Tray structure of spin coater

Abstract

The utility model provides a spin coater tray structure, which relates to the technical field of spin coater, and comprises a spin coater, a glue shielding disc mounted in the middle of the top end of the spin coater, a top cover arranged at the top of the glue shielding disc, a tray arranged in the glue shielding disc, and an optical code disc mounted at the bottom end in the glue shielding disc and used for supporting the tray, and the adsorption assemblies are arranged on two sides of the top of the tray and are used for adsorbing and fixing the semiconductor chips. According to the spin coater tray structure, a semiconductor chip can be adsorbed on the tray to be fixed through the adsorption assembly, so that the semiconductor chip is stably placed on the tray, the semiconductor chip is prevented from falling off from the tray when being vibrated, the situation that the gluing work of the semiconductor chip is affected is avoided, the tray is conveniently detached from an optical code disc through the clamping assembly, and the working efficiency is improved. Paired trays can be replaced according to semiconductor chips of different sizes, it is ensured that the trays have good supporting force, and the trays are prevented from being damaged easily.

Description

Technical Field

[0001] The utility model relates to the technical field of spin coater, in particular to a spin coater tray structure. Background Art

[0002] A spin coater, also known as a spin coater or spin coater, is a device used to coat various types of glue solutions. It can quickly and accurately form a coating layer on a substrate, so it is widely used in the preparation of semiconductor devices. A spin coater tray is a component used on a spin coater. Its main function is to place semiconductor chips or other substrate materials to be processed, so that the spin coater can uniformly coat the colloid solvent on the material, form a protective layer on the substrate material, avoid being corroded by etching solution or other chemical substances, and ensure the integrity of the circuit pattern.

[0003] However, the existing spin coater tray structure still has the following disadvantages and deficiencies in actual use:

[0004] 1. When the existing spin coater tray is in use, the semiconductor chip is directly placed on the tray, and there is no fixing structure on the tray. When the vibration motor inside the spin coater works, the vibration motor transmits vibration to the optical encoder disk and the tray, causing the semiconductor chip to shake and be unstable during the process of uniformly coating the colloid on the semiconductor chip, resulting in the semiconductor chip being easily vibrated and dropped from the tray.

[0005] 2. When the tray and the optical encoder disk are in use, the tray is fixedly installed on the optical encoder disk, and the tray is not easy to disassemble and replace. When the semiconductor chip is large in size, the tray that matches the size of the semiconductor chip cannot be replaced, resulting in too small a tray size, which will reduce the supporting force and easily damage the tray. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is: to provide a spin coater tray structure, through which the adsorption component can adsorb and fix the semiconductor chip on the tray to prevent the semiconductor chip from falling off the tray when vibrating, avoiding affecting the glue coating work of the semiconductor chip, and through the clamping component, the tray that matches the semiconductor chip of different sizes can be replaced to ensure that the tray has good supporting force.

[0007] The technical problem to be solved by the utility model is achieved by the following technical solutions:

[0008] A spin coater tray structure includes: a spin coater, a glue shielding disk installed in the middle of the top end of the spin coater, a top cover arranged on the top of the glue shielding disk, a tray arranged inside the glue shielding disk, an optical encoder disk installed at the bottom end inside the glue shielding disk for supporting the tray, adsorption components arranged on both sides of the top of the tray for adsorbing and fixing the semiconductor chip, and a clamping component arranged between the tray and the optical encoder disk for clamping and installing the tray and the optical encoder disk.

[0009] Preferably, the adsorption assembly includes: suction cups installed on both sides of the top of the tray, a connecting pipe a provided at the bottom end of the suction cup, an air extraction pipe provided at the bottom of the connecting pipe a, an air extraction pump installed at the outer end of the spin coater, an air suction port provided at the top of the air extraction pump, and the air extraction pipe penetrates through the glue shielding disc and is connected to the air suction port, and an exhaust port provided at the outer end of the air extraction pump.

[0010] Preferably, the clamping assembly includes: a jack opened in the middle of the tray, a plurality of limiting grooves opened in the circumferential direction inside the jack, clamping grooves respectively opened on both sides inside the plurality of limiting grooves, a plurality of limiting blocks installed on the circumferential direction of the outer part of the optical code disc, and clamping blocks installed on both sides of the outer ends of the plurality of limiting blocks and clamped with the clamping grooves.

