Water cleaning tank

Abstract

The utility model relates to the technical field of wafer surface treatment processing equipment, in particular to a water cleaning box which comprises a container, a partition plate, a spraying assembly and a valve assembly. The partition plate is arranged in the container, the partition plate divides the container into an upper cavity and a lower cavity, the upper cavity is communicated with the lower cavity, the spraying assembly comprises a plurality of spraying heads, and the spraying heads are located above the container; the container is provided with a first through hole, the first through hole is located below the partition plate, the valve assembly comprises a driving source and a hole cover plate, and the driving source drives the hole cover plate to move so that the hole cover plate can block the first through hole or be away from the first through hole; the valve assembly is arranged at the bottom of the container, the first through hole is machined in the bottom of the container, the valve assembly is composed of the driving source and the hole cover plate, the driving source drives the hole cover plate to move so that the hole cover plate can rapidly block the first through hole or be rapidly separated from the first through hole, and cleaning liquid in the container can rapidly flow out; therefore, the phenomenon of residual liquid on the surface of the wafer is avoided, and the production requirement is met.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer surface treatment and processing equipment, in particular to a water cleaning tank. Background Technique

[0002] The wafer completes surface cleaning in a chemical agent solution, and then enters the water cleaning process to rinse off the residual chemical agent on the wafer surface. Usually, this surface cleaning process is completed in a water cleaning tank. However, with the traditional cleaning method, there is still a problem that a small amount of liquid remains on the wafer surface, which affects the subsequent processing of the wafer. Therefore, the traditional cleaning method cannot meet the production requirements and affects the processing quality stability of the wafer, and needs to be improved. Summary of the Invention

[0003] In order to overcome the problem that there is residual liquid on the wafer surface in the prior art, which affects the processing quality stability of the wafer, the purpose of the utility model is to provide a water cleaning tank to reduce the problem of the residual liquid on the wafer surface and improve the stability of production quality.

[0004] To achieve the above purpose, the technical solution of the utility model is as follows:

[0005] A water cleaning tank includes a container, a partition plate, a spraying component and a valve component;

[0006] The partition plate is arranged in the container. The partition plate divides the container into an upper cavity and a lower cavity, and the upper cavity and the lower cavity are communicated. The spraying component includes a plurality of spray heads, and the spray heads are located above the container;

[0007] The container is provided with a first through hole, and the first through hole is located below the partition plate. The valve component includes a driving source and a hole cover plate, and the driving source drives the hole cover plate to move so that the hole cover plate blocks the first through hole or is away from the first through hole.

[0008] Further, the container further includes a diversion plate, the diversion plate is located in the container, the diversion plate is located below the partition plate, the diversion plate is arranged at a distance from the first through hole, and the diversion plate is inclined towards the direction of the first through hole.

[0009] Further, the container includes a first bottom plate and a first side plate, the first through hole is arranged on the first bottom plate and penetrates through the first bottom plate along the thickness direction of the first bottom plate, and the first side plate and the first bottom plate enclose a first cavity.

[0010] Further, the water cleaning tank further includes an external liquid storage tank, the external liquid storage tank includes a second bottom plate and a second side plate, the second bottom plate is connected to the first side plate, the second side plate is arranged at a distance from the first side plate, and the second side plate, the second bottom plate and the first side plate enclose a second cavity.

[0011] Further, the upper end surface of the second side plate is higher than that of the first side plate, and the first side plate is provided with a notch which is arranged on the upper end surface of the first side plate.

[0012] Further, the water cleaning tank further includes a resistance detection component. The second bottom plate is provided with a second through hole, and the resistance detection component communicates with the second cavity through the second through hole.

[0013] Further, the water cleaning tank further includes a temperature sensing component which is arranged inside the container.

[0014] Further, the water cleaning tank further includes an air pipe assembly which is arranged on the container and extends into the container.

[0015] The beneficial effects of the present utility model are as follows: By arranging a valve assembly at the bottom of the container, a first through hole is processed at the bottom of the container. The valve assembly is composed of a driving source and a hole cover plate. The driving source drives the hole cover plate to move so that the hole cover plate quickly blocks the first through hole or quickly disengages from the first through hole, enabling the cleaning liquid in the container to flow out quickly, thereby avoiding the phenomenon of residual liquid on the surface of the wafer and meeting the production requirements. Description of the Drawings

[0016] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0017] Figure 2 is a disassembled structural schematic diagram of the present utility model;

[0018] Figure 3 is a first perspective cross-sectional view of the present utility model;

[0019] Figure 4 is a second perspective cross-sectional view of the present utility model;

[0020] Figure 5 is a cross-sectional view of the present utility model in a state of being loaded into an external material frame.

