Case for server with high energy consumption and high calorific value

Abstract

The utility model discloses a case for a high-energy-consumption and high-calorific-value server, and the case comprises a case body which is used for placing hardware equipment of the server, one transverse end of the case body is provided with an air inlet, and the other transverse end of the case body is provided with an air outlet; the first air cooling assembly is arranged in the box body and located at the air inlet of the box body; the second air cooling assembly is arranged in the box body and located between the first air cooling assembly and the hardware equipment, the end, away from the second air cooling assembly, of the hardware equipment is close to the air outlet, and the second air cooling assembly is used for conducting air cooling heat dissipation on the hardware equipment; and the liquid cooling assembly is used for performing liquid cooling heat dissipation on the hardware equipment, the liquid cooling assembly comprises a radiator, the radiator is located between the first air cooling assembly and the second air cooling assembly, and the first air cooling assembly can perform air cooling heat dissipation on the radiator. According to the case for the high-energy-consumption and high-calorific-value server, heat dissipation can be rapidly and effectively conducted on hardware equipment of the server, the heat dissipation efficiency is high, and the heat dissipation effect is good.

Description

Technical Field

[0001] The present application relates to a server chassis, and in particular to a chassis for a server with high energy consumption and high heat generation. Background Art

[0002] With the continuous improvement of computer hardware performance, especially the popularization of high-performance CPUs and PCIe devices (such as high-end network cards, solid-state drives, graphics cards, etc.), the power consumption and heat generation of servers have increased significantly. These high-energy consumption devices will generate a lot of heat during operation. If the heat cannot be effectively dissipated, it may lead to the risk of hardware performance degradation, system instability, and even hardware damage. Therefore, designing a chassis with efficient and stable heat dissipation is particularly important for servers with high energy consumption and high heat generation. Utility Model Content

[0003] The purpose of this application is to propose a chassis for a high-energy consumption, high-heat-generating server, which can quickly and efficiently dissipate heat for the server's hardware equipment, with high heat dissipation efficiency and good effect.

[0004] In order to solve at least one of the above technical problems, the technical solution of the present application is as follows:

[0005] According to an embodiment of the present application, a chassis for a high-energy consumption and high-heat-generating server is provided, comprising: a chassis, the chassis is used to house the hardware equipment of the server, an air inlet is provided at one lateral end of the chassis and an air outlet is provided at the other end; a first air-cooling component, the first air-cooling component is arranged in the chassis and located at the air inlet of the chassis; a second air-cooling component, the second air-cooling component is arranged in the chassis and located between the first air-cooling component and the hardware equipment, one end of the hardware equipment away from the second air-cooling component is close to the air outlet, and the second air-cooling component is used for air-cooling the hardware equipment; a liquid-cooling component, the liquid-cooling component is used for liquid-cooling the hardware equipment, the liquid-cooling component comprises a radiator, the radiator is located between the first air-cooling component and the second air-cooling component, and the first air-cooling component can air-cool the radiator.

[0006] In a possible implementation of the above embodiment, the liquid cooling assembly also includes: a liquid cooling cover, which is used to cooperate with the hardware device to liquid-cool the hardware device; and a liquid pump, which is used to transport the coolant in the radiator to the liquid cooling cover, and transport the liquid in the liquid cooling cover back to the radiator.

[0007] In a possible implementation of the above embodiment, the length direction of the radiator is consistent with the longitudinal direction of the box, the liquid pump is connected to the radiator outlet and the liquid cooling cover inlet through pipelines, and the liquid cooling cover outlet is connected to the radiator inlet through pipelines.

[0008] In a possible implementation of the above embodiment, the liquid pump is installed in the box body through the first bracket, both ends of the radiator in the length direction are installed in the box body through the second bracket respectively, and a support for connecting with the liquid cooling cover is arranged on the hardware device.

[0009] In a possible implementation of the above embodiment, the length direction of the air inlet, the length direction of the first air cooling component, and the length direction of the second air cooling component are all consistent with the longitudinal direction of the box body.

