Punching equipment for semiconductor production

Abstract

The utility model discloses punching equipment for semiconductor production, which comprises a base, a supporting table and a collecting box, a groove is arranged on the outer wall of one side of the base in a penetrating manner, the supporting table is arranged on one side of the base, one end of the supporting table extends into the groove, a hole is arranged on the upper surface of the base in a penetrating manner, and the collecting box is arranged in the hole. Supporting blocks are rotatably connected to the inner walls of the two sides of the hole, a punching machine body is fixedly connected to the position, opposite to the hole, of the outer wall of one end of the supporting table, sliding grooves are symmetrically formed in the upper surface of the base in a penetrating mode relative to the hole, and sliding blocks are slidably connected to the inner walls of the two sliding grooves; and one ends of the two sliding blocks extend out of the base and are fixedly connected with clamping blocks, the lower ends of the two sliding grooves extend into the holes in a penetrating mode and are slidably connected with limiting blocks, chippings fall into the collecting box, auxiliary supporting can be conducted on the semiconductor plate through the supporting blocks, the chippings can be collected, and the chippings are prevented from being splashed at will. And environmental harm is caused.

Description

Technical Field

[0001] The utility model relates to the technical field of punching equipment, in particular to a punching equipment for semiconductor production. Background Technique

[0002] A semiconductor is a material with electrical conductivity between that of a conductor and an insulator. Its electrical conductivity can be significantly changed by doping, applying an electric field, or illumination. Common semiconductor materials include silicon, germanium, and compound semiconductors such as gallium arsenide. Semiconductor punching is an important step in the semiconductor manufacturing process.

[0003] A large amount of debris is generated when the semiconductor plate is drilled. The debris on the surface of the semiconductor plate can be sucked by a suction device, but the debris under the semiconductor plate will fall on the support base, which cannot be effectively cleaned and affects the working environment. Therefore, it is necessary to propose a punching equipment for semiconductor production. Content of the Utility Model

[0004] The purpose of the utility model is to provide a punching equipment for semiconductor production to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A punching equipment for semiconductor production, including a base, a support table, and a collection box. A groove is penetrated and opened on one outer wall of the base. A support table is provided on one side of the base, and one end of the support table extends into the groove. A hole is penetrated and opened on the upper surface of the base. Support blocks are rotatably connected to the inner walls on both sides of the hole. One end outer wall of the support table is fixedly connected with a punching machine main body relative to the position of the hole.

[0006] Chutes are penetrated and opened symmetrically on the upper surface of the base relative to the hole. Sliders are slidably connected to the inner walls of the two chutes. One ends of the two sliders extend outside the base and are fixedly connected with clamping blocks. The lower ends of the two chutes penetrate and extend into the hole and are slidably connected with limit blocks. Conical blocks are fixedly connected to the lower surfaces of the two support blocks relative to the position of the limit blocks. And the two limit blocks are abutted against the corresponding conical blocks. A collection box is provided on the lower surface of the base relative to the position of the hole.

[0007] Preferably, convex blocks are symmetrically provided on the upper surface of the base. Screw holes are penetrated and opened on one end outer walls of the two convex blocks and are threadedly connected with fixing screws. One ends of the two fixing screws extend into the convex blocks and are rotatably connected to the clamping block on the same side. And the other ends of the two fixing screws extend outside the convex blocks and are provided with handles.

[0008] Preferably, springs are fixedly connected to the outer walls of one ends of the two limiting blocks located in the sliding groove, and the other ends of the two springs are fixedly connected to the sliders on the same side.

[0009] Preferably, a stop block is fixedly connected to the inner wall of one side of the hole relative to the support block, and the two support blocks are both abutted against the stop block.

[0010] Preferably, threaded holes are symmetrically formed through the outer wall of the collection box, and the two threaded holes both penetrate through and extend into the base and are both threadedly connected with fixing bolts.

