Glue pouring circuit board, glue pouring circuit board mold and petroleum logging instrument

Abstract

The utility model belongs to the technical field of electronic packaging, and discloses a glue pouring circuit board, a glue pouring circuit board mold and a petroleum logging instrument. The potting circuit board comprises a circuit board body, at least two supports and a potting layer, and the at least two supports clamp the edge of the circuit board body; the potting layer wraps the circuit board body and the support to form a potting circuit board, and the surface of the potting layer is convexly provided with damping ribs. According to the utility model, the support is arranged on the circuit board body, so that the structural strength of the circuit board body is improved; the outer sides of the circuit board body and the bracket are coated with the glue pouring layer, so that the circuit board body and the bracket form an integrated structure, and the vibration damping ribs are convexly arranged on the surface of the glue pouring layer, so that the overall vibration resistance and the bending strength of the glue pouring circuit board can be improved; therefore, the stability and reliability of the potting circuit board in a high-vibration working environment are improved, and stable and reliable working of the logging instrument with the potting circuit board is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging, in particular to a potted circuit board, a potted circuit board mold and a petroleum logging instrument. Background Technique

[0002] During the process of underground oil exploration, petroleum logging instruments have been in an environment of high temperature, high pressure and high vibration. In order to ensure the reliability and stability of the operation of petroleum logging instruments, there are high requirements for the structural strength of circuit boards. Usually, circuit boards are fixed to the circuit framework of logging instruments by screws. However, in this case, when the logging instrument is in a high-vibration working environment, the intense vibration will be transmitted to the circuit board through the screws. Prolonged vibration will cause the solder joints of the circuit board components to fall off and the circuit board to deform, resulting in the failure of the circuit board and the abnormal operation of the logging instrument. Content of the Utility Model

[0003] The purpose of the utility model is to provide a potted circuit board, a potted circuit board mold and a petroleum logging instrument, so as to solve the problem that the circuit board is prone to failure in a high-vibration working environment and the problem that the logging instrument cannot operate normally due to the failure of the circuit board.

[0004] To achieve the above object, the utility model adopts the following technical solutions:

[0005] The potted circuit board includes:

[0006] A circuit board body;

[0007] A bracket, at least two brackets are provided, and at least two brackets are arranged to sandwich the edge of the circuit board body;

[0008] A potting layer, the potting layer covers the outside of the circuit board body and the bracket to form the potted circuit board, and damping rib strips are convexly arranged on the surface of the potting layer.

[0009] In some embodiments, the brackets are arranged at intervals along the width direction of the circuit board body and sandwich the circuit board body.

[0010] In some embodiments, both of the two brackets extend along the length direction of the circuit board body.

[0011] In some embodiments, the bracket is provided with a mounting groove, the mounting groove runs through along the length direction of the circuit board body, and the edge of the circuit board body is inserted into the mounting groove.

[0012] In some embodiments, the damping rib strips extend along the length direction of the circuit board body.

[0013] In some embodiments, the damping ribs are disposed on both side surfaces of the potting layer along the thickness direction of the circuit board body.

[0014] In some embodiments, anti-slip structures are provided on two side surfaces of the potting layer along the width direction of the circuit board body.

[0015] In some embodiments, the anti-slip structure is a protrusion protruding from the surface of the potting layer and / or a pit recessed in the surface of the potting layer.

[0016] In some embodiments, the material of the bracket is any one of ABS resin, polycarbonate, polystyrene or fiberglass.

[0017] In some embodiments, the potting layer is made of silicone rubber.

[0018] A potting circuit board mold is used to prepare the potting circuit board provided by the present invention. The potting circuit board mold includes an upper mold and a lower mold. The upper mold has an upper mold cavity, and the lower mold has a lower mold cavity. Rib slots are provided at the bottom of the upper mold cavity and / or the bottom of the lower mold cavity.

[0019] In some embodiments, when the upper mold and the lower mold are clamped together, the bracket of the potting circuit board is clamped between the bottom of the upper mold cavity and the bottom of the lower mold cavity. Potting cavities are respectively formed between both sides of the circuit board body of the potting circuit board along the thickness direction of the circuit board body and the bottom of the upper mold cavity and the bottom of the lower mold cavity. The height of the potting cavity is equal to the thickness of the potting layer of the potting circuit board.

[0020] In some embodiments, the rib slots extend along the length direction of the circuit board body.