[0011] Preferably, a control panel is installed on the outer side of the spin coater, a handle is installed in the middle of the top end of the top cover, a connecting head is provided at the bottom of the top cover, and a sealing ring is sleeved outside the connecting head.

[0012] Preferably, a pipe joint connected to the air extraction pipe is provided at the bottom of the connecting pipe a, and a connecting pipe b is connected between the pipe joint and the air extraction pipe.

[0013] Preferably, support rods are installed on both sides of the bottom end inside the glue shielding disc, a supporting block is installed at the top of the support rod, and an arc groove adapted to the air extraction pipe is opened at the top of the supporting block.

[0014] Preferably, a protection frame is installed at the outer end of the spin coater by bolts, and the air extraction pump is located inside the protection frame. An installation block is installed between the air extraction pump and the protection frame by bolts. A through hole is opened on one side of the top of the protection frame, and the air extraction pipe is located inside the through hole.

[0015] The beneficial effects of the present utility model are:

[0016] Through the adsorption assembly, the semiconductor chip can be adsorbed and fixed on the tray, so that the semiconductor chip is stably placed on the tray, preventing the semiconductor chip from falling off the tray when vibrating, avoiding affecting the glue coating work of the semiconductor chip, and through the clamping assembly, it is convenient to disassemble the tray from the optical code disc, and trays of different sizes can be replaced according to the semiconductor chips of different sizes to ensure that the tray has good supporting force and avoid easily damaging the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the present utility model.

[0018] Figure 2 is a schematic diagram of the internal structure of the glue shielding disc of the present utility model.

[0019] Figure 3 This is a schematic cross-sectional view of the glue masking plate of the present utility model.

[0020] Figure 4 This is a schematic structural view of the tray of the present utility model.

[0021] Figure 5 This is a schematic structural view of the optical code disk of the present utility model.

[0022] Figure 6 This is a schematic structural view of the top cover of the present utility model.

[0023] Figure 7 This is of the present utility model Figure 2 Schematic enlarged view of part A.

[0024] Figures 1-7 In the figure: 1. Glue spreading machine; 101. Glue masking plate; 102. Top cover; 103. Tray; 104. Optical code disk; 105. Control panel; 2. Suction cup; 201. Connecting pipe a; 202. Exhaust pipe; 203. Exhaust pump; 204. Suction port; 205. Exhaust port; 206. Pipe joint; 207. Connecting pipe b; 3. Support rod; 301. Supporting block; 4. Jack; 401. Limiting groove; 402. Card slot; 5. Limiting block; 501. Clamping block; 6. Handle; 601. Connecting head; 602. Sealing ring; 7. Protection frame; 701. Mounting block; 702. Through hole. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0026] Next, the present application will be described in detail in conjunction with the accompanying drawings and specific embodiments.

[0027] Embodiment 1

[0028] As Figures 1-7 shown, a glue spreading machine tray structure includes: a glue spreading machine 1, a glue masking plate 101 installed in the middle of the top end of the glue spreading machine 1, a top cover 102 arranged on the top of the glue masking plate 101, a tray 103 arranged inside the glue masking plate 101, an optical code disk 104 installed at the bottom end inside the glue masking plate 101 for supporting the tray 103, an adsorption assembly arranged on both sides of the top of the tray 103 for adsorbing and fixing a semiconductor chip, and a clamping assembly arranged between the tray 103 and the optical code disk 104 for clamping and installing the tray 103 and the optical code disk 104.

[0029] Among them, referring toFigure 1 , Figure 2 , Figure 3 and Figure 6 , a control panel 105 is installed on the outside of the spin coater 1, a handle 6 is installed in the middle of the top of the top cover 102, a connector 601 is provided at the bottom of the top cover 102, and a sealing ring 602 is sleeved outside the connector 601.