[0010] In a possible implementation of the above embodiment, the first air cooling component includes: a first mounting plate, the first mounting plate is installed in the box body, and the length direction of the first mounting plate is consistent with the longitudinal direction of the box body; a plurality of first cooling fans, and the plurality of first cooling fans are arranged on the first mounting plate in sequence along the length direction of the first mounting plate.

[0011] In a possible implementation of the above embodiment, the second air cooling component includes: a second mounting plate, the second mounting plate is installed in the box body, and the length direction of the second mounting plate is consistent with the longitudinal direction of the box body; a plurality of second cooling fans, and the plurality of second cooling fans are arranged on the second mounting plate in sequence along the length direction of the second mounting plate.

[0012] In a possible implementation of the above embodiment, grooves are respectively arranged at the top of both ends of the length direction of the second mounting plate, and limiting parts corresponding to each groove are arranged on the box body, and the limiting parts are located above the grooves.

[0013] In a possible implementation of the above embodiment, the interface of the hardware device is located in the air outlet.

[0014] In a possible implementation of the above embodiment, a detachable dust-proof net is arranged at the air inlet of the box body.

[0015] In a possible implementation of the above embodiment, a temperature detector for detecting temperature is arranged in the box body.

[0016] In a possible implementation of the above embodiment, the hardware device includes a controller, and the controller is used to control the first air cooling component, the second air cooling component, and the liquid cooling component.

[0017] In a possible implementation of the above embodiment, handles are respectively arranged on both sides of one end in the transverse direction of the box body, and the two handles and the air inlet are located at the same end of the box body.

[0018] In a possible implementation of the above embodiment, an openable cover plate is arranged on the box body, and the cover plate corresponds to the first air cooling component, the second air cooling component, the liquid cooling component, and the hardware device respectively.

[0019] At least one of the above technical solutions of the present application has the following beneficial effects:

[0020] The chassis for a high - energy - consumption and high - heat - generation server according to the present application has the hardware devices of the server arranged inside the cabinet of the chassis. Inside the cabinet, a first air - cooling component, a second air - cooling component, and a liquid - cooling component are provided. One end of the cabinet in the transverse direction is provided with an air inlet, and the other end is provided with an air outlet. The first air - cooling component is arranged inside the cabinet and is located at the air inlet of the cabinet. The second air - cooling component is arranged inside the cabinet and is located between the first air - cooling component and the hardware devices. One end of the hardware devices away from the second air - cooling component is close to the air outlet. The liquid - cooling component includes a radiator, and the radiator is located between the first air - cooling component and the second air - cooling component. The first air - cooling component can perform air - cooling on the radiator of the liquid - cooling component. The second air - cooling component is used for air - cooling the hardware devices, and the liquid - cooling component is used for liquid - cooling the hardware devices. That is to say, on the one hand, the second air - cooling component directly performs air - cooling on the hardware devices, and at the same time, the liquid - cooling component performs liquid - cooling on the hardware devices. The first air - cooling component performs air - cooling on the radiator of the liquid - cooling component. The first air - cooling component, the second air - cooling component, and the radiator can also block the heat in the corresponding areas, avoiding the mutual interference of heat between the areas. On the other hand, there is no obstruction of hardware devices between the air inlet and the first air - cooling component, shortening the distance between the air inlet and the first air - cooling component, reducing the wind resistance, and increasing the air flow through - put. Thus, it can quickly and efficiently dissipate the heat of the hardware devices of the server, with high heat - dissipation efficiency and good heat - dissipation effect, greatly reducing the risks such as the performance degradation of the hardware devices of the server, system instability, and even hardware damage caused by over - high temperature, having high safety, stability, and reliability, extending the service life, and being applicable to various high - energy - consumption and high - heat - generation servers, such as game consoles, workstations, computer hosts, etc., with a wide application range.

