Rotating disc type double-station chip efficient automatic disc placing equipment

Abstract

The utility model discloses a rotating disc type double-station efficient automatic chip placing device which comprises a rotating disc type carrying device, and adsorption carrying mechanisms used for adsorbing and carrying chips are arranged on the outer edge of the rotating disc type carrying device in the circumferential direction at equal angles. A chip feeding mechanism, an adjusting device for adjusting the placement direction of chips, a chip receiving device for receiving the chips carried by the rotating disc type carrying device and a defective product recycling mechanism are sequentially arranged on the periphery of the rotating disc type carrying device in the conveying direction; a positioning and separating device for separating a chip from a wafer blue film is arranged between the chip feeding mechanism and the rotating disc type carrying device, a chip detection device is arranged above the positioning and separating device, and a wafer recycling mechanism and a wafer carrying mechanism are arranged on the opposite side of the chip feeding mechanism. According to the utility model, the rotating disc type carrying device is adopted, and the double-station material receiving device is adopted for alternately receiving materials, so that the disc arranging efficiency can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip processing, and particularly relates to a rotary double-station chip high-efficiency automatic loading device.

Background Art

[0002] In the process of semiconductor chip processing, it is necessary to transfer the single chips tested on the whole wafer to the Tray tray. When there was no relevant loading device designed in the early stage, the chip loading process used the manual method to place the chips into the chip slots of the Tray tray one by one, which had the problems of high labor cost, low loading efficiency and chip damage. However, with the improvement of the degree of automation, relevant automatic loading devices have been designed to realize chip loading. For example, a chip loading device disclosed in Chinese Patent Publication No. CN118173473A, a crystal ring loading and unloading device, a Tray tray loading and unloading device, and a chip separation and transfer device. The chip separation and transfer device is used to separate a single chip from the crystal ring at the crystal ring working position and place the single chip on a chip slot of the Tray tray located at the Tray tray working position. In this solution, moving the tray or moving and placing the chips on the crystal ring are both realized by multi-axis linear movement, which not only occupies a large space, but also requires multiple linear movements to realize the movement in three-dimensional space, with a slow beat and low production efficiency.

[0003] Therefore, it is necessary to provide a rotary double-station chip high-efficiency automatic loading device to solve the above technical problems.

Content of the Utility Model

[0004] The main purpose of the utility model is to provide a rotary double-station chip high-efficiency automatic loading device, which adopts a rotary handling device and an alternating receiving device with two stations to receive materials, and can improve the loading efficiency.

[0005] The utility model realizes the above purpose through the following technical solutions: A rotary double-station chip high-efficiency automatic loading device, which includes a frame and a rotary handling device arranged on the frame. The outer edge of the rotary handling device is circumferentially and equiangularly provided with an adsorption and handling mechanism for adsorbing and handling chips; along the conveying direction, a chip feeding mechanism, an adjustment device for adjusting the chip placement direction, a chip receiving device for receiving the chips handled by the rotary handling device, and a defective product recycling mechanism are sequentially arranged on the outer periphery of the rotary handling device. A positioning and separating device for separating the chips from the wafer blue film is arranged between the chip feeding mechanism and the rotary handling device. A chip detection device is arranged above the positioning and separating device. A wafer recycling mechanism is arranged on the opposite side of the chip feeding mechanism, and a wafer handling mechanism for handling between the chip feeding mechanism, the wafer recycling mechanism and the positioning and separating device is provided.

[0006] The chip receiving device includes a first chip receiving device and a second chip receiving device which are respectively arranged on one side of the rotary transfer device and perform alternating chip receiving.

[0007] Furthermore, the chip feeding mechanism and the wafer recycling mechanism have the same structure and both include a first motor, a first support frame driven by the first motor to move up and down, a wafer conveying line fixed on the first support frame, and a first blocking component arranged on the first support frame to block the continuous forward conveyance of the wafer.

[0008] Furthermore, the positioning and separating device includes an XYZ moving and positioning mechanism for positioning a single wafer, and a thimble mechanism that extends from below into the interior of the XYZ moving and positioning mechanism to contact the back surface of the wafer and push up the chip to separate the chip from the wafer blue film;

[0009] The thimble mechanism includes a first driving member, a second support frame driven by the first driving member to move up and down, a second driving member fixed on the second support frame, and a thimble assembly driven by the second driving member to rotate. The upper end of the thimble assembly includes a plurality of thimbles for pushing up the chip.

[0010] Furthermore, the wafer transfer mechanism includes an X-axis driving module, a first moving frame driven by the X-axis driving module to move along the X direction, and a first clamping module and a second clamping module which are symmetrically arranged on the first moving frame and clamp the wafers in the chip feeding mechanism and the wafers on the positioning and separating device respectively.