[0030] When applying glue to the semiconductor chip, grasp the handle 6 and lift the top cover 102 from the top of the glue masking plate 101. After placing the semiconductor chip into the glue masking plate 101, support and hold it through the tray 103 and the optical code disk 104, and then cover the top cover 102 on the glue masking plate 101 for sealing. The connector 601 at the bottom of the top cover 102 is inserted into the inside of the glue masking plate 101, so that the sealing ring 602 is closely attached to the inner wall of the glue masking plate 101. The sealing performance between the top cover 102 and the glue masking plate 101 is increased through the sealing ring 602. Wires and a power plug are provided on the outside of the spin coater 1. The wires are connected to the control panel 105. Control buttons are provided on the control panel 105. After inserting the power plug into an external socket and turning on the power, start the vibration motor inside the spin coater 1 through the control panel 105. The vibration motor transmits vibration to the tray 103 and the optical code disk 104, so that the glue on the semiconductor chip vibrates and is evenly coated.

[0031] Among them, referring to Figures 1-3 , the adsorption assembly includes: suction cups 2 installed on both sides of the top of the tray 103, a connecting pipe a201 provided at the bottom end of the suction cup 2, an air extraction pipe 202 provided at the bottom of the connecting pipe a201, an air extraction pump 203 installed at the outer end of the spin coater 1, an air suction port 204 provided at the top of the air extraction pump 203, and the air extraction pipe 202 penetrates through the glue masking plate 101 and is connected to the air suction port 204, and an exhaust port 205 provided at the outer end of the air extraction pump 203.

[0032] When the tray 103 is installed on the optical code disk 104, the connecting pipe a201 at the bottom end of the suction cup 2 is connected to the air extraction pipe 202. After the semiconductor chip is placed on the tray 103, both sides of the bottom of the semiconductor chip are in contact with the suction cups 2. The air extraction pump 203 is electrically connected to the control panel 105 through wires. Start the air extraction pump 203 through the control buttons on the control panel 105. The air suction port 204 of the air extraction pump 203 generates suction force in the air extraction pipe 202, the connecting pipe a201 and the suction cups 2, extracts the air in the suction cups 2, and discharges the extracted air from the exhaust port 205, so that a lower pressure is formed in the suction cups 2, creating a vacuum environment. At this time, the pressure difference between the suction cups 2 and the semiconductor chip generates a vacuum suction force, thereby adsorbing and fixing the semiconductor chip, making the semiconductor chip firmly placed on the tray 103, preventing the semiconductor chip from falling off the tray 103 when vibrating, and avoiding affecting the glue application work of the semiconductor chip.

[0033] After the semiconductor chip is coated and processed, the air extraction pump 203 is turned off through the control button on the control panel 105, and the evacuation of the air extraction pipe 202, the connecting pipe a201, and the inside of the suction cup 2 is stopped. The vacuum state inside the suction cup 2 will gradually balance with the external atmospheric pressure, causing the semiconductor chip to slowly separate from the suction cup 2. Then, the semiconductor chip can be taken away from the suction cup 2. Moreover, for the control program involved in the present invention, those skilled in the art can implement it according to the same or similar principles in the prior art, and this part is not the innovation of the present invention.

[0034] Among them, referring to Figures 1-2 , a protective frame 7 is installed at the outer end of the spin coater 1 through bolts, and the air extraction pump 203 is located inside the protective frame 7. An installation block 701 is installed between the air extraction pump 203 and the protective frame 7 through bolts. A through hole 702 is opened on one side of the top of the protective frame 7, and the air extraction pipe 202 is located inside the through hole 702.

[0035] When the air extraction pump 203 is in use, the air extraction pump 203 is installed inside the protective frame 7 through the installation block 701 to prevent the air extraction pump 203 from protruding from the outer end of the spin coater 1 and being damaged by impact. When the air extraction pipe 202 is installed with the air extraction pump 203, the air extraction pipe 202 can penetrate through the through hole 702 into the protective frame 7, so that the air extraction pipe 202 can be connected and installed with the suction port 204 of the air extraction pump 203.

[0036] Among them, referring to Figure 3 , a pipe joint 206 connected to the air extraction pipe 202 is provided at the bottom of the connecting pipe a201, and a connecting pipe b207 is connected between the pipe joint 206 and the air extraction pipe 202.

[0037] When the connecting pipe a201 is installed and connected to the air extraction pipe 202, the two suction cups 2, the connecting pipe a201, and the air extraction pipe 202 can be interconnected through the pipe joint 206 and the connecting pipe b207. When the air extraction pump 203 works, the air inside the two suction cups 2 can be pumped out simultaneously, so that the two suction cups 2 reach a vacuum state at the same time to adsorb and fix the semiconductor chip, ensuring that the semiconductor chip is placed flat.

