Heat dissipation assembly and compressor
By designing a heat dissipation assembly including holders, heat dissipation parts and pressing parts, the problem of IGBT heat dissipation scheme affecting the stability of welding connections in the prior art is solved, and good heat dissipation performance and assembly properties are achieved.
Patent Information
- Application Number
- CN202422063734.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The existing IGBT heat dissipation solutions affect the stability and reliability of soldered connections and are difficult to find a balance between ensuring assembly and heat dissipation.
The heat dissipation assembly design includes a holder, a heat dissipation member and a pressing member is adopted. The power semiconductor device is pressed against the heat dissipation member through an elastic pressing member, and combined with the heat conducting medium layer and the metal plate part to establish an effective thermal connection and fix the assembly by screws or bolts.
It achieves the ability to ensure assembly, while providing good heat dissipation performance, and improves the stability and reliability of welding connections.
Smart Images
Figure CN223092874U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation structures. More specifically, this application relates to a heat dissipation component, which aims to provide improved assembly performance. This application also relates to a compressor, which includes the above heat dissipation component. Background Art
[0002] Power electronic devices for compressors may include power semiconductor devices, such as Insulated Gate Bipolar Transistors (IGBTs for short). Such devices tend to generate significant heat during operation, and therefore, it is desirable that the heat dissipated by such devices escapes effectively and quickly. Existing heat dissipation solutions for IGBTs include pre-assembling the IGBT and circuit modules onto a plastic bracket, and then positioning them by welding, such as welding to a circuit board. In some solutions, a pressure component is also provided to press the IGBT. For example, such a pressure component can be installed after the IGBT is positioned by welding relative to the circuit board. However, the introduction of such a pressure component can affect the stability and reliability of the welding connection. Summary of the Invention
[0003] An object of one aspect of this application is to provide a heat dissipation component that can provide good heat dissipation performance while ensuring the assemblability of the component. Another object of this application is to provide a compressor that includes the above heat dissipation component.
[0004] The object of this application is achieved by the following technical solutions:
[0005] A heat dissipation component, comprising:
[0006] A holding member, which includes opposite first and second sides;
[0007] A heat dissipation member, which is attached to the first side of the holding member, at least one first space is formed between the first side of the holding member and the heat dissipation member, and a power semiconductor device is installed in the first space; and
[0008] A pressing member, which is installed on the second side of the holding member, and the pressing member is connected to the heat dissipation member,
[0009] The pressing member is configured to apply an elastic pressure to the power semiconductor device to press the power semiconductor device against the heat dissipation member.
[0010] In the above heat dissipation component, optionally, the heat dissipation member includes a metal plate portion, the metal plate portion has opposite first and second heat interfaces, the first heat interface is oriented towards the holding member, and the heat dissipation component includes:
[0011] A second heat-conducting medium layer, which is disposed at the first thermal interface and is a flexible layer adhesively bonded between the heat sink and the power semiconductor device to establish a thermal connection between the heat sink and the power semiconductor device.
[0012] In the above heat dissipation assembly, optionally, each power semiconductor device includes a body and a plurality of pins. The holder is manufactured by injection molding and includes:
[0013] A plurality of first holes through which the pins respectively extend and are exposed at the second side of the holder;
[0014] A plurality of second holes where the body of the power semiconductor device is mounted;
[0015] The pressing member is formed by metal stamping and includes a plurality of pressing portions. The pressing portions are elastic and abut against the body of the power semiconductor device through the second holes.
[0016] In the above heat dissipation assembly, optionally,
[0017] The holder includes at least one third hole disposed near the plurality of second holes;
[0018] The pressing member includes a body. The pressing portions extend from the body. The body is provided with first mounting holes at positions corresponding to the third holes. The holder is attached to the heat sink by fasteners passing through the first mounting holes and the third holes.
[0019] In the above heat dissipation assembly, optionally, the heat sink includes second mounting holes having threads, and the fasteners include screws that are threadedly engaged with the second mounting holes.
[0020] In the above heat dissipation assembly, optionally, the pressing portion includes a bent portion, and the bent portion passes through the second hole and abuts against the body of the power semiconductor device.
[0021] In the above heat dissipation assembly, optionally, the holder includes positioning pins, and the body includes positioning holes. The positioning pins and the positioning holes match each other to position the pressing member to the installation position.
[0022] In the above heat dissipation assembly, optionally, it includes one or more busbars, which are installed between the holder and the heat sink or embedded within the holder.
[0023] A compressor includes:
[0024] The above heat dissipation assembly;
[0025] One or more power semiconductor devices, which are assembled in the heat dissipation assembly;
[0026] One or more busbars, which are assembled in the heat dissipation assembly;
[0027] A circuit board, which is attached to a heat dissipation component and is soldered to the pins of a power semiconductor device;
[0028] An electric motor, which is electrically connected to the circuit board; and
[0029] A housing, which houses the electric motor, and the heat dissipation component and the circuit board are mounted on one side of the housing.
