and optoelectronics, such as in integrated circuits, solar cells, and photodiodes. Common semiconductor materials include silicon, germanium, and compound semiconductors such as gallium nitride and indium phosphide. Semiconductor processing refers to the process of fabricating various electronic devices from semiconductor materials.

[0003] In the prior art, during the semiconductor processing, it is necessary to handle the loading and unloading of semiconductor materials. During the loading and unloading process, the processing equipment will stop running, which will affect the continuity of semiconductor material processing, resulting in low processing efficiency of semiconductor materials and affecting production efficiency. At the same time, during the processing, in order to ensure the stability of semiconductor materials, it is necessary to fix the semiconductor materials, resulting in inconvenient adjustment during subsequent processing of semiconductor materials and affecting the flexibility of semiconductor material processing. Therefore, the utility model designs a semiconductor processing device. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problem that in the prior art, during the semiconductor processing, it is necessary to handle the loading and unloading of semiconductor materials, and during the loading and unloading process, the processing equipment will stop running, which will affect the continuity of semiconductor material processing, resulting in low processing efficiency of semiconductor materials and affecting production efficiency. At the same time, during the processing, in order to ensure the stability of semiconductor materials, it is necessary to fix the semiconductor materials, resulting in inconvenient adjustment during subsequent processing of semiconductor materials and affecting the flexibility of semiconductor material processing, and to propose a semiconductor processing device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A semiconductor processing equipment comprises a base plate and a bracket, the bracket is fixedly connected to the upper surface of the base plate, the base plate is rotatably connected with a rotating shaft inside, the top of the rotating shaft is fixedly connected with a turntable, the top inner wall of the bracket is fixedly connected with a cylinder, the end of the piston rod of the cylinder is fixedly connected with a connecting plate, the bottom of the base plate is fixedly connected with a fixing frame, the inside of the fixing frame is fixedly connected with a motor, a plurality of grooves are opened around the top inner wall of the turntable, the inner wall of the turntable located in the groove is opened with a strip groove, the turntable is rotatably connected with a bidirectional lead screw located in the inner wall of the strip groove, a slider is threadedly connected to the rod wall of the bidirectional lead screw, the top of the slider is hinged with a push rod, the end of the push rod facing away from the slider is hinged with a moving plate, and a deceleration mechanism is provided inside the fixed frame.

[0007] Preferably, a guide ring is fixedly sleeved on the side wall of the turntable, a guide groove is opened on the inner wall of the bracket, and the guide ring is slidably arranged on the inner wall of the bracket located in the guide groove.

[0008] Preferably, the reduction mechanism comprises a pinion and a gear, wherein the pinion is fixedly connected to the end of the output shaft of the motor, and the gear is fixedly sleeved on the shaft wall of the rotating shaft, and the pinion and the gear are meshed with each other.

[0009] Preferably, a cavity is opened on the inner wall of the groove where the turntable is located, and the turntable is rotatably connected to a turn rod on the inner wall of the cavity, and the rod walls at the corresponding ends of the turn rod and the bidirectional screw rod respectively extend into the interior of the cavity and a bevel gear is fixedly provided on the fixed sleeve, and the two bevel gears are meshed with each other.

[0010] Preferably, a notch is formed on the inner wall of the top end of the rotating disk, and the rod wall of the rotating rod extends into the inside of the notch and is fixedly connected with a rotating handle.

[0011] Preferably, a plurality of slots are respectively provided on the inner wall at the top end of the movable plate, and plug blocks are respectively inserted into the inner walls of the movable plate located in the plurality of slots, and the top ends of the plug blocks extend to the outside of the slots and are fixedly connected with clamping plates.

[0012] Preferably, a rectangular groove is provided inside the plug block, and the plug block is fixedly connected to a fixing rod on the inner wall of the rectangular groove, a clamping plate and a torsion spring are movably sleeved on the rod wall of the fixing rod, one end of the torsion spring is fixedly connected to the inner wall of the clamping plate, and the other end of the torsion spring is fixedly connected to the inner wall of the plug block, a clamping groove is provided on the inner wall of the movable plate, and the clamping plate is clamped on the inner wall of the clamping groove.

[0013] Preferably, a drawstring is fixedly connected to the side wall of the card plate, and one end of the drawstring facing away from the card plate passes through the insert block, extends to the outside of the clamp plate and is fixedly connected to a draw ring.

