Filament lamp with multiple LED chips integrally packaged

Abstract

The utility model discloses a filament lamp with multiple LED chips integrally packaged. The filament lamp comprises a lampshade, a ceramic substrate filament, a socket and a base. The socket is connected with the base; the ceramic substrate lamp filament is inserted into the socket, and the lampshade covers the ceramic substrate lamp filament and is connected with the socket; the ceramic substrate lamp filament is of a multi-layer high-temperature co-fired ceramic substrate structure, is in a long strip shape and sequentially comprises a surface wiring layer, a first through hole filling layer, a buried layer circuit layer, a plurality of second through hole filling layers, a buried layer circuit layer, a first through hole filling layer and a surface wiring layer. The two side faces of the ceramic substrate are connected with the two surface wiring layers through side face printing. One or more LED chip assemblies are fixedly packaged on the surface wiring layer on the periphery of the ceramic substrate lamp filament and the top of the ceramic substrate lamp filament. The LED packaging structure is simple and high in luminous efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of LED filament lamps, and particularly relates to a filament lamp with multiple LED chips integrally packaged. Background Art

[0002] In practical applications, although the appearance of the LED filament lamp is similar to that of an incandescent lamp, its performance and photo effect are more excellent. At present, the traditional LED filament lamp is composed of a "rigid straight wire LED filament + constant current drive power supply + glass core column + glass bulb + lamp holder". Then, metal-based LED filaments and ceramic-based LED filaments have been developed. However, usually, the LED chips are fixed and packaged on one side of the LED filament lamp, and multiple filaments are used to surround to ensure the light-emitting angle. The packaging structure is complex and the light-emitting efficiency is low. Therefore, it is necessary to develop a new packaging structure to simplify the packaging and solve the above problems. Summary of the Utility Model

[0003] In view of this, the utility model expects to provide a filament lamp with multiple LED chips integrally packaged, which has a simple packaging structure and high light-emitting efficiency.

[0004] To achieve the above object, the technical solution of the utility model is realized as follows:

[0005] The utility model provides a filament lamp with multiple LED chips integrally packaged, including a lamp cover, a ceramic substrate filament, a socket and a base; the socket is connected to the base; the ceramic substrate filament is inserted into the socket, and the lamp cover is sleeved outside the ceramic substrate filament and connected to the socket; the ceramic substrate filament is a multi-layer high-temperature co-fired ceramic substrate structure, and the ceramic substrate filament is strip-shaped, and sequentially includes a surface wiring layer, a first via filling layer, a buried wiring layer, a plurality of second via filling layers, a buried wiring layer, a first via filling layer, and a surface wiring layer. The two sides of the ceramic substrate are connected to the two surface wiring layers through side printing; one or more LED chip components are fixedly packaged on the surface wiring layer around the ceramic substrate filament and on the top.

[0006] Further, the LED chip component includes a positive electrode pad, a negative electrode pad and an LED chip. The positive electrode pad and the negative electrode pad are packaged in the surface wiring layer, the LED chip is sealed on the positive electrode pad, and the positive electrode pad is connected to the negative electrode pad through gold wire bonding.

[0007] Further, the surface wiring layer and the first via filling layer have the same length, the buried wiring layer and the second via filling layer have the same length, and the length of the buried wiring layer is greater than that of the surface wiring layer, so that the bottom of the ceramic substrate filament is a T-shaped structure, and the bottom of the ceramic substrate filament is inserted into the socket.

[0008] Furthermore, the electrode distributions of the LED chip components on each of the surface wiring layers are the same, and the electrode distributions of the LED chip components on two adjacent surface wiring layers around the ceramic substrate filament are opposite.

[0009] The beneficial effects of the present utility model are as follows:

[0010] (1) The ceramic substrate filament structure of the present utility model encapsulates the LED chips with five-sided wiring, densely arranges the LED chips, emits light 360° through five surfaces, enlarges the light-emitting surface, and has high luminous efficiency.

[0011] (2) The LED filament structure of the present utility model adopts a multi-layer high-temperature co-fired ceramic substrate structure. The ceramic material can increase the heat conduction performance, reduce the chip operating temperature, improve the heat dissipation efficiency, and has a simple encapsulation structure.

[0012] (3) The bottom of the ceramic substrate filament structure of the present utility model is a T-shaped structure, and the two sides are respectively the positive and negative electrodes of the filament, which can be directly plugged and unplugged with the socket, making it more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0014] Figure 2 is a schematic diagram of the ceramic substrate filament structure of an embodiment of the present utility model;

[0015] Figure 3 is a schematic diagram of the hierarchical wiring of the ceramic substrate filament of an embodiment of the present utility model;

[0016] Figure 4 is a left view of the ceramic substrate filament of an embodiment of the present utility model;

[0017] Figure 5 is a right view of the ceramic substrate filament of an embodiment of the present utility model;

[0018] Among them: 1 is the lampshade, 2 is the socket, 3 is the base, 4 is the ceramic substrate filament, 5 is the LED chip component, 41 is the surface wiring layer, 42 is the first via filling layer, 43 is the buried layer circuit layer, 44 is the second via filling layer, 51 is the positive electrode pad, 52 is the negative electrode pad, 53 is the LED chip, and 54 is the gold wire bonding. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] In order to understand the features and technical content of the present utility model in more detail, the implementation of the present utility model will be described in detail below with reference to the accompanying drawings. The accompanying drawings are only for reference and illustration purposes and are not used to limit the present utility model.