[0021] In addition, in the technical solution of the present application, unless otherwise specifically stated, the present technical solution can be implemented by adopting conventional means in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0023] Figure 1 It is a three - dimensional structural schematic diagram of a chassis for a high - energy - consumption and high - heat - generation server according to an embodiment of the present application;

[0024] Figure 2 It is an embodiment of the present application Figure 1 The partial enlarged view of part A;

[0025] Figure 3 Top view of a chassis for high - energy - consumption and high - heat - generation servers according to an embodiment of the present application;

[0026] Figure 4 Schematic structural view of the air inlet side of a chassis for high - energy - consumption and high - heat - generation servers according to an embodiment of the present application;

[0027] Figure 5 Schematic structural view of the air outlet side of a chassis for high - energy - consumption and high - heat - generation servers according to an embodiment of the present application.

[0028] Explanation of reference numerals in the drawings:

[0029] Cabinet 100; air inlet 101; air outlet 102; limiting part 103; dust - proof net 104; handle 105;

[0030] First air - cooling component 200; first mounting plate 201; first cooling fan 202;

[0031] Second air - cooling component 300; second mounting plate 301; second cooling fan 302; groove 303;

[0032] Liquid - cooling component 400; radiator 401; liquid pump 402; liquid - cooling cover 403; first bracket 404; second bracket 405;

[0033] Hardware device 500; main board 501; power supply 502. Detailed implementation manners

[0034] In order to make the objectives, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are part of the embodiments of the present application, rather than all of the embodiments, and are only used to explain the present application, not to limit the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0035] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "both ends", "both sides", "bottom", "top", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In addition, terms such as "first", "second", "superior", "inferior", "main", "secondary", etc. are only used for descriptive purposes and can be simply used to more clearly distinguish different components, rather than indicating or implying relative importance.

[0036] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0037] See Figures 1 to 5 As shown, schematically shown is a chassis for a high-energy-consumption and high-heat-generation server according to the present application, including: a box body 100, a first air-cooling component 200, a second air-cooling component 300, and a liquid-cooling component 400.

[0038] Among them, the box body 100 is used to accommodate the hardware device 500 of the server. An air inlet 101 is provided at one end of the box body 100 in the transverse direction, and an air outlet 102 is provided at the other end. The first air-cooling component 200 is arranged inside the box body 100 and is located at the air inlet 101 of the box body 100. The second air-cooling component 300 is arranged inside the box body 100 and is located between the first air-cooling component 200 and the hardware device 500. One end of the hardware device 500 away from the second air-cooling component 300 is close to the air outlet 102. The second air-cooling component 300 is used for air-cooling the hardware device 500, and the liquid-cooling component 400 is used for liquid-cooling the hardware device 500. The liquid-cooling component 400 includes a radiator 401, and the radiator 401 is located between the first air-cooling component 200 and the second air-cooling component 300. The first air-cooling component 200 can air-cool the radiator 401.

[0039] It should be noted that the horizontal direction of the cabinet 100 is the length direction of the cabinet 100, and the vertical direction of the cabinet 100 is the width direction of the cabinet 100; the hardware device 500 of the server generally includes a power supply 502 and a motherboard 501. The motherboard 501 is provided with a Central Processing Unit (CPU), PCIe (peripheral component interconnect express, high-speed serial computer expansion bus standard) devices, NVMe (Non Volatile Memory Host Controller Interface Specification express, non-volatile memory host controller interface specification) devices, USB (Universal Serial Bus, universal serial bus) interfaces, etc. The PCIe devices are mainly high-end network cards, solid-state drives, graphics cards, sound cards, video capture cards, etc., and the NVMe devices are mainly solid-state drives and mobile solid-state drives.

