Radiator with vapor chamber
By matching the curvature of the copper pipes with an arc-shaped groove on the uniform board, the heat transfer efficiency is enhanced through increased surface contact, addressing the limited contact area issue in existing designs.
Patent Information
- Application Number
- CN202422147552.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-03
AI Technical Summary
The existing temperature uniform plate has a small contact area when conducting heat, resulting in a general thermal conductivity and failing to fully exert its heat dissipation performance.
A radiator with a temperature equalization plate is designed. By setting an arc groove in the heat equalization groove and the copper tube groove, the heat-sinking copper tube contacts the heat-sinking plate surface, increasing the contact area, and improving structural stability through the connecting structure and support columns.
The thermal conductivity effect is improved through surface contact, the heat dissipation efficiency is enhanced, and more efficient heat transfer is achieved.
Smart Images

Figure CN223106751U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a radiator with a heat pipe vapor chamber. Background Art
[0002] A heat exchanger is a device that transfers part of the heat of a hot fluid to a cold fluid, also known as a heat exchanger. Heat exchangers play an important role in many industrial productions such as chemical industry, petroleum, power, food and others. In chemical production, heat exchangers can be used as heaters, coolers, condensers, evaporators, reboilers, etc., and are widely used.
[0003] The utility model with the application number CN202322018271.7 relates to a heat pipe vapor chamber and a radiator. The radiator includes a heat pipe vapor chamber, a back glue, a back plate, heat pipes, a mounting bracket and a heat sink fin group. The lower surface of the heat pipe vapor chamber is provided with the back glue, the upper surface of the heat pipe vapor chamber is provided with the back plate, heat pipe grooves are arranged on both sides of the back plate, the heat pipes are arranged in the heat pipe grooves, and the other ends of the heat pipes protrude from the heat pipe grooves and are connected to the mounting bracket. The heat sink fin group is assembled and spliced with the heat pipes on both sides and the upper surface of the back plate.
[0004] When the existing heat pipe vapor chamber conducts heat to the copper pipe, the contact area is small and the heat conduction effect is average, and the heat conduction and heat dissipation effect of the heat pipe vapor chamber is not exerted. Content of the Utility Model
[0005] The purpose of the utility model is to provide a radiator with a heat pipe vapor chamber aiming at the deficiencies of the prior art.
[0006] To achieve the above purpose, the technical solution of the utility model is as follows:
[0007] A radiator with a heat pipe vapor chamber includes a first fin module, a second fin module and a third fin module, and heat dissipation copper pipes penetrating between the first fin module, the second fin module and the third fin module. The first fin module, the second fin module and the third fin module are interconnected through the heat dissipation copper pipes;
[0008] The third fin module includes a plurality of heat sink fins. A heat pipe vapor chamber groove is formed in the third fin module, and a heat pipe vapor chamber is installed in the heat pipe vapor chamber groove. A copper pipe groove for installing the heat dissipation copper pipes is formed in the third fin module; a heat conduction surface that fits the heat pipe vapor chamber groove is convexly formed on the heat pipe vapor chamber, and an arc groove that fits the heat dissipation copper pipes is formed along the length direction of the heat conduction surface. The radian of the arc groove is adapted to the radian of the heat dissipation copper pipes.
[0009] Furthermore, a connection structure is arranged between the first fin module, the second fin module and the third fin module. The connection structure includes a first connection strip formed on the first fin module, a second connection strip formed on the second fin module, and a third connection strip formed on the third fin module.
[0010] Further: The first connecting strip, the second connecting strip, and the third connecting strip are flush with each other, and the connecting structure further includes mounting strips respectively connected to the first connecting strip, the second connecting strip, and the third connecting strip.
[0011] Further: The mounting strip is formed with a first mounting hole, and the first connecting strip and the second connecting strip are respectively formed with second mounting holes that cooperate with the first mounting hole.
