Track moving type plasma planarization processing system
Through the track mobile plasma flattening processing system, the position and speed are adjusted using linear slide rails and control units, combined with dust barrier, the accuracy reduction problem caused by vibration of the clamping device during movement of the object to be processed is solved, and high-precision and efficient planarization is achieved.
Patent Information
- Application Number
- CN202421711550.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-07-18
AI Technical Summary
In the existing planarization process, the position deviation of the object to be made during movement due to vibration of the clamping device, resulting in the problem of degradation of the planarization processing accuracy and low product yield.
The track mobile plasma flattening processing system is adopted. By setting up the first and second tracks of the linear slide structure, combining the control processing unit and the rotation unit, high-precision position and speed adjustment are achieved, and dust barrier devices are combined to prevent dust pollution and improve process accuracy.
The planarization processing accuracy of the objects to be processed is improved, the accuracy problem caused by position offset is reduced, the positioning accuracy is enhanced, and the overall processing efficiency is improved and the cost is reduced.
Smart Images
Figure CN223123886U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of plasma etching processing, and particularly to an orbital mobile plasma planarization processing system. Background Art
[0002] Plasma etching technology is widely used in the manufacturing processes of semiconductors and microelectromechanical systems (MEMS). Particularly in improving the surface flatness of processed articles, it has proven to be an effective technology. Its main principle is to selectively remove a part of the material surface using high-energy plasma, thereby achieving the purpose of planarizing the surface of the processed article.
[0003] Among them, in the existing planarization process, the movement of the object to be processed between various processing devices is usually completed by a clamping device (such as a robotic arm). However, when the clamping device clamps and moves the object to be processed, the object to be processed is usually in a suspended state. As a result, during the movement of the object to be processed, it is prone to displacement due to slight vibrations of the clamping device, leading to problems such as a decrease in the accuracy of the planarization process of the object to be processed and a low yield rate of subsequent products. Summary of the Utility Model
[0004] Based on this, it is necessary to provide an orbital mobile plasma planarization processing system for the problem of low processing accuracy in the planarization process.
[0005] An orbital mobile plasma planarization processing system for planarizing a surface to be processed of an object to be processed, the orbital mobile plasma planarization processing system comprising:
[0006] A process chamber provided with a detection area and a plasma processing area disposed on one side of the detection area;
[0007] A carrying device having a carrying platform and a first track, the carrying platform being used to place the object to be processed, and the first track being used to allow the carrying platform to reciprocate along a conveying direction between the detection area and the plasma processing area;
[0008] A detection device disposed in the detection area and coupled to the carrying device, the detection device detecting and outputting position information of the object to be processed on the carrying platform, and detecting and outputting surface flatness information of the surface to be processed; and
[0009] A plasma processing device disposed in the plasma processing area and coupled to the detection device, the plasma processing device planarizing the surface to be processed according to the position information and the surface flatness information.
[0010] In one embodiment, the carrier device has a control processing unit and a rotating unit coupled to each other. When the plasma processing device performs plasma planarization on the surface to be processed, the control processing unit can receive and, based on the position information and the surface flatness information, control the position of the carrier platform on the first track to perform uniaxial radial adjustment on the object to be processed, and control the rotation speed of the rotating unit to perform rotation speed adjustment on the object to be processed.
[0011] In one embodiment, the carrier device has a sliding seat that slides on the first track. The sliding seat has a second track perpendicular to the first track, and the carrier platform slides on the second track.
[0012] In one embodiment, before the plasma processing device performs plasma planarization on the surface to be processed, the control processing unit can receive and, based on the position information, control the position of the sliding seat on the first track and the position of the carrier platform on the second track to perform position adjustment on the object to be processed.
[0013] In one embodiment, the carrier platform includes an adsorbing member for adsorbing and fixing the object to be processed.
[0014] In one embodiment, the detection device includes a position detection member and a flatness detection member. The position detection member detects and outputs the position information. The flatness detection member is disposed in the detection area and on one side of the position detection member close to the plasma processing area. The flatness detection member detects and outputs the surface flatness information.