[0011] Preferably, a suction nozzle is fixedly connected to the upper surface of one of the clamping blocks, a hydraulic rod is fixedly connected to the inner wall of one side of the base above the support table, and the output end of the hydraulic rod is fixedly connected to the support table.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows: Place the semiconductor plate on the base, and rotate the fixing screw inward. The fixing screw drives the clamping block to clamp and fix the semiconductor plate. The punching machine is pushed by the hydraulic rod to punch the semiconductor plate. The suction nozzle sucks out the debris on the surface of the semiconductor plate. Part of the semiconductor plate debris falls on the support block, separating the clamping block from the semiconductor plate, separating the limiting block from the support block, the support block rotates downward, and the debris falls into the collection box. The semiconductor plate can be assisted and supported by the support block, and the debris can be collected to prevent the debris from splashing randomly and causing environmental hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is the front view structural diagram of the present utility model;

[0014] Figure 2 is the bottom view structural diagram of the present utility model;

[0015] Figure 3 is the sectional view of the base of the present utility model;

[0016] Figure 4 is the front view structural diagram of the collection box of the present utility model;

[0017] Figure 5 is the front view structural diagram of the support block of the present utility model.

[0018] In the figure: 1. Base; 2. Support table; 3. Support block; 4. Punching machine main body; 5. Slider; 6. Clamping block; 7. Limiting block; 8. Tapered block; 9. Collection box; 10. Fixing screw; 11. Spring; 12. Stop block; 13. Fixing bolt; 14. Suction nozzle; 15. Hydraulic rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Please refer toFigures 1-5 , the utility model provides a technical solution: a punching device for semiconductor production, including a base 1, a support table 2 and a collection box 9. A groove is penetrated and opened on the outer wall of one side of the base 1. A support table 2 is provided on one side of the base 1, and one end of the support table 2 extends into the groove. A hole is penetrated and opened on the upper surface of the base 1. Support blocks 3 are rotatably connected to the inner walls on both sides of the hole. A punching machine main body 4 is fixedly connected to the outer wall of one end of the support table 2 relative to the position of the hole;

[0020] Chutes are penetrated and opened symmetrically on the upper surface of the base 1 relative to the hole. Sliders 5 are slidably connected to the inner walls of the two chutes. One ends of the two sliders 5 extend outside the base 1 and are fixedly connected with clamping blocks 6. The lower ends of the two chutes penetrate and extend into the hole and are slidably connected with limit blocks 7. Conical blocks 8 are fixedly connected to the lower surfaces of the two support blocks 3 relative to the position of the limit blocks 7. And the two limit blocks 7 are abutted against the corresponding conical blocks 8. A collection box 9 is provided on the lower surface of the base 1 relative to the position of the hole. The groove is arranged in a T shape.

[0021] Among them, convex blocks are symmetrically arranged on the upper surface of the base 1. Screw holes are penetrated and opened on the outer walls of one ends of the two convex blocks and are threadedly connected with fixing screws 10. One ends of the two fixing screws 10 extend into the convex blocks and are rotatably connected with the clamping block 6 on the same side. And the other ends of the two fixing screws 10 extend outside the convex blocks and are provided with handles, which is convenient to drive the fixing screw 10 to rotate by using the handle and drive the clamping block 6 to move by using the fixing bolt 10.

[0022] Among them, springs 11 are fixedly connected to the outer walls of one ends of the two limit blocks 7 located in the chutes, and the other ends of the two springs 11 are fixedly connected with the sliders 5 on the same side, which is convenient to use the springs 11 to push the limit blocks 7 to move.

[0023] Among them, a stop block 12 is fixedly connected to the inner wall of one side of the hole relative to the support block 3, and the two support blocks 3 are abutted against the stop block 12, which is convenient to use the stop block 12 to limit and fix the support block 3.

[0024] Among them, threaded holes are penetrated and opened symmetrically on the outer wall of the collection box 9, and the two threaded holes penetrate and extend into the base 1 and are threadedly connected with fixing bolts 13, which is convenient to use the fixing bolts 13 to limit and fix the collection box 9.

[0025] Among them, a suction nozzle 14 is fixedly connected to the upper surface of one of the clamping blocks 6. A hydraulic rod 15 is fixedly connected to the inner wall of one side of the base 1 above the support table 2, and the output end of the hydraulic rod 15 is fixedly connected with the support table 2. One end of the suction nozzle 14 is connected with a suction machine, which is convenient to use the hydraulic rod 15 to drive the support table 2 to move and use the suction nozzle 14 to suck out the debris during punching.