[0012] Further: The heat sink is provided with a plurality of first fitting pieces vertically formed on the heat dissipation fins, and two adjacent first fitting pieces are integrally formed and connected, and the first fitting pieces are in contact with the heat sink plate.
[0013] Further: The heat sink is provided with a plurality of second fitting pieces vertically formed on the heat dissipation fins, and two adjacent second fitting pieces are integrally formed and connected, and the second fitting pieces are in contact with the heat conduction surface.
[0014] Further: The height of the second fitting piece is arranged lower than that of the first fitting piece.
[0015] Further: The copper tube groove and the arc groove are both semi-circular grooves with a semi-circular cross-section; the copper tube groove semi-surrounds a part of the heat dissipation copper tube, and the arc groove semi-surrounds the other part of the heat dissipation copper tube.
[0016] Further: The heat sink plate includes a VC upper plate and a VC lower plate installed in the heat sink, and the VC lower plate and the VC upper plate are assembled by covering, and the internal space between the VC lower plate and the VC upper plate forms an internal cavity after covering.
[0017] Further: The internal cavity is provided with a plurality of support columns; the VC lower plate is formed with an inwardly concave riveting point, and the inwardly concave part of the riveting point is connected to the VC upper plate, and the VC upper plate and the VC lower plate are riveted through the riveting point.
[0018] The beneficial effects of the present utility model: The heat sink plate is convexly formed with a heat conduction surface that fits the heat sink, and the heat conduction surface is formed with an arc groove that fits the heat dissipation copper tube along the length direction, and the radian of the arc groove is adapted to the radian of the heat dissipation copper tube; when the heat dissipation copper tube conducts heat to the third fin module, the heat sink plate adopts an arc groove adapted to the radian of the heat dissipation copper tube, so that the contact area between the heat dissipation copper tube and the heat sink plate is increased, which is upgraded from the traditional line contact to surface contact, greatly increasing the heat conduction effect, and thus the effect of the heat sink plate can be exerted. Description of the Drawings
[0019] Figure 1 It is a schematic structural diagram of the radiator.
[0020] Figure 2 It is a schematic structural diagram of another perspective of the radiator, with the heat sink plate hidden.
[0021] Figure 3 It is an exploded schematic diagram of the radiator.
[0022] Figure 4 Another perspective explosion schematic diagram of the radiator.
[0023] The attached drawing reference numerals include:
[0024] 1 - First fin module,
[0025] 11 - Second fin module, 12 - Third fin module, 13 - Heat dissipation copper tube, 14 - First connecting bar,
[0026] 15 - Second connecting bar, 16 - Third connecting bar, 17 - Mounting bar, 18 - First mounting hole,
[0027] 19 - Second mounting hole,
[0028] 2 - Heat pipe,
[0029] 21 - VC upper plate, 22 - VC lower plate, 23 - Riveting point,
[0030] 3 - Heat pipe groove,
[0031] 31 - Copper tube groove, 32 - Heat conduction surface, 33 - Arc groove, 34 - First fitting piece, 35 - Second fitting piece,
[0032] 36 - Heat dissipation fin. Detailed implementation mode
[0033] The present utility model will be described in detail below with reference to the attached drawings.
[0034] As Figures 1-4 shown, a radiator with a heat pipe includes a first fin module 1, a second fin module 11 and a third fin module 12, and a heat dissipation copper tube 13 passing through the first fin module 1, the second fin module 11 and the third fin module 12. The first fin module 1, the second fin module 11 and the third fin module 12 are interconnected through the heat dissipation copper tube 13; the heat of the heat dissipation copper tube 13 can be dissipated respectively through the first fin module 1, the second fin module 11 and the third fin module 12.
