High-density multichannel transceiving integrated device and laser radar

Abstract

The utility model provides a high-density multichannel transmit-receive integrated device and laser radar, including at least four transmit-receive assemblies, each transmit-receive assembly includes a waveguide chip, a laser array and a circuit board assembly, the laser array includes at least eight lasers arranged in parallel, and the waveguide chip is connected with the circuit board assembly. Each laser is used for emitting a light signal to the waveguide chip, the waveguide chip is used for dividing each received light signal into at least four paths of first light splitting signals and emitting the first light splitting signals to the external scanning unit, and the external scanning unit emits the first light splitting signals to a target object; the structure can be applied to the laser radar, the laser radar with more than 128 independent channels is realized through the structure, the demodulation cross-period of the laser radar is avoided, and the demodulation requirement of the laser radar is met.

Description

Technical Field

[0001] The utility model relates to the technical field of radar speed measurement and ranging, in particular to a high-density multi-channel transceiver integrated device and a lidar. Background Technique

[0002] In order to meet the needs of driverless technology, existing vehicle-mounted lidars usually need to meet the sensing requirements of a distance of more than 200 m, a large angle of 120 degrees × 25 degrees, a high frequency of more than 5 Hz / frame, and a high resolution of 0.2 degrees. Correspondingly, the lidar needs to scan about 400,000 points per second. When a lidar with 64 independent channels is used for scanning, the scanning integration time for each point is 1.25 microseconds; when a lidar with 32 independent channels is used for scanning, the scanning integration time for each point is 0.625 microseconds. In existing common solutions, beat frequency demodulation of reflected light and local oscillator light is adopted within the same period. The time for one period of the optical signal to be emitted towards a target at 200 m and return to the receiver is 1.33 microseconds. When the number of independent channels is 64 and 32, the scanning integration time for a single point is less than 1.33 microseconds, resulting in the scanning time for a single point exceeding the round-trip period of the optical signal, leading to inability to demodulate and restore distance and speed information. Moreover, most of the existing lidar structures are usually adapted to 64 or 32 independent channels, which are difficult to meet the demodulation requirements.

[0003] In view of this, overcoming the defects of the existing technology is an urgent problem to be solved in this technical field. Summary of the Utility Model

[0004] The problem to be solved by the utility model is to provide a lidar structure with a sufficient number of independent channels to meet the demodulation requirements.

[0005] In a first aspect, a high-density multi-channel transceiver integrated device is provided, including: at least four transceiver components 1, where:

[0006] Each transceiver component 1 includes a waveguide chip 11, a laser array 12, and a circuit board component 13. The laser array 12 includes at least 8 lasers 121 arranged in parallel;

[0007] Each laser 121 is used to emit an optical signal to the waveguide chip 11. The waveguide chip 11 is used to divide each received optical signal into at least four first split optical signals and emit them to an external scanning unit. The waveguide chip 11 is also used to receive the return light from the external scanning unit. The circuit board component 13 is used to convert the return light into an electrical signal.

[0008] Further, each of the waveguide chips 11 includes at least eight transmission components 11a, and each of the transmission components 11a corresponds to one of the lasers 121; each of the transmission components 11a includes: a transmitting end splitter 112, a plurality of couplers 113, and a plurality of transceiver units 114, wherein:

[0009] The transmitting end splitter 112 is configured to receive the optical signal emitted from the corresponding laser 121, and divide the optical signal into at least four first split signals. The transmitting end splitter 112 includes at least four split output terminals, and each output terminal is connected to the incident end of the corresponding coupler 113. The combined port of the coupler 113 is connected to the corresponding transceiver unit 114, and the return light output from the output terminal of the coupler 113 is transmitted to the corresponding PD array unit 131 in the circuit board assembly 13;

[0010] The transceiver unit 114 is configured to emit the first split signal to an external scanning unit, and is further configured to receive the return light from the external scanning unit. The return light is looped back from the combined port of the coupler 113 to the output terminal of the coupler 113.

[0011] Further, each of the transmission components 11a further includes: a first splitter 116, a receiving end splitter 117, and a plurality of mixers 118, wherein:

[0012] In the same transmission component 11a, the first splitter 116 is configured to receive the optical signal emitted from the corresponding laser 121, and divide the optical signal into two paths. The first splitter 116 includes at least two split output terminals, one of the split output terminals is connected to the input end of the transmitting end splitter 112, and the other split output terminal is connected to the receiving end splitter 117, and the two split optical signals are respectively transmitted to the transmitting end splitter 112 and the receiving end splitter 117;

[0013] The receiving end splitter 117 is configured to divide the received optical signal into at least four second split signals. The receiving end splitter 117 includes at least four split output terminals, and each output terminal is connected to one of the input ends of the corresponding mixer 118. The other input end of the mixer 118 is connected to the output terminal of the corresponding coupler 113;

[0014] The mixer 118 is configured to mix the second split signal and the return light, and transmit the mixed optical signal to the PD array unit 131.

