MOSEFT chip welding device
Through the MOSEFT chip welding device integrating slide chutes, sliders, adjustment motors and camera image processing modules, the precise adjustment and temperature control of the welding joints are achieved, and the problems of inaccurate temperature and inaccurate positioning are solved, and the welding quality and efficiency are improved.
Patent Information
- Application Number
- CN202422322877.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The existing chip welding devices are not accurate enough in temperature control, which can easily lead to overheating and damage to the chip, inaccurate welding position position, complicated operation and inefficient efficiency.
The MOSEFT chip welding device is adopted that integrates chutes, sliders, adjustment motors and camera image processing modules to achieve accurate adjustment and temperature control of the welding head, and dynamically adjusts the heating power with the temperature sensor and controller to ensure welding quality and accuracy.
Improves soldering quality and accuracy, avoids chip overheating and damage, reduces human errors, and improves production efficiency.
Smart Images

Figure CN223114322U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip soldering, in particular to a MOSEFT chip soldering device. Background Art
[0002] Chip soldering refers to the process of assembling chips divided into individual circuits onto a metal lead frame or socket. Chip soldering is an important link in the integrated circuit manufacturing process, and strict control of the soldering quality is required to ensure the performance and reliability of the integrated circuit. In the production process of electronic devices, the soldering quality of MOSEFT chips directly affects the performance and reliability of the devices.
[0003] Existing chip soldering devices often have some deficiencies in actual use. For example, the temperature control during soldering is not precise enough, which easily causes overheating and damage to the chips; the positioning of the soldering position is not accurate enough, affecting the soldering effect; the operation is complex and the efficiency is low. Therefore, a MOSEFT chip soldering device is proposed. Summary of the Utility Model
[0004] In view of this, the utility model hopes to provide a MOSEFT chip soldering device to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option.
[0005] The technical solution of the embodiment of the utility model is realized as follows: A MOSEFT chip soldering device includes a soldering component, and the soldering component includes an operating table, a bracket, a chute, a first slider, a mounting frame, a second slider, a lifting electric cylinder, a heating element, a soldering head, a temperature sensor, a mounting ring, a camera, a through groove, a controller and an image processing module;
[0006] Both sides of the upper surface of the operating table are fixedly connected with brackets. The middle part of the upper surface of the bracket is provided with a chute. The inner side wall of the chute is slidably connected with a first slider. The bottom of the first slider is fixedly connected with a mounting frame. The inner side wall of the mounting frame is slidably connected with a second slider. The bottom of the second slider is fixedly connected with a lifting electric cylinder. The output end of the lifting electric cylinder is fixedly connected with a heating element. The center of the bottom of the heating element is provided with a soldering head. The middle part of the outer side wall of the soldering head is provided with a temperature sensor. The lower part of the outer side wall of the heating element is fixedly connected with a camera through a mounting ring. A through groove is opened in the front part of the upper surface of the operating table. The inner side wall of the through groove is fixedly connected with a controller. The output end of the temperature sensor is electrically connected to the input end of the controller. The top of the first slider is provided with an image processing module. The output end of the camera is electrically connected to the input end of the image processing module. The output end of the image processing module is electrically connected to the input end of the controller. The input end of the lifting electric cylinder is electrically connected to the output end of the controller.
[0007] Further preferably, a limiting groove is formed in the middle of the upper surface of the operating table. A heat dissipation opening is formed in the middle of the inner bottom wall of the limiting groove. A welding table is attached to the inner side wall of the limiting groove. A placement groove is formed in the middle of the upper surface of the welding table. An anti-slip pad is fixedly connected to the inner bottom wall of the placement groove. A plurality of heat dissipation holes are formed in both the inner bottom wall of the placement groove and the upper surface of the anti-slip pad. Pick-and-place grooves are formed in the middle of both sides of the upper surface of the operating table near the placement groove.