[0014] Preferably, a chamfer is provided at the bottom of the insertion block, and the moving plate is located on the inner wall of the slot and matches the insertion block.

[0015] Compared with the prior art, the present utility model provides a semiconductor processing device, which has the following beneficial effects:

[0016] 1. In this semiconductor processing device, the output shaft of the motor rotates to drive the small gear to rotate, and at the same time drives the large gear meshed with the small gear to rotate. The rotation of the large gear can drive the rotating shaft and the turntable to rotate. The small gear driving the large gear to rotate is a speed-reducing transmission, which is more labor-saving and can reduce the resistance when the output shaft of the motor rotates. When the semiconductor material is placed inside the groove and the turntable rotates, the semiconductor material can be adjusted. During the semiconductor processing, the semiconductor material can be loaded and unloaded and replaced, without affecting the processing efficiency.

[0017] 2. In this semiconductor processing device, rotating the turning handle can drive the turning rod to rotate. The rotation of the turning rod drives the lower bevel gear to rotate, and the rotation of the upper bevel gear can drive the lower bevel gear to rotate, causing the bidirectional lead screw to rotate. The rotation of the bidirectional lead screw can drive the slider to move and jack up the ejector rod, which can lift the moving plate. The height of the moving plate can be adjusted flexibly according to the usage requirements, which can ensure the processing of semiconductor materials with different thicknesses.

[0018] 3. In this semiconductor processing device, the clamping plate can be fixedly arranged by inserting the insertion block along the inner wall of the slot. The insertion block is arranged in different slots, so that the clamping plate can stably clamp semiconductor materials of different specifications. The torsion spring pushes the clamping plate to rotate along the rod wall of the fixed rod and extends into the internal of the clamping groove, improving the stability of the insertion block inside the slot, which can improve the stability of the clamping plate. Pulling the pull ring can pull the pull rope to move, so that the clamping plate contracts to the inner wall of the rectangular groove, and the clamping plate can be disassembled for flexible adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of a semiconductor processing device proposed by the present utility model;

[0020] Figure 2 is Figure 1 a schematic enlarged view of the partial A part in

[0021] Figure 3 is Figure 1 a top view of the structure of the turntable in

[0022] Figure 4 is Figure 2 a three-dimensional view of the structure of the clamping plate in

[0023] In the figure: 1 bottom plate, 2 support, 3 rotating shaft, 4 turntable, 5 guide ring, 6 cylinder, 7 connecting plate, 8 fixing frame, 9 motor, 10 small gear, 11 large gear, 12 bidirectional lead screw, 13 slider, 14 ejector rod, 15 moving plate, 16 rotating rod, 17 bevel gear, 18 rotating handle, 19 clamping plate, 20 insertion block, 21 fixing rod, 22 clamping board, 23 torsion spring, 24 pulling rope, 25 pulling ring. Specific implementation manner

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0025] Embodiment 1

[0026] Referring to Figure 1-2 , a semiconductor processing device includes a bottom plate 1 and a support 2. The support 2 is fixedly connected to the upper surface of the bottom plate 1. The inside of the bottom plate 1 is rotatably connected with a rotating shaft 3. The top end of the rotating shaft 3 is fixedly connected with a turntable 4. The inner wall of the top end of the support 2 is fixedly connected with a cylinder 6. The end of the piston rod of the cylinder 6 is fixedly connected with a connecting plate 7. The bottom of the bottom plate 1 is fixedly connected with a fixing frame 8. The inside of the fixing frame 8 is fixedly connected with a motor 9. A plurality of grooves are circumferentially formed on the inner wall of the top end of the turntable 4. A strip-shaped groove is formed on the inner wall of the turntable 4 at the groove. A bidirectional lead screw 12 is rotatably connected to the inner wall of the strip-shaped groove of the turntable 4. A slider 13 is threadedly connected to the rod wall of the bidirectional lead screw 12. The top end of the slider 13 is hinged with an ejector rod 14. The end of the ejector rod 14 away from the slider 13 is hinged with a moving plate 15. A guide ring 5 is fixedly sleeved on the side wall of the turntable 4. A guide groove is formed on the inner wall of the support 2. The guide ring 5 is slidably arranged on the inner wall of the support 2 at the guide groove.