[0040] That is to say, the chassis for high-power consumption and high-heat generation servers of the present application includes a cabinet 100, the hardware device 500 of the server is arranged in the cabinet 100 of the chassis, a first air-cooling component 200, a second air-cooling component 300 and a liquid-cooling component 400 are arranged in the cabinet 100. An air inlet 101 is arranged at one end of the horizontal direction of the cabinet 100 and an air outlet 102 is arranged at the other end. The first air-cooling component 200 is arranged in the cabinet 100 and is located at the air inlet 101 of the cabinet 100. The second air-cooling component 300 is arranged in the cabinet 100 and is located between the first air-cooling component 200 and the hardware device 500. One end of the hardware device 500 away from the second air-cooling component 300 is close to the air outlet 102. The liquid-cooling component 400 includes a radiator 401. The radiator 401 is located between the first air-cooling component 200 and the second air-cooling component 300. The first air-cooling component 200 can air-cool the radiator 401 of the liquid-cooling component 400. The second air-cooling component 300 is used to air-cool the hardware device 500, and the liquid-cooling component 400 is used to liquid-cool the hardware device 500. It can be seen that, on the one hand, the second air-cooling component 300 directly air-cools the hardware device 500, and at the same time, the liquid-cooling component 400 liquid-cools the hardware device 500 and transfers the heat to the radiator 401 of the liquid-cooling component 400, and then the first air-cooling component 200 air-cools the radiator 401 of the liquid-cooling component 400. The first air-cooling component 200, the second air-cooling component 300 and the radiator 401 can also block the heat in the corresponding areas to avoid interference of heat between different areas. On the other hand, there is no obstruction of the hardware device 500, such as hard disks, USB interfaces, etc., between the air inlet 101 and the first air-cooling component 200, which shortens the distance between the air inlet 101 and the first air-cooling component 200, reduces the air resistance, and increases the air flow through rate.

[0041] Thus, the chassis of the present application for high - energy - consumption and high - heat - generating servers can quickly and efficiently dissipate heat from the hardware device 500 of the server, with high heat dissipation efficiency and good heat dissipation effect. It greatly reduces the risks such as the performance degradation of the hardware device 500 of the server, system instability, and even hardware damage caused by over - high temperature, and has high safety, stability, and reliability, prolongs the service life, and is applicable to various high - energy - consumption and high - heat - generating servers, such as game consoles, workstations, computer hosts, etc., facilitating wide application in various high - performance computer devices and having a wide application range.

[0042] In some embodiments, as Figures 1 to 3 described, the liquid - cooling component 400 further includes a liquid - cooling cover 403 and a liquid pump 402. Among them, the liquid - cooling cover 403 is used to cooperate with the hardware device 500 correspondingly for liquid - cooling heat dissipation of the hardware device 500. For example, the liquid - cooling cover 403 cooperates correspondingly with the central processing unit of the hardware device 500. The liquid pump 402 is used to transport the coolant in the radiator 401 to the liquid - cooling cover 403 and transport the liquid in the liquid - cooling cover 403 back to the radiator 401. Specifically, the liquid pump 402 is respectively connected to the outlet of the radiator 401 and the inlet of the liquid - cooling cover 403 through pipelines, and the outlet of the liquid - cooling cover 403 is connected to the inlet of the radiator 401 through a pipeline. Those skilled in the art can understand that the coolant includes but is not limited to water, and can also be other cooling liquids in the prior art.

[0043] That is to say, the liquid pump 402 transports the coolant to the liquid - cooling cover 403. After the coolant in the liquid - cooling cover 403 absorbs the heat generated by the hardware device 500, it is transported back to the radiator 401. The first air - cooling component 200 performs air - cooling heat dissipation on the radiator 401, and then the liquid pump 402 transports the coolant in the radiator 401 to the liquid - cooling cover 403 again, so that the coolant circulates, ensuring stable and efficient liquid - cooling heat dissipation for the hardware device 500, with higher heat dissipation efficiency and better heat dissipation effect.

[0044] In some embodiments, as Figure 1 、 3 shown, the length direction of the radiator 401 is consistent with the longitudinal direction of the box body 100. Usually, a heat - dissipation flow channel (not shown) for the coolant to pass through is provided in the radiator 401. The radiator 401 can adopt a long - strip cold - plate structure, and the length of the radiator 401 should be approximately equal to the width (longitudinal length) of the box body 100 to increase the heat - dissipation area as much as possible. Thus, it not only ensures more stable placement of the radiator 401 in the box body 100, but also improves the heat - dissipation efficiency of the coolant, etc.