[0011] Furthermore, the rotary transfer device includes a turntable on which a plurality of the adsorption and transfer mechanisms are installed, a disk driving module for driving the turntable to rotate, and a mounting disk arranged in parallel above the turntable with the same center. A pushing module for pushing the adsorption and transfer mechanism downward to facilitate material taking and placing is arranged on the outer periphery of the mounting disk.

[0012] Furthermore, the adjustment device includes a rotating mechanism for rotating the chip around the vertical axis to adjust the direction and a turning-over mechanism for rotating the chip around the horizontal axis to turn it over.

[0013] Furthermore, the rotating mechanism includes a second motor, a clamping member driven by the second motor to perform a rotating action, and a plurality of clamping blocks driven by the clamping member to perform an opening or clamping action; the wafer turning-over mechanism includes a third motor and a turning-over module driven by the third motor to move from the outer periphery of the turntable to the center. The turning-over module includes a receiving plate for accommodating the chip, a first stop block and a second stop block respectively arranged on the upper and lower sides of the receiving plate, and a fourth motor for driving the receiving plate to rotate and simultaneously driving the first stop block and the second stop block to perform an alternating axial telescopic action.

[0014] Furthermore, both the first chip receiving device and the second chip receiving device include a tray feeding unit disposed on one side of the rotary transfer device, a tray discharging unit disposed in front of the rotary transfer device, and a transfer conveyor mechanism for transferring an empty tray above the tray feeding unit to receive the chips on the adsorption and transfer mechanism and transporting the tray filled with chips to the tray discharging unit.

[0015] Furthermore, the transfer conveyor mechanism includes a first XY-axis driving module, a first support plate driven by the first XY-axis driving module to move in the XY direction, a rotary driving member disposed on the first support plate, a conveying module driven by the rotary driving member to rotate around the Z-axis and convey the tray, and a second blocking component disposed at one end of the conveying module to block the tray from continuing to be conveyed forward.

[0016] Furthermore, the defective product recycling mechanism includes a waste receiving box for receiving defective products from the adsorption and transfer mechanism, a material receiving module for receiving chips to be inspected and confirmed, a defective product tray disposed beside the material receiving module, and a transfer module for transferring the defective products on the material receiving module to the defective product tray.

[0017] Compared with the prior art, the beneficial effects of a rotary dual-station chip high-efficiency automatic tray loading device of the present utility model are as follows:

[0018] (1) By adopting a rotary transfer device and providing a plurality of adsorption and transfer mechanisms on the outer periphery of the turntable, the chips are sequentially transferred into the tray, and the chip transfer can be completed with high efficiency; moreover, the entire device integrates wafer picking, chip picking, chip rotation angle adjustment, chip flipping, and blanking, all of which are arranged around the outer periphery of the rotary transfer device, with a compact layout and space saving.

[0019] (2) A first chip receiving device and a second chip receiving device for alternate receiving are disposed on one side of the rotary transfer device. The dual-station receiving device receives materials alternately, which can accelerate the beat of product tray loading, improve the tray loading efficiency, and there are multiple bins disposed on the tray discharging unit, which can reduce the handling frequency;

[0020] (3) Since there are a chip feeding mechanism and a wafer recycling mechanism, there are two feeding methods in total. The first feeding method is that the processed single wafer first enters the wafer conveyor line of the chip feeding mechanism, and after adsorption, the remaining defective wafers are transported to the wafer recycling mechanism; the second feeding method is to place multiple wafers in the magazine, and the magazine is directly placed on the wafer conveyor line of the chip feeding mechanism. After adsorption, the remaining defective wafers are transported to the magazine of the chip feeding mechanism. Therefore, this solution can not only cooperate with the production line to realize the tray loading of single wafers, but also be used as an independent machine to only perform tray loading operations, with good flexibility and high versatility.

Description of the Drawings

[0021] Figure 1 It is a three-dimensional structure diagram of the rotary double-station chip high-efficiency automatic tray loading device according to an embodiment of the present invention;

[0022] Figure 2 It is a top view structure diagram of the rotary double-station chip high-efficiency automatic tray loading device according to an embodiment of the present invention;

[0023] Figure 3 It is a three-dimensional structure diagram of the rotary handling device according to an embodiment of the present invention;

[0024] Figure 4 According to an embodiment of the present invention Figure 1 The three-dimensional structure diagram when sucking the chip at position A;

[0025] Figure 5 It is a three-dimensional structure diagram of the adsorption and handling mechanism according to an embodiment of the present invention;