[0027] A speed reduction mechanism is arranged inside the fixing frame 8. The speed reduction mechanism includes a small gear 10 and a large gear 11. The small gear 10 is fixedly connected to the end of the output shaft of the motor 9. The large gear 11 is fixedly sleeved on the shaft wall of the rotating shaft 3. The small gear 10 and the large gear 11 are meshed with each other.

[0028] A cavity is formed on the inner wall of the turntable 4 at the groove. A rotating rod 16 is rotatably connected to the inner wall of the cavity of the turntable 4. The rod walls of the corresponding ends of the rotating rod 16 and the bidirectional lead screw 12 respectively extend into the cavity and are fixedly sleeved with bevel gears 17. The two bevel gears 17 are meshed with each other. A notch is formed on the inner wall of the top end of the turntable 4. The rod wall of the rotating rod 16 extends into the notch and is fixedly connected with a rotating handle 18.

[0029] During use, the rotation of the output shaft of the motor 9 can drive the rotation of the pinion 10 and simultaneously drive the rotation of the large gear 11 meshed with the pinion 10. The rotation of the large gear 11 can drive the rotation of the rotating shaft 3 and the turntable 4. The pinion 10 driving the large gear 11 for rotation is a speed-reducing transmission, which is more labor-saving and can reduce the resistance when the output shaft of the motor 9 rotates. When the semiconductor material is placed inside the groove and the turntable 4 rotates, the semiconductor material can be adjusted. The semiconductor material can be loaded, unloaded, and replaced while the semiconductor is being processed, without affecting the processing efficiency. The sliding of the guide ring 5 along the inner wall of the guide groove can improve the stability of the rotation of the turntable 4 inside the bracket 2. Rotating the turning handle 18 can drive the rotation of the rotating rod 16. The rotation of the rotating rod 16 drives the rotation of the bevel gear 17 below. The rotation of the upper bevel gear 17 can drive the rotation of the bevel gear 17 below to rotate the bidirectional lead screw 12. The rotation of the bidirectional lead screw 12 can drive the movement of the slider 13 to jack up the ejector rod 14, which can lift the moving plate 15. The height of the moving plate 15 can be flexibly adjusted according to the use requirements, ensuring that semiconductor materials of different thicknesses can be processed. The connecting plate 7 can be connected to the processing device to ensure that the processing equipment can have a multi-functional processing effect, and the cylinder 6 can adjust the height position of the connecting plate 7.

[0030] Embodiment 2

[0031] Referring to Figure 1-2 , a plurality of slots are respectively opened on the inner wall of the top end of the moving plate 15. Plug blocks 20 are respectively inserted and arranged on the inner walls of the moving plate 15 at the plurality of slots. The top ends of the plug blocks 20 extend to the outside of the slots and are fixedly connected with clamping plates 19. The bottom of the plug block 20 is provided with a rounded corner. The inner wall of the moving plate 15 at the slot is matched with the plug block 20.

[0032] The plug block 20 being inserted along the inner wall of the slot can fix the clamping plate 19. The plug block 20 being arranged in different slots enables the clamping plate 19 to stably clamp semiconductor materials of different specifications.

[0033] Embodiment 3

[0034] Referring to Figure 1-2 , a rectangular groove is opened inside the plug block 20. A fixing rod 21 is fixedly connected to the inner wall of the plug block 20 at the rectangular groove. A clamping plate 22 and a torsion spring 23 are movably sleeved on the rod wall of the fixing rod 21. One end of the torsion spring 23 is fixedly connected to the inner wall of the clamping plate 22, and the other end of the torsion spring 23 is fixedly connected to the inner wall of the plug block 20. A clamping groove is opened on the inner wall of the moving plate 15. The clamping plate 22 is clamped and arranged on the inner wall of the clamping groove. A pull rope 24 is fixedly connected to the side wall of the clamping plate 22. One end of the pull rope 24 departing from the clamping plate 22 penetrates through the plug block 20 and extends to the outside of the clamping plate 19 and is fixedly connected with a pull ring 25.

[0035] The torsion spring 23 can push the clamping plate 22 to rotate along the rod wall of the fixed rod 21 and extend into the inner part of the clamping groove, which can improve the stability of the insertion block 20 inside the insertion slot and the stability of the clamping plate 19. Pulling the pull ring 25 can pull the pull cord 24 to move, so that the clamping plate 22 shrinks to the inner wall of the rectangular groove, the clamping plate 19 can be disassembled, and flexible adjustment can be carried out.