[0008] Further preferably, a first screw rod penetrates through the upper part of one side of the bracket. A transverse adjustment motor is fixedly connected to the outside of the bracket near the first screw rod. One end of the first screw rod is fixedly connected to the output end of the transverse adjustment motor. A first screw hole is formed in the center of one side of the first slider. The inner side wall of the first screw hole is threadedly connected to the inner side wall of the first screw rod. The input end of the transverse adjustment motor is electrically connected to the output end of the controller.
[0009] Further preferably, a second screw rod penetrates through the center of the front surface of the installation frame. A longitudinal adjustment motor is fixedly connected to the outside of the installation frame near the second screw rod. The front surface of the second screw rod is fixedly connected to the output end of the longitudinal adjustment motor. A second screw hole is formed in the center of the front surface of the second slider. The inner side wall of the second screw hole is threadedly connected to the inner side wall of the second screw rod. The input end of the longitudinal adjustment motor is electrically connected to the output end of the controller.
[0010] Further preferably, first limiting grooves are formed in the middle of both the inner front wall and the inner rear wall of the chute. First limiting blocks are fixedly connected to the middle of both the front surface and the rear surface of the first slider. The outer side wall of the first limiting block is slidably connected to the inner side wall of the first limiting groove.
[0011] Further preferably, second limiting grooves are formed in both sides of the inner side wall of the installation frame. Second limiting blocks are fixedly connected to the middle of both sides of the second slider. The outer side wall of the second limiting block is slidably connected to the inner side wall of the second limiting groove.
[0012] Further preferably, a touch screen is arranged on the upper surface of the controller.
[0013] Further preferably, support legs are fixedly connected to the four corners of the bottom of the operating table.
[0014] Due to the adoption of the above technical solutions in the embodiments of the present utility model, it has the following advantages:
[0015] 1. The utility model integrates a chute, a first slider, a second slider, a lateral adjustment motor and a longitudinal adjustment motor, realizing precise adjustment of the welding head in the left - right and front - back directions. At the same time, the addition of a camera and an image - processing module enables the device to capture images of the welding area in real - time and quickly analyze the welding state through image - processing technology, ensuring the accuracy of the welding position, improving the welding quality, and enhancing the precision and stability of welding;
[0016] 2. The utility model uses a temperature sensor to monitor the temperature of the welding - head area in real - time and feedback the data to the controller. The controller dynamically adjusts the heating power of the heating element according to the preset temperature parameters, ensuring accurate temperature control during the welding process, effectively avoiding the risk of chip overheating and damage. Moreover, the entire welding process, from positioning, heating to welding, is automatically completed by the device without manual intervention, greatly improving production efficiency and reducing the possibility of human error.
[0017] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will become apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] To more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 It is a structural diagram of one perspective of the utility model;
[0020] Figure 2 It is a structural diagram of another perspective of the utility model;
[0021] Figure 3 It is a structural diagram of the welding table and the anti - slip pad of the utility model;
[0022] Figure 4 It is a structural diagram of the first slider and the welding head of the utility model.
[0023] Reference numerals: 1, welding assembly; 11, operating table; 12, bracket; 13, chute; 14, first slider; 15, mounting frame; 16, second slider; 17, lifting electric cylinder; 18, heating element; 19, welding head; 20, temperature sensor; 21, mounting ring; 22, camera; 23, through groove; 24, controller; 25, image processing module; 26, limiting groove; 27, heat dissipation port; 28, welding table; 29, placement groove; 30, anti-slip pad; 31, heat dissipation hole; 32, pick-and-place groove; 33, first screw; 34, lateral adjustment motor; 35, first screw hole; 36, second screw; 37, longitudinal adjustment motor; 38, second screw hole; 39, first limiting groove; 40, first limiting block; 41, second limiting groove; 42, second limiting block; 43, touch screen; 44, support leg. Detailed implementation manners
[0024] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.
[0025] The embodiments of the present invention will be described in detail below with reference to the drawings.