[0030] In the above-mentioned compressor, optionally, the heat dissipation member includes a metal plate portion, the metal plate portion has opposite first and second heat interfaces, and the first heat interface is oriented towards the holding member; the heat dissipation component includes a first heat conductive medium layer, which establishes a thermal connection between the second heat interface and the housing. Description of the Drawings
[0031] The present application will be further described in detail below in conjunction with the drawings and preferred embodiments. Those skilled in the art will appreciate that these drawings are only drawn for the purpose of explaining the preferred embodiments and should not be construed as limiting the scope of the present application. In addition, unless otherwise specified, the drawings are only intended to conceptually represent the composition or structure of the described object and may include exaggerated displays. The drawings are not necessarily drawn to scale.
[0032] Figure 1 is a partial cross-sectional view of an embodiment of the compressor of the present application.
[0033] Figure 2 is Figure 1 the front view of the heat dissipation component shown in
[0034] Figure 3 is Figure 2 the perspective view of the embodiment shown in
[0035] Figure 4 is an exploded view of an embodiment of the compressor of the present application. Detailed Description of the Embodiments
[0036] The preferred embodiments of the present application will be described in detail below with reference to the drawings. Those skilled in the art will appreciate that these descriptions are only descriptive and exemplary and should not be construed as limiting the scope of protection of the present application.
[0037] First of all, it should be noted that the orientation terms such as top, bottom, up, down, etc. mentioned in this article are defined relative to the directions in each drawing. These orientations are relative concepts and will therefore change according to their positions and states. Therefore, these or other orientation terms should not be understood as restrictive.
[0038] In addition, it should be noted that for any single technical feature described or implied in the embodiments of this document or any single technical feature shown or implied in the drawings, these technical features (or their equivalents) can continue to be combined to obtain other embodiments not directly mentioned in this document.
[0039] It should be noted that in different drawings, the same reference numerals denote the same or substantially the same components.
[0040] The heat dissipation assembly of the present application may include several components. For example, in one embodiment, the heat dissipation assembly may include: a holding member 100, a heat dissipation member 200, a pressing member 300, etc. A part of the compressor of the present application is shown in Figure 1 . As Figure 1 shown, the compressor may include: a heat dissipation assembly 10, one or more power semiconductor devices 20, a circuit board 40, a motor, a housing 60, etc. In one embodiment, the power semiconductor device 20 may be an IGBT module. In one embodiment, the compressor may further include one or more busbars 30. The housing 60 may accommodate the motor, the power semiconductor device 20 and the busbar 30 may be mounted in the heat dissipation assembly 10, and the heat dissipation assembly 10 and the circuit board 40 may be mounted at one end of the housing 60. The circuit board 40 may be electrically connected to the motor and may operate the motor. In one embodiment, the circuit board 40 may be attached to the heat dissipation assembly 10, and the circuit board 40 is soldered to the pins 21 of the power semiconductor device 20. In one embodiment, an electrical connection is established between the circuit board 40 and the power semiconductor device 20 by soldering. In one embodiment, the pins 21 of the power semiconductor device 20 may extend through the circuit board 40. In one embodiment, the power semiconductor device 20 may include a body and a plurality of pins 21.
[0041] The holding member 100 can be made of plastic and can be electrically insulated. In one embodiment, the holding member 100 can include a first side and a second side. The first side of the holding member 100 can face the heat sink 200, and the pressing member 300 can be arranged at the second side of the holding member 100. In one embodiment, the holding member 100 can include a plurality of first holes 110, a plurality of second holes 120, at least one third hole 130, and at least one positioning pin 140. The third hole 130 can be disposed near the plurality of second holes 120. The various holes above can be through holes, for example, extending through the holding member 100. The first holes 110 can be adapted to the pins 21 of the power semiconductor device 20. For example, a plurality of pins 21 extending from the power semiconductor device 20 can extend through the first holes 110 and be exposed at the second side of the holding member 100. The second holes 120 can correspond to the respective power semiconductor devices 20, for example, disposed directly above the power semiconductor device 20. The third hole 130 and the positioning pin 140 can correspond to the pressing member 300. In one embodiment, the holding member 100 can be injection molded.