[0036] The above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, with equivalent substitution or change, should be covered within the protection scope of the present invention.

Claims

1. A semiconductor processing device, comprising a bottom plate (1) and a bracket (2), characterized in that: The bracket (2) is fixedly connected to the upper surface of the base plate (1); the base plate (1) is rotatably connected to a rotating shaft (3); the top end of the rotating shaft (3) is fixedly connected to a rotating disk (4); the top inner wall of the bracket (2) is fixedly connected to a cylinder (6); the piston rod end of the cylinder (6) is fixedly connected to a connecting plate (7); the bottom of the base plate (1) is fixedly connected to a fixing frame (8); the inside of the fixing frame (8) is fixedly connected to a motor (9); the rotating disk (4) A plurality of grooves are formed around the inner wall of the top end of the rotating disc (4), a strip groove is formed on the inner wall of the groove, a bidirectional screw rod (12) is rotatably connected to the inner wall of the strip groove of the rotating disc (4), a slider (13) is threadedly connected to the rod wall of the bidirectional screw rod (12), a top end of the slider (13) is hingedly provided with a push rod (14), and a movable plate (15) is hingedly provided at one end of the push rod (14) away from the slider (13), and a speed reduction mechanism is provided inside the fixed frame (8).

2. The semiconductor processing equipment according to claim 1, wherein: A guide ring (5) is fixedly sleeved on the side wall of the rotating disk (4), a guide groove is opened on the inner wall of the bracket (2), and the guide ring (5) is slidably arranged on the inner wall of the bracket (2) located in the guide groove.

3. A semiconductor processing device according to claim 1, characterized in that: The speed reduction mechanism comprises a pinion (10) and a large gear (11); the pinion (10) is fixedly connected to the end of the output shaft of the motor (9); the large gear (11) is fixedly sleeved on the shaft wall of the rotating shaft (3); and the pinion (10) and the large gear (11) are meshed with each other.

4. A semiconductor processing apparatus according to claim 1, characterized in that: The inner wall of the rotating disk (4) located in the groove is provided with a cavity, and the inner wall of the rotating disk (4) located in the cavity is rotatably connected with a rotating rod (16), and the rod walls of the rotating rod (16) and the corresponding ends of the bidirectional screw rod (12) respectively extend into the interior of the cavity and are fixedly sleeved with a bevel gear (17), and the two bevel gears (17) are meshed with each other.

5. A semiconductor processing apparatus according to claim 4, characterized in that: A notch is formed on the inner wall of the top end of the rotating disk (4); the rod wall of the rotating rod (16) extends into the interior of the notch and is fixedly connected to a rotating handle (18).

6. A semiconductor processing apparatus according to claim 1, characterized in that: The inner wall at the top end of the movable plate (15) is provided with a plurality of slots, and the inner walls of the movable plate (15) located at the plurality of slots are respectively provided with plug-in blocks (20), and the top ends of the plug-in blocks (20) extend to the outside of the slots and are fixedly connected with a clamping plate (19).

7. A semiconductor processing apparatus according to claim 6, characterized in that: A rectangular groove is provided inside the plug block (20), and a fixing rod (21) is fixedly connected to the inner wall of the rectangular groove of the plug block (20). A clamping plate (22) and a torsion spring (23) are movably sleeved on the rod wall of the fixing rod (21), one end of the torsion spring (23) is fixedly connected to the inner wall of the clamping plate (22), and the other end of the torsion spring (23) is fixedly connected to the inner wall of the plug block (20). A clamping groove is provided on the inner wall of the movable plate (15), and the clamping plate (22) is clamped on the inner wall of the clamping groove.

8. A semiconductor processing apparatus according to claim 7, characterized in that: A drawstring (24) is fixedly connected to the side wall of the card plate (22); one end of the drawstring (24) facing away from the card plate (22) passes through the insert block (20) and extends to the outside of the clamp plate (19) and is fixedly connected to a draw ring (25).

9. A semiconductor processing apparatus according to claim 6, wherein: The bottom of the insertion block (20) is provided with a chamfer, and the moving plate (15) is located on the inner wall of the slot and matches the insertion block (20).

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