Waste liquid precipitation and recovery device for drain pipe of CMP grinding machine of semi-conductor factory
The installation of a semi-enclosed box structure with valves and bypass pipes in the CMP machine's drainage system addresses sediment buildup, ensuring uninterrupted operation and extended pipe lifespan by facilitating easy sediment removal.
Patent Information
- Application Number
- CN202422015415.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-19
AI Technical Summary
During the CMP grinding process, the drainage pipes are prone to blockage, resulting in abnormal operation of the machine, affecting production efficiency and cost.
Design a sedimentation and recovery device for waste liquid sedimentation and recovery of drainage pipes of CMP grinding machines in semiconductor factory, including rectangular box, first and second pipelines, valves and connectors. The sedimentation waste liquid is precipitated in the rectangular box and then discharged to the factory storage tank to avoid direct entry into the main pipeline.
Effectively reduce pipeline blockage, ensure normal operation of the system, extend the service life of the main pipeline, reduce operating costs, and be simple to install and do not occupy additional space.
Smart Images

Figure CN223098906U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chemical mechanical polishing, and particularly relates to a waste liquid precipitation and recovery device for a drain pipe of a CMP polishing machine in a semiconductor factory. Background Technique
[0002] The CMP (Chemical Mechanical Polishing) technology is most widely used in semiconductor manufacturing, mainly for planarizing the wafer surface. In semiconductor manufacturing, the CMP technology can be used to remove impurities such as oxide layers, silicides, and metal residues on the wafer surface to ensure the performance and stability of devices such as transistors. During the CMP process, a special liquid abrasive, namely CMP polishing liquid, is required. The composition of the CMP polishing liquid is a mixture of various chemical substances, mainly including abrasives, buffers, polishing agents, and additives, etc. Common types of polishing liquids include tungsten CMP polishing liquid, dielectric CMP polishing liquid, copper CMP polishing liquid, aluminum CMP polishing liquid, silicon wafer polishing liquid, silicon carbide wafer polishing liquid, hard disk head CMP polishing liquid, etc.
[0003] The main component of the semiconductor chemical mechanical polishing liquid is silicon dioxide (SiO2) particles, and the discharged wastewater also contains SiO2. This substance will cause the suspended solids (SS) to be too high. The polishing powder in the polishing liquid is easy to accumulate into blocks and precipitate at the bottom of the container, reacting with water to form a paste-like precipitate, which will react with the chemical agents discharged simultaneously during the process and cause blockage of the factory wastewater system pipe. During the polishing process, the abrasives in the polishing liquid will also aggregate and precipitate in the drainage pipeline, resulting in blockage of the drainage pipeline, seriously affecting the normal operation of the machine tool. In the long term, it can affect the drainage of the entire polishing wastewater main pipe, cause the system operation to be blocked, and in severe cases, the main pipe needs to be replaced, affecting the normal operation. Content of the Utility Model
[0004] In view of this, the purpose of the utility model is to provide a waste liquid precipitation and recovery device for a drain pipe of a CMP polishing machine in a semiconductor factory to solve the deficiencies in the prior art.
[0005] In order to achieve the above purpose, the utility model is realized through the following technical solutions:
[0006] A waste liquid precipitation and recovery device for a drain pipe of a CMP polishing machine in a semiconductor factory is provided, which is installed between the secondary power distribution drain pipe of the machine tool and the discharge pipeline. Among them, it includes a rectangular box body, a first pipeline, and a second pipeline. The rectangular box body is located on the first pipeline. The first pipeline is provided with a first valve and a second valve, and the first valve and the second valve are respectively connected to the front end face and the rear end face of the rectangular box body. The second pipeline is a bypass of the first pipeline, and the second pipeline is provided with a third valve.
[0007] As described in the waste liquid precipitation recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory, wherein a transparent detachable PVC plate is provided at the top of the rectangular box body.
[0008] As described in the waste liquid precipitation recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory, wherein a detachable blind plate is provided at the bottom of the rectangular box body.
[0009] As described in the waste liquid precipitation recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory, wherein first pipeline connectors are respectively provided on the front end face and the rear end face of the rectangular box body.
[0010] As described in the waste liquid precipitation recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory, wherein a second pipeline connector is provided on the lower end face of the rectangular box body.
[0011] The beneficial effects of the technical solution of the present utility model are:
[0012] It can effectively reduce the cleaning of pipeline sediments, and the precipitated wastewater can be smoothly discharged into the plant service wastewater storage tank, aiming to reduce the downtime caused by pipeline blockage, extend the service life of the main pipeline, ensure the normal operation of the system, reduce the operation cost, is easy to install, does not occupy space, and is easy to clean. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] To further illustrate the above objects, structural features and effects of the present utility model, the present utility model will be described in detail below with reference to the drawings.