[0026] As Figures 1 - 4 shown, an embodiment of the present invention provides a MOSFET chip welding device, including a welding assembly 1. The welding assembly 1 includes an operating table 11, a bracket 12, a chute 13, a first slider 14, a mounting frame 15, a second slider 16, a lifting electric cylinder 17, a heating element 18, a welding head 19, a temperature sensor 20, a mounting ring 21, a camera 22, a through groove 23, a controller 24, and an image processing module 25;
[0027] On both sides of the upper surface of the operating table 11, there are fixedly connected brackets 12. In the middle of the upper surface of the bracket 12, there is a chute 13. The inner side wall of the chute 13 is slidably connected with a first slider 14. The bottom of the first slider 14 is fixedly connected with a mounting frame 15. The inner side wall of the mounting frame 15 is slidably connected with a second slider 16. The bottom of the second slider 16 is fixedly connected with a lifting electric cylinder 17. The output end of the lifting electric cylinder 17 is fixedly connected with a heating element 18. At the center of the bottom of the heating element 18, there is a welding head 19. In the middle of the outer side wall of the welding head 19, there is a temperature sensor 20. The lower part of the outer side wall of the heating element 18 is fixedly connected with a camera 22 through a mounting ring 21. In the front part of the upper surface of the operating table 11, there is a through groove 23. The inner side wall of the through groove 23 is fixedly connected with a controller 24. The output end of the temperature sensor 20 is electrically connected to the input end of the controller 24. At the top of the first slider 14, there is an image processing module 25. The output end of the camera 22 is electrically connected to the input end of the image processing module 25. The output end of the image processing module 25 is electrically connected to the input end of the controller 24. The input end of the lifting electric cylinder 17 is electrically connected to the output end of the controller 24. The camera 22 takes pictures of the welding area and transmits the taken pictures to the image processing module 25. Thus, the image processing module 25 analyzes and identifies the welding state (such as whether there is poor welding, whether the solder joints are uniform, etc.), and feeds back the analysis result to the controller 24. If an abnormal situation occurs, the controller 24 can take remedial measures in time or stop welding.
[0028] In one embodiment, specifically: In the middle of the upper surface of the operating table 11, there is a limit groove 26. In the middle of the inner bottom wall of the limit groove 26, there is a heat dissipation port 27. The inner side wall of the limit groove 26 is closely connected with a welding table 28. In the middle of the upper surface of the welding table 28, there is a placement groove 29. The inner bottom wall of the placement groove 29 is fixedly connected with an anti-slip pad 30. Both the inner bottom wall of the placement groove 29 and the upper surface of the anti-slip pad 30 are provided with a plurality of heat dissipation holes 31. On both sides of the upper surface of the operating table 11, close to the middle of the placement groove 29, there are pick-up and placement grooves 32. The heat generated during the welding process is dissipated through the welding table 28, the anti-slip pad 30, and the heat dissipation ports 27 and heat dissipation holes 31 on the operating table 11 to ensure that the temperature of the welding device and the chip is within a safe range.
[0029] In one embodiment, specifically: a first screw rod 33 passes through the upper part of one side of the bracket 12. A lateral adjustment motor 34 is fixedly connected to the outer side of the bracket 12 near the first screw rod 33. One end of the first screw rod 33 is fixedly connected to the output end of the lateral adjustment motor 34. A first screw hole 35 is formed at the center of one side of the first slider 14. The inner side wall of the first screw hole 35 is threadedly connected to the inner side wall of the first screw rod 33. The input end of the lateral adjustment motor 34 is electrically connected to the output end of the controller 24. By the threaded connection between the first screw rod 33 and the first screw hole 35 on the first slider 14, when the lateral adjustment motor 34 drives the first screw rod 33 to rotate, the first slider 14 is driven to move left and right.
[0030] In one embodiment, specifically: a second screw rod 36 passes through the center of the front surface of the mounting frame 15. A longitudinal adjustment motor 37 is fixedly connected to the outer side of the front surface of the mounting frame 15 near the second screw rod 36. The front surface of the second screw rod 36 is fixedly connected to the output end of the longitudinal adjustment motor 37. A second screw hole 38 is formed at the center of the front surface of the second slider 16. The inner side wall of the second screw hole 38 is threadedly connected to the inner side wall of the second screw rod 36. The input end of the longitudinal adjustment motor 37 is electrically connected to the output end of the controller 24. By the threaded connection between the second screw rod 36 and the second screw hole 38 on the second slider 16, when the longitudinal adjustment motor 37 drives the second screw rod 36 to rotate, the second slider 16 is driven to move back and forth.
