PCB
By designing welding holes lower than the surface of the board on the PCB board and setting up an annular countertop and solder paste area, the problem of less tin on the welding is solved, the welding quality and mechanical strength are improved, and the risk of welding deformation is reduced.
Patent Information
- Application Number
- CN202422144676.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-02
AI Technical Summary
During the reflow soldering process, the area of the through hole surface on the PCB board is too large, resulting in insufficient tin allocation, resulting in less tin welding, affecting the mechanical strength and quality of the solder joints.
A PCB board is designed, the horizontal height of the welding hole is lower than the surface of the board body, and an annular table top is set between the welding hole and the board body, and solder paste areas are on the annular wall surface and table top to form a shape similar to step holes to increase the solder paste residence.
Reduce the phenomenon of less tin on welding, improve welding quality, improve mechanical connections and heat conduction, and reduce the risk of welding deformation.
Smart Images
Figure CN223125058U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB, in particular to a PCB board. Background Art
[0002] PIP components, namely pin in paste reflow, is a welding technology for electronic components, which is mainly used to connect components to printed circuit boards through through-hole reflow. At present, during the reflow process, due to the large hole ring area on the surface of the through-hole on the PCB board, it causes too much tin to be distributed, which affects the filling of the through-hole, resulting in insufficient tin when tinning, which directly affects the mechanical strength of the solder joint, making the solder joint prone to tin cracking when subjected to external force, and may even cause cold solder joints, greatly affecting the quality of welding. Utility Model Content
[0003] The utility model aims to provide a PCB board, the design of the welding holes on the board body can greatly reduce the occurrence of insufficient tin in welding, well solve the shortcomings of the background technology, and improve the welding quality.
[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0005] A PCB board comprises: a board body; a welding hole for welding an electronic component, which is arranged on the board body and the horizontal height of the welding hole is lower than the horizontal height of the board body surface; and an annular table, which is arranged between the welding hole and the board body, wherein the board body has a cylindrical annular wall surface between the annular table surface and the surface of the board body, and the annular wall surface and the annular table surface both have a solder paste area for solder paste filling.
[0006] Preferably, a plurality of welding holes are provided and arranged in a straight line.
[0007] Preferably, the distance between two adjacent welding holes is greater than 1 mm.
[0008] Preferably, the width of the annular table is 0.2 mm.
[0009] Preferably, the height of the annular wall is 0.15 mm.
[0010] Preferably, the annular table top is made of glass fiber epoxy resin copper clad laminate.
[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows: Due to the existence of the solder paste area, a shape similar to a stepped hole can be formed at the position of the welding hole. When welding, more solder paste can stay in the solder paste area at the position of the welding hole. After setting the annular table surface, a solder paste area will be formed on the periphery of the welding hole, so that more solder paste is distributed on the periphery of the welding hole, reducing the phenomenon of insufficient solder in welding and improving the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 FIG. is a schematic structural diagram of a welding hole on a plate body according to an embodiment of the present utility model;
[0013] Figure 2 FIG. is a schematic diagram of a plurality of welding holes arranged on a plate body according to an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0014] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0015] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0016] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.
[0017] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.
[0018] Figure 1 and Figure 2It is a schematic diagram of a PCB board according to an embodiment of the present utility model. The PCB board includes a board body 1, welding holes 2 provided on the board body 1, and an annular table surface 3. When the welding holes 2 are provided on the board body 1, their horizontal height is lower than the horizontal height of the surface of the board body 1, so as to form an annular table surface 3 between the welding holes 2 and the board body 1. The annular table surface 3 is below the surface of the board body 1, and there is a cylindrical annular wall surface 4 between the annular table surface 3 and the surface of the board body 1. The annular wall surface 4 is provided on the board body 1, and both the annular wall surface 4 and the annular table surface 3 have solder paste regions 5 for solder paste filling. The solder paste regions 5 can be in a stepped shape, so that the position of the welding holes 2 forms a shape similar to a stepped hole. When welding, more solder paste can stay in the solder paste regions 5 at the positions of the welding holes 2. After the annular table surface 3 is provided, solder paste regions 5 will be formed on the periphery of the welding holes 2, so that more solder paste is distributed on the periphery of the welding holes 2, reducing the phenomenon of less solder in welding. In addition, it can also improve the mechanical connection and heat conduction between the pads and solder joints of the PCB board body 1. The annular table surface 3 can provide a more uniform heat distribution, reducing hot spots and non-uniform heating during the welding process, thereby reducing the risk of welding deformation and improving the welding quality.
[0019] In addition, referring to Figure 2 , the welding holes 2 provided on the board body 1 are used for welding electronic components. The electronic components can be surface mount resistors, capacitors, inductors, integrated circuits (ICs), transistors, diodes, etc. There are multiple welding holes 2 provided on the board body 1. As a preferred embodiment, they are arranged in a straight line, and the distance between adjacent two welding holes 2 is greater than 1 mm to adapt to various electronic components.
[0020] Secondly, the width of the annular table surface 3 can be set relatively narrow, such as 0.2 mm. The relatively narrow annular table surface 3 can minimize the interference to the electronic components during welding while ensuring that the solder paste can be accommodated. Moreover, the material of the annular table surface 3 is glass fiber epoxy copper clad laminate, which uses an electronic grade glass fiber cloth as the reinforcing material and has good mechanical properties, electrical insulation, heat resistance, and flame retardancy. Similarly, the height of the annular wall surface 4 can be set relatively short, such as 0.15 mm. The relatively short annular wall surface 4 can minimize the interference to the electronic components during welding while ensuring that the solder paste can be accommodated.
[0021] According to the disclosure and teachings of the above specification, those skilled in the art to which the present utility model pertains can also make changes and modifications to the above embodiments. Therefore, the present utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present utility model should also fall within the protection scope of the claims of the present utility model. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present utility model.
Claims
1. A PCB board, characterized in that, Comprising: A plate body (1); A welding hole (2) for welding an electronic component, provided on the plate body (1) and the horizontal height of the welding hole (2) is lower than the horizontal height of the surface of the plate body (1); And An annular tabletop (3), provided between the welding hole (2) and the plate body (1), Wherein, the plate body (1) has a cylindrical annular wall surface (4) between the annular tabletop (3) and the surface of the plate body (1), and a solder paste area (5) for solder paste filling is provided on both the annular wall surface (4) and the annular tabletop (3).
2. The PCB board according to claim 1, wherein A plurality of the welding holes (2) are provided and arranged in a straight line.
3. The PCB board according to claim 2, wherein The distance between two adjacent welding holes (2) is greater than 1 mm.
4. The PCB board according to claim 1, wherein The width of the annular tabletop (3) is 0.2 mm.
5. The PCB board according to claim 1, wherein The height of the annular wall surface (4) is 0.15 mm.
6. The PCB board according to claim 1, characterized in that, The material of the annular tabletop (3) is glass fiber epoxy copper clad laminate.