Grinding device for wafer production

Abstract

The utility model discloses a grinding device for wafer production, belongs to the related technical field of wafers, and aims to solve the problems that in the prior art, only one end face of a wafer can be ground at a time when the surface of the wafer is ground, and the top end and the bottom end of the wafer need to be ground when the surface of the wafer is ground, so that the wafer production efficiency is high. The wafer surface grinding device comprises a shell, one end of the shell is fixedly connected with a pipe body, the pipe body and the shell are both filled with hydraulic oil, a first push rod is installed on the pipe body, a piston is driven by the push rod to move in the pipe body, and then the hydraulic oil can be injected into multiple sets of cylinders; the two end faces of the wafer can be ground at a time by means of contact between the front grinding disc and the rear grinding disc and the two end faces of the wafer, and the surface grinding operation efficiency of the wafer is relatively high.

Description

Technical Field

[0001] The utility model belongs to the technical field related to wafers, and more specifically, particularly relates to a grinding device for wafer production. Background Technique

[0002] When processing wafers, in order to ensure the flatness of the wafer surface, the wafer surface will be ground. There is a existing surface grinding device for wafer production and processing (application number: 201821494866.2), which can improve the clamping effect, but it cannot adapt to the clamping of wafer slices of different sizes, and at the same time prevent the wafer slices from being damaged during the clamping process; there is no need for manual use of a grinding sand disk to grind the top surface of the wafer slices, saving manpower, ensuring the flatness of the grinding surface, improving the grinding effect, and improving the practicability.

[0003] The above situation exists. When performing surface grinding on the wafer, only one end face of the wafer can be ground at a time. When performing surface grinding on the wafer, it is usually necessary to grind both the top and bottom ends of the wafer to complete the grinding work of the wafer, and the operation efficiency of the surface grinding of the wafer is relatively poor. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a grinding device for wafer production to solve the technical problem that when performing surface grinding on the wafer in the prior art, only one end face of the wafer can be ground at a time. When performing surface grinding on the wafer, it is usually necessary to grind both the top and bottom ends of the wafer to complete the grinding work of the wafer, and the operation efficiency of the surface grinding of the wafer is relatively poor.

[0005] To achieve the above object, the utility model is realized through the following technical solutions: A grinding device for wafer production, including a housing, one end of the housing is fixedly connected with a pipe body, hydraulic oil is filled in both the pipe body and the housing, a first push rod is installed on the pipe body, a piston is fixedly connected to the output end of the first push rod, the outer wall of the piston is slidably connected to the inner wall of the pipe body, a plurality of cylinder bodies are fixedly connected to the housing, piston rods are slidably connected to the inner walls of the plurality of cylinder bodies, clamping plates are fixedly connected to the plurality of piston rods, a column body is rotatably connected to the housing through a bearing, plate bodies are fixedly connected to both ends of the column body, second push rods are installed on both of the plate bodies, motors are installed on the output ends of the two second push rods, and grinding disks are installed on the output ends of the two motors.

[0006] As a preferred technical solution of the utility model, two hole bodies are processed on the housing, an insertion rod is in clearance fit with the inner wall of one of the hole bodies, the insertion rod is in clearance fit with one of the plate bodies, a spring is in clearance fit with the outer wall of the insertion rod, and one end and the other end of the spring are fixedly connected to the insertion rod and the corresponding plate body respectively.

[0007] As a preferred technical solution of the present utility model, rubber pads are fixedly connected to multiple groups of the clamping plates.

[0008] As a preferred technical solution of the present utility model, two groups of bases are fixedly connected to the bottom end of the housing.

[0009] As a preferred technical solution of the present utility model, two groups of valve bodies are fixedly connected to the housing.

[0010] As a preferred technical solution of the present utility model, a handle is fixedly connected to the insertion rod.

[0011] The present utility model provides a grinding device for wafer production, which has the following beneficial effects:

[0012] 1. Through the cooperation among hydraulic oil, push rod, piston, cylinder body, piston rod, housing, pipe body, clamping plate and grinding disc, by driving the piston to move in the pipe body with the push rod, hydraulic oil can be injected into multiple groups of cylinder bodies, and then multiple groups of piston rods are pushed to approach each other, so that multiple groups of clamping plates can vertically clamp and place the wafer. At this time, by contacting the front and rear grinding discs with both end faces of the wafer, the grinding treatment of both end faces of the wafer can be carried out at one time, and the surface grinding operation efficiency of the wafer is relatively high.