[0035] The third fin module 12 includes a plurality of heat dissipation fins 36. The third fin module 12 is formed with a heat dissipation groove 3, and a heat pipe plate 2 is installed in the heat dissipation groove 3. The third fin module 12 is formed with a copper pipe groove 31 for installing a heat dissipation copper pipe 13; a heat conduction surface 32 that fits with the heat dissipation groove 3 is convexly formed on the heat pipe plate 2, and an arc groove 33 that fits with the heat dissipation copper pipe 13 is formed along the length direction of the heat conduction surface 32. The radian of the arc groove 33 is adapted to the radian of the heat dissipation copper pipe 13; when the heat dissipation copper pipe 13 conducts heat to the third fin module 12, the arc groove 33 adapted to the radian of the heat dissipation copper pipe 13 is adopted by the heat pipe plate 2, so that the contact area between the heat dissipation copper pipe 13 and the heat pipe plate 2 is increased, and the traditional line contact is upgraded to surface contact, greatly increasing the heat conduction effect, so that the effect of the heat pipe plate 2 can be exerted.
[0036] Preferably, both the copper pipe groove 31 and the arc groove 33 are semi-circular grooves with a semi-circular cross-section; the copper pipe groove 31 semi-surrounds a part of the heat dissipation copper pipe 13, and the arc groove 33 semi-surrounds another part of the heat dissipation copper pipe 13; the copper pipe groove 31 and the arc groove 33 can surround the heat dissipation copper pipe 13, increasing the heat transfer area to achieve a better heat dissipation effect; enabling the heat dissipation copper pipe 13 to further improve the heat transfer efficiency, thereby increasing the heat dissipation efficiency; there is no need to flatten the heat dissipation copper pipe 13.
[0037] A connection structure is provided between the first fin module 1, the second fin module 11, and the third fin module 12. The connection structure includes a first connection strip 14 formed on the first fin module 1, a second connection strip 15 formed on the second fin module 11, and a third connection strip 16 formed on the third fin module 12. The first connection strip 14, the second connection strip 15, and the third connection strip 16 are all flat blocks, which can ensure their flatness.
[0038] The first connection strip 14, the second connection strip 15, and the third connection strip 16 are flush with each other. The connection structure further includes mounting strips 17 respectively connected to the first connection strip 14, the second connection strip 15, and the third connection strip 16; the mounting strip 17 is formed with a first mounting hole 18, and the first connection strip 14 and the second connection strip 15 are respectively formed with second mounting holes 19 that cooperate with the first mounting hole 18. The mounting strip 17 is respectively attached to the first connection strip 14, the second connection strip 15, and the third connection strip 16, so that the first mounting hole 18 and the second mounting hole 19 are coaxially aligned and bolts can be inserted for connection, enabling the first fin module 1, the second fin module 11, and the third fin module 12 to be connected to each other and improving the overall structural integrity.
[0039] The heat pipe 2 includes a VC upper plate 21 and a VC lower plate 22 installed in the heat pipe groove 3. The VC lower plate 22 and the VC upper plate 21 are covered and assembled. After covering, an internal space between the VC lower plate 22 and the VC upper plate 21 forms an internal cavity; several support columns are provided in the internal cavity; the VC lower plate 22 is formed with a concave riveting point 23, and the concave part of the riveting point 23 is connected to the VC upper plate 21. The VC upper plate 21 and the VC lower plate 22 are riveted through the riveting point 23, so that the VC upper plate 21 and the VC lower plate 22 are riveted to each other, and with the support of the support columns, the formed internal cavity is not easily recessed, ensuring the stability of the structure.
[0040] The heat pipe groove 3 is provided with a plurality of first fitting pieces 34 vertically formed on the heat dissipation fins 36. Two adjacent first fitting pieces 34 are integrally formed and connected. The first fitting piece 34 is fitted with the heat pipe 2; the VC upper plate 21 of the heat pipe 2 is fitted and installed on the heat pipe groove 3 with the first fitting piece 34, so that the heat dissipation fins 36 can be connected to the heat pipe 2 through the first fitting piece 34, increasing heat transfer.