[0015] In one embodiment, the number of the detection areas is plural and arranged at intervals along a moving direction perpendicular to the conveying direction; the number of the plasma processing areas is also plural and corresponds to the number of the detection areas, and is arranged at intervals along the moving direction.
[0016] In one embodiment, the number of the position detection members is plural and arranged at intervals along the moving direction; the number of the carrier devices and the plasma processing devices is also plural and corresponds to the number of the position detection members, and is arranged at intervals along the moving direction. The flatness detection member reciprocates between the detection areas along the moving direction.
[0017] In one embodiment, the plasma processing device has a plasma nozzle and a positioning member. The plasma nozzle is used to perform planarization processing on the surface to be processed of the object to be processed. The positioning member is slidably connected to the plasma nozzle, and the positioning member is used to adjust the height of the plasma nozzle relative to the loading device.
[0018] In one embodiment, a dust barrier device is further included. The dust barrier device extends downward from the top of the process chamber, and the dust barrier device is disposed between the detection area and the plasma processing area.
[0019] In one embodiment, the dust barrier device has a barrier member and a blowing member. The barrier member extends downward from the top of the process chamber. The blowing member is disposed at the bottom edge of the barrier member. The blowing member outputs gas in a blowing direction perpendicular to the conveying direction to generate a gas barrier to separate the detection area and the plasma processing area.
[0020] In one embodiment, the vertical installation height of the blowing member relative to the loading platform is higher than the vertical installation height of the object to be processed relative to the loading platform.
[0021] In the above-mentioned rail-mobile plasma planarization processing system, by setting the linear slide rail structure as the first rail, with the high adjustment accuracy of the sliding rail (the error is within plus or minus 0.5 mm), when the loading device reciprocates between the detection area and the plasma processing area while carrying the object to be processed, the adjustment accuracy of the loading device can be effectively improved, thereby avoiding the problem of insufficient planarization processing accuracy due to position deviation during the plasma planarization process. Furthermore, in this application, by setting the second rail, the fine adjustment of the loading device in the moving direction can be effectively carried out, further increasing the positioning accuracy of the object to be processed and improving the planarization processing accuracy of the object to be processed. Description of the Drawings
[0022] Figure 1 It is a perspective schematic diagram of a rail-mobile planarization processing system in an embodiment of the present application.
[0023] Figure 2 It is a front-view perspective sectional schematic diagram of a rail-mobile planarization processing system in an embodiment of the present application, used to show that the loading platform is located in the detection area.
[0024] Figure 3 It is a front-view perspective sectional schematic diagram of a rail-mobile planarization processing system in an embodiment of the present application, used to show that the loading platform moves to the position of the position detection member.
[0025] Figure 4This is a schematic cross-sectional view of the track-mounted planarization processing system from the front view perspective in an embodiment of the present application, used to represent the position where the carrier platform moves to the flatness detection component.
[0026] Figure 5 This is a schematic cross-sectional view of the track-mounted planarization processing system from the front view perspective in an embodiment of the present application, used to represent the position where the carrier platform moves to the plasma processing area device.
[0027] Figure 6 This is a top view schematic diagram of the track-mounted planarization processing system in another embodiment of the present application.
[0028] Figure 7 This is a frame schematic diagram of the track-mounted planarization processing system in an embodiment of the present application.
[0029] Explanation of the reference numerals in the drawings:
[0030] 100, track-mounted plasma planarization processing system; 200, object to be processed; 210, surface to be processed; 10, processing chamber; 11, detection area; 12, plasma processing area; 20, carrier device; 21, carrier platform; 211, adsorption member; 22, first track; 23, slide; 231, second track; 24, control processing unit; 25, rotation unit; 30, detection device; 31, position detection member; 32, flatness detection member; 40, plasma processing device; 41, plasma nozzle; 42, positioning member; 50, dust barrier device; 51, barrier member; 52, blowing member; X, conveying direction; Y, moving direction; Z, blowing direction. Detailed implementation manners
[0031] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0032] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.