[0014] Figure 1 It is a schematic structural diagram of the rectangular box body of the preferred embodiment of the present utility model;
[0015] Figure 2 It is a schematic diagram of the application scenario of the preferred embodiment of the present utility model;
[0016] Figure 3 It is a schematic diagram of the process piping and instrumentation diagram (PID) of the preferred embodiment of the present utility model;
[0017] In the figure: 1, rectangular box body; 2, first pipeline; 3, second pipeline; 4, first valve; 5, second valve; 6, third valve; 7, transparent detachable PVC plate; 8, first pipeline connector; 9, second pipeline connector. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] The term "utility model" used in this specification, and "the present utility model" are intended in a broad sense to refer to all the subject matters of this specification and any of the following patent claims. Statements containing these terms should not be construed as limiting the subject matter described herein or the meaning or scope of any of the following patent claims. In addition, this specification does not attempt to describe or limit the subject matter covered by any specific component, paragraph, statement, or claim of this application. The subject matter should be understood with reference to the entire specification, all the drawings, and any of the following claims. The present utility model may have other embodiments and be practiced or implemented in other ways. Moreover, it should be understood that the language and terms used herein are for illustrative purposes and should not be considered limiting.
[0019] Details of the present utility model will now be discussed with reference to the drawings which illustrate the present utility model by way of example only. In the drawings, like features or components may be labeled with the same reference numerals.
[0020] The use of "comprising", "having", "including" and their variants herein means including the items listed hereinafter, their equivalents and additional items. Although directions such as above, below, upward, downward, backward, bottom, top, front, back, etc. may be referred to in describing the drawings for convenience with reference to the drawings. These directions are not intended to be literally accepted or limiting in any form of the present utility model. In addition, terms such as "first", "second", "third", etc. are used herein for illustrative purposes and are not intended to indicate or imply importance or significance.
[0021] Referring to Figure 1 、 Figure 2 and Figure 3 As shown, the waste liquid precipitation recovery device of the CMP grinding machine in the semiconductor factory of the present utility model is installed between the secondary power distribution drain pipe and the discharge pipeline of the machine. Specifically, it includes a rectangular box body 1, a first pipeline 2, and a second pipeline 3. The rectangular box body 1 is located on the first pipeline 2. The first pipeline 2 is provided with a first valve 4 and a second valve 5. The first valve 4 and the second valve 5 are respectively connected to the front end face and the rear end face of the rectangular box body 1. The second pipeline 3 is a bypass of the first pipeline 2, and the second pipeline 3 is provided with a third valve 6.
[0022] In a preferred embodiment, continuing to refer to Figure 1 As shown, the top of the rectangular box body 1 is provided with a transparent detachable PVC board 7, and the bottom of the rectangular box body 1 is provided with a detachable blind plate.
[0023] The front end face and the rear end face of the rectangular box body 1 are respectively provided with a first pipeline connector 8, and the lower end face of the rectangular box body 1 is provided with a second pipeline connector 9. Configuring the second pipeline connector 9 on the basis of the first pipeline connector 8 makes the application more flexible and maneuverable.
[0024] Valves are installed at the front and back of the box body, and a bypass is installed at the water inlet end with a valve. Under normal circumstances, after the wastewater enters the box body, flocculent and paste-like precipitates will settle at the bottom. After precipitation, the wastewater is discharged into the plant pipeline. When the precipitates need to be cleaned, the front and back valves of the box body are closed, the bypass valve is opened for drainage. After cleaning, the front and back valves are opened again, and the bypass valve is closed. The advantage is that there is no need to borrow an opportunity, and the normal operation of the machine is not affected. After being precipitated by this device, the wastewater can be smoothly discharged into the plant storage tank, reducing secondary precipitation in the main pipeline, effectively maintaining the discharge flow of the main pipeline and extending the service life.
[0025] Above the device is a transparent detachable PVC board 7. A visual window needs to be reserved on the raised floor to observe the internal sediments of the device at any time, which can effectively prevent downtime.
[0026] Cleaning method: The lower blind plate can be detached, or the upper transparent PVC board can be opened. When cleaning, just pour the internal precipitates into the recycling trash can, and then restore the original state, which is simple and easy to operate. Before installation, the pipeline needs to be dredged or replaced irregularly. After installing this device, it only needs to be cleaned once every 3 - 4 years.
[0027] This improved device uses common materials, is simple to process, and has strong versatility, and is applicable to all CMP area grinding wastewater discharge systems.
[0028] The above are only the preferred embodiments of the present utility model, and do not limit the implementation manners and protection scope of the present utility model. For those skilled in the art, it should be realized that all equivalent replacements and obvious changes made by using the description and illustrations of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A waste liquid precipitation and recovery device for the drain pipe of a CMP grinding machine in a semiconductor factory, which is installed between the secondary power distribution drain pipe of the machine and the discharge pipeline, and is characterized in that It includes a rectangular box body, a first pipeline and a second pipeline. The rectangular box body is located on the first pipeline. The first pipeline is provided with a first valve and a second valve, and the first valve and the second valve are respectively connected to the front end face and the rear end face of the rectangular box body. The second pipeline is a bypass of the first pipeline, and the second pipeline is provided with a third valve.
2. The waste liquid precipitation and recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory according to claim 1, wherein, The top of the rectangular box body is provided with a transparent detachable PVC board.
3. The waste liquid precipitation and recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory according to claim 2, characterized in that, The bottom of the rectangular box body is provided with a detachable blind plate.
4. The waste liquid precipitation and recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory according to claim 1, wherein, The front end face and the rear end face of the rectangular box body are respectively provided with a first pipeline connector.
5. The waste liquid precipitation and recovery device for the drain pipe of the CMP grinding machine in the semiconductor factory according to claim 4, wherein The lower end face of the rectangular box body is provided with a second pipeline connector.