Miniaturized multi-channel high-power transceiving assembly

Abstract

The utility model provides a miniaturized multi-channel high-power transmit-receive assembly, which comprises a circuit structure and an assembly structure, the circuit structure comprises a radio frequency circuit and a low frequency circuit, wherein the radio frequency circuit comprises a plurality of groups of radio frequency links; the low-frequency circuit comprises a power conversion circuit, a modulation circuit and a filter circuit; the assembly structure comprises a multi-layer plate and a cavity. A bare chip and a packaging device are carried on the multilayer board; the cavity provides a channel sub-cavity for each receiving and transmitting channel; the radio frequency circuit and the low frequency circuit are respectively arranged on two sides of the cavity. According to the utility model, the feasible output power of the transmitting channel can be improved, and the internal space of the product is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of radar, and particularly relates to a miniaturized multi-channel high-power transceiver module. Background Art

[0002] Transceiver modules are widely used in various active phased array radar arrays and occupy a relatively large volume and weight. With the gradual emergence of requirements such as conformal, stealth, and lightweight for the radar mounting platform, the development of high-frequency transceiver modules with small size, high integration, and high power has important engineering significance and practical value for phased array radars. However, during the development process, the high degree of integration and the requirement for higher output power will bring the following problems: (1) As the number of channels of the transceiver module increases, the layout of channels will become more compact in a limited space, and the electrical interconnection will also become more complex. Moreover, insulators are often used for electrical interconnection in high-frequency transceiver modules, which not only increases the assembly process but also occupies the internal space of the product. The schematic diagram of the assembly of a traditional microwave transceiver module is as shown in Figure 1 shown; (2) The high output power of the channels requires very high heat dissipation for the product. In order to ensure the output power, high-power amplifier chips will be selected for the product, and the corresponding heat consumption of the product will also increase. If the heat cannot be conducted to the heat dissipation surface in time, the channels cannot work normally and stably, and in severe cases, the amplifier chips will be burned out.

[0003] Based on this, the utility model proposes a miniaturized multi-channel high-power transceiver module, which improves the feasible output power of the transmitting channels and saves the internal space of the product through the layout of each structure. Content of the Utility Model

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a miniaturized multi-channel high-power transceiver module, which can ensure the heat dissipation efficiency while improving the space utilization rate.

[0005] The purpose of the utility model is realized through the following technical solutions:

[0006] A miniaturized multi-channel high-power transceiver module includes a circuit structure and an assembly structure; the circuit structure includes a radio frequency circuit and a low-frequency circuit, wherein:

[0007] The radio frequency circuit includes multiple groups of radio frequency links; each group of radio frequency links is composed of multiple groups of transceiver channels and a power divider

[0008] The low-frequency circuit includes a power conversion circuit, a modulation circuit, and a filtering circuit;

[0009] The assembly structure includes a multilayer board and a cavity; bare chips and packaged devices are mounted on the multilayer board; the cavity provides channel sub-cavities for each transceiver channel; the radio frequency circuit and the low-frequency circuit are respectively arranged on both sides of the cavity.

[0010] Optionally or preferably, each of the radio frequency links is assembled in the cavity by bonding and sintering.

[0011] Optionally or preferably, a hollow structure is provided on one side of the cavity close to the multi-layer board; the multi-layer board is bonded in the hollow structure.

[0012] Optionally or preferably, the cavity is of a stepped structure.

[0013] Optionally or preferably, the multi-layer board is a 10-layer hybrid board; the multi-layer board is made of FR4.

[0014] Optionally or preferably, the miniaturized multi-channel high-power transceiver module is an eight-channel transceiver module; the radio frequency circuit includes two groups of radio frequency links; each group of the radio frequency links is composed of four groups of transceiver channels and a power divider.

[0015] Optionally or preferably, the assembly structure further includes an upper cover plate, a mounting plate and a lower cover plate; the multi-layer board is arranged below the cavity; the lower cover plate is arranged below the multi-layer board to encapsulate and fix the multi-layer board in the lower cavity of the cavity; the mounting plate is arranged above the cavity to fix the radio frequency circuit in each channel sub-cavity of the cavity through screw connectors; the upper cover plate is arranged above the mounting plate to encapsulate and fix the mounting plate and the screw connectors in the upper cavity of the cavity.

[0016] Based on the above technical solutions, the following technical effects can be achieved:

[0017] A miniaturized multi-channel high-power transceiver module provided by the present utility model can be applied to various active phased array radar arrays, can realize the reception and transmission of multi-channel radio frequency signals, and has the characteristics of small size, high integration and high power. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0019] Figure 1 It is a schematic assembly diagram of a traditional microwave transceiver module;

[0020] Figure 2 It is a principle block diagram of an eight-channel transceiver module in the present utility model;

[0021] Figure 3 It is a top view of the cavity in the present utility model;

[0022] Figure 4 It is the bottom view of the cavity in the present utility model;

[0023] Figure 5 It is the cross-sectional view of the cavity in the present utility model;

[0024] Figure 6 It is the exploded view of the present utility model;

[0025] Description of the drawings in the figure:

[0026] 1 - RF link, 101 - transceiver channel, 2 - cavity, 3 - multilayer board, 4 - upper cover plate, 5 - mounting plate, 6 - lower cover plate, A1 - cover plate, A2 - high-frequency board, A3 - low-frequency board, A4 - cavity, A5 - glass insulator, A6 - chip, A7 - packaged device. Specific implementation manners

[0027] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0028] In a preferred embodiment:

[0029] This embodiment provides a miniaturized multi-channel high-power transceiver assembly, as Figure 2-5 shown, including a circuit structure and an assembly structure; the circuit structure includes a radio frequency circuit and a low-frequency circuit, wherein:

[0030] This miniaturized multi-channel high-power transceiver assembly is an eight-channel transceiver assembly; the radio frequency circuit includes two groups of RF links 1; each group of the RF links 1 is composed of four groups of transceiver channels 101 and a power divider;

[0031] The low-frequency circuit includes a power conversion circuit, a modulation circuit and a filtering circuit;

[0032] The assembly structure includes a multilayer board 3 and a cavity 2; bare chips and packaged devices are mounted on the multilayer board 3; the cavity 2 provides channel sub-cavities for each transceiver channel 101; the radio frequency circuit and the low-frequency circuit are respectively arranged on both sides of the cavity 2.

