LED device

Abstract

The utility model discloses an LED device, the LED device comprises an LED support, a first kind of LED chips and a second kind of LED chips, the first kind of LED chips and the second kind of LED chips are arranged on the LED support, each of the first kind of LED chips and the second kind of LED chips comprises at least two first sub-bonding parts and at least two second sub-bonding parts, the first sub-bonding parts and the second sub-bonding parts are connected in series through wires, and a bonding part comprises at least two first sub-bonding parts and at least two second sub-bonding parts. The first type of LED chips are connected in series between the two first sub-bonding parts, the second type of LED chips are connected in series between the two second sub-bonding parts, and the first type of LED chips are connected in series between any two connected first type of LED chips or between the first type of LED chips and the first sub-bonding parts. And / or a bridging chip is connected in series between any two connected second-type LED chips or between the second-type LED chips and the second sub-bonding parts for bridging. According to the utility model, the problems that the application of an LED device is limited and the design expansion of a finished lamp is not facilitated due to the fact that a lead is connected with an electrode bonding pad nearby after the LED chips are arranged in a crossed manner in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and particularly relates to an LED device. Background Art

[0002] A light-emitting diode (LED) is a semiconductor electronic component that can emit light. Due to its small size, high brightness, low energy consumption and other characteristics, it has attracted the attention of more and more researchers. It can be packaged into an LED device and applied to dimmable LED lamps such as health lighting and intelligent lighting.

[0003] In order to make the color temperature adjustment range of the LED device wider, usually two LED chips emitting different color temperatures are spliced. That is, after combination, the two LED chips can be controlled by a circuit to achieve independent light emission and mixed light emission. In order to make the light emission uniform, the two LED chips are usually arranged in a cross pattern. For example, two first-class LED chips and second-class LED chips are arranged in a cross pattern, and then the wires between the LED chips and the electrode pads are connected nearby, that is, the wires between the LED chips are cross-connected, and the wires between the LED chips and the electrode pads are horizontally connected. This will cause the two bonding parts at both ends of the same color temperature LED chip to be located at the diagonal positions of the LED bracket respectively, restricting the practical application of the finished lamp. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide an LED device, aiming to solve the problem that the application of the LED device is restricted and the design expansion of the finished lamp is not conducive to due to the wires connecting to the electrode pads nearby after the LED chips are arranged in a cross pattern in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions to implement:

[0006] An LED device, the LED device includes an LED bracket and a first type of LED chip and a second type of LED chip disposed on the LED bracket. The LED bracket includes a base and a surrounding portion extending from the edge of the base. The base is provided with an adhesive portion and a bonding portion. The adhesive portion includes a first sub-adhesive portion for fixing the first type of LED chip and a second sub-adhesive portion for fixing the second type of LED chip. Both the first type of LED chip and the second type of LED chip include at least two and are connected in series through wires. The bonding portion includes at least two first sub-bonding portions spaced apart on the base and at least two second sub-bonding portions spaced apart on the base. The first type of LED chip is connected in series between the two first sub-bonding portions, and the second type of LED chip is connected in series between the two second sub-bonding portions. And a bridging chip is further serially disposed between any two connected first type of LED chips or between the first type of LED chip and the first sub-bonding portion, and / or between any two connected second type of LED chips or between the second type of LED chip and the second sub-bonding portion for bridging.

[0007] According to one aspect of the above technical solution, both the first type of LED chip and the second type of LED chip include two. The two first type of LED chips and the two second type of LED chips are collectively disposed in the middle region of the base. The two first type of LED chips and the two second type of LED chips are both arranged obliquely. The two first type of LED chips and the two second type of LED chips are connected obliquely to each other through wires.

[0008] According to one aspect of the above technical solution, the two first type of LED chips are connected in series between the two first sub-bonding portions, and the two second type of LED chips are connected in series between the two second sub-bonding portions.

[0009] According to one aspect of the above technical solution, a bridging chip is provided between the first type of LED chip and the first sub-bonding portion.

[0010] According to one aspect of the above technical solution, between the two first type of LED chips, a bridging chip is provided between the first type of LED chip that is farther from the first sub-bonding portion to which it is connected and its corresponding first sub-bonding portion.

[0011] According to one aspect of the above technical solution, the bridging chip is disposed on the second sub-bonding portion on the same side as the first sub-bonding portion. Both ends of the bridging chip are respectively connected to the first type of LED chip and the first sub-bonding portion through wires.