[0013] 2. Through the cooperation among the insertion rod, column body, hole body and spring, by making the insertion rod have a clearance fit with two groups of hole bodies, two groups of plate bodies can be placed horizontally or vertically, and the positions of the two groups of grinding discs can be adjusted, thus facilitating the installation or disassembly of the wafer. Description of the Drawings

[0014] Figure 1 is a three-dimensional structure schematic diagram of the structure of the present utility model;

[0015] Figure 2 is a sectional structure schematic diagram of the structure of the present utility model;

[0016] Figure 3 is Figure 1 a schematic diagram of the structures of the housing, column body and plate body in

[0017] Figure 4 is Figure 2 a schematic diagram of the structures of the clamping plate, hydraulic oil and column body in

[0018] In the figure: 1. Housing; 2. Pipe body; 3. First push rod; 4. Piston; 5. Cylinder body; 6. Piston rod; 7. Clamping plate; 8. Hydraulic oil; 9. Column body; 10. Plate body; 11. Second push rod; 12. Motor; 13. Grinding disc; 14. Hole body; 15. Insertion rod; 16. Spring; 17. Rubber pad; 18. Valve body; 19. Base; 20. Handle. Detailed Embodiments

[0019] The embodiments of the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0020] In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more; the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0022] Please refer to Figures 1 to 4 , the present utility model provides a technical solution: a grinding device for wafer production, including a housing 1, a pipe body 2 is fixedly connected to one end of the housing 1, hydraulic oil 8 is filled in both the pipe body 2 and the housing 1, a first push rod 3 is installed on the pipe body 2, a piston 4 is fixedly connected to the output end of the first push rod 3. When the first push rod 3 drives the piston 4 to move up and down, the hydraulic oil 8 can be injected into or drawn out of multiple cylinder bodies 5, and then the piston rod 6 can move telescopically in the corresponding cylinder body 5. The outer wall of the piston 4 is slidably connected to the inner wall of the pipe body 2. Multiple cylinder bodies 5 are fixedly connected to the housing 1, piston rods 6 are slidably connected to the inner walls of multiple cylinder bodies 5, clamping plates 7 are fixedly connected to multiple piston rods 6, a cylinder 9 is rotatably connected to the housing 1 through a bearing, plate bodies 10 are fixedly connected to both ends of the cylinder 9, second push rods 11 are installed on both plate bodies 10, motors 12 are installed on the output ends of the two second push rods 11, and the model of the motor 12 is selected according to actual working requirements. The second push rod 11 is used to bring the grinding disc 13 into contact with the wafer, and then the surface of the wafer can be ground. Grinding discs 13 are installed on the output ends of the two motors 12. The wafer is vertically fixed by multiple clamping plates 7, and the two grinding discs 13 are respectively brought into contact with one end and the other end of the wafer, so that the grinding of both end faces of the wafer can be completed at one time.

[0023] Among them, two groups of hole bodies 14 are machined on the housing 1. A plug rod 15 is in clearance fit with the inner wall of one group of hole bodies 14. The two groups of hole bodies 14 are distributed at 90 degrees with the cylinder 9 as the center. One group of hole bodies 14 is placed above the cylinder 9, and the other group of hole bodies 14 is placed on the right side of the cylinder 9. The plug rod 15 is in clearance fit with one group of plate bodies 10. A spring 16 is in clearance fit with the outer wall of the plug rod 15. The spring 16 gives the force for the clearance fit between the plug rod 15 and the hole body 14. One end and the other end of the spring 16 are fixedly connected to the plug rod 15 and the corresponding plate body 10 respectively. By making the plug rod 15 in clearance fit with the two groups of hole bodies 14, the two groups of plate bodies 10 can be placed vertically or horizontally, and then the grinding disc 13 can be removed from blocking the multiple groups of clamping plates 7, which is convenient for placing or taking out the wafer between the multiple groups of clamping plates 7.