[0020] As Figures 1-5As shown in the figure, a filament lamp with multiple LED chips integrally packaged according to an embodiment of the present utility model includes a lamp cover 1, a ceramic substrate filament 4, a socket 2, and a base 3; the socket 2 is connected to the base 3; the ceramic substrate filament 4 is inserted into the socket 2, and the lamp cover 1 is sleeved outside the ceramic substrate filament 4 and connected to the socket 2; the ceramic substrate filament 4 is a multi-layer high-temperature co-fired ceramic substrate structure, and the ceramic substrate filament 4 is strip-shaped and sequentially includes a surface wiring layer 41, a first via filling layer 42, a buried layer wiring layer 43, a second via filling layer 44, a buried layer wiring layer 43, a first via filling layer 42, and a surface wiring layer 41. The two sides of the ceramic substrate filament 4 are connected to the two surface wiring layers 42 through side printing; one or more LED chip components 5 are fixedly packaged on the surface wiring layers 42 around the ceramic substrate filament 4 and at the top.

[0021] The LED chip component 5 includes a positive electrode pad 51, a negative electrode pad 52, and an LED chip 53. The positive electrode pad 51 and the negative electrode pad 52 are packaged in the surface wiring layer 41. The LED chip 53 is sealed and connected to the positive electrode pad 51, and the positive electrode pad 51 is connected to the negative electrode pad 52 through a gold wire bonding 54.

[0022] The surface wiring layer 41 and the first via filling layer 42 have the same length. The buried layer wiring layer 43 and the second via filling layer 44 have the same length. The length of the buried layer wiring layer 43 is greater than that of the surface wiring layer 41, so that the bottom of the ceramic substrate filament 4 is a T-shaped structure, and the bottom of the ceramic substrate filament 4 is inserted into the socket to achieve direct plug-and-play docking.

[0023] The electrode distributions of the LED chip components 5 on each surface wiring layer 42 are the same. The electrode distributions of the LED chip components on the two adjacent surface wiring layers 42 around the ceramic substrate filament 4 are opposite, such as: “﹢-” “-﹢” “﹢-” “-﹢” or “-﹢” “﹢-” “-﹢” “﹢-”. The direction of the electrodes of the LED chip components 5 packaged at the top of the ceramic substrate filament 4 can be set arbitrarily according to the built-in buried layer wiring.

[0024] The ceramic substrate filament 4 has a multi-layer high-temperature co-fired ceramic substrate structure. The surface wiring layer 41 on the front encapsulates the LED chip assembly 5, and is connected to the buried wire in the buried layer wiring layer 43 through the through-hole in the through-hole filling layer 42 to achieve electrical interconnection. Similarly, the LED chip assembly 5 encapsulated by the surface wiring layer 41 on the back is also electrically interconnected through the corresponding through-hole filling layer 42 and buried layer wiring layer 43, and the electrode exchange between the front and back is achieved through the through-hole in the second through-hole filling layer 44, so that the positive and negative electrodes are separately concentrated on one side of the T-shaped structure at the bottom of the ceramic substrate filament 4. The two sides of the ceramic substrate filament 4 are connected to the surface wiring layer 42 through side printing and are electrically interconnected through the buried layer wiring layer 43.

[0025] Preferably, the length, width and other dimensions of the ceramic substrate filament 4 can be designed according to the size and quantity of the chips, and the quantity of the second through-hole filling layer 44 can be set according to the size of the ceramic substrate filament 4.

[0026] Here, the specific models of the above-mentioned devices are not limited and described in detail, and the in-depth connection methods of the above-mentioned devices are not described in detail. As common knowledge, those skilled in the art can understand.

[0027] The embodiments of the present invention only introduce its specific implementation manners and do not limit its protection scope. Those skilled in the art of this industry can make some modifications inspired by this embodiment. Therefore, all equivalent changes or modifications made according to the scope of the present invention patent are within the scope of the claims of the present invention patent.

Claims

1. A filament lamp with multiple LED chips integrally encapsulated, characterized in that, It includes a lamp shade, a ceramic substrate filament, a socket and a base; the socket is connected to the base; the ceramic substrate filament is inserted into the socket, and the lamp shade is arranged outside the ceramic substrate filament and connected to the socket; the ceramic substrate filament is a multi-layer high-temperature co-fired ceramic substrate structure, and the ceramic substrate filament is strip-shaped and sequentially includes a surface wiring layer, a first via filling layer, a buried wiring layer, a plurality of second via filling layers, a buried wiring layer, a first via filling layer, and a surface wiring layer. The two sides of the ceramic substrate are connected to the two surface wiring layers through side printing; one or more LED chip components are fixedly encapsulated on the surface wiring layers around the ceramic substrate filament and at the top.

2. The filament lamp with multiple LED chips integrally packaged according to claim 1, wherein The LED chip component includes a positive electrode pad, a negative electrode pad and an LED chip. The positive electrode pad and the negative electrode pad are encapsulated in the surface wiring layer. The LED chip is sealed on the positive electrode pad, and the positive electrode pad is connected to the negative electrode pad through gold wire bonding.

3. The filament lamp with multiple LED chips integrally packaged according to claim 2, wherein, The surface wiring layer and the first via filling layer have the same length, the buried wiring layer and the second via filling layer have the same length, and the length of the buried wiring layer is greater than that of the surface wiring layer, so that the bottom of the ceramic substrate filament is a T-shaped structure, and the bottom of the ceramic substrate filament is inserted into the socket.

4. A filament lamp with multiple LED chips integrally packaged according to claim 3, characterized in that, The electrode distributions of the LED chip components on each surface wiring layer are the same, and the electrode distributions of the LED chip components on two adjacent surface wiring layers around the ceramic substrate filament are opposite.

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