[0045] In some embodiments, as Figures 2 to 3As shown, the liquid pump 402 is installed in the box body 100 through the first bracket 404. The two ends of the radiator 401 in the length direction are respectively installed in the box body 100 through the second bracket 405. A support (not shown) for connecting with the liquid cooling cover 403 is arranged on the hardware device 500. Among them, the first bracket 404 can be installed in the box body 100 by fasteners such as screws, so that the first bracket 404 is tightly fixed in the box body 100. The second bracket 405 can also be respectively connected with the radiator 401 and the box body 100 by fasteners such as screws. The liquid cooling cover 403 and the support can be connected by screws or adhesive bonding, etc. Thus, operations such as installation and disassembly are more convenient and fast, and the structure is more stable and reliable.

[0046] In some embodiments, such as Figure 1 , 3 As shown in FIGS. 1 to 5, the length direction of the air inlet 101, the length direction of the first air cooling component 200, and the length direction of the second air cooling component 300 are all consistent with the longitudinal direction of the box body 100. That is to say, the lengths of the air inlet 101, the first air cooling component 200, the second air cooling component 300, and the radiator 401 should be approximately equal to the width (longitudinal length) of the box body 100, so as to increase the heat dissipation area as much as possible. Thus, not only is the structure more stable, but also the heat dissipation efficiency is improved, and the heat in the corresponding area can be blocked to avoid mutual interference of heat between regions.

[0047] In some embodiments, such as Figures 2 to 3 As shown, the first air cooling component 200 includes a first mounting plate 201 and a plurality of first cooling fans 202. Among them, the first mounting plate 201 is installed in the box body 100. The length direction of the first mounting plate 201 is consistent with the longitudinal direction of the box body 100. The plurality of first cooling fans 202 are sequentially arranged on the first mounting plate 201 along the length direction of the first mounting plate 201. The first mounting plate 201 can be installed in the box body 100 by fasteners such as screws, and the first cooling fans 202 can also be installed on the first mounting plate 201 by fasteners such as screws. The first cooling fans 202 can be high-speed fans. The number and arrangement of the first cooling fans 202 are determined according to the specific situation such as the length of the first mounting plate 201. For example, four first cooling fans 202 can be evenly distributed in the length direction of the first mounting plate 201. Thus, it can be ensured that the liquid cooling component 400 can better dissipate heat from the radiator 401, etc.

[0048] In some embodiments, such as Figures 2 to 3As shown, the second air-cooling component 300 includes a second mounting plate 301 and a plurality of second cooling fans 302. Among them, the second mounting plate 301 is installed inside the box body 100, the length direction of the second mounting plate 301 is consistent with the longitudinal direction of the box body 100, and the plurality of second cooling fans 302 are sequentially arranged on the second mounting plate 301 along the length direction of the second mounting plate 301. The second mounting plate 301 can be installed inside the box body 100 by fasteners such as screws, and the second cooling fans 302 can also be installed on the second mounting plate 301 by fasteners such as screws. The second cooling fans 302 can also be high-speed fans. The number and arrangement of the second cooling fans 302 are determined according to the specific situation such as the length of the second mounting plate 301. For example, four first cooling fans 202 can be evenly distributed in the length direction of the second mounting plate 301. Thus, better heat dissipation of the hardware device 500 can be ensured, etc.

[0049] In some embodiments, as Figure 2 shown, grooves 303 are respectively provided at the top ends of both ends of the second mounting plate 301 in the length direction, and limiting parts 103 corresponding to each groove 303 are provided on the box body 100, and the limiting parts 103 are located above the grooves 303. Among them, the limiting parts 103 can be flanging structures formed on the box body 100. Thus, through the cooperation of the two limiting parts 103 of the box body 100 with the grooves 303 at both ends of the second mounting plate 301 respectively, the up-and-down movement of the second mounting plate 301 is restricted, and the structure is more stable and reliable.

