Signal amplification device of voice pickup unit and earphone

By building a metal baffle as a signal amplifier above the voice pickup unit, the problem of poor noise reduction of headphones caused by too small signals is solved, and a more complete sound pickup and better call noise reduction effect is achieved.

CN223124980UActive Publication Date: 2025-07-18COSONIC INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202422001634.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-16
Publication Date
2025-07-18
Estimated Expiration
2034-08-16

AI Technical Summary

Technical Problem

In the prior art, the signal obtained by the voice pickup unit is too small, resulting in poor noise reduction effect of the headphones and incomplete sound.

Method used

A metal baffle is built above the voice pickup unit, using the high sound transmission speed of the metal as the sound signal amplifier, and fixed to the PCB board through the support legs to form a signal amplification device.

Benefits of technology

The input signal strength of the voice pickup unit is improved, ensuring that the headset can pick up more complete sound signals, thereby improving the noise reduction effect of calling.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a signal amplification device of a voice pick-up unit and an earphone, the voice pick-up unit is applied to the earphone with a conversation noise reduction function, the voice pick-up unit is arranged on a PCB of the earphone, and the signal amplification device comprises a baffle plate and supporting legs; the baffle is made of a metal material; the supporting legs are fixed on the PCB and located on the peripheral side of the voice pickup unit, and the baffle is fixed on the PCB through the supporting legs; and the baffle plate is arranged above the voice pickup unit. According to the utility model, the input signal of the voice pickup unit can be improved, the noise reduction earphone can pick up a more complete sound signal, and the subsequent noise reduction effect is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of voice pickup units, in particular to a signal amplification device and an earphone for a voice pickup unit. Background Art

[0002] VPU (Voice Pick-up Unit, that is, a voice pickup unit, also known as a voice pickup or a voice pickup sensor, etc.) can effectively isolate noise during a call, enabling the other party to hear less of the surrounding noise. It not only realizes the accurate pickup of human voice signals, but also significantly improves the anti-high-noise ability of the call for the multiplex voice signals picked up through the cooperation of software and hardware. When you are in a noisy environment such as a shopping mall, subway, or airport, or in a high-wind noise scenario such as by the sea or cycling, the other party will also think that you are in a quiet environment during the call.

[0003] However, when the signal obtained by the VPU unit is too small, resulting in an incomplete signal, it will affect the ENC (Environmental Noise Cancellation) noise reduction effect of the earphone with call noise reduction function. For example, phenomena such as the other party hearing an incomplete voice, being able to hear the complete noise, and the human voice being relatively unclear may occur. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a signal amplification device and an earphone for a voice pickup unit, which can increase the input signal of the voice pickup unit, facilitate the pickup of more complete voice signals by the noise reduction earphone, and improve the subsequent noise reduction effect.

[0005] To solve the above technical problem, in the first aspect of the utility model, a signal amplification device for a voice pickup unit is disclosed. The voice pickup unit is applied to an earphone with a call noise reduction function. The voice pickup unit is arranged on the PCB board of the earphone and includes a baffle and support legs; the baffle is made of a metal material; the support legs are fixed on the PCB board and are located on the periphery of the voice pickup unit, and the baffle is fixed on the PCB board through the support legs; the baffle is installed above the voice pickup unit.

[0006] As an optional implementation manner, the size of the gap between the baffle and the voice pickup unit is 0.1 - 0.3 mm.

[0007] As another optional implementation manner, the thickness of the baffle is 0.1 - 0.3 mm.

[0008] As another optional implementation manner, the length and width of the baffle are 3 - 5 mm and 1.5 - 3.5 mm respectively.

[0009] As another alternative embodiment, the height of the baffle relative to the PCB board is 0.5 - 2.5 mm.

[0010] As another alternative embodiment, the support legs are made of the same material as the baffle and are integrally formed therewith.

[0011] As another alternative embodiment, the model of the voice pickup unit is LSM6DSV16BX.

[0012] The second aspect of the present utility model discloses an earphone, which includes the voice pickup unit and its signal amplification device as described in the first aspect of the present utility model.