[0012] According to one aspect of the above technical solution, the enclosing part protrudes outward from the edge of the base to enclose a receiving space above the base, and both the first type of LED chips and the second type of LED chips are disposed in the receiving space.

[0013] According to one aspect of the above technical solution, the inner wall of the enclosing part forms a preset inclination angle with the base, and the thickness of the enclosing part near the base is greater than the thickness of the enclosing part away from the base.

[0014] According to one aspect of the above technical solution, a first fluorescent glue and a second fluorescent glue are further filled in the receiving space. The second fluorescent glue covers the second type of LED chips, and the first fluorescent glue fills the receiving space and covers both the second fluorescent glue and the first type of LED chips together.

[0015] According to one aspect of the above technical solution, the light emitted by the first type of LED chips emits white light after being excited by the first fluorescent glue, and the light emitted by the second type of LED chips emits warm light after being jointly excited by the first fluorescent glue and the second fluorescent glue.

[0016] Compared with the prior art, the beneficial effects of adopting the LED device shown in the present utility model are as follows:

[0017] By making the bonding part include a first sub-bonding part for fixing the first type of LED chips and a second sub-bonding part for fixing the second type of LED chips, both the first type of LED chips and the second type of LED chips are at least two and are connected in series through wires, and by making the bonding part include at least two first sub-bonding parts arranged at intervals on the base and at least two second sub-bonding parts arranged at intervals on the base, at least two first type of LED chips are connected in series between the two first sub-bonding parts, and at least two second type of LED chips are connected in series between the two second sub-bonding parts, and a bridging chip is further connected in series between any two adjacent first type of LED chips or between a first type of LED chip and a first sub-bonding part, and / or between any two adjacent second type of LED chips or between a second type of LED chip and a second sub-bonding part for bridging, then in the LED device, the LED chips can maintain a better light mixing effect by maintaining a cross-layout manner, and through the setting of the bridging chip, while maintaining the original uniform arrangement, the bonding parts with the same color temperature and their electrode pads are on the same side, making the design of the finished lamps at the downstream application end more flexible, reducing jumper wires, improving the production efficiency of the finished lamps, and improving the reliability of the finished lamps. Description of the Drawings

[0018] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0019] Figure 1 Schematic structural diagram of the LED device without a connected wire in the first embodiment of the present utility model;

[0020] Figure 2 Schematic structural diagram of the LED device with a connected wire in the first embodiment of the present utility model;

[0021] Figure 3 Cross-sectional schematic diagram of the LED device shown in the first embodiment of the present utility model;

[0022] Figure 4 Schematic structural diagram of the LED device with a connected wire in the second embodiment of the present utility model;

[0023] Figure 5 Schematic structural diagram of the LED device with a connected wire in the third embodiment of the present utility model;

[0024] Explanation of the reference numerals of the components in the drawings:

[0025] LED bracket 10, base 11, enclosure part 12, accommodation space 13, bonding part 20, first sub-bonding part 21, second sub-bonding part 22, bonding part 30, first sub-bonding part 31, second sub-bonding part 32, first type of LED chip 40, second type of LED chip 50, wire 60, bridging chip 70, first fluorescent glue 80, second fluorescent glue 90, electrode pad 100. Detailed implementation manners

[0026] To make the objectives, features, and advantages of the present utility model more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present utility model with reference to the accompanying drawings. Several embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used herein in the specification of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] Embodiment 1

[0029] Please refer to Figures 1 - 3, the first embodiment of the present utility model provides an LED device, which is a light-emitting device after the LED chip is encapsulated, and can be used to emit white light, mixed light, etc., which needs to be adjusted according to actual needs.

[0030] In this embodiment, the LED device includes an LED bracket 10 and an LED chip disposed on the LED bracket 10. There are two types of LED chips, which are used to emit different colors of light, such as white light and warm light. Therefore, in this embodiment, the two types of LED chips are respectively defined as the first type of LED chip 40 and the second type of LED chip 50. The LED bracket 10 includes a base 11 and a surrounding portion 12 extending outward from the edge of the base 11. The base 11 is horizontally arranged, and the surrounding portion 12 extends outward from the edge of the base 11 to form a raised surrounding portion 12 on the base 11, so as to enclose a receiving space 13 through the cooperation of the base 11 and the surrounding portion 12. The above-mentioned first type of LED and the second type of LED chip 50 are disposed in the receiving space 13.

