4K high-definition low-delay video image processing circuit board based on FPGA

Abstract

The utility model belongs to the technical field of circuit boards, in particular to a 4K high-definition low-delay video image processing circuit board based on an FPGA (Field Programmable Gate Array), which comprises a printed circuit board on which an FPGA chip is fixed, and further comprises a positioning frame provided with a stepped hole; an anti-interference cover; the metal heat conducting plate is connected to the bottom of the positioning frame, and the top surface of the metal heat conducting plate is attached to the bottom surface of the printed circuit board; the four rubber supporting blocks are fixed to the four corners of the bottom face of the positioning frame in a diagonal mode. According to the utility model, the printed circuit board is positioned and installed through the arranged positioning frame, the printed circuit board is safely protected from the side edge, the anti-interference capability of the FPGA chip is improved through the arranged anti-interference cover, and the metal heat-conducting plate is located below the printed circuit board and abuts against the bottom surface of the printed circuit board. The heat generated by the printed circuit board can be quickly conducted out, and the working performance of the FPGA chip is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and particularly relates to a 4K high-definition low-latency video image processing circuit board based on FPGA. Background Technique

[0002] FPGA is a product further developed on the basis of programmable devices such as PAL and GAL. It appears as a semi-custom circuit in the field of application-specific integrated circuits, which not only solves the deficiencies of custom circuits but also overcomes the shortcoming of limited number of gate circuits in the original programmable devices. Compared with the traditional chip design mode, the FPGA chip is not simply limited to the research and design of chips, but for products in many fields, specific chip models can be used for optimized design.

[0003] At present, circuit boards used for video image processing often adopt FPGA chip design, which can reduce the hardware cost, greatly improve the efficiency of video image processing, and effectively reduce latency. However, the FPGA chip is easily interfered and its working performance is reduced.

[0004] It is retrieved that in the prior art, the Chinese utility model patent with the authorization announcement number CN218735156U discloses an "anti-interference FPGA chip", including a heat absorption sheet, a heat dissipation sheet, an anti-interference cover, a shielding layer, a frame-shaped base, a plugging sheet, and a conductive sheet. The plugging sheet is attached to the upper end face of the printed circuit board, the frame-shaped base is installed on the upper end face of the plugging sheet, the anti-interference cover is inserted into the inner wall of the frame-shaped base, the shielding layer is sprayed on the inner wall of the anti-interference cover, the conductive sheet is pasted on the lower end face of the anti-interference cover, the heat absorption sheet is installed on the upper end face of the anti-interference cover, and the heat dissipation sheet is welded on the upper end face of the heat absorption sheet. This design solves the problems of poor anti-interference ability and protection ability of the original chip.

[0005] For the FPGA chips in the prior art including the above, although they can provide safety protection and anti-interference for the FPGA chips, in actual use, the heat dissipation sheet is located at the top of the anti-interference cover, and the heat generated by the printed circuit board during operation cannot be quickly dissipated. Moreover, the anti-interference cover also affects the air circulation, further reducing the heat dissipation performance. If the heat of the printed circuit board cannot be quickly dissipated, it will inevitably reduce the working performance of the FPGA chip.

[0006] To solve the above problems, a 4K high-definition low-latency video image processing circuit board based on FPGA is proposed in this application. Content of the Utility Model

[0007] To solve the above problems existing in the prior art, the utility model provides a 4K high-definition low-latency video image processing circuit board based on FPGA, which has the characteristics of convenient use, good protection effect, and easy heat dissipation.

[0008] To achieve the above object, the present utility model provides the following technical solutions: A 4K high-definition low-latency video image processing circuit board based on FPGA, including a printed circuit board, on which an FPGA chip is fixed, and further including:

[0009] A positioning frame, the positioning frame has a stepped hole, and the printed circuit board is fixed in the stepped hole;

[0010] An anti-interference cover, the anti-interference cover is fixed on the top of the positioning frame;

[0011] A metal heat conducting plate, the metal heat conducting plate is connected to the bottom of the positioning frame, and the top surface of the metal heat conducting plate fits the bottom surface of the printed circuit board, and heat dissipation fins are evenly distributed on the bottom surface of the metal heat conducting plate;

[0012] Four rubber support blocks are diagonally fixed at the four corners of the bottom surface of the positioning frame.