[0031] In one embodiment, specifically: first limiting grooves 39 are formed in the middle of the inner front wall and the inner rear wall of the sliding groove 13. First limiting blocks 40 are fixedly connected to the middle of the front surface and the rear surface of the first slider 14. The outer side wall of the first limiting block 40 is slidably connected to the inner side wall of the first limiting groove 39. By the first limiting block 40 on the first slider 14 sliding inside the first limiting groove 39, the first limiting block 40 is limited, thereby increasing the stability of the sliding of the first slider 14.
[0032] In one embodiment, specifically: second limiting grooves 41 are formed on both sides of the inner side wall of the mounting frame 15. Second limiting blocks 42 are fixedly connected to the middle of both sides of the second slider 16. The outer side wall of the second limiting block 42 is slidably connected to the inner side wall of the second limiting groove 41. By the second limiting block 42 on the second slider 16 sliding inside the second limiting groove 41, the second slider 16 is limited, thereby increasing the stability of the sliding of the second slider 16.
[0033] In one embodiment, specifically: a touch screen 43 is arranged on the upper surface of the controller 24. Through the touch screen 43, it is convenient to set welding parameters and observe welding quality, etc.
[0034] In one embodiment, specifically: Support legs 44 are fixedly connected to the four corners of the bottom of the operating table 11. By supporting the operating table 11 through the support legs 44, the stability of the entire device is increased.
[0035] When the present utility model is working: The MOSEFT chip to be welded is placed in the placement groove 29 of the welding table 28. The anti-slip pad 30 ensures that the chip does not slide during the welding process. Welding parameters such as welding temperature and welding time are set through the touch screen 43 on the operating table 11. These parameters will be input into the controller 24. The horizontal adjustment motor 34 is started, and the first slider 14 is driven by the first screw rod 33 to move left and right in the sliding groove 13, thereby adjusting the horizontal position of the welding head 19 left and right. At the same time, the vertical adjustment motor 37 is started, and the second slider 16 is driven by the second screw rod 36 to move back and forth in the mounting frame 15, so that the welding head 19 is aligned with the welding point on the chip. The controller 24 controls the lifting electric cylinder 17 to start according to the preset welding parameters, so that the heating element 18 and the welding head 19 descend close to the chip surface. The heating element 18 starts to heat, and the heat is transferred to the chip and the solder through the welding head 19, and the welding process starts. The temperature sensor 20 monitors the temperature of the welding area in real time and transmits the data to the controller 24. The controller 24 adjusts the heating power of the heating element 18 according to the temperature data to ensure that the welding temperature is maintained within the set range. The camera 22 takes an image of the welding area, analyzes it through the image processing module 25, identifies the welding state (such as whether there is poor welding, whether the solder joints are uniform, etc.), and feeds back the analysis result to the controller 24. If an abnormal situation occurs, the controller 24 can take remedial measures in time or stop the welding. After the welding is completed, the lifting electric cylinder 17 drives the heating element 18 and the welding head 19 to rise and leave the chip surface. The operator can conveniently pick up and place the welded chip or place a new chip for welding through the pick-and-place groove 32 on the operating table 11.
[0036] As described above, only the specific embodiments of the present utility model are provided, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various changes or substitutions, and these should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.