[0026] Specifically, when using the utility model, the punching machine main body 4 and the hydraulic rod 15 are both connected to an external drive source through a controller. Place the semiconductor plate to be punched on the base 1, and place the part to be punched at the groove of the support block 3. Drive the fixing screw 10 to rotate inward by the handle. The fixing screw 10 pushes the clamping block 6 to clamp and fix the semiconductor plate. At the same time, the clamping block 6 pushes the slider 5 to move. The slider 5 pushes the limiting block 7 to move through the spring 11. The limiting block 7 supports the support block 3 through the tapered block 8 and provides auxiliary support for the semiconductor plate. Start the hydraulic rod 15 and the punching machine main body 4. The hydraulic rod 15 pushes the support table 2 to move downward, and the punching machine main body 4 punches the semiconductor plate. The suction nozzle 14 sucks out the debris on the surface of the semiconductor plate. Some debris falls on the support block 3. After punching, start the hydraulic rod 15 to drive the support table 2 to move back to the original position, and drive the fixing screw 10 to rotate reversely by the handle. The clamping block 6 is separated from the semiconductor plate. At this time, the clamping block 6 drives the slider 5, the spring 11 and the limiting block 7 to move outward. The limiting block 7 is separated from the tapered block 8, and the support block 3 rotates downward to make the debris fall into the collection box 9. The fixing bolt 13 can be turned out to collect the debris in the collection box 9.

Claims

1. A punching device for semiconductor production, comprising a base (1), a support table (2) and a collection box (9), characterized in that, A groove is penetrated and opened on the outer wall of one side of the base (1). A support platform (2) is arranged on one side of the base (1), and one end of the support platform (2) extends into the groove. A hole is penetrated and opened on the upper surface of the base (1). Support blocks (3) are rotatably connected to the inner walls on both sides of the hole. One end of the outer wall of the support platform (2) is fixedly connected to a punching machine main body (4) relative to the position of the hole. Chutes are penetrated and opened symmetrically on the upper surface of the base (1) relative to the hole. Sliders (5) are slidably connected to the inner walls of the two chutes. One end of each of the two sliders (5) extends outside the base (1) and is fixedly connected to a clamping block (6). The lower ends of the two chutes both penetrate and extend into the hole and are slidably connected to limit blocks (7). Conical blocks (8) are fixedly connected to the lower surfaces of the two support blocks (3) relative to the position of the limit blocks (7). And the two limit blocks (7) are both abutted against the corresponding conical blocks (8). A collection box (9) is arranged on the lower surface of the base (1) relative to the position of the hole.

2. The punching device for semiconductor production according to claim 1, characterized in that: Protrusions are arranged symmetrically on the upper surface of the base (1). Screw holes are penetrated and opened on the outer walls of one ends of the two protrusions and are threadedly connected with fixing screws (10). One end of each of the two fixing screws (10) extends into the protrusion and is rotatably connected to the clamping block (6) on the same side. And the other ends of the two fixing screws (10) both extend outside the protrusion and are both provided with handles.

3. The punching device for semiconductor production according to claim 1, characterized in that: Spring (11) is fixedly connected to the outer wall of one end of each of the two limit blocks (7) located in the chute. And the other ends of the two springs (11) are both fixedly connected to the slider (5) on the same side.

4. A punching device for semiconductor production according to claim 1, characterized in that: A stop block (12) is fixedly connected to the inner wall of one side of the hole relative to the support block (3). And the two support blocks (3) are both abutted against the stop block (12).

5. A punching device for semiconductor production according to claim 1, characterized in that: Threaded holes are penetrated and opened symmetrically on the outer wall of the collection box (9). The two threaded holes both penetrate and extend into the base (1) and are both threadedly connected with fixing bolts (13).

6. The punching device for semiconductor production according to claim 1, characterized in that: An air suction nozzle (14) is fixedly connected to the upper surface of one of the clamping blocks (6). A hydraulic rod (15) is fixedly connected to the inner wall of one side of the base (1) above the support platform (2). And the output end of the hydraulic rod (15) is fixedly connected to the support platform (2).

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