[0021] In some embodiments, in the upper mold and the lower mold, one is provided with a groove, and the other is provided with a wiring hole. The groove communicates with the upper mold cavity or the lower mold cavity. The signal lines at both ends of the circuit board body can pass through the groove and then pass through the wiring hole to be led out.

[0022] In some embodiments, in the upper mold and the lower mold, one is provided with a pin, and the other is provided with a pin hole. The pin and the pin hole are cooperatively inserted for positioning.

[0023] In some embodiments, a matching structure is provided on the side wall of the upper mold cavity and / or the lower mold cavity. The matching structure forms the anti-slip structure on the potting circuit board after potting.

[0024] In some embodiments, in the upper mold and the lower mold, one is provided with a plurality of first threaded holes, and the other is provided with a plurality of through holes. A plurality of first connecting members respectively pass through the plurality of through holes and are threadedly connected to the plurality of first threaded holes to connect the upper mold and the lower mold.

[0025] In some embodiments, one of the upper mold and the lower mold is provided with a plurality of second threaded holes. A plurality of second connecting members can be threadedly connected to the second threaded holes and abut against the upper mold or the lower mold to separate the upper mold and the lower mold.

[0026] In some embodiments, a glue injection hole and an exhaust hole are provided at the bottom of the upper mold cavity or the bottom of the lower mold cavity.

[0027] A petroleum logging instrument includes a circuit skeleton, a cover plate, and the potted circuit board provided by the present utility model. The circuit skeleton is provided with a chamber. The potted circuit board is disposed in the chamber. The cover plate covers the chamber and is connected to the circuit skeleton.

[0028] Advantages of the present utility model:

[0029] For the potted circuit board provided by the present utility model, by clamping two brackets on the circuit board body, it is beneficial to improve the structural strength of the circuit board body. By covering a potting layer on the outside of the circuit board body and the brackets, the circuit board body and the brackets become an integral structure. The damping rib strips protruding from the surface of the potting layer can improve the overall anti-vibration ability and anti-bending strength of the potted circuit board, thereby improving the stability and reliability of the potted circuit board in a high-vibration working environment, and ensuring the stable and reliable operation of the logging instrument with the potted circuit board.

[0030] The potted circuit board mold provided by the present utility model is used for the molding of the potted circuit board. The potted circuit board mold includes an upper mold and a lower mold. The upper mold has an upper mold cavity, and the lower mold has a lower mold cavity. Ribbed grooves are provided at the bottom of the upper mold cavity and / or the bottom of the lower mold cavity. Thus, when potting, a potting layer can be formed on the outside of the circuit board body, and the surface of the potting layer has damping rib strips, so that the overall anti-vibration ability and anti-bending strength of the potted circuit board are improved.

[0031] The petroleum logging instrument provided by the present utility model includes a circuit skeleton, a cover plate, and the potted circuit board provided by the present utility model. The circuit skeleton is provided with a chamber. The potted circuit board is disposed in the chamber. The cover plate covers the chamber and is connected to the circuit skeleton. Since the potted circuit board is provided with brackets and a potting layer, and damping rib strips protrude from the outside of the potting layer, the damping rib strips can absorb the vibration transmitted from the circuit skeleton to the circuit board body, thereby achieving the damping effect on the circuit board body, which is beneficial to ensuring the stable and reliable operation of the petroleum logging instrument including the circuit board body. Description of the Drawings

[0032] Figure 1 It is a schematic structural diagram of the potted circuit board provided by an embodiment of the present utility model;

[0033] Figure 2 It is a schematic structural diagram of the lower mold of the potted circuit board mold provided by an embodiment of the present utility model (with a circuit board body and a bracket built-in);

[0034] Figure 3 It is a schematic structural diagram of the upper mold of the potted circuit board mold provided by an embodiment of the present utility model;

[0035] Figure 4 It is a schematic structural diagram of the installation of the potted circuit board on a petroleum logging instrument provided by an embodiment of the present utility model.

[0036] In the figure:

[0037] 1. Potted circuit board; 11. Circuit board body; 12. Bracket; 13. Potted layer; 14. Vibration damping rib; 15. Anti-slip structure;

[0038] 2. Lower mold; 21. Lower mold cavity; 22. Groove; 23. Pin hole; 24. First threaded hole; 25. Second threaded hole;

[0039] 3. Upper mold; 31. Upper mold cavity; 32. Rib groove; 33. Wiring hole; 34. Pin; 35. Matching structure; 36. Through hole; 37. Glue injection hole; 38. Exhaust hole;

[0040] 4. Circuit skeleton; 5. Cover plate. Detailed implementation manners

[0041] The following further elaborates on the present utility model in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are merely used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the sake of convenience of description, only parts related to the present utility model rather than all structures are shown in the drawings.