[0031] Among them, the surrounding portion 12 is made of, for example, PPA material, and can be fixed on the base 11 by bonding or other means after injection molding, so as to enclose the receiving space 13. And the thickness of the surrounding portion 12 near the base 11 is greater than the thickness of the side away from the base 11. Specifically, the inner surface of the surrounding portion 12 gradually inclines outward from the side close to the base 11, and the wall thickness gradually decreases, so as to enclose a receiving space 13 with an increasingly larger opening on the base 11 to obtain the bowl cup structure of the LED device. The above-mentioned first type of LED chip 40 and the second type of LED chip 50 are disposed in the bowl cup structure. The light emitted by the LED chip is condensed and guided by the bowl cup structure, and then the light is irradiated out through the side of the surrounding portion 12 away from the base 11.

[0032] Among them, a bonding portion 20 and a bonding pad portion 30 are provided on the base 11. The bonding portion 20 is used to fix the above-mentioned first type of LED chip 40 and the second type of LED chip 50 on the base 11. The first type of LED chip 40 and the second type of LED chip 50 are respectively connected to the bonding pad portion through a wire 60. The bonding pad portion 30 is also connected to an electrode pad 100 disposed on the back of the base 11. The electrode pad 100 is used to be welded and fixed to the PCB circuit board to realize the electrical connection of the LED chip. Then the LED chip can emit light when the circuit is turned on.

[0033] Specifically, there are two first - type LED chips 40 and two second - type LED chips 50 in this embodiment. Correspondingly, the bonding part 20 disposed on the base 11 has a first sub - bonding part 21 and a second sub - bonding part 22, and there are two of each of the first sub - bonding part 21 and the second sub - bonding part 22. The above - mentioned first sub - bonding part 21 is used to fix the first - type LED chip 40 on the base 11, and the second sub - bonding part 22 is used to fix the second - type LED chip 50 on the base 11. The two first - type LED chips 40 are arranged diagonally opposite to each other, and the two second - type LED chips 50 are arranged diagonally opposite to each other. The two first - type LED chips 40 and the two second - type LED chips 50 are arranged alternately around the center point of the base 11. Therefore, the first sub - bonding part 21 and the second sub - bonding part 22 need to be arranged according to the arrangement of the above - mentioned LED chips.

[0034] Of course, the structures of the first sub - bonding part 21 and the second sub - bonding part 22 are the same. They are both formed by fixing a bonding medium on the base 11, and only the positions are different. In this embodiment, they are described differently to adapt to the arrangement of the LED chips.

[0035] Similarly, the bonding part 30 disposed on the base 11 has a first sub - bonding part 31 and a second sub - bonding part 32, and there are two of each of the first sub - bonding part 31 and the second sub - bonding part 32. The two first sub - bonding parts 31 are respectively disposed on both sides of one end of the base 11, and the two second sub - bonding parts 32 are respectively disposed on both sides of the other end of the base 11. It is easy to understand that the two first sub - bonding parts 31 are disposed on both sides in the first direction of the base 11, and the two second sub - bonding parts 32 are disposed on both sides in the second direction of the base 11. And the two first sub - bonding parts 31 and the two second sub - bonding parts 32 can be set at the four - corner positions of the base 11, or can be spaced apart on the base 11 without being set at the four - corner positions. For example, the two first sub - bonding parts 31 are respectively set at the corner positions of the base 11, while the two second sub - bonding parts 32 are only set on both sides of the middle of the base 11.

[0036] More specifically, since the two first - type LED chips 40 are arranged obliquely on both sides of the center point of the base 11, an oblique connection needs to be made between the two first - type LED chips 40 through a wire 60. For example, the negative electrode of the first first - type LED chip 40 is obliquely connected to the positive electrode of the second first - type LED chip 40 through the wire 60. Similarly, since the two second - type LED chips 50 are arranged obliquely on both sides of the center point of the base 11, an oblique connection also needs to be made between the two second - type LED chips 50 through the wire 60. For example, the negative electrode of the first second - type LED chip 50 is obliquely connected to the positive electrode of the second second - type LED chip 50 through the wire 60. The above settings make the wires 60 between the two first - type LED chips 40 and the two second - type LED chips 50 cross - arranged, but the wires 60 are spaced apart for insulation. The above - mentioned wire 60 can be, for example, a gold wire, a silver wire, etc., and it can be fixed on the LED chip and the bonding part by soldering flux.

