Attached chip noise reduction and heat dissipation device

Abstract

The utility model belongs to the technical field of chip noise reduction and heat dissipation, and discloses an attached chip noise reduction and heat dissipation device which comprises an insulating heat conduction gasket, a first heat dissipation aluminum plate is attached to the top end of the insulating heat conduction gasket, and a second heat dissipation aluminum plate is attached to the bottom end of the insulating heat conduction gasket. The top end of the insulating heat-conducting gasket further comprises a chip mounting assembly; the chip installation assembly comprises a heat dissipation aluminum substrate attached to the upper surface of a first heat dissipation aluminum plate, the heat dissipation aluminum substrate of a chip is directly attached to a large metal heat dissipation sheet, no isolation material is needed in the middle, the heat dissipation sheet is specially machined in order to avoid short circuit, the heat dissipation sheet is composed of an upper heat dissipation sheet and a lower heat dissipation sheet, and the heat dissipation aluminum substrate is attached to the upper surface of the first heat dissipation aluminum plate. The upper heat dissipation plate and the lower heat dissipation plate are separated through the high-heat-conduction silica gel sheet in the middle, and then the upper heat dissipation plate and the lower heat dissipation plate are locked together through the screws with the nylon isolation sleeves, so that design external short circuit of an internal circuit of the chip is avoided, the effective size of a heat dissipation aluminum base of the chip is greatly enlarged, and thermal noise in the working process of the chip is fully released.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip noise reduction and heat dissipation, and specifically relates to a fitting type chip noise reduction and heat dissipation device. Background Technique

[0002] For chip noise reduction and heat dissipation, usually the heat dissipation aluminum base of the chip is isolated by a heat-conducting insulating material and then attached to a heat dissipation plate for heat dissipation. In this way, the internal circuit of the chip will not be short-circuited with the circuit outside the design and cause damage. However, the heat dissipation effect is average and relatively large noise will be generated.

[0003] In the existing technology, due to a layer of insulating material between the chip aluminum base and the heat dissipation aluminum plate, the thermal noise generated inside the chip cannot be fully absorbed by the metal material, resulting in larger noise particles as the chip circuit works for a longer time.

[0004] Therefore, in view of the above problems, a fitting type chip noise reduction and heat dissipation device is proposed. Summary of the Invention

[0005] To solve the problems raised in the above background technique, the utility model provides a fitting type chip noise reduction and heat dissipation device, which has the advantage that the heat dissipation aluminum base of the chip is directly attached to a large metal heat sink without any isolation material in the middle, so that the thermal noise in the chip working process can be fully released.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A fitting type chip noise reduction and heat dissipation device, including an insulating and heat-conducting gasket. A first heat dissipation aluminum plate is attached to the top end of the insulating and heat-conducting gasket, and a second heat dissipation aluminum plate is attached to the bottom end of the insulating and heat-conducting gasket. The top end of the insulating and heat-conducting gasket also includes a chip mounting component;

[0007] The chip mounting component includes a heat dissipation aluminum substrate attached to the upper surface of the first heat dissipation aluminum plate. A nylon sleeve penetrating through the insulating and heat-conducting gasket, the first heat dissipation aluminum plate and the second heat dissipation aluminum plate is provided inside the heat dissipation aluminum substrate. A chip is sleeved on the outer top end of the nylon sleeve.

[0008] Preferably, a docking component is further included on the outer side of the first heat dissipation aluminum plate;

[0009] The docking component includes a first skirt fixed on the outer side of the first heat dissipation aluminum plate, and a second skirt fixed on the outer side of the second heat dissipation aluminum plate.

[0010] Preferably, a sealing ring inserted into the second skirt is fixed at the bottom end of the first skirt, and anti-slip grooves are arranged on the outer side of the sealing ring.

[0011] Preferably, a slot is arranged at the top end of the second skirt, and the sealing ring is located inside the slot.

[0012] Preferably, a threaded sleeve is fixedly arranged on the outer side of the bottom end of the nylon sleeve, and a fastening nut that fits the lower surface of the second heat dissipation aluminum plate is spirally arranged on the outer side of the threaded sleeve.

[0013] Preferably, a limiting ring that fits the upper surface of the chip is fixedly arranged at the top end of the nylon sleeve.