[0042] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0043] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0044] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left" and "right" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operations, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0045] As Figures 1-4 , the embodiment of the present utility model provides a potted circuit board 1, a potted circuit board mold for preparing the potted circuit board 1, and a petroleum logging instrument having the potted circuit board 1.

[0046] As Figure 1 and Figure 2 shown, the potted circuit board 1 includes a circuit board body 11, brackets 12 and a potted layer 13. There are at least two brackets 12, and the at least two brackets 12 are arranged to sandwich the edge of the circuit board body 11; the potted layer 13 covers the outside of the circuit board body 11 and the brackets 12 to form the potted circuit board 1, and damping ribs 14 are convexly provided on the surface of the potted layer 13.

[0047] For the potted circuit board 1 provided by the present utility model, by sandwiching two brackets 12 on the circuit board body 11, it is beneficial to improve the structural strength of the circuit board body 11. Especially when the size of the circuit board body 11 is relatively large, the brackets 12 can improve the bending strength of the circuit board body 11. By covering the outside of the circuit board body 11 and the brackets 12 with the potted layer 13, the circuit board body 11 and the brackets 12 become an integral structure. The damping ribs 14 convexly provided on the surface of the potted layer 13 can improve the overall anti-vibration ability and anti-bending strength of the potted circuit board 1, thereby improving the stability and reliability of the potted circuit board 1 in a high-vibration working environment and ensuring the stable and reliable operation of the logging instrument having the potted circuit board 1.

[0048] In some embodiments, the brackets 12 are arranged at intervals along the width direction of the circuit board body 11 and sandwich the circuit board body 11.

[0049] like Figure 1 As shown, the length direction of the circuit board body 11 is the X direction, the width direction of the circuit board body 11 is the Y direction, and the thickness direction of the circuit board body 11 is the Z direction. The X direction, the Y direction, and the Z direction are perpendicular to each other. In this embodiment, the size of the circuit board body 11 along the X direction is larger than the size along the Y direction, so the bracket 12 is set at the edge of the bracket 12 in the X direction, thereby improving the bending strength of the circuit board body 11 when the length dimension of the circuit board body 11 is large. In this embodiment, two brackets 12 are set as an example. The two brackets 12 are arranged to sandwich the circuit board body 11. When the glue is poured, the circuit board body 11 and the bracket 12 are simultaneously poured and sealed to form an integral glue-filled circuit board 1.

[0050] In some embodiments, the two brackets 12 are both extended along the length direction of the circuit board body 11 .

[0051] like Figure 2 As shown, the extension length of the two brackets 12 is less than the length of the circuit board body 11, which is conducive to forming glue pouring channels at both ends of the circuit board body 11, which is conducive to smooth glue pouring. Under the premise of ensuring smooth glue pouring, the length of the bracket 12 is extended to the vicinity of both ends of the circuit board body 11 as much as possible, so that the circuit board body 11 is evenly stressed and the structure is stable.

[0052] In some embodiments, the bracket 12 is provided with a mounting groove, and the mounting groove is arranged through the length direction of the circuit board body 11, and the edge of the circuit board body 11 is inserted into the mounting groove.

[0053] For example Figure 2 The two brackets 12 are symmetrically arranged on both sides of the circuit board body 11 , and both side edges of the circuit board body 11 are inserted into the mounting grooves of the two brackets 12 , thereby facilitating the glue filling and packaging of the circuit board body 11 .

[0054] In some embodiments, the vibration-damping ribs 14 are extended along the length direction of the circuit board body 11 .

[0055] like Figure 1 In the illustrated embodiment, the vibration-damping ribs 14 are extended along the length direction of the circuit board body 11, thereby facilitating the improvement of the bending resistance of the circuit board body 11 in the length direction and facilitating the preparation of vibration-damping ribs 14 with a larger length dimension. When the glue-filled circuit board 1 is installed, the vibration-damping ribs 14 will be compressed and deformed first, thereby protecting the circuit board body 11 from being deformed by excessive extrusion force.

[0056] In some embodiments, a plurality of vibration-damping ribs 14 are provided, and the plurality of vibration-damping ribs 14 are evenly spaced apart along the width direction of the circuit board body 11 .