[0013] As a preferred technical solution of the present utility model, it further includes:

[0014] Four supporting plates are diagonally fixed to the bottom surface of the positioning frame;

[0015] A support column, the support column penetrates through the supporting plate;

[0016] A supporting disk, the supporting disk is fixed at the top end of the support column for supporting the printed circuit board;

[0017] A telescopic spring, the telescopic spring is sleeved on the support column and distributed between the supporting plate and the supporting disk.

[0018] As a preferred technical solution of the present utility model, it further includes:

[0019] A limiting disk, the limiting disk is fixed at the bottom end of the support column.

[0020] As a preferred technical solution of the present utility model, it further includes:

[0021] A rubber support pad, the rubber support pad is adhesively fixed to the inner bottom surface of the stepped hole.

[0022] As a preferred technical solution of the present utility model, it further includes:

[0023] A first positioning stud, the first positioning stud is fixed on the positioning frame;

[0024] Two fixing feet are symmetrically fixed at both ends of the anti-interference cover, and a waist-shaped hole for the first positioning stud to penetrate through is provided on the fixing feet;

[0025] The first regular hexagonal nut is fixed to the protruding end of the first positioning stud by means of screw thread engagement.

[0026] As a preferred technical solution of the present utility model, it further includes:

[0027] The second positioning stud is fixed on the positioning frame, and the second positioning stud penetrates through the printed circuit board;

[0028] The second regular hexagonal nut is fixed to the protruding end of the second positioning stud by means of screw thread engagement.

[0029] As a preferred technical solution of the present utility model, the outer wall of the metal heat conducting plate abuts against the inner wall of the stepped hole.

[0030] Compared with the prior art, the beneficial effects of the present utility model are:

[0031] In the present utility model, the printed circuit board is positioned and installed by the provided positioning frame, and at the same time, the printed circuit board is safely protected from the side. The anti-interference cover is provided to improve the anti-interference ability of the FPGA chip. The metal heat conducting plate is located below the printed circuit board and abuts against the bottom surface of the printed circuit board, which can quickly conduct out the heat generated by the printed circuit board and ensure the working performance of the FPGA chip.

[0032] Other additional advantages and beneficial effects of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:

[0034] Figure 1 is a schematic structural diagram of the present utility model;

[0035] Figure 2 is a schematic cross-sectional structural diagram of the present utility model;

[0036] Figure 3 is for the present utility model Figure 2 The enlarged structural diagram at A in.

[0037] In the figure: 1. Printed circuit board; 101. FPGA chip; 2. Positioning frame; 201. Step hole; 202. First positioning stud; 203. Rubber support pad; 204. Rubber support block; 205. Second positioning stud; 3. Anti-interference cover; 31. Fixed foot; 311. Waist-shaped hole; 32. First regular hexagon nut; 4. Metal heat-conducting plate; 401. Heat dissipation fin; 5. Second regular hexagon nut; 6. Support plate; 7. Support column; 8. Support tray; 9. Telescopic spring; 10. Limit disc. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] Please refer to Figures 1-3 , the present invention provides the following technical solutions: A 4K high-definition low-latency video image processing circuit board based on FPGA, including a printed circuit board 1, on which an FPGA chip 101 is fixed, and further including: a positioning frame 2, an anti-interference cover 3, a metal heat-conducting plate 4, and a rubber support block 204.

[0040] Furthermore, as shown by Figure 1 and Figure 2 , in this embodiment, the positioning frame 2 has a step hole 201, the printed circuit board 1 is fixed in the step hole 201, the anti-interference cover 3 is fixed on the top of the positioning frame 2, the metal heat-conducting plate 4 is connected to the bottom of the positioning frame 2, and the top surface of the metal heat-conducting plate 4 is attached to the bottom surface of the printed circuit board 1. Heat dissipation fins 401 are evenly distributed on the bottom surface of the metal heat-conducting plate 4. Four rubber support blocks 204 are fixed at the four corners of the bottom surface of the positioning frame 2 in a diagonal manner. After adopting the above solution, during use, first use conventional means to fix the positioning frame 2 inside the housing of the video image processing device, then place the metal heat-conducting plate 4 in the step hole 201, and then fix the printed circuit board 1 in the step hole 201. At this time, the top surface of the metal heat-conducting plate 4 is attached to the bottom surface of the printed circuit board 1. Finally, fix the anti-interference cover 3 on the top of the positioning frame 2. The present invention positions and installs the printed circuit board 1 through the provided positioning frame 2, and at the same time provides safety protection for the printed circuit board 1 from the side. The anti-interference cover 3 is provided to improve the anti-interference ability of the FPGA chip 101. The metal heat-conducting plate 4 is located below the printed circuit board 1 and abuts against the bottom surface of the printed circuit board 1, which can quickly conduct the heat generated by the printed circuit board 1 and ensure the working performance of the FPGA chip 101.