[0033] Furthermore, in this embodiment, each of the RF links is assembled in the cavity by means of bonding and sintering.

[0034] Furthermore, in this embodiment, a hollow structure is provided on one side of the cavity 2 close to the multilayer board; the multilayer board 3 is bonded in the hollow structure.

[0035] Furthermore, in this embodiment, as Figure 5 shown, the cavity is a stepped structure. While ensuring the interconnection of RF devices and the reasonable layout of low-frequency RF circuits, it can keep the bottom cavity of the power amplifier chip complete, so as to achieve the rapid conduction of heat from the chip to the cavity, thereby ensuring the stable output of high-power signals in the channel.

[0036] Furthermore, in this embodiment, the multilayer board is a 10-layer hybrid board; the multilayer board is made of FR4; in this embodiment, the thickness of the multilayer board is 1.8 mm. By utilizing the flexible wiring characteristics of the multilayer board, the bare chip and the packaged device are integrated on the same side, realizing the power supply and control functions of the RF circuit. In this embodiment, there is no need to use insulators for interconnection, which saves product space and achieves the effect of reducing costs and simplifying assembly while saving product space.

[0037] Furthermore, in this embodiment, the assembly structure further includes an upper cover plate 4, a mounting plate 5, and a lower cover plate 6; the multilayer board 3 is arranged below the cavity 2; the lower cover plate 6 is arranged below the multilayer board 3 to encapsulate and fix the multilayer board 3 in the lower cavity of the cavity 2; the mounting plate 5 is arranged above the cavity 2 to fix the RF circuit in each channel sub-cavity of the cavity 2 through screw connectors; the upper cover plate 4 is arranged above the mounting plate 5 to encapsulate and fix the mounting plate 5 and the screw connectors in the upper cavity of the cavity 2.

[0038] The miniaturized multi-channel high-power transceiver module provided by this embodiment has the following advantages:

[0039] (1) The multilayer board adopts the multilayer hybrid technology, eliminating the insulator, saving the internal space of the product, and improving the product integration;

[0040] (2) The eight transceiver channels and the low-frequency circuit are respectively located on both sides of the cavity, and the cavity is in a stepped structure, solving the heat dissipation problem of the product and realizing the multi-channel high-power output of the product;

[0041] (3) The output power of the channel is ≥45 dBm, and the duty cycle is 15%;

[0042] (4) This structure can be expanded and is not limited to the eight-channel transceiver module, and can be applied to other microwave transceiver modules.

[0043] The above is only the preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications, and environments, and can be changed within the scope of the concept described herein through the above teachings or the technology or knowledge in related fields. And the changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should fall within the protection scope of the appended claims of the present invention.

Claims

1. A miniaturized multi-channel high-power transceiver module, characterized in that: It includes a circuit structure and an assembly structure; the circuit structure includes a radio frequency (RF) circuit and a low-frequency circuit, where: The RF circuit includes multiple groups of RF links; each group of RF links is composed of multiple groups of transceiver channels and a power divider. The low-frequency circuit includes a power conversion circuit, a modulation circuit, and a filtering circuit. The assembly structure includes a multilayer board and a cavity; bare chips and packaged devices are mounted on the multilayer board; the cavity provides channel sub-cavities for each transceiver channel; the RF circuit and the low-frequency circuit are respectively arranged on both sides of the cavity.

2. The miniaturized multi-channel high-power transceiver module according to claim 1, characterized in that: Each RF link is assembled in the cavity by bonding and sintering.

3. The miniaturized multi-channel high-power transceiver module according to claim 1, wherein: A hollow structure is provided on the side of the cavity close to the multilayer board; the multilayer board is bonded in this hollow structure.

4. A miniaturized multi-channel high-power transceiver module according to claim 1, characterized in that: The cavity is a stepped structure.

5. A miniaturized multi-channel high-power transceiver module according to claim 1, characterized in that: The multilayer board is a 10-layer hybrid board; the multilayer board is made of FR4.

6. The miniaturized multi-channel high-power transceiver module according to claim 1, characterized in that: This miniaturized multi-channel high-power transceiver module is an eight-channel transceiver module; the RF circuit includes two groups of RF links; each group of RF links is composed of four groups of transceiver channels and a power divider.

7. A miniaturized multi-channel high-power transceiver module according to claim 1, characterized in that: The assembly structure further includes an upper cover plate, a mounting plate, and a lower cover plate; the multilayer board is arranged below the cavity; the lower cover plate is arranged below the multilayer board to encapsulate and fix the multilayer board in the lower cavity of the cavity; the mounting plate is arranged above the cavity to fix the RF circuit in each channel sub-cavity of the cavity through screw connectors; the upper cover plate is arranged above the mounting plate to encapsulate and fix the mounting plate and the screw connectors in the upper cavity of the cavity.

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