[0014] Preferably, the insulating and heat-conducting gasket is set as a high thermal conductivity silica gel sheet.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] 1. In the present utility model, the heat dissipation aluminum base of the chip is directly attached to a large metal heat sink, and no isolation material is required in the middle. To avoid short circuits, special processing is performed on the heat sink. This heat sink consists of two upper and lower parts, which are isolated by a high thermal conductivity silica gel sheet in the middle, and then the upper and lower heat dissipation plates are locked together with screws with nylon isolation sleeves. In this way, external short circuits in the internal circuit design of the chip are avoided, and the effective volume of the heat dissipation aluminum base of the chip is greatly expanded, so that the thermal noise during the operation of the chip can be fully released.

[0017] 2. In the present utility model, through the cooperation of the skirt edges in the docking component, a limiting structure is formed between the insulating and heat-conducting gaskets, which can also effectively avoid the problem of the insulating and heat-conducting gasket being installed obliquely during the installation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0019] Figure 2 is an exploded structure schematic diagram of the heat dissipation component of the present utility model;

[0020] Figure 3 is an installation structure schematic diagram of the chip installation component of the present utility model.

[0021] In the figure: 1. Insulating and heat-conducting gasket; 2. First heat dissipation aluminum plate; 3. Second heat dissipation aluminum plate;

[0022] 4. Docking component; 41. First skirt edge; 42. Sealing ring; 43. Second skirt edge; 44. Slot;

[0023] 5. Chip installation component; 51. Heat dissipation aluminum substrate; 52. Chip; 53. Nylon sleeve; 54. Threaded sleeve; 55. Fastening nut; 56. Limiting ring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0025] As Figures 1 to 3 shown, the present utility model provides a conformal chip noise reduction and heat dissipation device, including an insulating and heat-conducting gasket 1. A first heat-dissipating aluminum plate 2 is attached to the top end of the insulating and heat-conducting gasket 1, and a second heat-dissipating aluminum plate 3 is attached to the bottom end of the insulating and heat-conducting gasket 1. The first heat-dissipating aluminum plate 2 and the second heat-dissipating aluminum plate 3 are stacked outside the insulating and heat-conducting gasket 1 to form a clamping heat dissipation structure. The top end of the insulating and heat-conducting gasket 1 further includes a chip mounting assembly 5;

[0026] The chip mounting assembly 5 includes a heat-dissipating aluminum substrate 51 attached to the upper surface of the first heat-dissipating aluminum plate 2. A nylon sleeve 53 that penetrates through the insulating and heat-conducting gasket 1, the first heat-dissipating aluminum plate 2, and the second heat-dissipating aluminum plate 3 is provided inside the heat-dissipating aluminum substrate 51. A chip 52 is sleeved on the outer top end of the nylon sleeve 53. The chip 52 is connected through the nylon sleeve 53, reducing the generation of noise while stably dissipating heat.

[0027] As Figures 1 to 3 shown, a docking assembly 4 is further included outside the first heat-dissipating aluminum plate 2;

[0028] The docking assembly 4 includes a first skirt 41 fixedly arranged outside the first heat-dissipating aluminum plate 2, a second skirt 43 fixedly arranged outside the second heat-dissipating aluminum plate 3. A sealing ring 42 that is inserted into the second skirt 43 is fixedly arranged at the bottom end of the first skirt 41. Anti-slip grooves are provided on the outer side of the sealing ring 42, and a slot 44 is provided at the top end of the second skirt 43. The sealing ring 42 is located inside the slot 44. The first skirt 41 and the second skirt 43 are docked through the sealing ring 42 to form a protection and limit structure.

[0029] As Figures 1 to 3 shown, a threaded sleeve 54 is fixedly arranged on the outer side of the bottom end of the nylon sleeve 53. A fastening nut 55 that fits the lower surface of the second heat-dissipating aluminum plate 3 is spirally arranged on the outer side of the threaded sleeve 54. A limiting ring 56 that fits the upper surface of the chip 52 is fixedly arranged at the top end of the nylon sleeve 53. The insulating and heat-conducting gasket 1 is set as a high thermal conductivity silicone sheet. The threaded sleeve 54 is used in cooperation with the fastening nut 55 to insert and connect the hollow nylon sleeve 53 into the inside of the first heat-dissipating aluminum plate 2 and the second heat-dissipating aluminum plate 3 for positioning.