[0015] Further, the high-density multi-channel transceiver integrated device further includes a first combining prism 2a, wherein:

[0016] A transmitting surface 21a and a reflecting surface 22a are provided on the first combining prism 2a;

[0017] The first splitting signals emitted by at least two transceiver components 1 are incident on the transmission surface 21a of the first combining prism 2a along a first direction, and are transmitted through the transmission surface 21a to the external scanning unit;

[0018] The first splitting signals emitted by at least two other transceiver components 1 are incident on the reflection surface 22a of the first combining prism 2a along a second direction, and are reflected by the reflection surface 22a to the external scanning unit;

[0019] Wherein, the first direction and the second direction are perpendicular to each other, the first direction forms a 45-degree angle with both the transmission surface 21a and the reflection surface 22a in the first combining prism 2a, and the second direction forms a 45-degree angle with both the transmission surface 21a and the reflection surface 22a in the first combining prism 2a.

[0020] Further, the high-density multi-channel transceiver integrated device further includes a second combining prism 2b and a half-wave plate 3, wherein:

[0021] The first splitting signals emitted by at least two transceiver components 1 are incident on the second combining prism 2b along a first direction, and are transmitted through the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit;

[0022] The first splitting signals emitted by at least two other transceiver components 1 are incident on the second combining prism 2b along a second direction after passing through the half-wave plate 3, and are reflected by the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit;

[0023] Wherein, the first direction and the second direction are perpendicular to each other, the first direction forms a 45-degree angle with the transmissive-reflective mirror 21b in the second combining prism 2b, and the second direction forms a 45-degree angle with the transmissive-reflective mirror 21b in the second combining prism 2b.

[0024] Further, the at least four transceiver components 1 include: a first transceiver component 1a, a second transceiver component 1b, a third transceiver component 1c, and a fourth transceiver component 1d. The high-density multi-channel transceiver integrated device further includes: a first reflecting prism 4, a second reflecting prism 5, a third reflecting prism 6, and a fourth reflecting prism 7, wherein:

[0025] The first splitting signal emitted by the first transceiver component 1a is incident on the second combining prism 2b along a first direction, and is transmitted through the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit;

[0026] The first split optical signal emitted by the second transceiver component 1b is incident on the second reflection prism 5 along the first direction. The second reflection prism 5 reflects the received first split optical signal to the first reflection prism 4. The first reflection prism 4 reflects the received first split optical signal along the first direction to the second combining prism 2b, and is transmitted through the transmissive and reflective lens 21b in the second combining prism 2b to the external scanning unit.

[0027] The first split optical signal emitted by the third transceiver component 1c is incident on the second combining prism 2b along the second direction after passing through the half-wave plate 3, and is reflected by the transmissive and reflective lens 21b in the second combining prism 2b to the external scanning unit.

[0028] The first split optical signal emitted by the fourth transceiver component 1d is incident on the fourth reflection prism 7 along the second direction. The fourth reflection prism 7 reflects the received first split optical signal to the third reflection prism 6. The third reflection prism 6 reflects the received first split optical signal along the second direction to the half-wave plate 3, is incident on the second combining prism 2b after passing through the half-wave plate 3, and is reflected by the transmissive and reflective lens 21b in the second combining prism 2b to the external scanning unit.

[0029] Further, each transceiver component 1 further includes a first lens array 14 and an isolator array 15, where:

[0030] In the same transceiver component 1, the first lens array 14 and the isolator array 15 are sequentially arranged on the optical path between the laser array 12 and the waveguide chip 11.

[0031] Further, each transceiver component 1 further includes a second lens array 16, where:

[0032] In the same transceiver component 1, the second lens array 16 is arranged on the optical path of the return light to the waveguide chip 11.

[0033] Further, each transceiver component 1 further includes a semiconductor cooler 17, where:

[0034] In the same transceiver component 1, the laser array 12 and the waveguide chip 11 are both arranged on the semiconductor cooler 17, and the semiconductor cooler 17 is connected to the circuit board component 13.

[0035] In a second aspect, a lidar is provided, including the high-density multi-channel transceiver integrated device described in the first aspect and a scanning unit;

[0036] The high-density multi-channel transceiver integrated device is used to emit at least 128 optical signals, and the scanning unit is used to emit the at least 128 optical signals to a target object.

[0037] The utility model provides a high-density multi-channel transceiver integrated device, which includes at least four transceiver components. Each transceiver component includes a waveguide chip, a laser array and a circuit board component. The laser array includes at least 8 lasers arranged in parallel. Each laser is used to emit an optical signal to the waveguide chip. The waveguide chip is used to divide each received optical signal into at least four first split optical signals and emit them to an external scanning unit. The external scanning unit emits the first split optical signals to a target object. The target object reflects the light back to the waveguide chip. The waveguide chip transmits the received returned light to the circuit board component. The circuit board component converts the returned light into an electrical signal and transmits it to an external host to obtain the scanning information of the target object. The above structure can be applied to lidar production. A lidar with more than 128 independent channels is realized through the above structure, avoiding the demodulation cross-cycle of the lidar and meeting the demodulation requirements of the lidar. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0039] Figure 1 It is a schematic structural diagram of a high-density multi-channel transceiver integrated device provided by an embodiment of the present utility model;

[0040] Figure 2 It is a schematic structural diagram of a single transceiver component in a high-density multi-channel transceiver integrated device provided by an embodiment of the present utility model;

[0041] Figure 3 It is an optical path schematic diagram of a laser, a transmission component and a circuit board component in a high-density multi-channel transceiver integrated device provided by an embodiment of the present utility model;

[0042] Figure 4 It is a partial structural schematic diagram of another high-density multi-channel transceiver integrated device provided by an embodiment of the present utility model;