[0057] likeFigure 1 In the illustrated embodiment, when the size of the circuit board body 11 is 200 mm×50 mm×1.6 mm, four vibration-damping ribs 14 are provided on the surface of the circuit board body 11. The four vibration-damping ribs 14 are parallel to each other and evenly spaced. The four vibration-damping ribs 14 have the same structure and size, so that the surface of the circuit board body 11 can receive balanced pressure, which is beneficial to reducing the vibration of the circuit board body 11 and improving the stability of the circuit board body 11.

[0058] In some embodiments, the vibration-damping ribs 14 are arranged on both side surfaces of the potting layer 13 along the thickness direction of the circuit board body 11. When the potted circuit board 1 is installed, the vibration-damping ribs 14 on both sides can be symmetrically compressed and deformed to absorb vibration energy, thereby reducing the vibration of the circuit board body 11 to protect the circuit board body 11.

[0059] In some embodiments, the cross section of the vibration-damping rib 14 is semicircular. Figure 1 As shown, the plane part of the vibration-damping rib 14 is in line with the surface of the glue potting layer 13 to form a whole, and the end of the vibration-damping rib 14 away from the surface of the glue potting layer 13 is an arc surface, which is conducive to molding and reducing surface defects. The vibration-damping rib 14 with a semicircular cross-section can reduce the overall installation and fixing area of ​​the glue potting circuit board 1, and is easy to elastically deform after being stressed to absorb vibration. During use, the glue potting circuit board 1 is stressed and pressed to install, and the deformation of the vibration-damping rib 14 on the surface of the glue potting layer 13 will absorb the pressure and reduce vibration through deformation, thereby reducing the vibration and external force on the circuit board body 11, and preventing the failure of the circuit board body 11 from affecting the normal operation of the oil well logging instrument.

[0060] In some embodiments, the glue-filled layer 13 is provided with anti-skid structures 15 on two sides along the width direction of the circuit board body 11. It can be understood that the glue-filled circuit board 1 provided by the utility model is used in an oil well logging instrument, and a chamber is provided on the circuit skeleton 4 of the oil well logging instrument, and the glue-filled circuit board 1 is installed in the chamber. By providing the anti-skid structure 15, the installation positioning of the glue-filled circuit board 1 in the chamber can be improved, thereby improving the installation efficiency.

[0061] In some embodiments, the anti-slip structure 15 is a protrusion convexly provided on the surface of the glue potting layer 13 and / or a pit concavely provided on the surface of the glue potting layer 13 .

[0062] like Figure 1 As shown, taking the protrusion structure as an example, the two side surfaces of the glue-filled layer 13 are provided with protrusions as anti-slip structures 15. When the glue-filled circuit board 1 is installed, the protrusions can abut against the side walls of the chamber to achieve anti-slip. It should be noted that when the protective structure is a pit, a corresponding matching structure 35 needs to be provided on the side walls of the chamber for anti-slip limiting.

[0063] In some embodiments, there are multiple protrusions and / or pits, and the multiple protrusions and / or multiple pits are arranged at intervals along the length direction of the circuit board body 11.

[0064] As Figure 1 shown, seven protrusions are respectively arranged on both side surfaces of the potted circuit board 1, and the seven protrusions are evenly spaced to improve the uniform friction force to play an anti-slip role. When the anti-slip structure 15 is a pit, multiple pits are evenly spaced, and multiple corresponding matching structures 35 also need to be arranged on the side wall of the chamber for anti-slip limiting. Of course, the structure of the protrusion or pit is preferably an arc surface, but is not limited to a hemispherical or semi-elliptical shape, and can also be strip-shaped.

[0065] In some embodiments, the material of the bracket 12 is any one of ABS resin, polycarbonate, polystyrene or fiberglass. The material of the bracket 12 is selected as a plastic material with good hardness and rigidity. Generally, the hardness and rigidity of the bracket 12 are greater than those of the circuit board body 11. In this embodiment, the bracket 12 is selected as fiber-reinforced plastic fiberglass FRP, which has good bending resistance effect.

[0066] In some embodiments, the potted layer 13 is made of silicone rubber. The silicone rubber material has good elasticity and is easy to be potted and formed. By wrapping a potted layer 13 made of silicone rubber material on the outer sides of the circuit board body 11 and the bracket 12, the vibration transmitted from the petroleum logging instrument to the circuit board body 11 is absorbed by the elasticity of the silicone rubber to protect the circuit board body 11. Of course, the silicone rubber material is the preferred material, and the potted layer 13 is not limited to the silicone rubber material, and other materials with elastic energy absorption effects can also be selected.