[0042] The heat sink 200 can be a substantially plate-shaped or flat plate-like component. The heat sink 200 can include a metal plate portion, and the metal plate portion can have opposite first and second thermal interfaces. The first thermal interface can face the holding member 100, and the second thermal interface can face away from the holding member 100. In one embodiment, the heat sink 200 can be made of a thermally conductive material and can have a planar shape. The heat sink 200 can be assembled with the holding member 100, and at least one first space can be formed between the heat sink 200 and the holding member 100. In one embodiment, the power semiconductor device 20 can be installed in the first space. In one embodiment, the bus bar 30 can be installed or clamped between the holding member 100 and the heat sink 200. In one embodiment, the bus bar 30 can be embedded within the holding member 100. As Figure 2 shown, the bus bar 30 can extend on the outer surface of the holding member 100 and can extend beyond the first thermally conductive medium layer 410. That is, the bus bar 30 can extend beyond the heat sink 200. In one embodiment, the number of bus bars 30 can be three. In one embodiment, the adjacent plurality of first spaces can be in communication with each other.
[0043] The pressing member 300 can include a body 310 and a plurality of elastic pressing portions 320. The body 310 can include a first mounting hole 330 and a positioning hole 340. The first mounting hole 330 can correspond to the third hole 130 of the holding member 100, and the positioning hole 340 can correspond to the positioning pin 140 of the holding member 100. As Figure 3As shown, the positioning pin 140 can extend through the positioning hole 340 to fix the pressing member 300 in place relative to the holding member 100. The pressing portion 320 can extend from the body 310, for example, extend outward from the periphery of the body 310. Each pressing portion 320 can respectively have a curved portion. The pressing portion 320 can be shaped to fit the second hole 120 of the holding member 100, so that the pressing portion 320 can extend through the second hole 120 and press on the power semiconductor device 20. In one embodiment, the curved portion of the pressing portion 320 can be positioned to abut against the power semiconductor device 20. In one embodiment, the pressing portion 320 presses and fixes the power semiconductor device 20 in the first space. In one embodiment, the curved portion of the pressing portion 320 can be curved toward the holding member 100 and the heat sink 200. In one embodiment, the curved portion of the pressing portion 320 provides an elastic force, and the direction of the elastic force can be to push the power semiconductor device 20 toward the heat sink 200. In one embodiment, the pressing member 300 can be formed by metal stamping.
[0044] The pressing member 300 can be fixed by a fixing member. For example, the bolt 400 can be used to mount the pressing member 300 to the holding member 100. The bolt 400 can extend through the mounting hole of the pressing member 300 and the third hole 130 of the holding member 100 to fix the pressing member 300 in place. As Figure 4 shown, the second mounting hole 230 can be arranged on the heat sink 200. The second mounting hole 230 can be threaded. In one embodiment, the second mounting hole 230 on the heat sink 200 can cooperate with the first mounting hole 330 on the pressing member 300 and the third hole 130 of the holding member 100 to install screws or bolts 400. Therefore, the pressing member 300 can connect the holding member 100 and the heat sink 200 together by screws or bolts 400.
[0045] The heat sink 200 can include a side facing the holding member 100 and a side facing away from the holding member 100. In one embodiment, a heat-conducting medium layer can be provided on one or both sides of the heat sink 200. For example, the first heat-conducting medium layer 410 can be provided on the side of the heat sink 200 facing away from the holding member 100, and / or the second heat-conducting medium layer 420 can be provided on the side of the heat sink 200 facing the holding member 100. In one embodiment, the second heat-conducting medium layer 420 can be located between the heat sink 200 and the holding member 100 and / or the power semiconductor device 20, and establish a thermal connection between the holding member 100 and / or the power semiconductor device 20 and the heat sink 200. In one embodiment, the first heat-conducting medium layer 410 can be located between the heat sink 200 and the housing 60 of the compressor, and establish a thermal connection between the heat sink 200 and the housing 60.
[0046] The first heat-conducting medium layer 410 and / or the second heat-conducting medium layer 420 can be filled during assembly. In addition, in Figure 2 , the first heat-conducting medium layer 410 completely covers the heat sink 200. It is easy to understand that the heat sink 200 can be located Figure 2 behind the first heat-conducting medium layer 410 in Figure 4 , the first heat-conducting medium layer 410, the heat sink 200 and the second heat-conducting medium layer 420 are shown as separated. In one embodiment, the first heat-conducting medium layer 410, the heat sink 200 and the second heat-conducting medium layer 420 can be attached together. In one embodiment, the first heat-conducting medium layer 410 and / or the second heat-conducting medium layer 420 can include a thermal interface material (TIM for short). In one embodiment, the first heat-conducting medium layer 410 and / or the second heat-conducting medium layer 420 can have a certain viscosity and can be a viscous layer, and the second heat medium layer 420 can be bonded between the heat sink 200 and the power semiconductor device 20, so as to establish a tight bond and thermal contact between the second heat medium layer 420 and the heat sink 200 and between the second heat medium layer 420 and the power semiconductor device 20. In one embodiment, the first heat-conducting medium layer 410 and / or the second heat-conducting medium layer 420 can be flexible, so as to effectively eliminate the air gaps around them, and thereby improve the heat conduction efficiency. In one embodiment, the first heat-conducting medium layer 410 and / or the second heat-conducting medium layer 420 can be separately manufactured components. In one embodiment, the first heat medium layer 410 can establish a thermal connection between the second thermal interface of the heat sink 200 and the housing 60, and the second heat medium layer 420 can be arranged at the first thermal interface.