[0041] Similarly, the heat pipe groove 3 is provided with a plurality of second fitting pieces 35 vertically formed on the heat dissipation fins 36. Two adjacent second fitting pieces 35 are integrally formed and connected. The second fitting piece 35 is fitted with the heat conduction surface 32 formed on the VC upper plate 21; so that the heat dissipation fins 36 can be connected to the heat pipe 2 through the second fitting piece 35, increasing heat transfer. The height of the second fitting piece 35 is arranged lower than that of the first fitting piece 34; so that multiple different regions of the heat pipe 2 can be in surface contact with the heat dissipation fins 36, thereby improving its heat conduction effect.
[0042] In summary, it can be seen that the present utility model has the above-mentioned excellent characteristics, enabling it to have practicality by enhancing the efficiency that has never existed in the prior art in use, and becoming a product with extremely high practical value.
[0043] The above content is only the preferred embodiment of the present utility model. For those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present utility model.
Claims
1. A radiator with a heat pipe, characterized in that: It includes a first fin module, a second fin module, and a third fin module, as well as a heat dissipation copper tube passing through the first fin module, the second fin module, and the third fin module. The first fin module, the second fin module, and the third fin module are interconnected through the heat dissipation copper tube. The third fin module includes a plurality of heat dissipation fins. A heat dissipation groove is formed in the third fin module, and a heat dissipation plate is installed in the heat dissipation groove. A copper tube groove for installing the heat dissipation copper tube is formed in the third fin module. A heat conduction surface that fits the heat dissipation groove is convexly formed on the heat dissipation plate. An arc groove that fits the heat dissipation copper tube is formed along the length direction of the heat conduction surface, and the radian of the arc groove is adapted to the radian of the heat dissipation copper tube.
2. The heat sink with a vapor chamber according to claim 1, wherein: A connection structure is provided between the first fin module, the second fin module, and the third fin module. The connection structure includes a first connection bar formed on the first fin module, a second connection bar formed on the second fin module, and a third connection bar formed on the third fin module.
3. The heat sink with a heat pipe according to claim 2, characterized in that: The first connection bar, the second connection bar, and the third connection bar are flush with each other. The connection structure further includes mounting bars respectively connected to the first connection bar, the second connection bar, and the third connection bar.
4. A radiator with a heat pipe according to claim 3, characterized in that: The mounting bar is formed with a first mounting hole, and the first connection bar and the second connection bar are respectively formed with second mounting holes that cooperate with the first mounting hole.
5. The heat sink with a vapor chamber according to claim 1, wherein: The heat dissipation groove is provided with a plurality of first fitting pieces vertically formed on the heat dissipation fins. Two adjacent first fitting pieces are integrally formed and connected, and the first fitting pieces are in contact with the heat dissipation plate.
6. The heat sink with a vapor chamber according to claim 5, wherein: The heat dissipation groove is provided with a plurality of second fitting pieces vertically formed on the heat dissipation fins. Two adjacent second fitting pieces are integrally formed and connected, and the second fitting pieces are in contact with the heat conduction surface.
7. The heat sink with a vapor chamber according to claim 6, wherein: The height of the second fitting piece is arranged lower than that of the first fitting piece.
8. The heat sink with a heat pipe according to claim 1, wherein: Both the copper tube groove and the arc groove are semi-circular grooves with a semi-circular cross-section; the copper tube groove semi-surrounds a part of the heat dissipation copper tube, and the arc groove semi-surrounds the other part of the heat dissipation copper tube.
9. The heat sink with a heat pipe according to claim 1, wherein: The heat dissipation plate includes a VC upper plate and a VC lower plate installed in the heat dissipation groove. The VC lower plate and the VC upper plate are assembled by covering. The internal space between the VC lower plate and the VC upper plate forms an internal cavity after covering.
10. A radiator with a heat pipe according to claim 9, characterized in that: A number of support columns are provided in the internal cavity; the VC lower plate is formed with an inwardly concave riveting point, and the inwardly concave part of the riveting point is connected to the VC upper plate. The VC upper plate and the VC lower plate are riveted through the riveting point.
Citation Information
Patent Citations
Vapor chamber and radiator
CN220422314U