[0067] The embodiment of the present utility model also provides a potted circuit board mold for preparing the potted circuit board 1 provided by the present utility model. The potted circuit board mold includes an upper mold 3 and a lower mold 2. The upper mold 3 has an upper mold cavity 31, and the lower mold 2 has a lower mold cavity 21. Rib grooves 32 are provided at the bottom of the upper mold cavity 31 and / or the bottom of the lower mold cavity 21.

[0068] As Figure 2 and Figure 3 shown, by providing the rib grooves 32, damping ribs 14 can be formed on the surface of the circuit board body 11 after potting. Under the action of the potted layer 13 and the damping ribs 14, the structural strength of the circuit board body 11 is improved and the vibration of the circuit board body 11 is reduced. The potted circuit board 1 is prepared by the method of buckling and potting the upper mold 3 and the lower mold 2. The preparation method is simple, the molding efficiency is high, and the manufacturing cost of the potted circuit board 1 is low. Among them, the rib grooves 32 can be provided only at the bottom of the upper mold cavity 31 or only at the bottom of the lower mold cavity 21, or can be provided at the bottom of both the upper mold cavity 31 and the lower mold cavity 21 at the same time. Specifically, multiple groups can be set according to the structure of the potted circuit board 1 to facilitate the selection of the upper mold 3 and the lower mold 2 according to needs.

[0069] In some embodiments, after the upper mold 3 and the lower mold 2 are clamped together, the bracket 12 of the potted circuit board 1 is clamped between the bottom of the upper mold cavity 31 and the bottom of the lower mold cavity 21. The circuit board body 11 of the potted circuit board 1 forms a potting cavity on both sides along the thickness direction of the circuit board body 11 between the bottom of the upper mold cavity 31 and the bottom of the lower mold cavity 21, and the height of the potting cavity is equal to the thickness of the potting layer 13 of the potted circuit board 1.

[0070] For another example Figure 2 During production, first, the brackets 12 are clamped on both sides of the circuit board body 11, and then the circuit board body 11 and the brackets 12 are placed together in the lower mold cavity 21. At this time, the bottom end of the bracket 12 contacts the bottom of the lower mold cavity 21, and there is a gap between the circuit board body 11 and the bottom of the lower mold cavity 21 to facilitate potting, and the top end of the bracket 12 protrudes from the end face of the lower mold cavity 21. After the upper mold 3 is clamped on the lower mold 2, the bottom of the upper mold cavity 31 abuts against the top end of the bracket 12 to realize clamping and fixing of the bracket 12, and there is also a gap between the circuit board body 11 and the bottom of the upper mold cavity 31 to facilitate potting. It can be understood that the function of the bracket 12 can, on the one hand, form an integral structure with the circuit board body 11 after potting for structural reinforcement of the circuit board body 11; on the other hand, the bracket 12 can also support the circuit board body 11 during the potting process to facilitate better potting.

[0071] In some embodiments, the cross-section of the rib groove 32 is semi-circular, which is beneficial to form a damping rib 14 with a semi-circular cross-section on the surface of the potting layer 13.

[0072] In some embodiments, the rib groove 32 extends along the length direction of the circuit board body 11.

[0073] In some embodiments, there are multiple rib grooves 32, and the multiple rib grooves 32 are evenly spaced along the width direction of the circuit board body 11. The rib grooves 32 are correspondingly arranged according to the damping ribs 14.

[0074] In some embodiments, in the upper mold 3 and the lower mold 2, one is provided with a groove 22, and the other is provided with a wire passing hole 33. The groove 22 is communicated with the upper mold cavity 31 or the lower mold cavity 21, and the signal lines at both ends of the circuit board body 11 can pass through the groove 22 and pass through the wire passing hole 33 to be led out.