[0041] It should be noted that the metal heat-conducting plate 4 is preferably made of an aluminum plate, which has a relatively high specific heat capacity and low cost. If cost is not considered, under the same conditions, the thermal conductivity of copper is better than that of aluminum, and the metal heat-conducting plate 4 can also be made of a copper plate.

[0042] Preferably, as Figures 1-3 shown, in this embodiment, it further includes: a support plate 6, a support column 7, a support disk 8, and a telescopic spring 9. Four support plates 6 are fixedly arranged diagonally on the bottom surface of the positioning frame 2. The support column 7 penetrates through the support plate 6, and the support disk 8 is fixed to the top end of the support column 7 for supporting the printed circuit board 1. The telescopic spring 9 is sleeved on the support column 7 and is distributed between the support plate 6 and the support disk 8. After adopting the above solution, under the elastic action of the telescopic spring 9, the support disk 8 can be pushed upward, and the metal heat-conducting plate 4 is lifted by the support disk 8 to ensure that the top surface of the metal heat-conducting plate 4 reliably fits the bottom surface of the printed circuit board 1.

[0043] Preferably, as Figures 1-3 shown, in this embodiment, it further includes: a limit disk 10. The limit disk 10 is fixed to the bottom end of the support column 7, and the limit disk 10 is provided to limit the movement range of the support column 7.

[0044] Preferably, as Figure 1 shown, in this embodiment, it further includes: a rubber support pad 203. The rubber support pad 203 is adhesively fixed to the inner bottom surface of the stepped hole 201. The rubber support pad 203 has flexibility. By supporting the printed circuit board 1 with the rubber support pad 203, the printed circuit board 1 can be buffered and shock-proof, further improving the working safety of the printed circuit board 1.

[0045] Optionally, as Figure 1 shown, in this embodiment, it further includes: a first positioning stud 202, fixing feet 31, and a first regular hexagonal nut 32. The first positioning stud 202 is fixed on the positioning frame 2. Two fixing feet 31 are symmetrically fixed at both ends of the anti-interference cover 3, and a waist-shaped hole 311 for the first positioning stud 202 to penetrate is provided on the fixing feet 31. The first regular hexagonal nut 32 is fixed to the protruding end of the first positioning stud 202 by means of thread screwing. After adopting the above solution, when installing the anti-interference cover 3, the first positioning stud 202 is made to penetrate through the waist-shaped hole 311, and then the first regular hexagonal nut 32 is tightened on the protruding end of the first positioning stud 202, so as to realize the stable installation of the anti-interference cover 3.

[0046] Optionally, as Figure 1As shown in the figure, in this embodiment, it further includes: a second positioning stud 205 and a second regular hexagon nut 5. The second positioning stud 205 is fixed on the positioning frame 2, and the second positioning stud 205 penetrates through the printed circuit board 1. The second regular hexagon nut 5 is fixed to the protruding end of the second positioning stud 205 by means of screw threading. After adopting the above scheme, when installing the printed circuit board 1, make the second positioning stud 205 penetrate through the printed circuit board 1, and then tighten the second regular hexagon nut 5 on the protruding end of the second positioning stud 205, then the stable installation of the printed circuit board 1 can be realized.

[0047] Preferably, Figures 1-3 As shown in the figure, in this embodiment, the outer wall of the metal heat conducting plate 4 abuts against the inner wall of the stepped hole 201, which improves the stability of the metal heat conducting plate 4, avoids the metal heat conducting plate 4 from slipping or shaking, and thus avoids the metal heat conducting plate 4 from scratching the printed circuit board 1 due to slipping, further improving the working safety of the printed circuit board 1.

[0048] The circuit connection involved in the present utility model is a common means adopted by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments, belonging to the prior art that is widely used.

[0049] The components not described in detail in this article are prior art.