[0038] Among them, referring to Figure 3 , two support rods 3 are installed on both sides of the inner bottom end of the glue masking plate 101. A support block 301 is installed at the top of the support rod 3, and an arc-shaped groove adapted to the air extraction pipe 202 is opened at the top of the support block 301.

[0039] When the exhaust pipe 202 is connected to the connecting pipe a 201, the pipe joint 206 and the connecting pipe b 207 inside the glue shielding plate 101 during use, the bottom of the exhaust pipe 202 can be supported and placed by the support rod 3 and the support block 301, preventing the exhaust pipe 202 from sinking and bending, avoiding the formation of resistance inside the exhaust pipe 202 and affecting normal use. When replacing different trays 103 for use, since the exhaust pipe 202 is made of flexible hose material, its position can be adjusted according to the replaced tray 103 and connected to the connecting pipe a 201 and the pipe joint 206. Moreover, multiple positions of the support rod 3 and the support block 301 are arranged inside the glue shielding plate 101, and the adjusted exhaust pipe 202 can be supported and placed.

[0040] Embodiment 2

[0041] On the basis of Embodiment 1, referring to Figures 3-5 , the clamping component includes: a jack 4 opened in the middle of the tray 103, a plurality of limiting grooves 401 opened circumferentially inside the jack 4, a plurality of clamping grooves 402 respectively opened on both sides inside the plurality of limiting grooves 401, a plurality of limiting blocks 5 installed on the outer circumference of the optical code disk 104, and clamping blocks 501 installed on both outer ends of the plurality of limiting blocks 5 and engaged with the clamping grooves 402.

[0042] When the tray 103 is in use, the jack 4 in the middle of the tray 103 is inserted onto the optical code disk 104, and the limiting grooves 401 circumferentially inside the jack 4 will be respectively inserted into the corresponding limiting blocks 5 on the outer circumference of the optical code disk 104. At this time, the clamping blocks 501 on both outer ends of the limiting blocks 5 will be clamped in the clamping grooves 402 on both sides inside the limiting grooves 401. Since the diameters of the jack 4 and the optical code disk 104, the limiting grooves 401 and the limiting blocks 5, and the clamping grooves 402 and the clamping blocks 501 are all the same, when the optical code disk 104 is inserted into the jack 4, the limiting grooves 401 and the limiting blocks 5, and the clamping grooves 402 and the clamping blocks 501 are flush and engaged with each other, avoiding protruding outwards and affecting the normal use of the tray 103.

[0043] When the size of the semiconductor chip is relatively large, the tray 103 is pulled out from the optical code disk 104, so that the optical code disk 104 is separated from the jack 4, and the limiting blocks 5 and the clamping blocks 501 are respectively removed from the limiting grooves 401 and the clamping grooves 402, releasing the clamping and fixing of the limiting blocks 5 and the clamping blocks 501, facilitating the disassembly of the tray 103 from the optical code disk 104. The tray 103 can be replaced with a matching one according to different sizes of semiconductor chips, ensuring that the tray 103 has good supporting force and avoiding easy damage to the tray 103.

[0044] Specific working process:

[0045] When gluing a semiconductor chip, grasp the handle 6 to lift the top cover 102 from the top of the glue masking plate 101. After placing the semiconductor chip into the glue masking plate 101, support and hold it through the tray 103 and the optical code disk 104. The two sides at the bottom of the semiconductor chip are in contact and fit with the suction cups 2. Its air extraction pump 203 is electrically connected to the control panel 105 through a wire. Start the air extraction pump 203 to work through the control button on the control panel 105. The suction port 204 of the air extraction pump 203 generates suction force in the air extraction pipe 202, the connecting pipe a201, and the suction cups 2, extracts the air in the suction cups 2, and discharges the extracted air from the exhaust port 205, so as to form a lower pressure in the suction cups 2 and create a vacuum environment. At this time, the pressure difference between the suction cups 2 and the semiconductor chip generates a vacuum suction force, thereby adsorbing and fixing the semiconductor chip, making the semiconductor chip firmly placed on the tray 103 and preventing the semiconductor chip from falling off the tray 103 when it is vibrated.