[0043] Figure 5 It is a schematic structural diagram of another high-density multi-channel transceiver integrated device provided by an embodiment of the present utility model;

[0044] Figure 6 It is a partial structural schematic diagram of a high-density multi-channel transceiver integrated device provided by an embodiment of the present utility model;

[0045] Figure 7 It is a partial structural schematic diagram of another high-density multi-channel transceiver integrated device provided by an embodiment of the present invention;

[0046] Figure 8 It is a structural schematic diagram of a single transceiver component in a high-density multi-channel transceiver integrated device provided by an embodiment of the present invention;

[0047] Among them, the attached drawing numbers are as follows:

[0048] Transceiver component 1; First transceiver component 1a; Second transceiver component 1b; Third transceiver component 1c; Fourth transceiver component 1d; Waveguide chip 11; Transmission component 11a; Transmitter splitter 112; Coupler 113; Transceiver unit 114; Laser array 12; Laser 121; First splitter 116; Receiver splitter 117; Mixer 118; Circuit board assembly 13; PD array unit 131; First lens array 14; Isolator array 15; Second lens array 16; Semiconductor refrigerator 17; Thermistor 18; First combining prism 2a; Transmission surface 21a; Reflection surface 22a; Second combining prism 2b; Beam splitter 21b; Half-wave plate 3; First reflecting prism 4; Second reflecting prism 5; Third reflecting prism 6; Fourth reflecting prism 7. Detailed implementation manners

[0049] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the attached drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0050] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the attached drawings. It is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present disclosure.

[0051] In the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, for example, for the same type of nouns in the description, the method of adding "A" and "B" at the end is used to describe them as two independent individuals. In this case, the features defined with "A" and "B" are only used for the purpose of distinguishing similar individuals and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0052] In the description of some embodiments, the expressions "coupled", "coupled to" and "connected" and their derivatives may be used. For example, in the description of some embodiments, the term "connected" may be used to indicate that two or more components have direct physical or electrical contact with each other. Another example is that in the description of some embodiments, the term "coupled to" may be used to indicate that two or more components have direct physical or electrical contact. However, the term "connected" or "coupled" may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the content of the present utility model.

[0053] In the description of the present utility model, there will be a description method of "A and / or B", where A and B are used to formally represent specific feature contents. The corresponding description methods include the following three combinations: only A, only B, and the combination of A and B.

[0054] As used in the present utility model, "about", "substantially" or "approximately" includes the stated value and the average value within an acceptable deviation range of the specific value, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of the specific quantity, i.e., the limitations of the measurement system.

[0055] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is to be construed in an open - inclusive sense, that is, "including, but not limited to". In the description of the specification, terms such as "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" are intended to indicate that specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above - mentioned terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above - mentioned terms due to reasons such as the order and position of appearance, it is not limited that they can be carried by one embodiment or example in a combined manner.

[0056] In addition, the technical features involved in each embodiment of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0057] Embodiment 1:

[0058] In the prior art, when actually detecting a distal target by a lidar, for example, detecting a target more than 200 m away, the large angle is 120 degrees × 25 degrees, the high frequency is more than 5 Hz per frame, and at the same time, the high resolution is 0.2 degrees. Corresponding to the lidar scanning about 400,000 points per second. For the above scenario, the time for one cycle of the optical signal to be emitted towards the target at 200 m and returned to the receiver is 1.33 microseconds. Currently, lidars generally have 64 independent channels or 32 independent channels. When using a 64 - independent - channel lidar for scanning, the scanning integration time for each point is 1.25 microseconds; when using a 32 - independent - channel lidar for scanning, the scanning integration time for each point is 0.625 microseconds. To sum up, when the number of independent channels is 64 and 32, the scanning integration time for a single point is less than 1.33 microseconds, resulting in the scanning time for a single point exceeding the round - trip period of the optical signal, leading to inability to demodulate. This is because the number of independent channels is small and a single point cannot be scanned for a long time.

[0059] To solve the problem that the scanning integration time of a single point exceeds the round - trip period of the optical signal, resulting in inability to demodulate, this embodiment provides a lidar with at least 128 independent channels. When the number of independent channels is 128, the scanning integration time for each point is 2.5 microseconds, ensuring that the scanning integration time for a single point is greater than the round - trip period of the optical signal and meeting the demodulation requirements.

[0060] In order to avoid cross-cycle demodulation of lidar in the case of long-distance, high-resolution, and high-frame-rate detection (for example, detecting targets more than 200 m away, with a resolution of 0.2 degrees and a high frequency of more than 5 Hz per frame), this embodiment provides a high-density multi-channel transceiver integrated device with at least 128 independent channels to meet the corresponding demodulation requirements as follows:

[0061] As Figure 1 shown, the high-density multi-channel transceiver integrated device includes: at least four transceiver components 1, where:

[0062] Each transceiver component 1 includes a waveguide chip 11 and a laser array 12. The laser array 12 includes at least 8 lasers 121 arranged in parallel. Each laser 121 is used to emit an optical signal to the waveguide chip 11. The waveguide chip 11 is used to divide each received optical signal into at least four first split optical signals and emit them to an external scanning unit. The waveguide chip 11 is also used to receive the return light from the external scanning unit. The circuit board component 13 is used to convert the received return light into an electrical signal and process it to obtain information about the target object.