[0033] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0034] In the present application, unless otherwise clearly specified and limited, if there are terms such as "installed", "connected", "connected to", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0035] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0036] To facilitate the description of the central idea expressed in the above-mentioned creative content section of the present application, specific embodiments are used for illustration. In the embodiments, various different objects are drawn in a proportion suitable for listing description, rather than in the proportion of actual components, which is hereby stated first.
[0037] Please refer to Figures 1 to 7 As shown, a rail - movable plasma planarization processing system 100 according to an embodiment of the present application is disclosed, which is used to perform planarization processing on a surface 210 to be processed of a to - be - processed object 200. The rail - movable plasma planarization processing system 100 includes a processing chamber 10, a carrying device 20, a detection device 30, and a plasma processing device 40. Among them, when the present application performs the planarization processing, the processing environment can be an atmospheric environment or a negative - pressure environment; the to - be - processed object 200 can be a circuit composite carrier (such as a printed circuit board [PCB], a flexible printed circuit [FPC], etc.), a wafer, or a chip and other objects that need to be planarized.
[0038] The processing chamber 10 is provided with a detection area 11 and a plasma processing area 12 disposed on one side of the detection area 11. The detection area 11 is used to provide a setting for the detection device 30; the plasma processing area 12 is used to provide a setting for the plasma processing device 40. Among them, the carrying device 20 will first stay in the detection area 11 so that a conveying device (not shown in the figure) can place the to - be - processed object 200 on the carrying device 20; the carrying device 20 will transport the to - be - processed object 200 to the plasma processing area 12 so that the to - be - processed object 200 can complete the planarization processing by the plasma processing device 40 in the plasma processing area 12.
[0039] The carrying device 20 is provided with a carrying platform 21 and a first rail 22. The carrying platform 21 is used to place the to - be - processed object 200, and the first rail 22 is used to allow the carrying platform 21 to reciprocally move along a conveying direction X between the detection area 11 and the plasma processing area 12.
[0040] Please refer to and cooperate with Figures 1 to 5 As shown, in an embodiment of the present application, the carrying device 20 has a sliding seat 23. The sliding seat 23 slides on the first rail 22. The sliding seat 23 can have a second rail 231 perpendicular to the first rail 22, and the carrying platform 21 slides on the second rail 231. Among them, the first rail 22 and the second rail 231 can be, for example, linear sliding rails. Thereby, through the high adjustment accuracy of the sliding rails (including the first rail 22 and the second rail 231), the movement accuracy of the carrying platform 21 is controlled within an error of plus or minus 0.5 mm, so that the present application has the effect of high processing accuracy.
[0041] Please refer to 1 and Figure 7As shown, in the embodiment of the present application, the carrying device 20 has a control processing unit 24 and a rotating unit 25 which are coupled to each other. The control processing unit 24 is used to control the position of the carrying platform 21 on the first track 22 and the second track 231, and control the rotation speed of the rotating unit 25 rotating around the center of the surface to be processed 210, so as to control the processing position and processing speed of the object to be processed 200 in the planarization process by mechanical control means, and improve the planarization processing accuracy of the surface to be processed 210 of the object to be processed 200.
[0042] Please refer to Figure 5 As shown, in the embodiment of the present application, the carrying platform 21 may include a suction member 211, and the suction member 211 is used to adsorb and fix the object to be processed 200, but not limited thereto. The object to be processed 200 may also be fixed on the carrying platform 21 by means of attachment, adhesion, etc., so as to reduce the probability of the object to be processed 200 being offset during the movement process.
[0043] The detection device 30 is disposed in the detection area 11 and is coupled to the carrying device 20. The detection device 30 detects and outputs a position information of the object to be processed 200 on the carrying platform 21, and detects and outputs a surface flatness information corresponding to the surface to be processed 210. Among them, please refer to Figures 1 to 5 As shown, the detection device 30 includes a position detection member 31 and a flatness detection member 32. Since the object to be processed 200 may have a slight position deviation when placed on the carrying device 20, therefore, by detecting and outputting the position information through the position detection member 31, the probability of the object to be processed 200 causing the subsequent plasma process to be unable to perform plasma processing accurately due to the offset of the placement position can be reduced; and the flatness detection member 32 is disposed in the detection area 11 and on one side of the position detection member 31 close to the plasma processing area 12, and the flatness detection member 32 detects and outputs the surface flatness information.