[0021] The reference numerals include:

[0022] 1 - container, 11 - first through hole, 12 - guide plate

[0023] 101 - first bottom plate, 102 - first side plate, 103 - first cavity

[0024] 2 - partition, 3 - spraying assembly, 31 - nozzle

[0025] 4 - valve assembly, 41 - driving source, 42 - hole cover plate

[0026] 5 - assembly, 501 - second bottom plate, 502 - second side plate

[0027] 503 - Second cavity 6 - Resistance detection component 7 - Temperature sensing component

[0028] 8 - Air pipe assembly 100 - Feed bin. Detailed implementation manner

[0029] For the convenience of those skilled in the art to understand, the following further describes the present utility model in conjunction with embodiments and drawings. The content mentioned in the implementation manner does not limit the present utility model.

[0030] Please refer to Figures 1 to 5 , a water cleaning tank of the present utility model includes a container 1, a partition 2, a spraying assembly 3 and a valve assembly 4;

[0031] The partition 2 is arranged in the container 1. The partition 2 divides the container 1 into an upper cavity and a lower cavity. The upper cavity and the lower cavity are communicated. The spraying assembly 3 includes a plurality of nozzles 31, and the nozzles 31 are located above the container 1;

[0032] The container 1 is provided with a first through hole 11, and the first through hole 11 is located below the partition 2. The valve assembly 4 includes a driving source 41 and a hole cover plate 42. The driving source 41 drives the hole cover plate 42 to move so that the hole cover plate 42 blocks the first through hole 11 or is away from the first through hole 11.

[0033] Specifically, in this embodiment, the partition plate 2 is installed inside the container 1. The partition plate 2 divides the container 1 into an upper cavity and a lower cavity. The partition plate 2 is provided with a plurality of through holes that penetrate the partition plate 2 along the thickness direction of the partition plate 2, so that the upper cavity and the lower cavity are communicated. The spraying assembly 3 includes two groups of water pipes, and a plurality of nozzles 31 are installed on each group of water pipes. The two groups of water pipes are symmetrically arranged. Two first through holes 11 are processed at the bottom of the container 1. The driving source 41 is welded to the bottom plate of the container 1 and drives the hole cover plate 42 to move, so as to achieve the purpose of blocking the first through hole 11. The working principle is as follows: The external material frame 100 carrying the wafer is transported by an external manipulator to the upper part of the container 1 and then moves downward and gradually enters the container 1. When it reaches the preset height, the spraying assembly 3 starts spraying to pre-rinse the wafer. The rinsed water flows into the container 1. The two groups of water pipes of the spraying assembly 3 are respectively located on opposite sides of the wafer. The setting of a plurality of nozzles 31 realizes the purpose of uniformly spraying the wafer and achieves the purpose of uniform cleaning. After the pre-rinsing is completed, the driving source 41 drives the hole cover plate 42 to leave the first through hole 11. The waste liquid after pre-rinsing quickly flows out through the first through hole 11 under the action of gravity, and the residue in the waste liquid also flows out together. Then the driving source 41 drives the hole cover plate 42 to block the first through hole 11. The external material frame 100 is driven by an external manipulator to move downward, and the material frame 100 is placed on the partition plate 2. Cleaning liquid is injected into the container 1 again. The cleaning liquid performs surface cleaning on the wafer. After the cleaning is completed, the driving source 41 drives the hole cover plate 42 to leave the first through hole 11, and the cleaning liquid quickly flows out through the first through hole 11, that is, the residue and the cleaning liquid in the container 1 quickly flow out. The process of the cleaning liquid flowing out quickly avoids the appearance of residual liquid on the surface of the wafer, achieves the cleaning purpose, and meets the production requirements.

[0034] By providing a valve assembly 4 at the bottom of the container 1, a first through hole 11 is processed at the bottom of the container 1. The valve assembly 4 is composed of a driving source 41 and a hole cover plate 42. The driving source 41 drives the hole cover plate 42 to move so that the hole cover plate 42 quickly blocks the first through hole 11 or quickly disengages from the first through hole 11, so that the cleaning liquid in the container 1 quickly flows out, thereby avoiding the phenomenon of residual liquid on the surface of the wafer and meeting the production requirements.

[0035] The container 1 further includes a guide plate 12. The guide plate 12 is located inside the container 1. The guide plate 12 is located below the partition plate 2. The guide plate 12 is spaced from the first through hole 11. The guide plate 12 is inclined toward the direction of the first through hole 11. The number of the guide plates 12 is two, and the two guide plates 12 are symmetrically arranged, so that the cleaning liquid in the container 1 quickly flows toward the first through hole 11.