[0013] Compared with the prior art, the embodiments of the present utility model have the following beneficial effects:

[0014] In the embodiments of the present utility model, by building a metal baffle above the voice pickup unit, since the sound transmission speed of the metal is fast, the entire baffle can vibrate synchronously to serve as an amplifier for sound signals to amplify the sound input to the voice pickup unit, which can improve the input signal of the voice pickup unit, is beneficial for the noise-canceling earphone to pick up more complete sound signals, and improves the subsequent noise-canceling effect. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0016] Figure 1 is a partial structural schematic diagram of an earphone with a voice pickup unit and its signal amplification device disclosed in the embodiments of the present utility model;

[0017] Figure 2 is another structural schematic diagram of an earphone with a voice pickup unit and its signal amplification device disclosed in the embodiments of the present utility model;

[0018] Figure 3 is a signal intensity comparison diagram of the voice pickup unit with a signal amplification device and the voice pickup unit without a signal amplification device under the same test conditions disclosed in the embodiments of the present utility model. Detailed Embodiments

[0019] To enable those skilled in the art to better understand the solution of the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0020] Embodiment 1

[0021] See Figure 1-2 , the present embodiment of the utility model discloses a signal amplification device 2 for a voice pickup unit 1. The voice pickup unit is applied to an earphone with a call noise reduction function. The voice pickup unit is arranged on a PCB board 3 of the earphone and includes a baffle 21 and support legs 22; the baffle is made of a metal material; the support legs are fixed on the PCB board and are located on the periphery of the voice pickup unit, and the baffle is fixed on the PCB board through the support legs; the baffle is installed above the voice pickup unit.

[0022] In this embodiment, by building a metal baffle above the voice pickup unit, since the sound transmission speed of the metal is fast, the entire baffle can vibrate synchronously to serve as an amplifier for sound signals to amplify the sound input to the voice pickup unit, which can improve the input signal of the voice pickup unit, is beneficial for the noise reduction earphone to pick up more complete sound signals, and improves the subsequent noise reduction effect.

[0023] In an optional embodiment, the size of the gap between the baffle and the voice pickup unit is 0.1 - 0.3 mm.

[0024] In another optional embodiment, the thickness of the baffle is 0.1 - 0.3 mm.

[0025] In another optional embodiment, the length and width of the baffle are 3 - 5 mm and 1.5 - 3.5 mm respectively.

[0026] In another optional embodiment, the height of the baffle relative to the PCB board is 0.5 - 2.5 mm.

[0027] In another optional embodiment, the support legs and the baffle are made of the same material and are integrally formed.

[0028] In another optional embodiment, the model of the voice pickup unit is LSM6DSV16BX.

[0029] See Figure 3, under the same test method, the test bandwidth of the voice pickup unit (model LSM6DSV16B) without the signal amplification device of this embodiment is small, and the signal in the 400 - 600 Hz interval is weak. After adding the signal amplification device, the signal is significantly improved; among them, Figure 3 The corresponding baffle has a thickness of 0.2 mm, a length of 3.4 mm, a width of 1.2 mm, and the height of the baffle relative to the PCB board is 0.97 mm.

[0030] Embodiment 2

[0031] See Figure 1-2 , this embodiment of the present utility model discloses an earphone, including the voice pickup unit and its signal amplification device as described in Embodiment 1.

[0032] What is disclosed in the content of this embodiment of the present utility model is only the preferred embodiment of the present utility model, which is only used to illustrate the technical solution of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present utility model.

Claims

1. A signal amplification device for a voice pickup unit, the voice pickup unit being applied to an earphone with a call noise reduction function, the voice pickup unit being disposed on a PCB board of the earphone, characterized in that, It includes a baffle and support legs; the baffle is made of metal material; the support legs are fixed on the PCB board and are located on the periphery of the voice pickup unit, and the baffle is fixed on the PCB board through the support legs; the baffle is installed above the voice pickup unit.

2. The signal amplification device according to claim 1, wherein The size of the gap between the baffle and the voice pickup unit is 0.1 - 0.3 mm.

3. The signal amplification device according to claim 1, characterized in that The thickness of the baffle is 0.1 - 0.3 mm.

4. The signal amplification device according to claim 1, characterized in that The length and width of the baffle are 3 - 5 mm and 1.5 - 3.5 mm respectively.

5. The signal amplification device according to claim 1, wherein The height of the baffle relative to the PCB board is 0.5 - 2.5 mm.

6. The signal amplification device according to claim 1, wherein The support legs are made of the same material as the baffle and are integrally formed.

7. The signal amplification device according to claim 1, wherein, The model of the voice pickup unit is LSM6DSV16BX.

8. An earphone, characterized in that, It includes the voice pickup unit as described in claim 1 and its signal amplification device.