[0044] Please refer to Figure 7 As shown, in the embodiment of the present application, the detection device 30 outputs the position information and the surface flatness information to the control processing unit 24, and the control processing unit 24 can correspondingly control the actuation of the object to be processed 200 by means of the position information and the surface flatness information.
[0045] Before the plasma treatment device 40 performs plasma planarization on the surface 210 to be treated, the control processing unit 24 can receive and, according to the position information, control the position of the carriage 23 on the first track 22 to adjust the position of the object 200 to be processed; or it is necessary to perform fine adjustment of the position in the moving direction Y in cooperation with the second track 231. It should be noted that the second track 231 usually performs fine adjustment of the position in the moving direction Y when the detection device 30 detects the position information. When the plasma treatment device 40 performs plasma planarization on the surface 210 to be treated, the control processing unit 24 can receive and, according to the position information and the surface flatness information, control the position of the carrier platform 21 on the first track 22 to perform uniaxial radial adjustment on the object 200 to be processed, and control the rotation speed of the rotation unit 25 to adjust the rotation speed of the object 200 to be processed. Thereby, the control processing unit 24 can control the processing position and the processing rotation speed of the object 200 to be processed during the planarization process, improving the planarization processing accuracy of the surface 210 to be treated of the object 200 to be processed.
[0046] The plasma treatment device 40 is disposed in the plasma treatment area 12 and is coupled to the detection device 30. The plasma treatment device 40 performs plasma planarization on the surface 210 to be treated according to the position information and the surface flatness information. Among them, the plasma treatment device 40 has a plasma nozzle 41 and a positioning member 42. The plasma nozzle 41 is used to perform planarization on the surface 210 to be treated of the object 200 to be processed; the positioning member 42 is slidably connected to the plasma nozzle 41, and the positioning member 42 is used to adjust the height of the plasma nozzle 41 relative to the carrier device 20, so that the plasma nozzle 41 performs planarization on the surface 210 to be treated of the object 200 to be processed at the optimal processing position, improving the planarization processing accuracy.
[0047] Please refer to Figures 1 to 5 As shown, in the embodiment of the present application, there is further included a dust barrier device 50, which extends downward from the top of the process chamber 10, and the dust barrier device 50 is disposed between the detection area 11 and the plasma treatment area 12.
[0048] Please refer to Figures 1 to 5As shown, in the embodiment of the present application, the dust barrier device 50 has a barrier member 51 and a blowing member 52. The barrier member 51 extends downward from the top of the process chamber 10; the blowing member 52 is disposed at the bottom edge of the barrier member 51, and the blowing member 52 outputs gas in a blowing direction Z perpendicular to the vertical transport direction X to generate a gas barrier to separate the detection area 11 and the plasma processing area 12. Thereby, when the object to be processed 200 is subjected to planarization processing in the plasma processing area 12, the barrier member 51 and the gas barrier generated by the blowing member 52 can block the dust in the plasma processing area 12 from entering the detection area 11, thereby avoiding the detection device 30 in the detection area 11 from being contaminated by dust and resulting in inaccurate detection.
[0049] Please refer to Figures 1 to 5 As shown, in the embodiment of the present application, the vertical installation height of the blowing member 52 relative to the carrier platform 21 is higher than the vertical installation height of the object to be processed 200 relative to the carrier platform 21. Thereby, when the carrier platform 21 reciprocates between the detection area 11 and the plasma processing area 12, the blowing member 52 will not collide with the object to be processed 200, avoiding damage. Furthermore, when the carrier platform 21 moves from the plasma processing area 12 to the detection area 11, the blowing member 52 can blow the dust on the object to be processed 200 away from the surface to be processed 210, so as to avoid the dust from affecting the detection accuracy of the detection device 30.