[0063] In this embodiment, the high-density multi-channel transceiver integrated device includes four transceiver components 1. Each transceiver component 1 can use a ceramic block as a base board. The laser array 12 and the waveguide chip 11 are both arranged on the base board. At the same time, the circuit board component 13 is arranged on the base board. Electronic components such as cross-group amplifiers, resistors, and capacitors are arranged on the circuit board component 13. The circuit board component 13 is connected to the external circuit of the transceiver component 1 to achieve power supply. In this embodiment, the external scanning unit can be a one-dimensional galvanometer, a two-dimensional galvanometer, or a rotating mirror, etc.

[0064] The laser array 12 in each transceiver component 1 includes at least 8 lasers 121. Each laser 121 transmits an optical signal to the waveguide chip 11. The waveguide chip 11 divides each received optical signal into at least 4 first split optical signals. Therefore, a single transceiver component 1 will output at least 32 first split optical signals, and the entire high-density multi-channel transceiver integrated device will output at least 128 first split optical signals. After all the first split optical signals pass through the scanning unit, all the output first split optical signals are emitted to the target object. The first split optical signal is reflected by the target object along the original optical path and returns to the waveguide chip 11. The waveguide chip 11 transmits the return light to the circuit board component 13. The circuit board component 13 converts the received return light into an electrical signal and transmits it to an external host to analyze the electrical signal and realize image scanning of the target object.

[0065] In one embodiment, as Figure 2As shown in the figure, in each transceiver component 1, a first lens array 14 and an isolator array 15 are sequentially arranged along the optical path direction between the laser array 12 and the waveguide chip 11. The first lens array 14 includes at least 8 lenses. All the lenses in the same first lens array 14 are arranged in parallel. Each lens corresponds to each laser 121 one by one, and each lens is arranged on the outgoing optical path of the corresponding laser 121 to collimate the optical signal emitted by the corresponding laser 121. The isolator array 15 includes at least 8 isolators. All the isolators in the same isolator array 15 are arranged in parallel. Each isolator corresponds to each laser 121 one by one, and each isolator is arranged on the outgoing optical path of the corresponding laser 121, between the lens and the waveguide chip 11, to filter the collimated optical signal.

[0066] Similarly, as Figure 2 shown, the return light reflected from the target object back to the waveguide chip 11 also needs to be collimated. Therefore, each transceiver component 1 further includes a second lens array 16, where: the second lens array 16 is arranged on the optical path of the return light to the transceiver component 1. The second lens array 16 includes at least 32 lenses. Each lens in the second lens array 16 corresponds to one of the return lights and is arranged on the optical path of the corresponding return light to collimate the corresponding return light.

[0067] In this embodiment, in order to meet the requirements of the corresponding number of channels, it is necessary to meet the corresponding beam splitting requirements and the requirements for the round-trip optical paths of the optical signals in each channel. Therefore, this embodiment also involves the following design:

[0068] As Figure 3 shown, each waveguide chip 11 includes at least 8 transmission components 11a, and each transmission component 11a corresponds to one of the lasers 121; each transmission component 11a includes: a transmitting end splitter 112, a plurality of couplers 113, and a plurality of transceiver units 114, where.

[0069] The transmitting end splitter 112 is used to receive the optical signal emitted by the corresponding laser 121 and divide the optical signal into at least four first split optical signals. The transmitting end splitter 112 includes at least 4 split output ends. Each output end is connected to the incident end of the corresponding coupler 113, the composite port of the coupler 113 is connected to the corresponding transceiver unit 114, and the return light output from the output end of the coupler 113 is transmitted to the corresponding PD array unit 131 in the circuit board component 13.

[0070] The transceiver unit 114 is configured to emit the first split optical signal to an external scanning unit, and is further configured to receive the return light from the external scanning unit. The return light is looped back from the composite port of the coupler 113 to the output end of the coupler 113.

[0071] In this embodiment, the transmission component 11a may be an optical path structure, which corresponds to a single laser 121 and is configured to receive the optical signal output by the laser 121, perform split optical output, and receive the return light. The transmitter splitter 112 may be a 1:4 splitter, that is, the optical signal emitted by the corresponding laser 121 is divided into four first split optical signals. In most cases, the optical intensity of a single optical path can still meet the requirements, and the use of an amplifier can be avoided.

[0072] The coupler 113 may be a 3dB coupler, and the coupler 113 is configured to act as a circulator, that is, to separate the outgoing optical path and the return optical path. Compared with a circulator, the cost of the coupler is relatively lower.

[0073] The PD array unit 131 may be connected to the circuit board assembly 13 through gold wire bonding, and the current signal in the PD array unit 131 is amplified into a voltage signal for transmission. The circuit board assembly 13 is configured to process the electrical signal converted from the return light and send it to an external host, so as to realize the analysis of the return light and obtain the information of the target object scanned. The PD array unit 131 and the circuit board assembly 13 may be connected through gold wire bonding.

[0074] In summary, for the first split optical signal split by the transmitter splitter 112, after passing through the coupler 113 and the transceiver unit 114, the first split optical signal is transmitted to the target object. According to the corresponding coupler 113, transceiver unit 114, and PD array unit 131 of the channel, the return light of the channel is received, so as to realize the transceiver integration of the channel. There are at least 4 such channels in a single transmission component 11a, at least 32 such channels in the waveguide chip 11 in a single transceiver component 1, and at least 128 such channels in the entire high-density multi-channel transceiver integrated device, so as to realize the transceiver integration of at least 128 channels.