[0075] To Figure 2 and Figure 3Taking the shown as an example, the lower mold 2 is provided with grooves 22 at both ends of the lower mold cavity 21. The grooves 22 are communicated with the lower mold cavity 21. The signal lines at both ends of the circuit board body 11 extend out of the lower mold cavity 21 at the grooves 22. The upper mold 3 is provided with wire holes 33 at both ends of the upper mold cavity 31. The wire holes 33 penetrate through the thickness direction (Z direction) of the upper mold 3. The wire holes 33 and the grooves 22 are arranged corresponding to each other in the Z direction, so that the signal lines can pass through the wire holes 33 and thus the potting cavity. Of course, the upper mold 3 and the lower mold 2 are in a relative position relationship, and their structures can be interchanged. Therefore, the positions of the grooves 22 and the wire holes 33 can also be interchanged, which can be specifically set according to the actual space requirements and processing methods. This embodiment does not make any restrictions. For example, the grooves 22 and the wire holes 33 can also be alternately arranged on the upper mold 3 and the lower mold 2.

[0076] In some embodiments, in the upper mold 3 and the lower mold 2, one is provided with a pin 34, and the other is provided with a pin hole 23. The pin 34 and the pin hole 23 are cooperatively inserted for positioning.

[0077] In this embodiment, as Figure 2 and Figure 3 , the pin 34 is arranged on the mating surface of the upper mold 3, and the pin hole 23 is arranged on the mating surface of the lower mold 2. After the circuit board body 11 and the bracket 12 are placed in the lower mold cavity 21, when the upper mold 3 is placed, preliminary positioning can be performed through the cooperative insertion of the pin 34 and the pin hole 23, which is convenient for subsequent fixed connection. In some embodiments, the upper mold 3 and the lower mold 2 are connected by screws or bolts.

[0078] In some embodiments, there are multiple pins 34. The multiple pins 34 are arranged at intervals around the circumference of the upper mold cavity 31 or the lower mold cavity 21. Arranging multiple pins 34, that is, at least two pins 34 are arranged, can realize the rotational limit between the upper mold 3 and the lower mold 2 during installation, which is convenient for subsequent connection and fixation.

[0079] In some embodiments, the multiple pins 34 are respectively arranged at both ends in the diagonal direction of the upper mold 3 or the lower mold 2. When two pins 34 and two pin holes 23 are arranged as Figure 2 and Figure 3 shown, the two pins 34 are arranged in the diagonal direction, so that the distance between the two pins 34 is the largest, and the limiting effect is better. In some embodiments, one of the two pins 34 can also be arranged on the upper mold 3 and the other on the lower mold 2, as long as it plays a positioning role, it can be adopted. The combination of the pin 34 and the pin hole 23 can also be replaced by the combination of a limiting strip and a limiting groove.

[0080] In some embodiments, the side walls of the upper mold cavity 31 and / or the lower mold cavity 21 are provided with a mating structure 35. The mating structure 35 forms an anti-slip structure 15 on the potted circuit board 1 after potting.

[0081] As Figure 3 shown, the mating structure 35 corresponds to the anti-slip structure 15. After potting, an anti-slip structure 15 is formed on the surface of the potting layer 13. It can be understood that when the anti-slip structure 15 is a protrusion, the mating structure 35 is a pit, and when the anti-slip structure 15 is a pit, the mating structure 35 is a protrusion. The mating structure 35 is arranged according to the anti-slip structure 15.

[0082] In some embodiments, in the upper mold 3 and the lower mold 2, one is provided with a plurality of first threaded holes 24, and the other is provided with a plurality of through holes 36. A plurality of first connectors respectively pass through the plurality of through holes 36 and are threadedly connected to the plurality of first threaded holes 24 to connect the upper mold 3 and the lower mold 2.

[0083] Combined Figure 2 and Figure 3 shown, on the lower mold 2, three first threaded holes 24 are respectively arranged at intervals on both sides of the lower mold cavity 21. Correspondingly, on the upper mold 3, three through holes 36 are respectively arranged at intervals on both sides of the upper mold cavity 31. The first connector can be a bolt or a screw. After the first connector passes through the through hole 36, it is threadedly connected to the first threaded hole 24 to realize the detachable connection between the upper mold 3 and the lower mold 2.

[0084] In some embodiments, one of the upper mold 3 and the lower mold 2 is provided with a plurality of second threaded holes 25, and a plurality of second connectors can be threadedly connected to the second threaded holes 25 and abutted against the upper mold 3 or the lower mold 2 to separate the upper mold 3 and the lower mold 2.