[0026] Figure 6 It is a three-dimensional structure diagram of the pushing module according to an embodiment of the present invention;

[0027] Figure 7 It is a three-dimensional structure diagram of the chip feeding mechanism or the wafer recycling mechanism according to an embodiment of the present invention;

[0028] Figure 8 It is a three-dimensional structure diagram of the rotating mechanism according to an embodiment of the present invention;

[0029] Figure 9 It is a three-dimensional structure diagram of the turning-over mechanism according to an embodiment of the present invention;

[0030] Figure 10 It is a three-dimensional structure diagram of the transfer and conveying mechanism according to an embodiment of the present invention;

[0031] Figure 11 It is a three-dimensional structure diagram of the transfer and conveying mechanism according to an embodiment of the present invention;

[0032] Figure 12Schematic three-dimensional structure diagram of the XYZ mobile positioning mechanism according to an embodiment of the present utility model;

[0033] Figure 13 Schematic three-dimensional structure diagram of the ejector pin mechanism according to an embodiment of the present utility model;

[0034] Figure 14 Schematic three-dimensional structure diagram of the wafer handling mechanism according to an embodiment of the present utility model;

[0035] Figure 15 Schematic three-dimensional structure diagram of the defective product recycling mechanism according to an embodiment of the present utility model;

[0036] The numbers in the figure represent:

[0037] 100 - Rotary double-station chip high-efficiency automatic loading equipment; 200 - Wafer; 300 - Tray; 400 - Chip;

[0038] 1 - Frame, 11 - Cantilever bracket;

[0039] 2 - Rotary handling device, 21 - Adsorption handling mechanism, 211 - First mounting bracket, 212 - Elastic pushing component, 213 - Suction nozzle, 22 - Turntable, 23 - Disc drive module, 24 - Mounting plate, 25 - Pushing module, 251 - Second mounting bracket, 252 - Fifth motor, 253 - Pushing head, 26 - First pressing rod;

[0040] 3 - Chip feeding mechanism, 31 - First motor, 32 - First support frame, 33 - Wafer conveying line, 34 - First blocking component, 341 - First blocking plate, 342 - First cylinder;

[0041] 4 - Adjusting device, 41 - Rotating mechanism, 411 - Third mounting bracket, 412 - Second motor, 413 - Clamping part, 414 - Clamping block, 415 - First sensor, 42 - Turning-over mechanism, 421 - Fourth mounting bracket, 422 - Third motor, 423 - Accommodating plate, 424 - First stop block, 425 - Second stop block, 426 - Fourth motor, 427 - First accommodating groove, 428 - Second sensor;

[0042] 5 - Chip receiving device, 5a - First chip receiving device, 5b - Second chip receiving device, 51 - Tray feeding unit, 52 - Tray discharging unit, 53 - Intermediate conveying mechanism, 531 - First XY-axis driving module, 532 - First support plate, 534 - Rotation driving part, 533 - Conveying module, 5331 - Second pressing rod, 5332 - Third driving part, 535 - Second blocking component, 5351 - Mounting seat, 5352 - Second blocking plate, 5353 - Acting block, 5354 - Third cylinder, 5355 - First rotating shaft;

[0043] 6 - Positioning and separating device, 61 - XYZ moving positioning mechanism, 611 - Avoidance through - hole, 612 - XYZ moving table, 613 - Avoidance groove, 614 - Positioning frame, 615 - Card slot, 616 - XYZ driving module, 62 - Thimble mechanism, 621 - First driving part, 622 - Second support frame, 623 - Second driving part, 624 - Thimble rotating shaft, 625 - Top block, 626 - Thimble;

[0044] 7 - Chip detection device;

[0045] 8 - Wafer handling mechanism, 81 - First clamping module, 811 - Second support plate, 812 - Upper clamping jaw, 813 - Second cylinder, 814 - Lower clamping jaw, 82 - X - axis driving module, 83 - Second clamping module, 84 - First moving frame;

[0046] 9 - Wafer recycling mechanism;

[0047] 10 - Defective product recycling mechanism, 101 - Material receiving module, 1011 - Material receiving plate, 1012 - X - axis driving part, 102 - Defective product tray, 103 - Handling module, 1031 - Second XY - axis driving component, 1032 - Third support plate, 1033 - Fourth cylinder, 1034 - Handling block, 1035 - Suction cup, 104 - Waste receiving box, 105 - Fourth support plate.