[0075] Furthermore, since the return light reflected from the target object usually has a relatively weak optical intensity and is difficult to be normally received and analyzed, in this embodiment, a part of the optical signal needs to be split from the laser 121 to mix with the return light. On the one hand, the optical intensity of the return light is increased, and on the other hand, the mixed optical signal carries frequency information for subsequent analysis. Therefore, this embodiment also involves the following design:

[0076] Such as Figure 3As shown, each of the said transmission components 11a further includes: a first optical splitter 116, a receiving-end optical splitter 117, and a plurality of mixers 118, where: in the same transmission component 11a, the first optical splitter 116 is used to receive the optical signal emitted by the corresponding laser 121 and divide the optical signal into two paths. The first optical splitter 116 includes at least two optical splitting output terminals, one of the optical splitting output terminals is connected to the input terminal of the transmitting-end optical splitter 112, and the other optical splitting output terminal is connected to the receiving-end optical splitter 117, and the two split optical signals are respectively transmitted to the transmitting-end optical splitter 112 and the receiving-end optical splitter 117.

[0077] In this embodiment, the optical splitting ratio of the first optical splitter 116 can be 9:1, where 90% of the optical signal is transmitted to the transmitting-end optical splitter 112, and 10% of the optical signal is transmitted to the receiving-end optical splitter 117.

[0078] The receiving-end optical splitter 117 is used to divide the received optical signal into at least four second optical splitting signals. The receiving-end optical splitter 117 includes at least 4 optical splitting output terminals, and each output terminal is connected to one of the input terminals of the corresponding mixer 118. The other input terminal of the mixer 118 is connected to the output terminal of the corresponding coupler 113; the mixer 118 is used to mix the second optical splitting signal and the returned light, and transmit the mixed optical signal to the PD array unit 131.

[0079] As Figure 3 shown, in a single transmission component 11a, each second optical splitting signal split by the receiving-end optical splitter 117 is correspondingly transmitted to one of the mixers 118, and at the same time, the returned light reflected back is also transmitted to the corresponding mixer 118 after passing through the transceiver unit 114 and the coupler 113. The second optical splitting signal and the returned light are mixed in the mixer 118, and the mixed optical signal is transmitted to the PD array unit 131 to be converted into an electrical signal and transmitted to the circuit board assembly 13, thereby realizing the mixing of the returned light.

[0080] In this embodiment, since there are multiple transceiver components 1, each transceiver component 1 will output multiple first optical splitting signals. But on the one hand, considering the integration degree of the structural layout of each transceiver component 1, and on the other hand, it is necessary to combine the first optical splitting signals output by each transceiver component 1 so that the optical beam output by the lidar meets the density requirements. Therefore, it is necessary to adjust the optical path direction of the first optical splitting signals output according to the position of each transceiver component 1. Therefore, this embodiment provides a design:

[0081] As Figure 4As shown, the high-density multi-channel transceiver device further includes a first combining prism 2a, where: a transmission surface 21a and a reflection surface 22a are provided on the first combining prism 2a; the first splitting signals emitted from at least two transceiver components 1 are incident on the transmission surface 21a of the first combining prism 2a along a first direction, and are transmitted through the transmission surface 21a to an external scanning unit; in addition, the first splitting signals emitted from at least two transceiver components 1 are incident on the reflection surface 22a of the first combining prism 2a along a second direction, and are reflected by the reflection surface 22a to the external scanning unit.

[0082] Wherein, the first direction and the second direction are perpendicular to each other, the first direction forms a 45-degree angle with both the transmission surface 21a and the reflection surface 22a in the first combining prism 2a, and the second direction forms a 45-degree angle with both the transmission surface 21a and the reflection surface 22a in the first combining prism 2a.

[0083] By depositing a transmission film and a reflection film at different positions in the first combining prism 2a, the position where the transmission film is deposited is the transmission surface 21a, the position where the reflection film is deposited is the reflection surface 22a, and the transmission surface 21a and the reflection surface 22a respectively correspond to the optical paths of the corresponding transceiver components 1, so as to realize the combination of the optical paths of each transceiver component 1.

[0084] Further, for the beam combination of each transceiver component 1, this embodiment also provides another design:

[0085] As Figure 5 shown, the high-density multi-channel transceiver device further includes a second combining prism 2b and a half-wave plate 3, where: the first splitting signals emitted from at least two transceiver components 1 are incident on the second combining prism 2b along a first direction, and are transmitted through a transmissive-reflective mirror 21b in the second combining prism 2b to an external scanning unit. In addition, the first splitting signals emitted from at least two transceiver components 1 are incident on the second combining prism 2b along a second direction after passing through the half-wave plate 3, and are reflected by the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit.

[0086] Wherein, the first direction and the second direction are perpendicular to each other, the first direction forms a 45-degree angle with the transmissive-reflective mirror 21b in the second combining prism 2b, and the second direction forms a 45-degree angle with the transmissive-reflective mirror 21b in the second combining prism 2b.