[0037] In this embodiment, in order to enable the bonding parts and their electrode pads 100 of LED chips with the same color temperature to be arranged on the same side of the base 11, between the two first - type LED chips 40, a bridging chip 70 is provided between the first - type LED chip 40 that is farther from the first sub - bonding part 31 to which it is connected and its corresponding first sub - bonding part 31. By providing the bridging chip 70 between the first - type LED chip 40 and the first sub - bonding part 31, it is equivalent to providing a transfer point for the setting of the wire 60. While maintaining the uniform arrangement of the LED chips, the bonding parts and their electrode pads 100 corresponding to the LED chips with the same color temperature are on the same side of the base 11. This can make the downstream application end more flexible in the design of finished lamps, reduce the jumper of the wire 60, improve the production efficiency of the finished lamps, and improve the reliability of the finished lamps.

[0038] Specifically, the bridging chip 70 can be fixed on the second sub - bonding part 32 on the same side by an adhesive bonding method. The wire 60 led out from the first - type LED chip 40 is connected to one end of the bridging chip 70, and the other end of the bridging chip 70 is connected to the corresponding first sub - bonding part 31 through another wire 60, thus realizing the electrical connection between the first - type LED chip 40 and the first sub - bonding part 31.

[0039] It is easy to understand that since the LED chips are arranged diagonally, the wire 60 connecting the LED chip and the bonding part needs to be set with jumper wires. Specifically, because the wire 60 that needs to be set between the first type of LED chip 40 and the first sub-bonding part 31 is relatively long and inevitably needs to cross other wires 60. To avoid jumper wires, in this embodiment, a bridging chip 70 is provided on the second sub-bonding part 32 between the first type of LED chip 40 and the first sub-bonding part 31 and used as a transfer point for the wire 60, then the jumper wire setting of the wire 60 can be avoided, and it is ensured that the bonding parts and their electrode pads 100 of the LED chips with the same color temperature are located on the same side of the base 11, that is, the two first sub-bonding parts 31 connected to both ends of the two first type of LED chips 40 are located on one side of the base 11, and the two second sub-bonding parts 32 connected to both ends of the two second type of LED chips 50 are located on the other side of the base 11. Then, the bonding parts do not need to be arranged diagonally on the base 11, which is beneficial to the actual application of the subsequent finished lamps.

[0040] In addition, after the LED chips are fixed on the base 11 and the wires are fixed, the LED device also needs to be encapsulated. Specifically, a fluorescent glue formed by mixing fluorescent powder and silica gel is filled in the accommodation space 13 formed by enclosing the base 11 and the enclosure part 12, including a first fluorescent glue 80 and a second fluorescent glue 90. The mixing ratios of the fluorescent powder and silica gel in the first fluorescent glue 80 and the second fluorescent glue 90 are different, so their color rendering indexes are different, and then their colors are different after being excited by the light emitted by the LED chips.

[0041] Specifically, a second fluorescent glue 90 is covered on the second type of LED chip 50. After the second fluorescent glue 90 is dried and cured, the first fluorescent glue 80 is filled in the entire accommodation space 13. The first fluorescent glue 80 covers the first type of LED chip 40, the dried and cured second fluorescent glue 90, and the remaining uncovered base 11 together. That is, only the first fluorescent glue 80 is covered on the first type of LED chip 40, while the second type of LED chip 50 is covered with the second fluorescent glue 90 and the first fluorescent glue 80 in a stacked manner. Since the proportion of the fluorescent powder in the first fluorescent glue 80 and the second fluorescent glue 90 is different, their display indexes are different. Specifically, it is required that the light emitted by the first type of LED chip 40 after being excited by the first fluorescent glue 80 is white light during the preparation of the first fluorescent glue 80, while the light emitted by the second type of LED chip 50 is warm light after being doubly excited by the second fluorescent glue 90 and the first fluorescent glue 80.

[0042] Of course, the above-mentioned first type of LED chip 40 and the second type of LED chip 50 can be individually powered on and lit, or jointly powered on and lit to emit mixed light.

[0043] Embodiment 2

[0044] Please refer toFigure 4 , the second embodiment of the present invention also provides an LED device. The LED device shown in this embodiment is basically similar to the LED device shown in the first embodiment, and the difference lies in that:

[0045] In this embodiment, there are three first-type LED chips 40 and three second-type LED chips 50. The three first-type LED chips 40 are connected in series between two first sub-bonding parts 31, and the three second-type LED chips 50 are connected in series between two second sub-bonding parts 32. A bridging chip 70 is provided between the second sub-bonding part 32 and the first second-type LED chip 50 connected thereto, and the bridging chip 70 is disposed on the first sub-bonding part 31.