Specific implementation manner

[0048] Please refer to Figures 1-15 , in this embodiment, it is a rotary - type double - station chip high - efficiency automatic tray - loading device. The rotary - type double - station chip high - efficiency automatic tray - loading device 100 includes a frame 1 and a rotary handling device 2 arranged on the frame 1. The outer edge of the rotary handling device 2 is circumferentially and equiangularly provided with an adsorption and handling mechanism 21 for adsorbing and handling chips; on the outer periphery of the rotary handling device 2 and in the conveying direction in sequence, there are a chip feeding mechanism 3, an adjustment device 4 for adjusting the chip placement direction, a chip receiving device 5 for receiving the chips handled by the rotary handling device 2, and a defective product recycling mechanism 10. Between the chip feeding mechanism 3 and the rotary handling device 2, there is a positioning and separating device 6 for separating the chips from the wafer blue film. Above the positioning and separating device 6, there is a chip detection device 7. On the opposite side of the chip feeding mechanism 3, there are a wafer recycling mechanism 9 and a wafer handling mechanism 8 for handling between the chip feeding mechanism 3, the wafer recycling mechanism 9, and the positioning and separating device 6; the chip receiving device 5 includes a first chip receiving device 5a and a second chip receiving device 5b which are respectively arranged on one side of the rotary handling device 2 and perform alternate material receiving.

[0049] The chip feeding mechanism 3 and the wafer recycling mechanism 9 have the same structure and both include a first motor 31, a first support frame 32 driven by the first motor 31 to move up and down, a wafer conveying line 33 fixed on the first support frame 32, and a first blocking assembly 34 provided on the first support frame 32 to block the continuous forward conveyance of the wafer. The first blocking assembly 34 includes a first blocking plate 341 for blocking the continuous forward conveyance of the wafer and a first cylinder 342 for driving the first blocking plate 341 to move up and down. The wafer conveying line 33 is arranged as a belt conveyor, and two conveyor belts are arranged in parallel. The distance between the two conveyor belts can be adjusted to adapt to wafers of different sizes, with high adaptability and good versatility.

[0050] Due to the provision of the chip feeding mechanism 3 and the wafer recycling mechanism 9, there are the following two feeding methods. The first feeding method is as follows: The processed single wafer first enters the wafer conveying line 33 of the chip feeding mechanism 3. The wafer handling mechanism 8 transports the single wafer to the positioning and separation device 6. After the good chips are sucked away and placed on the tray, the wafer handling mechanism 8 transports the wafer with only defective products to the wafer recycling mechanism 9 for the next step of processing. The second feeding method: Multiple wafers are placed in the magazine, and the magazine is directly placed on the wafer conveying line 33 of the chip feeding mechanism 3. The wafer handling mechanism 8 transports a single wafer to the positioning and separation device 6. After the good chips are sucked away, the wafer handling mechanism 8 transports the wafer with only defective products back into the magazine of the chip feeding mechanism 3. After all the good chips of multiple wafers are sucked away and placed on the tray, all the wafers are recycled into the magazine and removed together. Therefore, this solution can not only cooperate with the production line to achieve the placement of single wafers on the tray, but also be used as an independent machine tool for only tray placement operations, with good flexibility and high versatility.

[0051] The positioning and separation device 6 includes an XYZ moving and positioning mechanism 61 for positioning a single wafer 200 and a thimble mechanism 62 that extends from below into the interior of the XYZ moving and positioning mechanism 61 to contact the back of the wafer 200 and push up the chip to separate the chip from the wafer blue film. Since the chip is adhered to the blue film, if the adsorption handling mechanism 21 is directly used to adsorb the chip, there will be a problem that it is difficult to adsorb successfully. Therefore, a thimble mechanism 62 is provided below the XYZ moving and positioning mechanism 61. The thimble 626 of the thimble mechanism 62 pushes the chip upward to separate the chip from the blue film, so that the adsorption handling mechanism 21 can better adsorb the chip.

[0052] The XYZ moving and positioning mechanism 61 includes an avoidance through-hole 611 with an avoidance thimble mechanism 62 arranged in the middle and avoidance grooves 613 arranged on the left and right sides for avoiding the wafer handling mechanism 8. The XYZ moving and positioning mechanism 61 includes an XYZ moving platform 612, an XYZ driving module 616 for driving the XYZ moving platform 612 to move in the XYZ directions, and a positioning frame 614 fixed to the upper end of the XYZ moving platform 612 and used for positioning a single chip. A card slot 615 arranged in a square shape with the single wafer 200 is provided inside the positioning frame 614.

[0053] The thimble mechanism 62 includes a first driving member 621, a second support frame 622 driven by the first driving member 621 to move up and down, a second driving member 623 fixed to the second support frame 622, and a thimble assembly driven by the second driving member 623 to rotate. The thimble assembly includes a thimble rotating shaft 624 installed at the output end of the second driving member 623, a top block 625 installed at the top end of the thimble rotating shaft 624 and matching the size of the chip, and a plurality of thimbles 626 installed on the top block 625 and used for jacking up the chip.