[0085] As Figure 2 shown, the lower mold 2 is provided with second threaded holes 25, and the second threaded holes 25 are arranged alternately with the first threaded holes 24. The second connector can be a bolt. When the second connector is threadedly connected to the second threaded hole 25, as the screwing depth of the second connector increases, the end of the second connector will abut against the mating surface of the upper mold 3, and as the screwing depth of the second connector increases, finally the upper mold 3 and the lower mold 2 are separated. It can be understood that the plurality of second connectors are arranged at intervals and are as balanced and synchronous as possible during screwing, which is beneficial to mold opening and demolding and improving product quality.

[0086] In some embodiments, a glue injection hole 37 and an exhaust hole 38 are provided at the bottom of the upper mold cavity 31 or the bottom of the lower mold cavity 21. As Figure 3 shown, three holes are provided at the bottom of the upper mold cavity 31. During potting, one of the holes serves as the glue injection hole 37, and the other two holes serve as the exhaust holes 38, which is beneficial to improving the quality of the potted product.

[0087] In some embodiments, release agents are provided on the inner walls of the upper mold cavity 31 and the lower mold cavity 21. The release agent can be W-35. In some embodiments, Teflon coatings are provided on the inner walls of the upper mold cavity 31 and the lower mold cavity 21. Preferably, the thickness of the Teflon coating is 10 μm, which facilitates demolding.

[0088] When applying the glue-filling circuit board mold of the above embodiments to prepare the glue-filling circuit board 1, first, the circuit board body 11 and the bracket 12 are combined and placed in the lower mold cavity 21. The signal lines at both ends of the circuit board body 11 are led out and passed through the wiring holes 33; the pins 34 on the upper mold 3 and the lower mold 2 are inserted into the pin holes 23 for positioning, and then the upper mold 3 and the lower mold 2 are fixedly connected by the first connecting member. The silicone rubber uses AB glue. After the A glue and the B glue are prepared according to a volume ratio of 1:1, they are stirred evenly and placed in a vacuum dish for degassing for 10 min; the degassed AB glue is slowly filled into the entire glue-filling cavity through the glue injection hole 37; it is left standing for 5 min. After the bubbles are exhausted from the exhaust hole 38, the glue-filling circuit board mold is placed in a high-temperature oven for heating and solidifying (70 °C, 40 min). After the AB glue is solidified and formed, demolding can obtain the glue-filling circuit board 1.

[0089] An embodiment of the present invention further provides a petroleum logging instrument, which includes a circuit skeleton 4, a cover plate 5, and the glue-filling circuit board 1 provided by the present invention. The circuit skeleton 4 is provided with a chamber, the glue-filling circuit board 1 is arranged in the chamber, and the cover plate 5 covers the chamber and is connected to the circuit skeleton 4.

[0090] The petroleum logging instrument provided by the present invention includes a circuit skeleton 4, a cover plate 5, and the glue-filling circuit board 1 provided by the present invention. The circuit skeleton 4 is provided with a chamber, the glue-filling circuit board 1 is arranged in the chamber, and the cover plate 5 covers the chamber and is connected to the circuit skeleton 4.

[0091] Since the glue-filling circuit board 1 is provided with the bracket 12 and the glue-filling layer 13, and the vibration damping ribs 14 protrude outside the glue-filling layer 13, the vibration damping ribs 14 can absorb the vibration transmitted from the circuit skeleton 4 to the circuit board body 11, thereby achieving the vibration damping effect on the circuit board body 11, which is beneficial to including the circuit board body 11 and ensuring the stable and reliable operation of the petroleum logging instrument. Among them, the cover plate 5 and the circuit skeleton 4 can be connected by screws. It should be noted that the side wall of the chamber is provided with a limiting structure that cooperates with the anti-slip structure 15 on the glue-filling circuit board 1 to facilitate a better anti-slip effect. When the anti-slip structure 15 is a protrusion, the side wall of the chamber can abut against the protrusion for anti-slip. When the anti-slip structure 15 is a pit, the side wall of the chamber is correspondingly provided with a protrusion to facilitate cooperation with the pit for anti-slip.

[0092] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. Encapsulated circuit board, characterized in that, Comprising: A circuit board body (11); Supports (12), at least two of said supports (12) being provided and sandwiching the edge of the circuit board body (11); A potting layer (13), the potting layer (13) covering the outside of the circuit board body (11) and the supports (12) to form the potted circuit board (1), and damping ribs (14) protruding from the surface of the potting layer (13).

2. The potted circuit board according to claim 1, characterized in that, The supports (12) are spaced along the width direction of the circuit board body (11) and sandwich the circuit board body (11).

