Automatic semiconductor manufacturing equipment

Abstract

The utility model discloses automatic semiconductor manufacturing equipment, which comprises a semiconductor ultrasonic cleaning machine and a cleaning tank arranged in the semiconductor ultrasonic cleaning machine, sliding rods are fixedly connected in the cleaning tank at equal intervals, and the automatic semiconductor manufacturing equipment belongs to the technical field of semiconductor manufacturing. According to the cleaning device, the sliding frame capable of sliding up and down is arranged in the cleaning tank, after a semiconductor part in the cleaning tank is cleaned, the rolling wheels can be driven to rotate by starting the inner rotor motor, so that the sliding frame drives the metal filter screen to slide upwards, and impurities in cleaning liquid can be filtered out; the metal filter screen can be detached, replaced or cleaned, so that cleaning liquid can be recycled for multiple times, resources are saved, the cost in the cleaning process is reduced, and by arranging a sealing groove and an adjusting cavity, after the friction force between a roller and a sliding rod is reduced, the interior of the sealing groove can be pressurized by rotating a bolt; the sliding stability of the sliding frame in the cleaning tank is improved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to an automated semiconductor manufacturing device. Background Art

[0002] Automated semiconductor manufacturing equipment is used to produce semiconductor chips. Through automated control and operation, various process steps in the semiconductor production process are realized, including cleaning, etching, deposition, exposure, etching, etc. These devices usually consist of robots, sensors, control systems, etc., and can accurately perform complex manufacturing tasks, improving production efficiency, quality, and consistency. There are various types of automated semiconductor manufacturing equipment, and common devices include: exposure machines, etching machines, cleaning machines, deposition equipment, ion implantation machines, and temperature control equipment, etc.

[0003] Among them, the ultrasonic cleaning machine in the automated semiconductor manufacturing equipment uses the principle of ultrasonic oscillation to detonate the tiny bubbles in the cleaning liquid, generating impact force to effectively remove the dirt on the surface of semiconductor devices. However, after the existing semiconductor ultrasonic cleaning machine cleans the semiconductor parts, the dirt will directly mix with the cleaning water. If the dirt is not filtered out in time, it will lead to a decline in the quality of the cleaning water and affect the cleaning effect. After the dirt mixes into the cleaning water, it may deposit on the surface of the device again, resulting in incomplete cleaning or leaving water marks, affecting the quality and performance of the device. If the cleaning liquid is frequently replaced, it will cause waste of resources and is not conducive to resource conservation and environmental protection. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides an automated semiconductor manufacturing device, which solves the problems that after the existing semiconductor ultrasonic cleaning machine cleans the semiconductor parts, the dirt will directly mix with the cleaning water. If the dirt is not filtered out in time, it will lead to a decline in the quality of the cleaning water and affect the cleaning effect. After the dirt mixes into the cleaning water, it may deposit on the surface of the device again, resulting in incomplete cleaning or leaving water marks, affecting the quality and performance of the device. If the cleaning liquid is frequently replaced, it will cause waste of resources and is not conducive to resource conservation and environmental protection.

[0005] To achieve the above object, the present utility model is realized through the following technical solutions: An automated semiconductor manufacturing device includes a semiconductor ultrasonic cleaner and a cleaning tank opened inside the semiconductor ultrasonic cleaner. The inside of the cleaning tank is fixedly connected with sliding rods at equal intervals. The inside of the cleaning tank is hermetically slidably connected with a sliding frame. The inside of the sliding frame is fixedly connected with a positioning frame. The surface of the positioning frame is fixedly connected with a first magnet. The surface of the first magnet adsorbs a second magnet. The surface of the second magnet is fixedly connected with a metal filter screen. The surface of the metal filter screen is fixedly connected with a pull rod. The inside of the sliding frame is fixedly connected with a fixed cylinder. The top and bottom of the inside of the fixed cylinder are both fixedly connected with sealing cylinders. The outer surface of the fixed cylinder is fixedly connected with a fixed block. The inside of the fixed block is provided with a sealing groove. The inside of the sealing groove is hermetically slidably connected with a sealing plate. The surface of the sealing plate is fixedly connected with a connecting block. The surface of the connecting block is fixedly installed with an inner rotor motor. The outer ring of the inner rotor motor is fixedly connected with a roller. The inside of the fixed block is provided with an adjustment cavity. The inside of the adjustment cavity is hermetically slidably connected with an adjustment block. The inside of the adjustment block is fixedly connected with a first bearing. The inside of the first bearing is fixedly connected with a bolt. The outer surface of the bolt is fixedly installed with a second bearing.