[0054] The wafer handling mechanism 8 includes an X-axis driving module 82, a first moving frame 84 driven by the X-axis driving module 82 to move in the X direction, and a first clamping module 81 and a second clamping module 83 which are symmetrically arranged on the left and right sides of the first moving frame 84 and used for clamping the wafers in the chip feeding mechanism 3 and the wafers on the clamping, positioning and separating device 6 respectively.

[0055] Both the first clamping module 81 and the second clamping module 83 include a second support plate 811 movably arranged on the left and right sides of the first moving frame 84, an upper clamping jaw 812 arranged on the second support plate 811, a second air cylinder 813 fixed to the second support plate 811, and a lower clamping jaw 814 driven by the second air cylinder 813 to move up and down and realizing the clamping and opening actions with the upper clamping jaw 812. The first clamping module 81 clamps the wafers in the left chip feeding mechanism 3, and the second clamping module 83 clamps the wafers with only defective products remaining on the right clamping, positioning and separating device 6. The X-axis driving module 82 drives the first clamping module 81 and the second clamping module 83 to move to the right. The first clamping module 81 places the new wafers on the positioning and separating device 6. The X-axis driving module 82 continues to drive the first clamping module 81 and the second clamping module 83 to move to the right. The second clamping module 83 places the wafers with only defective products remaining on the wafer recycling mechanism 9.

[0056] The rotary handling device 2 includes a turntable 22 on which a plurality of adsorption and handling mechanisms 21 are installed, a disk driving module 23 for driving the turntable 22 to rotate, and a mounting disk 24 arranged parallel to the turntable 22 and concentrically above it. A pushing module 25 for pushing the adsorption and handling mechanisms 21 downward to facilitate material taking and placing is arranged on the outer periphery of the mounting disk 24.

[0057] An L-shaped cantilever bracket 11 is provided on the frame 1. The mounting plate 24 is fixedly installed at the end of the cantilever bracket 11 and is located above the turntable 22. A number of weight-reducing grooves are provided on both the turntable 22 and the mounting plate 24. The chip detection device 7 is fixed above the mounting plate 24. A detection camera is provided on the chip detection device 7 for taking pictures of the chips on the positioning and separating device 6. The system detects and confirms the pictures taken. If the detection shows good products, they are transported to the chip receiving device 5 for tray loading.

[0058] The adsorption and handling mechanism 21 includes a first mounting bracket 211 fixed to the lower surface of the turntable 22, an elastic pushing component 212 movably arranged inside the first mounting bracket 211, and a suction nozzle 213 arranged at the lower end of the elastic pushing component 212. An air passage that is interconnected and allows air to enter and exit is provided inside the elastic pushing component 212 and the suction nozzle 213.

[0059] The pushing module 25 includes a second mounting bracket 251 fixed to the mounting plate 24, a fifth motor 252 fixed to the second mounting bracket 251, and a pushing head 253 that moves up and down driven by a third driving motor. Two first pressing rods 26 that press the upper surface of the wafer 200 are also provided on both sides of the pushing module 25. After the ejector pin mechanism 62 jacks up, the suction nozzle 213 adsorbs the chip 400 to prevent the chip from bending or warping. The two first pressing rods 26 provided press on the upper surface of the chip 400.

[0060] The adjustment device 4 includes a rotation mechanism 41 that rotates the chip around the vertical axis to adjust the direction and a turning-over mechanism 42 that rotates the chip around the horizontal axis to turn it over.

[0061] Since the chips removed from the wafer 200 may be in the reverse direction, the rotation mechanism 41 needs to be set to rotate the chip 180° around the Z axis to adjust the chip direction. The rotation mechanism 41 includes a third mounting bracket 411 fixed to the frame 1, a second motor 412 fixed to the third mounting bracket 411, a clamping member 413 driven by the second motor 412 to perform a rotation action, and a number of clamping blocks 414 driven by the clamping member 413 to perform an opening or clamping action. A clamping gap for the chip 400 to enter is formed between the four clamping blocks 414. The clamping member 413 has been described in detail in the patent application No. CN202020130093.0 with the title of a three-jaw clamping structure. Its working principle and structure are similar to those in this solution and will not be elaborated here; a first sensor 415 for detecting whether there is a chip on the clamping member is provided on the third mounting bracket 411.