[0087] In this embodiment, the second combining prism 2b can be a polarizing beam splitter (Polarizing Beam Splitter, abbreviated as PBS), the laser signal emitted by the laser 121 is P light, and the half-wave plate 3 is used to convert the P light into S light, and combined with the characteristics of the PBS prism reflecting S light and transmitting P light, the beam combination in two directions is realized.

[0088] When adopting the design of the above-mentioned second combining prism 2b, this embodiment also involves the following design for each transceiver component 1: The at least four transceiver components 1 include: a first transceiver component 1a, a second transceiver component 1b, a third transceiver component 1c, and a fourth transceiver component 1d. The high-density multi-channel transceiver integrated device further includes: a first reflecting prism 4, a second reflecting prism 5, a third reflecting prism 6, and a fourth reflecting prism 7, where:

[0089] The first splitting signal emitted by the first transceiver component 1a is incident on the second combining prism 2b along a first direction, and is transmitted through the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit.

[0090] The first splitting signal emitted by the second transceiver component 1b is incident on the second reflecting prism 5 along the first direction. The second reflecting prism 5 reflects the received first splitting signal to the first reflecting prism 4. The first reflecting prism 4 reflects the received first splitting signal along the first direction to the second combining prism 2b, and is transmitted through the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit;

[0091] The first splitting signal emitted by the third transceiver component 1c is incident on the second combining prism 2b along a second direction after passing through the half-wave plate 3, and is reflected by the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit.

[0092] The first splitting signal emitted by the fourth transceiver component 1d is incident on the fourth reflecting prism 7 along the second direction. The fourth reflecting prism 7 reflects the received first splitting signal to the third reflecting prism 6. The third reflecting prism 6 reflects the received first splitting signal along the second direction to the half-wave plate 3, and is incident on the second combining prism 2b after passing through the half-wave plate 3, and is reflected by the transmissive-reflective mirror 21b in the second combining prism 2b to the external scanning unit.

[0093] In this embodiment, considering the occupied area of the overall device, as Figure 5 shown, taking four transceiver components 1 as an example, namely the first transceiver component 1a, the second transceiver component 1b, the third transceiver component 1c, and the fourth transceiver component 1d, it should be noted that the first transceiver component 1a, the second transceiver component 1b, the third transceiver component 1c, and the fourth transceiver component 1d are all configured with the same model.

[0094] As Figure 5 and Figure 6 shown, Figure 5 the arrow A in Figure 5The arrow B in the figure is the second direction. The first transceiver component 1a and the second transceiver component 1b are arranged in parallel and both emit light along the first direction. The second combining prism 2b is arranged on the light-emitting path of the first transceiver component 1a. The angle between the dichroic mirror 21b in the second combining prism 2b and the first direction is 45 degrees. The first transceiver component 1a directly emits the optical signal to the second combining prism 2b. The dichroic mirror 21b is arranged in the second combining prism 2b. The dichroic mirror 21b is used to transmit the P-polarized light and reflect the S-polarized light.

[0095] Since the optical signal emitted by the laser 121 is P-polarized light, the optical signal emitted by the first transceiver component 1a is directly transmitted by the dichroic mirror 21b and transmitted along the original optical path direction. Due to the limitation of the volume of the second combining prism 2b itself and the width of the transceiver component 1 itself when the two transceiver components 1 are arranged in parallel, there is a certain distance between the light-emitting ports of the two transceiver components 1, which leads to a distance between the emitted light beams, and it may cause the optical signal emitted by the second transceiver component 1b not to enter the second combining prism 2b. Therefore, in this embodiment, a first reflecting prism 4 can be arranged on the light-emitting path of the second transceiver component 1b. The reflecting surface on the first reflecting prism 4 forms a 45-degree angle with the first direction. The optical signal emitted by the second transceiver component 1b is reflected by the first reflecting prism 4, and the direction of the optical signal emitted by the second transceiver component 1b is changed by 90 degrees and approaches the second combining prism 2b. Then, a second reflecting prism 5 is arranged. The reflecting surface on the second reflecting prism 5 forms a 45-degree angle with the first direction. The optical signal emitted by the second transceiver component 1b is reflected towards the second combining prism 2b, so that the optical signal emitted by the second transceiver component 1b is incident on the second combining prism 2b again along the first direction, and the optical signal emitted by the second transceiver component 1b is directly transmitted by the dichroic mirror 21b and transmitted along the first direction.

[0096] As Figure 5 and Figure 7 shown, the third transceiver component 1c and the fourth transceiver component 1d are arranged in parallel and both emit light along the second direction. The second combining prism 2b is located on the light-emitting path of the third transceiver component 1c. The angle between the dichroic mirror 21b in the second combining prism 2b and the second direction is 45 degrees. A half-wave plate 3 is arranged between the second combining prism 2b and the third transceiver component 1c.