[0030] Among them, the chip 52 is prior art and will not be elaborated; at the same time, the present utility model also includes a power supply, a controller, a switch, etc., which are not the main technical points of this patent and will not be elaborated.

[0031] The wiring diagram of the motor in the present utility model belongs to the common knowledge in the field. Its working principle is already known technology, and its model is selected according to actual use. Therefore, the control method and wiring layout of the motor will not be explained in detail.

[0032] Working principle and process:

[0033] Directly attach the chip heat dissipation aluminum substrate 51 of the chip mounting component 5 to a large metal heat sink, connect the first heat dissipation aluminum plate 2 and the second heat dissipation aluminum plate 3, without any isolation material in between. To avoid short circuits, we have made special processing on the heat sink. This heat sink consists of two upper and lower heat dissipation aluminum plates, namely the first heat dissipation aluminum plate 2 and the second heat dissipation aluminum plate 3, which are isolated by an insulating and heat-conducting gasket 1 made of high thermal conductivity silica gel in the middle. Then, a threaded sleeve 54 with a nylon sleeve 53 is used to cooperate with a fastening nut 55 to clamp the heat sink composed of the first heat dissipation aluminum plate 2 and the second heat dissipation aluminum plate 3, locking the two upper and lower heat dissipation plates together. In this way, it not only avoids external short circuits in the internal circuit of the chip 52, but also greatly expands the effective volume of the chip heat dissipation aluminum substrate 51 of the chip 52, enabling the thermal noise during the operation of the chip 52 to be fully released. At the same time, it cooperates with the docking component 4 on the outer sides of the first heat dissipation aluminum plate 2 and the second heat dissipation aluminum plate 3 to be docked with each other to form a closed structure, and insert the sealing ring 42 into the slot 44 to prevent the insulating and heat-conducting gasket 1 from being installed obliquely.

[0034] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0035] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A conformal chip noise reduction and heat dissipation device, comprising an insulating and heat-conducting gasket (1), characterized in that: A heat dissipation aluminum plate 1 is attached to the top end of the insulating and heat-conducting gasket 1, a heat dissipation aluminum plate 2 is attached to the bottom end of the insulating and heat-conducting gasket 1, and a chip mounting component 5 is further included at the top end of the insulating and heat-conducting gasket 1; The chip mounting component 5 includes a heat dissipation aluminum substrate 51 attached to the upper surface of the heat dissipation aluminum plate 1. A nylon sleeve 53 penetrating through the insulating and heat-conducting gasket 1, the heat dissipation aluminum plate 1 and the heat dissipation aluminum plate 2 is provided inside the heat dissipation aluminum substrate 51, and a chip 52 is sleeved on the outer top end of the nylon sleeve 53.

2. The conformable chip noise reduction and heat dissipation device according to claim 1, wherein: A docking component 4 is further included on the outer side of the heat dissipation aluminum plate 1; The docking component 4 includes a skirt 1 41 fixedly arranged on the outer side of the heat dissipation aluminum plate 1, and a skirt 2 43 fixedly arranged on the outer side of the heat dissipation aluminum plate 2.

3. The conformable chip noise reduction and heat dissipation device according to claim 2, characterized in that: A sealing ring 42 inserted into the skirt 2 43 is fixedly arranged at the bottom end of the skirt 1 41, and anti-slip grooves are formed on the outer side of the sealing ring 42.

4. The fitting type chip noise reduction and heat dissipation device according to claim 2, wherein: A slot 44 is formed at the top end of the skirt 2 43, and the sealing ring 42 is located inside the slot 44.

5. The conformable chip noise reduction and heat dissipation device according to claim 1, wherein: A threaded sleeve 54 is fixedly arranged on the outer bottom end of the nylon sleeve 53, and a fastening nut 55 attached to the lower surface of the heat dissipation aluminum plate 2 is spirally arranged on the outer side of the threaded sleeve 54.

6. The conformable chip noise reduction and heat dissipation device according to claim 1, wherein: A limiting ring 56 attached to the upper surface of the chip 52 is fixedly arranged at the top end of the nylon sleeve 53.

7. The fitting chip noise reduction and heat dissipation device according to claim 1, wherein: The insulating and heat-conducting gasket 1 is made of a high heat-conducting silica gel sheet.

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