[0062] Since the chip is facing down when it is removed from the wafer 200, and needs to be facing up when it is placed on the tray 300, a wafer flipping mechanism 42 for flipping the chip is provided on the outer periphery of the turntable transport device 2, and a pushing module 25 is provided on the mounting plate 24 above the wafer flipping mechanism 42. The pushing module 25 pushes the adsorption transport mechanism 21 downward to facilitate the placement of the chip on the wafer flipping mechanism 42. The wafer flipping mechanism 42 includes a fourth mounting bracket 421 fixed on the frame 1, a third motor 422 fixed on the fourth mounting bracket 421, and a flipping module driven by the third motor 422 to move from the outer periphery to the center of the turntable 22, the flipping module includes a accommodating plate 423 for accommodating chips, a first stopper 424 and a second stopper 425 respectively arranged on the upper and lower sides of the accommodating plate 423, and a fourth motor 426 for driving the accommodating plate 423 to rotate and simultaneously driving the first stopper 424 and the second stopper 425 to alternately extend and retract axially; the fourth motor 426 can drive the first stopper 424 and the second stopper 425 to alternately extend and retract axially while driving the accommodating plate 423 to rotate, this technology is prior art and will not be described in detail here; the accommodating plate 423 is provided with a first accommodating groove 427 that is shaped like a chip, and the fourth mounting bracket 421 is provided with a second sensor 428 for detecting whether there is a chip on the accommodating plate 423. The working principle of the wafer flipping mechanism 42 is as follows: when the adsorption and transporting mechanism 21 transports the chip to the wafer flipping mechanism 42, the third motor 422 drives the flipping module to move from the outer periphery to the center of the turntable 22, so that the flipping module is located directly below the chip. At this time, the first stopper 424 avoids the adsorption and transporting mechanism 21 at the rear side of the first receiving groove 427, so that the adsorption and transporting mechanism 21 places the chip into the first receiving groove 427, and at the same time, the second stopper 425 extends into the bottom of the first receiving groove 427 to block the chip to prevent the chip from falling. When the chip is completely placed in the first receiving groove 427, the fourth motor 426 drives the receiving plate 423 to rotate 180° around the horizontal axis, and at the same time drives the first stopper 424 to extend to block the chip to prevent the chip from falling, and drives the second stopper 425 to retract so that the adsorption and transporting mechanism 21 can enter the first receiving groove 427 to absorb the flipped chip.

[0063] The chip receiving device 5 includes a first chip receiving device 5a and a second chip receiving device 5b which are respectively arranged on the left and right sides of the turntable transport device 2 and perform alternate receiving.

[0064] The first chip receiving device 5a and the second chip receiving device 5b both include a tray feeding unit 51 arranged on the left front side or the right front side of the turntable transport device 2, a tray unloading unit 52 arranged in front of the turntable transport device 2, and a transfer conveying mechanism 53 used to transfer the empty trays above the tray feeding unit 51 to receive the chips on the adsorption transport mechanism 21 and to transport the tray 300 filled with chips to the tray unloading unit 52.

[0065] The material tray blanking unit 52 is provided with a plurality of bins, which can reduce the handling frequency. The working principles of the material tray feeding unit 51 and the material tray blanking unit 52 are prior arts and will not be elaborated here.

[0066] The transfer and conveying mechanism 53 includes a first XY-axis driving module 531, a first support plate 532 driven by the first XY-axis driving module 531 to move in the XY directions, a rotary driving part 534 arranged on the first support plate 532, a conveying module 533 driven by the rotary driving part 534 to rotate around the Z axis and for conveying the material tray, and a second blocking component 535 arranged at one end of the conveying module 533 for blocking the material tray from continuing to be conveyed forward.

[0067] The conveying module 533 is a belt conveyor line, provided with two mutually parallel conveying belts. In order to ensure the stability of the material tray during the transfer process, a pressing component for pressing the side of the material tray is further arranged on the conveying module 533. The pressing component includes a second pressing rod 5331 pressing on the upper surface of the material tray and a third driving part 5332 for driving the second pressing rod 5361 to extend into or away from the upper surface of the material tray.

[0068] The second blocking component 535 includes a mounting seat 5351, a second blocking plate 5352 rotatably arranged on the mounting seat 5351, an acting block 5353 movably arranged at the lower end of the blocking block 5352, and a third air cylinder 5354 for driving the acting block 5353 to act on the lower end of the second blocking plate 5352 so as to make the second blocking plate 5352 rotate. The second blocking plate 5352 is rotatably arranged on the mounting seat 5351 through a first rotating shaft 5355. When the third air cylinder 5354 extends, the acting block 5353 drives the second blocking plate 5352 to rotate around the first rotating shaft 5355 to block at one end of the material tray. When the third air cylinder 5354 retracts, the acting block 5252 removes the acting force on the second blocking plate 5352, and the second blocking plate 5352 rotates reversely around the first rotating shaft 5355 to open and remove the blocking of the material tray.