[0050] Furthermore, in another embodiment of the present application, the present application can also be provided with a blowing device (not shown in the figure), and the blowing device can generate an air flow flowing from the detection area 11 to the plasma processing area 12 in the process chamber 10, so that the aforementioned air flow can prevent the dust on the object to be processed 200 from entering the detection area 11 and prevent the dust from affecting the detection accuracy of the detection device 30 in the detection area 11.
[0051] Please refer to Figure 6As shown, in another embodiment of the present application, the number of detection areas 11 is plural, and they are arranged at intervals along a moving direction Y perpendicular to the vertical conveying direction X; the number of plasma processing areas 12 corresponds to that of the detection areas 11 and is plural, and they are arranged at intervals along the moving direction Y. Among them, the number of position detection members 31 is plural and they are arranged at intervals along the moving direction Y; the number of the carrying device 20 and the plasma processing device 40 also corresponds to that of the position detection members 31 and is plural, and they are arranged at intervals along the moving direction Y, and the flatness detection member 32 reciprocates along the moving direction Y between the detection areas 11. Thereby, multiple planarization processing mechanisms can be set in the process chamber 10 of the present application to simultaneously perform planarization processing on multiple objects to be processed 200, further improving the overall planarization processing efficiency. Moreover, since the flatness detection member 32 can move between multiple detection areas 11, the setting cost of setting multiple flatness detection members 32 can be saved, further reducing the overall cost of the present application. Of course, the flatness detection member 32 can also have several corresponding to the number of the position detection members 31, thereby avoiding detection errors caused by the position deviation of the flatness detection member 32 during reciprocating movement.
[0052] Thereby, the present application has the following advantages:
[0053] 1. The first track 22 of the present application is a linear slide rail structure, so that by means of the high adjustment accuracy of the sliding track (the error is within plus or minus 0.5 mm), when the object 200 to be processed is reciprocated between the detection area 11 and the plasma processing area 12, the adjustment accuracy of the carrying device 20 can be effectively improved, thereby avoiding the problem of insufficient planarization processing accuracy due to position deviation during the plasma planarization process.
[0054] 2. The setting of the second track 231 of the present application can effectively perform fine adjustment of the carrying device 20 in the moving direction Y, further increasing the positioning accuracy of the object 200 to be processed and improving the planarization processing accuracy of the object 200 to be processed.
[0055] 3. The carrying device 20 of the present application fixes the object 200 to be processed by adsorption, which can reduce the probability of the object 200 to be processed shifting during movement.
[0056] 4. The positioning member 42 of the present application can detect and correct the position of the object 200 to be processed in advance before the plasma nozzle 41 performs planarization processing on the surface 210 to be processed, so as to improve the overall planarization processing accuracy.
[0057] 5. By means of the setting of the control processing unit 24 and the rotation unit 25 of the present application, the plasma nozzle 41 can perform planarization processing on the surface 210 to be processed in a circular motion, so as to achieve the purposes of reducing the operation difficulty, reducing the process cost, maintaining the high process accuracy and simplifying the process mechanism.
[0058] 6. Multiple planarization processing mechanisms can be provided in the process chamber 10 of the present application to simultaneously perform planarization processing on multiple objects to be processed 200, further improving the overall planarization processing efficiency. Moreover, since the flatness detection member 32 can move between multiple detection areas 11, the setup cost of setting up multiple flatness detection members 32 can be saved, further reducing the overall cost of the present application.
[0059] 7. When the object to be processed 200 undergoes planarization processing in the plasma processing area 12, the barrier member 51 of the present application and the gas barrier generated by the air blowing member 52 can block dust in the plasma processing area 12 from entering the detection area 11, thereby preventing the detection device 30 in the detection area 11 from being contaminated by dust and resulting in inaccurate detection.
[0060] Although the present application is described with a preferred embodiment, those skilled in the art can make various different forms of changes without departing from the spirit and scope of the creation. The above-described embodiments are only used to illustrate the creation and are not used to limit the scope of the creation. All kinds of modifications or changes made without violating the spirit of the creation fall within the scope of the patent application of the present creation.
[0061] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered that the scope described in this specification is covered.