[0046] Then cover the top cover 102 on the glue masking plate 101 for sealing. The connector 601 at the bottom of the top cover 102 is inserted into the inside of the glue masking plate 101, so that the sealing ring 602 closely adheres to the inner wall of the glue masking plate 101, and the sealing performance between the top cover 102 and the glue masking plate 101 is increased through the sealing ring 602. There are wires and a power plug outside the spin coater 1. The wire is connected to the control panel 105. There are control buttons on the control panel 105. After inserting the power plug into an external socket, connect the power supply. Start the vibration motor inside the spin coater 1 through the control panel 105. The vibration motor transmits vibration to the tray 103 and the optical code disk 104, so that the glue on the semiconductor chip vibrates and is evenly coated. When the size of the semiconductor chip is relatively large, pull out the tray 103 from the optical code disk 104, so that the optical code disk 104 disengages from the jack 4, and the limit block 5 and the latch 501 are respectively removed from the limit groove 401 and the card slot 402. The tray 103 can be replaced with a matching one according to the size of different semiconductor chips to ensure that the tray 103 has good supporting force and avoid easily damaging the tray 103.

[0047] In the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0048] The above has introduced in detail a spin coater tray structure provided by an embodiment of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The descriptions of the above embodiments are only used to help understand the technical solution and its core idea of the present application. Those of ordinary skill in the art should understand that: They can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer chuck structure for a spin coater, characterized in that, Comprising: A spin coater (1); A glue shielding disc (101) installed in the middle of the top end of the spin coater (1); A top cover (102) arranged on the top of the glue shielding disc (101); A tray (103) arranged inside the glue shielding disc (101), and an optical encoder disc (104) for supporting the tray (103) is installed at the bottom end inside the glue shielding disc (101); Adsorption components arranged on both sides of the top of the tray (103) for adsorbing and fixing semiconductor chips; A clamping component arranged between the tray (103) and the optical encoder disc (104) for clamping and installing the tray (103) and the optical encoder disc (104).

2. The wafer chuck structure of the spin coater according to claim 1, wherein The adsorption component includes: Suction cups (2) installed on both sides of the top of the tray (103), and a connecting pipe a (201) is arranged at the bottom end of the suction cup (2); An air extraction pipe (202) arranged at the bottom of the connecting pipe a (201); An air extraction pump (203) installed at the outer end of the spin coater (1), an air suction port (204) is arranged at the top of the air extraction pump (203), and the air extraction pipe (202) penetrates through the glue shielding disc (101) and is connected to the air suction port (204); An exhaust port (205) arranged at the outer end of the air extraction pump (203).

3. The wafer chuck structure of the spin coater according to claim 1, wherein, The clamping component includes: A jack (4) opened in the middle inside the tray (103); A plurality of limiting grooves (401) opened circumferentially inside the jack (4), and clamping grooves (402) are respectively opened on both sides inside the plurality of limiting grooves (401); A plurality of limiting blocks (5) installed on the outer circumference of the optical encoder disc (104); Clamping blocks (501) installed on both sides of the outer ends of the plurality of limiting blocks (5) and clamped and connected to the clamping grooves (402).

4. The wafer chuck structure of the spin coater according to claim 1, wherein A control panel (105) is installed on the outer side of the spin coater (1), a handle (6) is installed in the middle of the top end of the top cover (102), a connecting head (601) is arranged at the bottom of the top cover (102), and a sealing ring (602) is sleeved outside the connecting head (601).

5. The wafer chuck structure of the spin coater according to claim 2, characterized in that, A pipe joint (206) connected to the air extraction pipe (202) is arranged at the bottom of the connecting pipe a (201), and a connecting pipe b (207) is connected between the pipe joint (206) and the air extraction pipe (202).

6. The wafer chuck structure of the spin coater according to claim 2, wherein, Support rods (3) are installed on both sides of the bottom end inside the glue shielding disc (101), a supporting block (301) is installed at the top of the support rod (3), and an arc groove adapted to the air extraction pipe (202) is opened at the top of the supporting block (301).

7. The wafer chuck structure of the spin coater according to claim 2, wherein A protection frame (7) is installed at the outer end of the spin coater (1) through bolts, and the air extraction pump (203) is located inside the protection frame (7). An installation block (701) is installed between the air extraction pump (203) and the protection frame (7) through bolts. A through hole (702) is opened on one side of the top of the protection frame (7), and the air extraction pipe (202) is located inside the through hole (702).

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