[0097] The optical signal emitted by the third transceiver component 1c is converted from P light to S light after passing through the half-wave plate 3, and then received by the second combining prism 2b. The transmissive-reflective mirror 21b in the second combining prism 2b reflects the optical signal emitted by the third transceiver component 1c in the first direction. However, due to the limitation of the volume of the second combining prism 2b itself and the width of the transceiver component 1 when two transceiver components 1 are arranged in parallel, there is a certain distance between the output port of the third transceiver component 1c and the output port of the fourth transceiver component 1d, which leads to a distance between the emitted light beams, and it may cause the optical signal emitted by the fourth transceiver component 1d to not be incident on the second combining prism 2b. Therefore, a third reflecting prism 6 can be arranged on the output optical path of the fourth transceiver component 1d. The reflecting surface on the third reflecting prism 6 is at a 45-degree angle to the first direction. The optical signal emitted by the fourth transceiver component 1d is reflected by the third reflecting prism 6, the direction of the optical signal emitted by the fourth transceiver component 1d is changed by 90 degrees, and it approaches the second combining prism 2b. Then, a fourth reflecting prism 7 is arranged. The reflecting surface on the fourth reflecting prism 7 is at a 45-degree angle to the second direction. The optical signal emitted by the fourth transceiver component 1d is reflected towards the second combining prism 2b. At the same time, a half-wave plate 3 is provided between the fourth reflecting prism 7 and the second combining prism 2b. The optical signal emitted by the fourth transceiver component 1d is converted from P light to S light after passing through the half-wave plate 3, and then received by the second combining prism 2b. The optical signal emitted by the fourth transceiver component 1d is reflected by the transmissive-reflective mirror 21b in the first direction.

[0098] In summary, through the arrangement of the second combining prism 2b and multiple reflecting prisms, it is ensured that when the transceiver component 1 emits light in different directions, each optical path is still adjusted to be incident on the second combining prism 2b, and the light beams are combined through the reflection or transmission of the second combining prism 2b, meeting the requirements of the lidar when emitting light beams.

[0099] Furthermore, when the laser 121 actually operates, the operating temperature of the laser 121 also needs to be adjusted. Therefore, this embodiment involves the following design:

[0100] As Figure 8 shown, each transceiver component 1 further includes a thermoelectric cooler 17. In the same transceiver component 1, the laser array 12 and the waveguide chip 11 are both arranged on the thermoelectric cooler 17. Each transceiver component 1 further includes a thermistor 18. In the same transceiver component 1, the thermistor 18 is arranged on the thermoelectric cooler 17.

[0101] In this embodiment, the semiconductor cooler 17 can be disposed on the base bottom plate, and the laser array 12, the waveguide chip 11, the first lens array 14, and the isolator array 15 can all be disposed on the semiconductor cooler 17. By adjusting the temperature of the semiconductor cooler 17, the operating temperature of the laser 121 can be adjusted. Further, a thermistor 18 is also disposed near the laser 121. Temperature feedback is achieved through the thermistor 18 to control the semiconductor cooler 17 to refrigerate or heat, so as to precisely adjust the temperature of the laser 121. In this embodiment, both the semiconductor cooler 17 and the thermistor 18 are connected to the circuit board assembly 13.

[0102] Each of the transceiver components 1 further includes a housing. In the same transceiver component 1, the waveguide chip 11 and the laser 121 chip are both disposed in the housing, and an airtight packaging solution is adopted to ensure the working environment of the laser chip and the active chip, which is suitable for use in harsh environments such as high temperature and high humidity.

[0103] Combined with the foregoing embodiments, this embodiment further provides a lidar, including the high-density multi-channel transceiver integrated device and the scanning unit of the foregoing embodiments; the high-density multi-channel transceiver integrated device is used to emit at least 128 optical signals, and the scanning unit is used to emit the at least 128 optical signals to a target object.

[0104] The foregoing are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-density multi-channel transceiver integrated device, characterized in that, Comprising: At least four transceiver components (1), wherein: Each transceiver component (1) includes a waveguide chip (11), a laser array (12), and a circuit board component (13), and the laser array (12) includes at least 8 lasers (121) arranged in parallel; Each of the lasers (121) is configured to emit an optical signal to the waveguide chip (11), the waveguide chip (11) is configured to divide each received optical signal into at least four first split optical signals and emit them to an external scanning unit, the waveguide chip (11) is further configured to receive the return light from the external scanning unit, and the circuit board component (13) is configured to convert the return light into an electrical signal.

2. The high-density multi-channel transceiver integrated device according to claim 1, wherein Each of the waveguide chips (11) includes at least 8 transmission components (11a), and each transmission component (11a) corresponds to one of the lasers (121); each transmission component (11a) includes: an emitting end splitter (112), a plurality of couplers (113), and a plurality of transceiver units (114), wherein: The emitting end splitter (112) is configured to receive the optical signal emitted by the corresponding laser (121), divide the optical signal into at least four first split optical signals, the emitting end splitter (112) includes at least 4 split output ends, each output end is connected to the input end of the corresponding coupler (113), the composite port of the coupler (113) is connected to the corresponding transceiver unit (114), and the return light output from the output end of the coupler (113) is transmitted to the corresponding PD array unit (131) in the circuit board component (13); The transceiver unit (114) is configured to emit the first split optical signal to the external scanning unit, and is further configured to receive the return light from the external scanning unit, and the return light is looped back to the output end of the coupler (113) from the composite port of the coupler (113).