[0069] The defective product recycling mechanism 10 includes a waste receiving box 104 for receiving defective products from the adsorption and handling mechanism 21, a material receiving module 101 for receiving the chips to be inspected and confirmed, a defective product tray 102 arranged beside the material receiving module 101, and a handling module 103 for handling the defective products on the material receiving module 101 to the defective product tray 102.

[0070] The material receiving module 101 includes a material receiving plate 1011 and an X-axis driving member 1012 for driving the material receiving plate 1011 to move in the X direction. A second receiving groove for accommodating chips is provided on the material receiving plate 1011. The handling module 103 includes a second XY-axis driving assembly 1031, a third support plate 1032 driven by the second XY-axis driving assembly 1031 to move in the XY direction, a fourth air cylinder 1033 fixed on the third support plate 1032, a handling block 1034 driven by the fourth air cylinder 1033 to move up and down, and a plurality of suction cups 1035 provided at the end of the handling block 1034. The waste receiving box 104, the material receiving module 101, and the defective product tray 102 are jointly arranged on a fourth support plate 105. The fourth support plate 105 is movably arranged. The movably arranged fourth support plate 105 can be arranged in a slider-rail manner and locked by screws. When the position needs to be adjusted, the screws can be loosened, and then locked again after adjustment.

[0071] When the turntable double-station chip efficient automatic plate placement device 100 provided by the present solution is applied, the X-axis driving module 82 of the wafer handling mechanism 8 drives the first clamping module 81 to clamp the wafer from the wafer conveying line 33, and the X-axis driving module 82 reversely drives the first clamping module 81 to place the wafer into the card slot 615 of the positioning and separation device 6. The detection camera provided on the chip detection device 7 takes a picture of the chip on the positioning and separation device 6, and the system detects the photographed picture to confirm whether the chip is a good product or a defective product. The first driving member 621 of the ejector mechanism 62 drives the second support frame 622 to drive the ejector assembly to move upward, so that the ejector 626 ejects the chip on the wafer. The pushing module 25 pushes the elastic pushing component 212 of the adsorption and transport mechanism 21 to move downward so as to contact the chip. After vacuuming, the suction nozzle 213 sucks up the chip. The disc driving module 23 drives the turntable 22 to rotate, so that the just-adsorbed chip moves to the top of the rotating mechanism 41. The adsorption and transport mechanism 21 places the chip in the clamping gap between the clamping blocks 414. The clamping member 413 drives the clamping block 414 to clamp the chip. The second motor 412 drives the clamping member 413 to rotate 180° around the vertical axis, thereby completing the adjustment of the chip direction. After the chip direction is adjusted, the adsorption and transport mechanism 21 places the chip in the first accommodating groove 427 on the wafer flipping mechanism 42, and the first stop block 4 24 avoids the adsorption and transportation mechanism 21 at the rear side of the first accommodating groove 427, and at the same time, the second stopper 425 extends into the bottom of the first accommodating groove 427 to block the chip to prevent the chip from falling, and the fourth motor 426 drives the accommodating plate 423 to rotate 180° to complete the flipping of the chip; the first XY axis driving module 531 of the first chip receiving device 5a or the second chip receiving device 5b drives the first supporting plate 532 to drive the conveying module 533 to move to communicate with the material tray feeding unit 51 and receive the empty material tray, and the second blocking component 535 blocks the material tray 300 from being conveyed forward so that the empty material tray is blocked on the conveying module 533, and the first XY axis driving module 531 .... The support plate 532 drives the conveying module 533 to move to the side of the turntable 22 to receive the chips on the adsorption and transportation mechanism 21. If it is a good product, the adsorption and transportation mechanism 21 will place the chip on the material tray 300. If it is a defective product, it will continue to be transported forward and placed on the defective product recovery mechanism 10. After the conveying module 533 is full of chips in the material tray 300, the first XY-axis driving module 531 drives the first support plate 532 to drive the conveying module 533 to move to connect with the material tray unloading unit 52, and transport the material tray full of chips to the material tray unloading unit 52. The first chip receiving device 5a and the second chip receiving device 5b receive materials alternately, and the double-station receiving can improve the efficiency of the tray setting.