Claims
1. An orbital mobile plasma planarization processing system, characterized in that, The orbital mobile plasma planarization processing system is used to planarize the surface to be processed of an object to be processed. The orbital mobile plasma planarization processing system includes: A process chamber, which is provided with a detection area and a plasma processing area arranged on one side of the detection area; A carrying device, which is provided with a carrying platform and a first track. The carrying platform is used to place the object to be processed, and the first track is used to enable the carrying platform to reciprocate along a conveying direction between the detection area and the plasma processing area; A detection device, which is arranged in the detection area and coupled to the carrying device. The detection device detects and outputs the position information of the object to be processed on the carrying platform, and detects and outputs the surface flatness information of the surface to be processed; and A plasma processing device, which is arranged in the plasma processing area and coupled to the detection device. The plasma processing device planarizes the surface to be processed according to the position information and the surface flatness information.
2. The orbital mobile plasma planarization processing system according to claim 1, wherein The carrying device has a control processing unit and a rotation unit that are coupled to each other. When the plasma processing device performs plasma planarization processing on the surface to be processed, the control processing unit can receive and control the position of the carrying platform on the first track according to the position information and the surface flatness information to perform uniaxial radial adjustment on the object to be processed, and control the rotation speed of the rotation unit to perform rotation speed adjustment on the object to be processed.
3. The orbital mobile plasma planarization processing system according to claim 2, wherein The carrying device has a sliding seat, which slides on the first track. The sliding seat has a second track perpendicular to the first track, and the carrying platform slides on the second track.
4. The orbital mobile plasma planarization processing system according to claim 3, wherein, Before the plasma processing device performs plasma planarization processing on the surface to be processed, the control processing unit can receive and control the position of the sliding seat on the first track and the position of the carrying platform on the second track according to the position information to perform position adjustment on the object to be processed.
5. The orbital mobile plasma planarization processing system according to claim 1, wherein The carrying platform includes an adsorbing member, which is used to adsorb and fix the object to be processed.
6. The orbital mobile plasma planarization processing system according to claim 1, wherein, The detection device includes a position detection member and a flatness detection member. The position detection member detects and outputs the position information. The flatness detection member is arranged in the detection area and on one side of the position detection member close to the plasma processing area. The flatness detection member detects and outputs the surface flatness information.
7. The orbital mobile plasma planarization processing system according to claim 6, wherein, The number of the detection areas is plural, and they are arranged at intervals along a moving direction perpendicular to the conveying direction; the number of the plasma processing areas is also plural and corresponds to the number of the detection areas, and they are arranged at intervals along the moving direction.
8. The orbital mobile plasma planarization processing system according to claim 7, wherein The number of the position detection members is plural and they are arranged at intervals along the moving direction; the number of the carrying devices and the plasma processing devices is also plural and corresponds to the number of the position detection members, and they are arranged at intervals along the moving direction. The flatness detection member reciprocates between the detection areas along the moving direction.
9. The orbital mobile plasma planarization processing system according to claim 1, wherein The plasma processing device has a plasma nozzle and a positioning member. The plasma nozzle is used for planarizing the surface to be processed of the object to be processed. The positioning member is slidably connected to the plasma nozzle, and the positioning member is used for adjusting the height of the plasma nozzle relative to the loading device.
10. The orbital mobile plasma planarization processing system according to claim 1, wherein, It further includes a dust barrier device. The dust barrier device extends downward from the top of the process chamber, and the dust barrier device is disposed between the detection area and the plasma processing area.
11. The orbital mobile plasma planarization processing system according to claim 10, wherein, The dust barrier device has a barrier member and a blowing member. The barrier member extends downward from the top of the process chamber. The blowing member is disposed at the bottom edge of the barrier member. The blowing member outputs gas in a blowing direction perpendicular to the conveying direction to generate a gas barrier to separate the detection area and the plasma processing area.
12. The orbital mobile plasma planarization processing system according to claim 11, wherein The vertical setting height of the blowing member relative to the loading platform is higher than the vertical setting height of the object to be processed relative to the loading platform.