3. The high-density multi-channel transceiver integrated device according to claim 2, wherein Each of the transmission components (11a) further includes: a first splitter (116), a receiving end splitter (117), and a plurality of mixers (118), wherein: In the same transmission component (11a), the first splitter (116) is configured to receive the optical signal emitted by the corresponding laser (121), divide the optical signal into two paths, the first splitter (116) includes at least two split output ends, one of the split output ends is connected to the input end of the emitting end splitter (112), and the other split output end is connected to the receiving end splitter (117), and the two divided optical signals are respectively transmitted to the emitting end splitter (112) and the receiving end splitter (117); The receiving end splitter (117) is configured to divide the received optical signal into at least four second split optical signals, the receiving end splitter (117) includes at least 4 split output ends, each output end is connected to one of the input ends of the corresponding mixer (118), and the other input end of the mixer (118) is connected to the output end of the corresponding coupler (113); The mixer (118) is used to mix the second split optical signal and the return light, and transmit the mixed optical signal to the PD array unit (131).

4. The high-density multi-channel transceiver integrated device according to claim 1, characterized in that The high-density multi-channel transceiver also includes a first combining prism (2a), where: A transmission surface (21a) and a reflection surface (22a) are provided on the first combining prism (2a); The first split optical signals emitted by at least two transceiver components (1) are incident on the transmission surface (21a) of the first combining prism (2a) along a first direction, and are transmitted through the transmission surface (21a) to the external scanning unit; The first split optical signals emitted by at least two other transceiver components (1) are incident on the reflection surface (22a) of the first combining prism (2a) along a second direction, and are reflected by the reflection surface (22a) to the external scanning unit; Wherein, the first direction and the second direction are perpendicular to each other, the first direction forms a 45-degree angle with both the transmission surface (21a) and the reflection surface (22a) in the first combining prism (2a), and the second direction forms a 45-degree angle with both the transmission surface (21a) and the reflection surface (22a) in the first combining prism (2a).

5. The high-density multi-channel transceiver integrated device according to claim 1, characterized in that The high-density multi-channel transceiver also includes a second combining prism (2b) and a half-wave plate (3), where: The first split optical signals emitted by at least two transceiver components (1) are incident on the second combining prism (2b) along a first direction, and are transmitted through the transmissive-reflective mirror (21b) in the second combining prism (2b) to the external scanning unit; The first split optical signals emitted by at least two other transceiver components (1) are incident on the second combining prism (2b) along a second direction after passing through the half-wave plate (3), and are reflected by the transmissive-reflective mirror (21b) in the second combining prism (2b) to the external scanning unit; Wherein, the first direction and the second direction are perpendicular to each other, the first direction forms a 45-degree angle with the transmissive-reflective mirror (21b) in the second combining prism (2b), and the second direction forms a 45-degree angle with the transmissive-reflective mirror (21b) in the second combining prism (2b).

6. The high-density multi-channel transceiver integrated device according to claim 5, wherein The at least four transceiver components (1) include: a first transceiver component (1a), a second transceiver component (1b), a third transceiver component (1c), and a fourth transceiver component (1d). The high-density multi-channel transceiver also includes: a first reflecting prism (4), a second reflecting prism (5), a third reflecting prism (6), and a fourth reflecting prism (7), where: The first split optical signal emitted by the first transceiver component (1a) is incident on the second combining prism (2b) along a first direction, and is transmitted through the transmissive-reflective mirror (21b) in the second combining prism (2b) to the external scanning unit; The first split optical signal emitted by the second transceiver component (1b) is incident on the second reflection prism (5) along the first direction. The second reflection prism (5) reflects the received first split optical signal to the first reflection prism (4). The first reflection prism (4) reflects the received first split optical signal along the first direction to the second combining prism (2b), and transmits it through the transmissive and reflective lens (21b) in the second combining prism (2b) to the external scanning unit; The first split optical signal emitted by the third transceiver component (1c) is incident on the second combining prism (2b) along the second direction after passing through the half-wave plate (3), and is reflected by the transmissive and reflective lens (21b) in the second combining prism (2b) to the external scanning unit; The first split optical signal emitted by the fourth transceiver component (1d) is incident on the fourth reflection prism (7) along the second direction. The fourth reflection prism (7) reflects the received first split optical signal to the third reflection prism (6). The third reflection prism (6) reflects the received first split optical signal along the second direction to the half-wave plate (3), and is incident on the second combining prism (2b) after passing through the half-wave plate (3), and is reflected by the transmissive and reflective lens (21b) in the second combining prism (2b) to the external scanning unit.

7. The high-density multi-channel transceiver integrated device according to any one of claims 1-6, characterized in that, Each transceiver component (1) further includes a first lens array (14) and an isolator array (15), where: In the same transceiver component (1), the first lens array (14) and the isolator array (15) are sequentially arranged on the optical path between the laser array (12) and the waveguide chip (11).

8. The high-density multi-channel transceiver integrated device according to any one of claims 1-6, characterized in that, Each transceiver component (1) further includes a second lens array (16), where: In the same transceiver component (1), the second lens array (16) is arranged on the optical path of the return light to the waveguide chip (11).

9. The high-density multi-channel transceiver integrated device according to any one of claims 1-6, characterized in that, Each transceiver component (1) further includes a semiconductor cooler (17), where: In the same transceiver component (1), both the laser array (12) and the waveguide chip (11) are arranged on the semiconductor cooler (17), and the semiconductor cooler (17) is connected to the circuit board assembly (13).

10. A lidar, characterized in that, Comprising the high-density multi-channel transceiver integrated device according to any one of claims 1-9 and a scanning unit; The high-density multi-channel transceiver integrated device is used to emit at least 128 optical signals, and the scanning unit is used to emit the at least 128 optical signals to a target object.

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