[0050] The working principle and usage process of the present utility model: For the printed circuit board 1 of the present utility model, when in use, first fix the positioning frame 2 in the housing of the video image processing device by using conventional means, then place the metal heat conducting plate 4 in the stepped hole 201, then fix the printed circuit board 1 in the stepped hole 201. At this time, the top surface of the metal heat conducting plate 4 fits the bottom surface of the printed circuit board 1, and finally fix the anti-interference cover 3 on the top of the positioning frame 2;

[0051] The present utility model positions and installs the printed circuit board 1 through the provided positioning frame 2, and at the same time provides safety protection for the printed circuit board 1 from the side. By providing the anti-interference cover 3, the anti-interference ability of the FPGA chip 101 is improved. The metal heat conducting plate 4 is located below the printed circuit board 1 and abuts against the bottom surface of the printed circuit board 1, which can quickly conduct the heat generated by the printed circuit board 1 and ensure the working performance of the FPGA chip 101;

[0052] The setting of the rubber support block 204, on the one hand, because the rubber support block 204 has flexibility, it can flexibly support the positioning frame 2 and has a buffering and earthquake-resistant effect. On the other hand, the rubber support block 204 can make a gap between the positioning frame 2 and the installation position, which is beneficial to air circulation and helps to improve the heat dissipation efficiency.

[0053] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A 4K high-definition low-latency video image processing circuit board based on FPGA, including a printed circuit board (1), on which an FPGA chip (101) is fixed, characterized in that, Further included are: A positioning frame (2), the positioning frame (2) having a stepped hole (201), and the printed circuit board (1) being fixed within the stepped hole (201); An anti-interference cover (3), the anti-interference cover (3) being fixed to the top of the positioning frame (2); A metal heat conducting plate (4), the metal heat conducting plate (4) being connected to the bottom of the positioning frame (2), and the top surface of the metal heat conducting plate (4) being in contact with the bottom surface of the printed circuit board (1), with heat dissipation fins (401) evenly distributed on the bottom surface of the metal heat conducting plate (4); Rubber support blocks (204), four of the rubber support blocks (204) being diagonally fixed to the four corners of the bottom surface of the positioning frame (2).

2. The 4K high-definition low-latency video image processing circuit board based on FPGA according to claim 1, wherein: Further included are: Support plates (6), four of the support plates (6) being diagonally fixed to the bottom surface of the positioning frame (2); Support columns (7), the support columns (7) passing through the support plates (6); A support tray (8), the support tray (8) being fixed to the top end of the support column (7) for supporting the printed circuit board (1); A telescopic spring (9), the telescopic spring (9) being sleeved on the support column (7) and distributed between the support plate (6) and the support tray (8).

3. The 4K high-definition low-latency video image processing circuit board based on FPGA according to claim 2, characterized in that: Further included are: A limit disc (10), the limit disc (10) being fixed to the bottom end of the support column (7).

4. A 4K high-definition low-latency video image processing circuit board based on FPGA according to claim 1, characterized in that: Further included are: A rubber support pad (203), the rubber support pad (203) being adhesively fixed to the inner bottom surface of the stepped hole (201).

5. A 4K high-definition low-latency video image processing circuit board based on FPGA according to claim 1, characterized in that: Further included are: A first positioning stud (202), the first positioning stud (202) being fixed to the positioning frame (2); Fixed feet (31), two of the fixed feet (31) being symmetrically fixed to both ends of the anti-interference cover (3), and having waist-shaped holes (311) on the fixed feet (31) for the first positioning stud (202) to pass through; A first regular hexagonal nut (32), the first regular hexagonal nut (32) being fixed to the protruding end of the first positioning stud (202) by means of screw thread engagement.

6. The 4K high-definition low-latency video image processing circuit board based on FPGA according to claim 1, wherein: Further included are: A second positioning stud (205), the second positioning stud (205) being fixed to the positioning frame (2), and the second positioning stud (205) passing through the printed circuit board (1); A second regular hexagonal nut (5), the second regular hexagonal nut (5) being fixed to the protruding end of the second positioning stud (205) by means of screw thread engagement.

7. A 4K high-definition low-latency video image processing circuit board based on FPGA according to claim 1, characterized in that: The outer wall of the metal heat conducting plate (4) abuts against the inner wall of the stepped hole (201).

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