[0006] Preferably, the outer surface of the second bearing is fixedly installed inside the sliding frame, and the end of the bolt away from the fixed block extends to the bottom of the sliding frame.

[0007] Preferably, the outer surface of the sliding rod is inserted into the inside of the sealing cylinder, and the outer surface of the sliding rod is hermetically slidably connected to the inner wall of the sealing cylinder.

[0008] Preferably, the outer surface of the sealing plate is fixedly installed with a sealing ring. The surface of the roller is arc-shaped, and the surface of the roller abuts against the outer surface of the sliding rod.

[0009] Preferably, the top of the inside of the adjustment cavity is communicated with the inside of the sealing groove, and the outer surface of the cleaning tank is threadedly engaged and rotatably connected to the center of the inside of the adjustment block.

[0010] Preferably, a storage battery and a waterproof control switch electrically connected to the inner rotor motor are fixedly installed inside the sliding frame. Beneficial effects

[0011] The present utility model provides an automated semiconductor manufacturing device. Compared with the prior art, it has the following beneficial effects:

[0012] 1. The automated semiconductor manufacturing equipment is configured with a slidable frame inside the cleaning tank. After the semiconductor components inside the cleaning tank are cleaned, by starting the inner rotor motor, the roller can be driven to rotate, causing the slidable frame to drive the metal filter screen to slide upward. This can filter out the debris in the cleaning liquid, and the metal filter screen can be disassembled, replaced, or cleaned, enabling the cleaning liquid to be recycled multiple times, saving resources, reducing the cost of the cleaning process, and improving the economic efficiency of cleaning.

[0013] 2. The automated semiconductor manufacturing equipment is provided with a sealing groove and an adjustment cavity. When the frictional force between the roller and the sliding rod decreases, by turning the bolt, the pressure inside the sealing groove can be increased, enhancing the pressure between the roller and the sliding rod, extending the stability of the slidable frame sliding inside the cleaning tank, and prolonging the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic structural diagram of the present utility model;

[0015] Figure 2 It is a schematic connection diagram of the slidable frame and the metal filter screen in the present utility model;

[0016] Figure 3 It is a schematic connection diagram of the fixed cylinder and the fixed block in the present utility model;

[0017] Figure 4 It is a schematic connection diagram of the fixed block and the roller in the present utility model;

[0018] Figure 5 It is a cross-sectional view of the fixed block in the present utility model.