[0024] Among them, rubber pads 17 are fixedly connected to the multiple groups of clamping plates 7. The rubber pads 17 are used to contact the wafer instead of the clamping plates 7, which can avoid damage to the wafer caused by the clamping plates 7 and can also improve the stability of clamping and fixing the wafer by the clamping plates 7.

[0025] Among them, two groups of bases 19 are fixedly connected to the bottom end of the housing 1.

[0026] Among them, two groups of valve bodies 18 are fixedly connected to the housing 1. The upper valve body 18 is used to inject hydraulic oil 8 into the housing 1 and the pipe body 2, and the lower valve body 18 is used to discharge the hydraulic oil 8 in the pipe body 2 and the housing 1.

[0027] Among them, a handle 20 is fixedly connected to the plug rod 15. The handle 20 is used to drive the plug rod 15 to be pulled out.

[0028] Specific usage method and function of this embodiment:

[0029] When this utility model is in use, the handle 20 drives the plug rod 15 to cancel the clearance fit with the corresponding hole body 14. At this time, the plug rod 15 can drive the two groups of plate bodies 10 and the cylinder 9 to rotate. After rotation, the plug rod 15 is re-made in clearance fit with the other group of hole bodies 14, and the two groups of plate bodies 10 can be changed from horizontal to vertical placement. At this time, the wafer can be placed between the multiple groups of clamping plates 7. When placing, the first push rod 3 is connected to an external power supply to drive the piston 6 to move downward in the pipe body 2, and the hydraulic oil 8 can be injected into the multiple groups of cylinders 5. Then, the multiple groups of piston rods 6 can move closer to each other, so that the multiple groups of clamping plates 7 can clamp and fix the wafer vertically. After fixing, the plate body 10 is re-changed to horizontal placement, and the second push rod 11 and the motor 12 are connected to an external power supply. The second push rod 11 can drive the corresponding motor 12 and the grinding disc 13 to approach the wafer. When the two groups of motors 12 drive the grinding disc 13 to rotate and contact the two end faces of the wafer, double-end surface grinding treatment can be performed on the wafer. When the grinding work is completed, the plate body 10 is re-changed to vertical placement, and the clamping and fixing of the multiple groups of clamping plates 7 against the wafer is cancelled, and the wafer can be taken out and collected.

[0030] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A grinding device for wafer production, characterized in that: It includes a housing (1), one end of the housing (1) is fixedly connected with a pipe body (2), hydraulic oil (8) is filled inside both the pipe body (2) and the housing (1), a first push rod (3) is installed on the pipe body (2), a piston (4) is fixedly connected to the output end of the first push rod (3), the outer wall of the piston (4) is slidably connected to the inner wall of the pipe body (2), multiple groups of cylinders (5) are fixedly connected to the housing (1), piston rods (6) are slidably connected to the inner walls of multiple groups of cylinders (5), clamping plates (7) are fixedly connected to multiple groups of piston rods (6), a column body (9) is rotatably connected to the housing (1) through a bearing, plate bodies (10) are fixedly connected to one end and the other end of the column body (9), second push rods (11) are installed on both groups of plate bodies (10), motors (12) are installed on the output ends of both groups of second push rods (11), and grinding discs (13) are installed on the output ends of both groups of motors (12).

2. The grinding device for wafer production according to claim 1, characterized in that: Two groups of holes (14) are machined on the housing (1), a plug rod (15) is in clearance fit with the inner wall of one group of holes (14), the plug rod (15) is in clearance fit with one group of plate bodies (10), a spring (16) is in clearance fit with the outer wall of the plug rod (15), and one end and the other end of the spring (16) are fixedly connected to the plug rod (15) and the corresponding plate body (10) respectively.

3. A grinding device for wafer production according to claim 1, characterized in that: Rubber pads (17) are fixedly connected to multiple groups of clamping plates (7).

4. A grinding device for wafer production according to claim 1, characterized in that: Two groups of bases (19) are fixedly connected to the bottom end of the housing (1).

5. A grinding device for wafer production according to claim 1, characterized in that: Two groups of valve bodies (18) are fixedly connected to the housing (1).

6. The lapping device for wafer production according to claim 2, characterized in that: A handle (20) is fixedly connected to the plug rod (15).

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