3. The potted circuit board according to claim 2, wherein, Both of the two supports (12) extend along the length direction of the circuit board body (11).

4. The potted circuit board according to claim 1, wherein The support (12) is provided with a mounting groove, the mounting groove extending through along the length direction of the circuit board body (11), and the edge of the circuit board body (11) is inserted into the mounting groove.

5. The potted circuit board according to claim 1, wherein, The damping ribs (14) extend along the length direction of the circuit board body (11).

6. The potted circuit board according to claim 1, wherein The damping ribs (14) are disposed on both side surfaces of the potting layer (13) along the thickness direction of the circuit board body (11).

7. The potted circuit board according to claim 1, wherein Anti-slip structures (15) are provided on both side surfaces of the potting layer (13) along the width direction of the circuit board body (11).

8. The potted circuit board according to claim 7, wherein The anti-slip structure (15) is a protrusion protruding from the surface of the potting layer (13) and / or a pit recessed in the surface of the potting layer (13).

9. The potted circuit board according to claim 1, wherein The material of the support (12) is any one of ABS resin, polycarbonate, polystyrene or fiberglass.

10. The potted circuit board according to claim 1, characterized in that, The potting layer (13) is made of silicone rubber.

11. A potting circuit board mold for preparing the potting circuit board (1) according to any one of claims 1-10, characterized in that, The potted circuit board mold includes an upper mold (3) and a lower mold (2), the upper mold (3) having an upper mold cavity (31), the lower mold (2) having a lower mold cavity (21), and rib grooves (32) provided at the bottom of the upper mold cavity (31) and / or the bottom of the lower mold cavity (21).

12. The potting circuit board mold according to claim 11, wherein When the upper mold (3) and the lower mold (2) are buckled, the support (12) of the potted circuit board (1) is sandwiched between the bottom of the upper mold cavity (31) and the bottom of the lower mold cavity (21), and potting cavities are respectively formed between both sides of the circuit board body (11) of the potted circuit board (1) along the thickness direction of the circuit board body (11) and the bottom of the upper mold cavity (31) and the bottom of the lower mold cavity (21), and the height of the potting cavity is equal to the thickness of the potting layer (13) of the potted circuit board (1).

13. The potting circuit board mold according to claim 12, characterized in that, The rib grooves (32) extend along the length direction of the circuit board body (11).

14. The potting circuit board mold according to claim 12, characterized in that, In the upper mold (3) and the lower mold (2), one is provided with a groove (22), and the other is provided with a wiring hole (33), the groove (22) communicating with the upper mold cavity (31) or the lower mold cavity (21), and the signal lines at both ends of the circuit board body (11) can pass through the groove (22) and be led out through the wiring hole (33).

15. The potting circuit board mold according to claim 11, wherein, In the upper mold (3) and the lower mold (2), one is provided with a pin (34), and the other is provided with a pin hole (23). The pin (34) and the pin hole (23) are cooperatively inserted and positioned.

16. The potting circuit board mold according to claim 11, wherein, A mating structure (35) is provided on the side wall of the upper mold cavity (31) and / or the lower mold cavity (21). The mating structure (35) forms an anti-slip structure (15) on the potted circuit board (1) after potting.

17. The potting circuit board mold according to claim 11, wherein In the upper mold (3) and the lower mold (2), one is provided with a plurality of first threaded holes (24), and the other is provided with a plurality of through holes (36). A plurality of first connectors respectively pass through the plurality of through holes (36) and are threadedly connected to the plurality of first threaded holes (24) to connect the upper mold (3) and the lower mold (2).

18. The potting circuit board mold according to claim 11, characterized in that, One of the upper mold (3) and the lower mold (2) is provided with a plurality of second threaded holes (25). A plurality of second connectors can be threadedly connected to the second threaded holes (25) and abut against the upper mold (3) or the lower mold (2) to separate the upper mold (3) and the lower mold (2).

19. The potting circuit board mold according to claim 11, characterized in that, A glue injection hole (37) and an exhaust hole (38) are provided at the bottom of the upper mold cavity (31) or the bottom of the lower mold cavity (21).

20. Petroleum logging instrument, characterized in that, It includes a circuit skeleton (4), a cover plate (5), and the potted circuit board (1) according to any one of claims 1-10. The circuit skeleton (4) is provided with a chamber. The potted circuit board (1) is arranged in the chamber. The cover plate (5) covers the chamber and is connected to the circuit skeleton (4).

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