[0047] The heat dissipation assembly and the compressor of the present application have the advantages of being simple and reliable, easy to implement, convenient to use, etc., and can improve the assemblability while providing good heat dissipation capacity.
[0048] This specification discloses the present application with reference to the accompanying drawings, and also enables those skilled in the art to implement the present application, including manufacturing and using any device or system, selecting suitable materials, and using any combination of methods. The scope of the present application is defined by the claimed technical solutions and includes other instances that those skilled in the art can think of. As long as such other instances include structural elements that are not different from the literal language of the claimed technical solutions, or such other instances include equivalent structural elements that have no substantial difference from the literal language of the claimed technical solutions, such other instances should be considered to be within the protection scope determined by the claimed technical solutions of the present application.
Claims
1. A heat dissipation component, characterized in that, Comprising: A holding member (100) including opposite first and second sides; A heat dissipation member (200) attached to the first side of the holding member (100), at least one first space being formed and surrounded between the first side of the holding member (100) and the heat dissipation member (200), and a power semiconductor device (20) being mounted in the first space; And A pressing member (300) mounted on the second side of the holding member (100), the pressing member (300) being connected to the heat dissipation member (200), The pressing member (300) being configured to apply an elastic pressure to the power semiconductor device (20) to press the power semiconductor device (20) against the heat dissipation member (200).
2. The heat dissipation component according to claim 1, wherein The heat dissipation member (200) includes a metal plate portion having opposite first and second heat interfaces, the first heat interface being oriented towards the holding member (100), and the heat dissipation assembly includes: A second heat conductive medium layer (420) disposed at the first heat interface and being a flexible layer bonded between the heat dissipation member (200) and the power semiconductor device (20) to establish a thermal connection between the heat dissipation member (200) and the power semiconductor device (20).
3. The heat dissipation component according to claim 1, characterized in that Each of the power semiconductor devices (20) includes a body and a plurality of pins (21), the holding member (100) being manufactured by injection molding and including: A plurality of first holes (110) through which the pins (21) respectively extend and are exposed at the second side of the holding member (100); A plurality of second holes (120) where the body of the power semiconductor device (20) is mounted; The pressing member (300) is formed by metal stamping and includes a plurality of pressing portions (320), the pressing portions (320) being elastic and abutting against the body of the power semiconductor device (20) through the second holes (120).
4. The heat dissipation assembly according to claim 3, wherein The holding member (100) includes at least one third hole (130) disposed near the plurality of second holes (120); The pressing member (300) includes a body (310), the pressing portions (320) extending from the body (310), and the body (310) being provided with a first mounting hole (330) at a position corresponding to the third hole (130), and the holding member (100) is attached to the heat dissipation member (200) by a fastener passing through the first mounting hole (330) and the third hole (130).
5. The heat dissipation component according to claim 4, wherein The heat dissipation member (200) includes a second mounting hole (230) having a thread, and the fastener includes a screw (400) that is threadedly engaged with the second mounting hole (230).
6. The heat dissipation component according to claim 4, wherein The pressing part (320) includes a bent portion, and the bent portion passes through the second hole (120) and abuts against the body of the power semiconductor device (20).
7. The heat dissipation component according to any one of claims 1-6, wherein The holder (100) includes a positioning pin (140), and the body (310) of the pressing member (300) includes a positioning hole (340). The positioning pin (140) and the positioning hole (340) are matched with each other to position the pressing member (300) to the installation position.
8. The heat dissipation component according to any one of claims 1-6, characterized in that Comprising one or more busbars (30), the busbars (30) are disposed between the holder (100) and the heat sink (200), or embedded within the holder (100).
9. A compressor, characterized in that, Comprising: The heat dissipation assembly (10) according to any one of claims 1-8; One or more power semiconductor devices (20), the power semiconductor devices (20) are assembled in the heat dissipation assembly (10); One or more busbars (30), the busbars (30) are assembled in the heat dissipation assembly (10); A circuit board (40), which is attached to the heat dissipation assembly (10) and is welded to the pins (21) of the power semiconductor device (20); A motor, which is electrically connected to the circuit board (40); and A housing (60), which houses the motor, and the heat dissipation assembly (10) and the circuit board (40) are mounted on one side of the housing (60).
10. The compressor according to claim 9, characterized in that, The heat sink (200) includes a metal plate portion, the metal plate portion has opposite first and second thermal interfaces, the first thermal interface is oriented towards the holder (100); the heat dissipation assembly includes a first thermal conductive medium layer (410), which establishes a thermal connection between the second thermal interface and the housing (60).