[0046] Specifically, the second sub-bonding part 32 is connected to one end of the bridging chip 70 through a wire 60, and the other end of the bridging chip 70 is connected to the first second-type LED chip 50 through a wire 60. The bridging chip 70 and the first second-type LED chip 50 can be directly connected through the wire 60, or can be connected through the wire 60 and a preset sub-bonding part for transition connection.

[0047] Of course, there can be four, five, etc. first-type LED chips 40 and second-type LED chips 50 respectively, and the set numbers of the first-type LED chips 40 and the second-type LED chips 50 can be inconsistent. For example, there are four first-type LED chips 40 and five second-type LED chips 50.

[0048] Embodiment Three

[0049] Please refer to Figure 5 , the third embodiment of the present invention also provides an LED device. The LED device shown in this embodiment is basically similar to the LED device shown in the first embodiment, and the difference lies in that:

[0050] In this embodiment, since the numbers of the first-type LED chips 40 and the second-type LED chips 50 are relatively large, both the numbers of the first-type LED chips 40 and the second-type LED chips 50 are eight. The bridging chips 70 shown in this embodiment are not only serially arranged between two adjacent first-type LED chips 40, but also the above-mentioned bridging chips 70 are simultaneously serially arranged between two adjacent second-type LED chips 50. Two mutually independent and insulated conductive channels are provided on the bridging chip 70, so as to realize the dual bridging effect of adjacent first-type LED chips 40 and adjacent second-type LED chips 50 through the bridging chip 70, so as to reduce the jumpers in the LED chip layout.

[0051] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0052] The above-described embodiments merely represent several implementation manners of the present utility model, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several variations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. An LED device, the LED device includes an LED bracket and a first type of LED chip and a second type of LED chip disposed on the LED bracket, the LED bracket includes a base and a surrounding portion extending from the edge of the base, and is characterized in that, The base is provided with an adhesion part and a bonding part. The adhesion part includes a first sub-adhesion part for fixing the first type of LED chips and a second sub-adhesion part for fixing the second type of LED chips. Both the first type of LED chips and the second type of LED chips include at least two and are connected in series through wires. The bonding part includes at least two first sub-bonding parts spaced apart on the base, and at least two second sub-bonding parts spaced apart on the base. The first type of LED chips are connected in series between the two first sub-bonding parts, and the second type of LED chips are connected in series between the two second sub-bonding parts. Moreover, between any two connected first type of LED chips or between the first type of LED chips and the first sub-bonding parts, and / or between any two connected second type of LED chips or between the second type of LED chips and the second sub-bonding parts, bridging chips are also connected in series for bridging.

2. The LED device according to claim 1, characterized in that, Both the first type of LED chips and the second type of LED chips include two. The two first type of LED chips and the two second type of LED chips are gathered and arranged in the middle area of the base. The two first type of LED chips and the two second type of LED chips are both arranged obliquely. The two first type of LED chips and the two second type of LED chips are obliquely connected to each other through wires.

3. The LED device according to claim 2, characterized in that, The two first type of LED chips are connected in series between the two first sub-bonding parts, and the two second type of LED chips are connected in series between the two second sub-bonding parts.

4. The LED device according to claim 1, wherein A bridging chip is provided between the first type of LED chip and the first sub-bonding part.

5. The LED device according to claim 4, wherein, Between one of the two first type of LED chips that is farther from the first sub-bonding part to which it is connected and its corresponding first sub-bonding part, a bridging chip is provided.

6. The LED device according to claim 5, characterized in that, The bridging chip is provided on the second sub-bonding part on the same side of the first sub-bonding part. Both ends of the bridging chip are respectively connected to the first type of LED chip and the first sub-bonding part through wires.

7. The LED device according to any one of claims 1-6, characterized in that, The enclosing part protrudes outward from the edge of the base to enclose a containing space above the base. Both the first type of LED chips and the second type of LED chips are arranged in the containing space.

8. The LED device according to claim 7, characterized in that, The inner wall of the enclosing part forms a preset inclination angle with the base, and the thickness of the enclosing part near the base is greater than the thickness of the enclosing part far from the base.

9. The LED device according to claim 7, characterized in that, The containing space is also filled with a first fluorescent glue and a second fluorescent glue. The second fluorescent glue covers the second type of LED chips, and the first fluorescent glue fills the containing space and covers both the second fluorescent glue and the first type of LED chips.

10. The LED device according to claim 9, characterized in that, The light emitted by the first type of LED chips emits white light after being excited by the first fluorescent glue, and the light emitted by the second type of LED chips emits warm light after being excited by the first fluorescent glue and the second fluorescent glue together.

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