[0050] In some embodiments, the interface of the hardware device 500 is located inside the air outlet 102, such as a USB interface, etc. That is to say, the interface of the hardware device 500 is hidden inside the air outlet 102. Thus, damage to the interface of the hardware device 500 can be avoided, etc.

[0051] In some embodiments, as Figure 1 、 4 shown, a detachable dust-proof net 104 is provided at the air inlet 101 of the box body 100. Thus, through the dust-proof net 104, dust and other sundries can be effectively prevented from entering the box body 100 and affecting the heat dissipation efficiency.

[0052] In some embodiments, a temperature detector (not shown) for detecting temperature is provided inside the box body 100. Among them, the temperature detector can adopt a temperature sensor, and there can be multiple temperature detectors, and the multiple temperature detectors can detect the temperature inside the box body 100 in all directions. Thus, by detecting the temperature inside the box body 100 through the temperature detector, it is convenient to better control the first air-cooling component 200, the second air-cooling component 300, and the liquid-cooling component 400 for heat dissipation.

[0053] In some embodiments, the hardware device 500 includes a controller (not shown) that is configured to control the first air-cooling component 200, the second air-cooling component 300, and the liquid-cooling component 400. That is, the temperature detector feeds back the detected temperature information to the controller in real time, and the controller controls the first air-cooling component 200, the second air-cooling component 300, and the liquid-cooling component 400 according to a preset temperature threshold, such as adjusting the fan speed and the operating state of the liquid-cooling component 400, so as to ensure that the hardware device 500 is in an optimal operating state and also facilitate reducing energy consumption and the like.

[0054] In some embodiments, as Figure 1 , 3 shown in FIG. 4, handles 105 are respectively provided on both sides of one end of the box body 100 in the transverse direction, and the two handles 105 and the air inlet 101 are located at the same end of the box body 100. Thus, it is convenient to lift and place the box body 100, and the operation is more convenient.

[0055] In some embodiments, an openable cover plate (not shown) is provided on the box body 100, and the cover plate corresponds to the first air-cooling component 200, the second air-cooling component 300, the liquid-cooling component 400, and the hardware device 500 respectively, Figure 1 and Figure 3 are structural schematic diagrams of the chassis for a high-energy-consumption and high-heat-generation server of the present application after removing the cover plate. Among them, the cover plate can be connected to the box body 100 through fasteners such as screws. Thus, by opening the cover plate, it is convenient to repair the devices in the box body 100 and the like.

[0056] In summary, for the chassis of the high-power consumption and high-heat generation server of the present application, on the one hand, the second air-cooling component 300 directly performs air-cooling on the hardware device 500. At the same time, the liquid-cooling component 400 performs liquid-cooling on the hardware device 500 and transfers the heat to the radiator 401 of the liquid-cooling component 400. Then, the first air-cooling component 200 performs air-cooling on the radiator 401 of the liquid-cooling component 400. The first air-cooling component 200, the second air-cooling component 300 and the radiator 401 can also block the heat in the corresponding areas to avoid interference between the heat in each area. On the other hand, there is no obstruction of the hardware device 500 between the air inlet 101 and the first air-cooling component 200, such as hard disks, USB interfaces, etc. This shortens the distance between the air inlet 101 and the first air-cooling component 200, reduces the air resistance, and increases the air flow rate. Therefore, the hardware device 500 of the server can be cooled quickly and efficiently, with high cooling efficiency and good cooling effect. It greatly reduces the risks such as performance degradation of the hardware device 500 of the server, system instability, and even hardware damage caused by overheating, and has high safety, stability and reliability, and extends the service life. Moreover, it is applicable to various high-power consumption and high-heat generation servers, such as game consoles, workstations, computer hosts, etc., and is convenient for wide application in various high-performance computer devices, with a wide application range.

[0057] Based on the above-described embodiments of the present application, in the case of no explicit negation or conflict, the technical features of one embodiment can be beneficially combined with one or more other embodiments.