[0072] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. An efficient automatic chip loading device with a rotary double-station, characterized in that: It includes a frame and a rotary handling device arranged on the frame. The outer edge of the rotary handling device is provided with adsorption and handling mechanisms for adsorbing and handling chips at equal angles along the circumferential direction; along the conveying direction, a chip feeding mechanism, an adjustment device for adjusting the placement direction of the chips, a chip receiving device for receiving the chips handled by the rotary handling device, and a defective product recycling mechanism are sequentially arranged on the outer periphery of the rotary handling device. A positioning and separating device for separating the chips from the wafer blue film is arranged between the chip feeding mechanism and the rotary handling device. A chip detection device is arranged above the positioning and separating device. A wafer recycling mechanism is arranged on the opposite side of the chip feeding mechanism, and a wafer handling mechanism for handling between the chip feeding mechanism, the wafer recycling mechanism and the positioning and separating device is arranged. The chip receiving device includes a first chip receiving device and a second chip receiving device which are respectively arranged on one side of the rotary handling device and perform alternate receiving.

2. The high-efficiency automatic chip loading device with a rotary table and two working positions as described in claim 1, characterized in that: The chip feeding mechanism and the wafer recycling mechanism have the same structure and both include a first motor, a first support frame driven by the first motor to move up and down, a wafer conveying line fixed on the first support frame, and a first blocking component arranged on the first support frame to block the continuous forward conveying of the wafer.

3. The high-efficiency automatic chip placing device with a rotary double-station as described in claim 1, characterized in that: The positioning and separating device includes an XYZ moving and positioning mechanism for positioning a single wafer, and a thimble mechanism that extends into the interior of the XYZ moving and positioning mechanism from below to contact the back of the wafer and jack up the chip to separate the chip from the wafer blue film. The thimble mechanism includes a first driving member, a second support frame driven by the first driving member to move up and down, a second driving member fixed on the second support frame, and a thimble assembly driven by the second driving member to rotate. The upper end of the thimble assembly includes a plurality of thimbles for jacking up the chip.

4. The high-efficiency automatic chip arranging device with a rotary double-station as described in claim 1, characterized in that: The wafer handling mechanism includes an X-axis driving module, a first moving frame driven by the X-axis driving module to move along the X direction, and a first clamping module and a second clamping module which are symmetrically arranged on the left and right on the first moving frame and clamp the wafers in the chip feeding mechanism and the wafers on the positioning and separating device respectively.

5. The high-efficiency automatic chip arranging device with a rotary double-station as described in claim 1, wherein: The rotary handling device includes a turntable on which a plurality of the adsorption and handling mechanisms are installed, a disk driving module for driving the turntable to rotate, and a mounting disk arranged parallel to the turntable and concentrically above it. A pushing module for pushing the adsorption and handling mechanism downward to facilitate material taking and placing is arranged on the outer periphery of the mounting disk.

6. The high-efficiency automatic chip placing device with a rotary double-station as described in claim 5, characterized in that: The adjustment device includes a rotating mechanism for rotating the chip around the vertical axis to adjust the direction and a turning mechanism for rotating the chip around the horizontal axis to turn it over.

7. The high-efficiency automatic chip placing device with a rotary table and two working positions according to claim 6, characterized in that: The rotation mechanism includes a second motor, a clamping member driven by the second motor to perform a rotation action, and a plurality of clamping blocks driven by the clamping member to perform an opening or clamping action; the wafer turning mechanism includes a third motor and a turning module driven by the third motor to move from the outer periphery to the center of the turntable. The turning module includes a receiving plate for accommodating the chip, a first stop block and a second stop block respectively arranged on the upper and lower sides of the receiving plate, and a fourth motor for driving the rotation of the receiving plate and simultaneously driving the first stop block and the second stop block to perform an alternating axial telescopic action.

8. The high-efficiency automatic chip arranging device with a rotary table and two working positions according to claim 1, characterized in that: Both the first chip receiving device and the second chip receiving device include a tray feeding unit arranged on one side of the turntable handling device, a tray discharging unit arranged in front of the turntable handling device, and a transfer conveying mechanism for transferring the empty tray above the tray feeding unit to receive the chips on the adsorption handling mechanism and transporting the tray filled with chips to the tray discharging unit.

9. The high-efficiency automatic chip arranging device with a rotary double-station turntable according to claim 8, wherein: The transfer conveying mechanism includes a first XY-axis driving module, a first support plate driven by the first XY-axis driving module to move in the XY direction, a rotation driving member arranged on the first support plate, a conveying module driven by the rotation driving member to rotate around the Z axis and convey the tray, and a second blocking assembly arranged at one end of the conveying module to block the tray from continuing to be conveyed forward.

10. The high-efficiency automatic chip arranging device with a rotary double-station as described in claim 1, wherein: The defective product recycling mechanism includes a waste receiving box for receiving defective products from the adsorption handling mechanism, a receiving module for receiving chips to be inspected and confirmed, a defective product tray arranged beside the receiving module, and a handling module for transporting the defective products on the receiving module to the defective product tray.

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