Claims
1. A MOSEFT chip soldering device, characterized in that: Comprising a welding assembly (1), the welding assembly (1) includes an operating table (11), a bracket (12), a chute (13), a first slider (14), a mounting frame (15), a second slider (16), a lifting electric cylinder (17), a heating element (18), a welding head (19), a temperature sensor (20), a mounting ring (21), a camera (22), a through slot (23), a controller (24) and an image processing module (25); On both sides of the upper surface of the operating table (11), brackets (12) are fixedly connected. In the middle of the upper surface of the bracket (12), a chute (13) is opened. The inner side wall of the chute (13) is slidably connected with a first slider (14). The bottom of the first slider (14) is fixedly connected with a mounting frame (15). The inner side wall of the mounting frame (15) is slidably connected with a second slider (16). The bottom of the second slider (16) is fixedly connected with a lifting electric cylinder (17). The output end of the lifting electric cylinder (17) is fixedly connected with a heating element (18). At the center of the bottom of the heating element (18), a welding head (19) is arranged. In the middle of the outer side wall of the welding head (19), a temperature sensor (20) is arranged. At the lower part of the outer side wall of the heating element (18), a camera (22) is fixedly connected through a mounting ring (21). At the front part of the upper surface of the operating table (11), a through slot (23) is opened. The inner side wall of the through slot (23) is fixedly connected with a controller (24). The output end of the temperature sensor (20) is electrically connected to the input end of the controller (24). At the top of the first slider (14), an image processing module (25) is arranged. The output end of the camera (22) is electrically connected to the input end of the image processing module (25). The output end of the image processing module (25) is electrically connected to the input end of the controller (24). The input end of the lifting electric cylinder (17) is electrically connected to the output end of the controller (24).
2. The welding device for a MOSEFT chip according to claim 1, characterized in that: In the middle of the upper surface of the operating table (11), a limiting groove (26) is opened. In the middle of the inner bottom wall of the limiting groove (26), a heat dissipation port (27) is opened. The inner side wall of the limiting groove (26) is fitted and connected with a welding table (28). In the middle of the upper surface of the welding table (28), a placement groove (29) is opened. On the inner bottom wall of the placement groove (29), an anti-slip pad (30) is fixedly connected. On the inner bottom wall of the placement groove (29) and the upper surface of the anti-slip pad (30), a plurality of heat dissipation holes (31) are opened. On both sides of the upper surface of the operating table (11) near the placement groove (29), pick-and-place grooves (32) are opened.
3. The welding device for a MOSEFT chip according to claim 1, characterized in that: A first screw rod (33) penetrates through the upper part of one side of the bracket (12). A lateral adjustment motor (34) is fixedly connected to the outside of the bracket (12) near the first screw rod (33). One end of the first screw rod (33) is fixedly connected to the output end of the lateral adjustment motor (34). A first screw hole (35) is formed at the center of one side of the first slider (14). The inner side wall of the first screw hole (35) is threadedly connected to the inner side wall of the first screw rod (33). The input end of the lateral adjustment motor (34) is electrically connected to the output end of the controller (24).
4. A MOSEFT chip soldering device according to claim 1, characterized in that: A second screw rod (36) penetrates through the center of the front surface of the mounting frame (15). A longitudinal adjustment motor (37) is fixedly connected to the outside of the front surface of the mounting frame (15) near the second screw rod (36). The front surface of the second screw rod (36) is fixedly connected to the output end of the longitudinal adjustment motor (37). A second screw hole (38) is formed at the center of the front surface of the second slider (16). The inner side wall of the second screw hole (38) is threadedly connected to the inner side wall of the second screw rod (36). The input end of the longitudinal adjustment motor (37) is electrically connected to the output end of the controller (24).
5. The welding device for a MOSEFT chip according to claim 3, wherein: First limiting grooves (39) are formed in the middle of the inner front wall and the inner rear wall of the sliding groove (13). First limiting blocks (40) are fixedly connected to the middle of the front surface and the rear surface of the first slider (14). The outer side wall of the first limiting block (40) is slidably connected to the inner side wall of the first limiting groove (39).
6. The welding device for a MOSEFT chip according to claim 4, characterized in that: Second limiting grooves (41) are formed on both sides of the inner side wall of the mounting frame (15). Second limiting blocks (42) are fixedly connected to the middle of both sides of the second slider (16). The outer side wall of the second limiting block (42) is slidably connected to the inner side wall of the second limiting groove (41).
7. A MOSEFT chip soldering device according to claim 1, characterized in that: A touch screen (43) is arranged on the upper surface of the controller (24).
8. A MOSEFT chip soldering device according to claim 1, characterized in that: Support legs (44) are fixedly connected to the four corners of the bottom of the operating table (11).