[0036] The container 1 includes a first bottom plate 101 and a first side plate 102. The first through hole 11 is provided on the first bottom plate 101 and penetrates the first bottom plate 101 along the thickness direction of the first bottom plate 101. The first side plate 102 and the first bottom plate 101 enclose a first cavity 103. The partition plate 2 is connected to the first side plate 102 and is spaced from the first bottom plate 101. The flow guide plate 12 is provided below the partition plate 2. One end of the flow guide plate 12 is connected to the first side plate 102, and the other end of the flow guide plate 12 is connected to the first bottom plate 101.

[0037] The water cleaning tank 3 further includes a liquid storage outer tank 5. The liquid storage outer tank 5 includes a second bottom plate 501 and a second side plate 502. The second bottom plate 501 is connected to the first side plate 102. The second side plate 502 is spaced from the first side plate 102. The second side plate 502, the second bottom plate 501, and the first side plate 102 enclose a second cavity 503. The setting of the liquid storage outer tank 5 enables the cleaning liquid in the container 1 to overflow and flow to the second cavity 503, which has the function of collecting the cleaning liquid.

[0038] The upper end surface of the second side plate 502 is higher than the upper end surface of the first side plate 102. The first side plate 102 is provided with a notch. The notch is provided on the upper end surface of the first side plate 102. The cleaning liquid in the container 1 overflows into the second cavity 503 through the notch. The notch is in a V shape.

[0039] The water cleaning tank further includes a resistance detection component 6. The second bottom plate 501 is provided with a second through hole. The resistance detection component 6 communicates with the second cavity 503 through the second through hole. The setting of the resistance detection component 6 detects the electronic elements of the cleaning liquid to determine whether the cleaning liquid still meets the usage requirements for cleaning the wafer.

[0040] The water cleaning tank further includes a temperature sensing component 7. The temperature sensing component 7 is provided in the container 1 to monitor the working temperature of the cleaning liquid in the first cavity 103 in a timely manner, further ensuring the cleaning efficiency of the wafer and meeting the processing requirements.

[0041] The water cleaning tank further includes a trachea assembly 8. The trachea assembly 8 is provided in the container 1 and extends into the container 1. Nitrogen is filled into the first cavity 103 through the trachea assembly 8, so that the cleaning liquid in the first cavity 103 is in a boiling and tumbling state, accelerating the cleaning speed.

[0042] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A water cleaning tank, characterized in that: It includes a container (1), a partition plate (2), a spraying component (3) and a valve component (4); The partition plate (2) is arranged inside the container (1). The partition plate (2) divides the container (1) into an upper cavity and a lower cavity. The upper cavity and the lower cavity are communicated. The spraying component (3) includes a plurality of spray heads (31), and the spray heads (31) are located above the container (1); The container (1) is provided with a first through hole (11). The first through hole (11) is located below the partition plate (2). The valve component (4) includes a driving source (41) and a hole cover plate (42). The driving source (41) drives the hole cover plate (42) to move so that the hole cover plate (42) blocks the first through hole (11) or moves away from the first through hole (11).

2. The water cleaning tank according to claim 1, wherein: The container (1) further includes a guide plate (12). The guide plate (12) is located inside the container (1). The guide plate (12) is located below the partition plate (2). The guide plate (12) is arranged at a distance from the first through hole (11), and the guide plate (12) is inclined towards the direction of the first through hole (11).

3. The water cleaning tank according to claim 1, characterized in that: The container (1) includes a first bottom plate (101) and a first side plate (102). The first through hole (11) is arranged on the first bottom plate (101) and penetrates through the first bottom plate (101) along the thickness direction of the first bottom plate (101). The first side plate (102) and the first bottom plate (101) enclose a first cavity (103).

4. The water cleaning tank according to claim 3, characterized in that: The water cleaning tank further includes a liquid storage outer tank (5). The liquid storage outer tank (5) includes a second bottom plate (501) and a second side plate (502). The second bottom plate (501) is connected to the first side plate (102). The second side plate (502) is arranged at a distance from the first side plate (102). The second side plate (502), the second bottom plate (501) and the first side plate (102) enclose a second cavity (503).

5. The water cleaning tank according to claim 4, wherein: The upper end surface of the second side plate (502) is higher than the upper end surface of the first side plate (102). The first side plate (102) is provided with a notch, and the notch is arranged on the upper end surface of the first side plate (102).

6. The water cleaning tank according to claim 4, wherein: The water cleaning tank further includes a resistance detection component (6). The second bottom plate (501) is provided with a second through hole. The resistance detection component (6) is communicated with the second cavity (503) through the second through hole.

7. The water cleaning tank according to claim 1, wherein: The water cleaning tank further includes a temperature sensing component (7). The temperature sensing component (7) is arranged inside the container (1).

8. The water cleaning tank according to claim 1, characterized in that: The water cleaning tank further includes an air pipe component (8). The air pipe component (8) is arranged on the container (1) and extends into the container (1).

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