[0058] The above are only some embodiments of the present application, which are only used to illustrate the technical solutions of the present application and are not intended to limit them. It should be understood that for those of ordinary skill in the art, without departing from the inventive concept of the present application, improvements or replacements can be made according to the above description, and all such improvements and replacements should fall within the protection scope of the appended claims of the present application. In this case, all details can be replaced with equivalent elements, and the materials, shapes and sizes can also be arbitrary.

Claims

1. A chassis for a high - energy - consumption and high - heat - generation server, characterized in that, Comprising: A box body, which is used to accommodate the hardware devices of the server. An air inlet is provided at one end of the box body in the transverse direction, and an air outlet is provided at the other end. A first air cooling component, which is arranged in the box body and located at the air inlet of the box body. A second air cooling component, which is arranged in the box body and located between the first air cooling component and the hardware device. One end of the hardware device away from the second air cooling component is close to the air outlet. The second air cooling component is used for air cooling the hardware device. A liquid cooling component, which is used for liquid cooling the hardware device. The liquid cooling component includes a radiator, and the radiator is located between the first air cooling component and the second air cooling component. The first air cooling component can air cool the radiator.

2. The chassis for a high-energy-consumption and high-heat-generation server according to claim 1, wherein The liquid cooling component further includes: A liquid cooling cover, which is used to cooperate with the hardware device correspondingly to liquid cool the hardware device. A liquid pump, which is used to transport the coolant in the radiator to the liquid cooling cover, and transport the liquid in the liquid cooling cover back to the radiator.

3. The chassis for a high-energy-consumption and high-heat-generation server according to claim 2, characterized in that, The length direction of the radiator is consistent with the longitudinal direction of the box body. The liquid pump is respectively connected to the outlet of the radiator and the inlet of the liquid cooling cover through pipelines. The outlet of the liquid cooling cover is connected to the inlet of the radiator through a pipeline.

4. The chassis for a high-energy-consumption and high-heat-generation server according to claim 3, characterized in that, The liquid pump is installed in the box body through a first bracket. Both ends of the radiator in the length direction are respectively installed in the box body through a second bracket. A support for connecting with the liquid cooling cover is provided on the hardware device.

5. The chassis for a high - energy - consumption and high - heat - generating server according to claim 1, wherein, The length direction of the air inlet, the length direction of the first air cooling component, and the length direction of the second air cooling component are all consistent with the longitudinal direction of the box body.

6. The chassis for a high-power consumption and high-heat generation server according to claim 5, wherein, The first air cooling component includes: A first mounting plate, which is installed in the box body. The length direction of the first mounting plate is consistent with the longitudinal direction of the box body. A plurality of first cooling fans, which are sequentially arranged on the first mounting plate along the length direction of the first mounting plate.

7. The chassis for a high-energy-consumption and high-heat-generation server according to claim 5, characterized in that, The second air cooling component includes: A second mounting plate, which is installed in the box body. The length direction of the second mounting plate is consistent with the longitudinal direction of the box body. A plurality of second cooling fans, which are sequentially arranged on the second mounting plate along the length direction of the second mounting plate.

8. The chassis for a high-energy-consumption and high-heat-generation server according to claim 7, characterized in that, Grooves are respectively provided at the top of both ends of the second mounting plate in the length direction. Position-limiting parts corresponding to each groove are provided on the box body, and the position-limiting parts are located above the grooves.

9. The chassis for a high-energy-consumption and high-heat-generation server according to claim 1, characterized in that, The interface of the hardware device is located in the air outlet.

10. The chassis for a high-energy-consumption and high-heat-generation server according to claim 1, wherein A detachable dust-proof net is provided at the air inlet of the box body. A temperature detector for detecting temperature is provided in the box body. The hardware device includes a controller, which is used to control the first air cooling component, the second air cooling component, and the liquid cooling component. Handles are respectively provided on both sides of one end of the box body in the transverse direction. The two handles and the air inlet are located at the same end of the box body. An openable cover plate is provided on the box body, and the cover plate corresponds to the first air cooling assembly, the second air cooling assembly, the liquid cooling assembly, and the hardware device respectively.

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