[0019] In the figure: 1. Semiconductor ultrasonic cleaning machine; 2. Cleaning tank; 3. Sliding rod; 4. Slidable frame; 5. Positioning frame; 6. First magnet; 7. Second magnet; 8. Metal filter screen; 9. Pull rod; 10. Fixed cylinder; 11. Sealing cylinder; 12. Fixed block; 13. Sealing groove; 14. Sealing plate; 15. Connecting block; 16. Inner rotor motor; 17. Roller; 18. Adjustment cavity; 19. Adjustment block; 20. Bolt; 21. First bearing; 22. Second bearing. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figures 1-5, the present utility model provides a technical solution: an automated semiconductor manufacturing device, including a semiconductor ultrasonic cleaning machine 1 and a cleaning tank 2 opened inside the semiconductor ultrasonic cleaning machine 1. Inside the cleaning tank 2, sliding rods 3 are fixedly connected at equal intervals. Inside the cleaning tank 2, a sliding frame 4 is hermetically and slidably connected. Inside the sliding frame 4, a positioning frame 5 is fixedly connected. On the surface of the positioning frame 5, a first magnet 6 is fixedly connected. A second magnet 7 is adsorbed on the surface of the first magnet 6. On the surface of the second magnet 7, a metal filter screen 8 is fixedly connected. On the surface of the metal filter screen 8, a pull rod 9 is fixedly connected. Inside the sliding frame 4, a fixed cylinder 10 is fixedly connected. At the top and bottom inside the fixed cylinder 10, sealing cylinders 11 are fixedly connected. The outer surface of the sliding rod 3 is inserted into the inside of the sealing cylinder 11, and the outer surface of the sliding rod 3 is hermetically and slidably connected to the inner wall of the sealing cylinder 11. On the outer surface of the fixed cylinder 10, a fixed block 12 is fixedly connected. Inside the fixed block 12, a sealing groove 13 is opened. Inside the sealing groove 13, a sealing plate 14 is hermetically and slidably connected. On the outer surface of the sealing plate 14, a sealing ring is fixedly installed. On the surface of the sealing plate 14, a connecting block 15 is fixedly connected. On the surface of the connecting block 15, an inner rotor motor 16 is fixedly installed. Inside the sliding frame 4, a storage battery and a waterproof control switch electrically connected to the inner rotor motor 16 are fixedly installed. On the outer ring of the inner rotor motor 16, a roller 17 is fixedly connected. The surface of the roller 17 is arc-shaped. The surface of the roller 17 abuts against the outer surface of the sliding rod 3. By arranging a slidable-up-and-down sliding frame 4 inside the cleaning tank 2, when the semiconductor components inside the cleaning tank 2 are cleaned, by starting the inner rotor motor 16, the roller 17 can be driven to rotate, so that the sliding frame 4 drives the metal filter screen 8 to slide upwards, the sundries in the cleaning liquid can be filtered out, and the metal filter screen 8 can be disassembled, replaced or cleaned, so that the cleaning liquid can be recycled multiple times, saving resources, reducing the cost of the cleaning process, and improving the economic benefits of the cleaning;

[0022] Inside the fixed block 12, an adjustment cavity 18 is opened. The top inside the adjustment cavity 18 is communicated with the inside of the sealing groove 13. Inside the adjustment cavity 18, an adjustment block 19 is hermetically and slidably connected. The outer surface of the cleaning tank 2 is threadedly engaged and rotatably connected to the center inside the adjustment block 19. Inside the adjustment block 19, a first bearing 21 is fixedly connected. Inside the first bearing 21, a bolt 20 is fixedly connected. One end of the bolt 20 away from the fixed block 12 extends to the bottom of the sliding frame 4. On the outer surface of the bolt 20, a second bearing 22 is fixedly installed. The outer surface of the second bearing 22 is fixedly installed inside the sliding frame 4. By arranging the sealing groove 13 and the adjustment cavity 18, when the friction between the roller 17 and the sliding rod 3 decreases, by rotating the bolt 20, the pressure inside the sealing groove 13 can be increased, the pressure between the roller 17 and the sliding rod 3 can be increased, the stability of the sliding frame 4 sliding inside the cleaning tank 2 is prolonged, and the service life is prolonged.

[0023] During operation, the material is placed inside the sliding rod 3 for cleaning. After the cleaning is completed and the material is taken out, by starting the inner rotor motor 16, the inner rotor motor 16 drives the roller 17 to rotate. Through the frictional force between the roller 17 and the sliding rod 3, the sliding frame 4 is driven to slide upward, and the debris in the cleaning liquid can be filtered out. When the sealing cylinder 11 is completely disconnected from the sliding rod 3, the entire sliding frame 4 can be taken out. Then, through the pull rod 9, the metal filter screen 8 is taken out, and the metal filter screen 8 can be disassembled, replaced or cleaned, enabling the cleaning liquid to be recycled multiple times, saving resources, reducing the cost of the cleaning process, and improving the economic benefits of cleaning. When the frictional force between the roller 17 and the sliding rod 3 decreases, by rotating the bolt 20, the adjusting block 19 can be driven to slide, increasing the pressure inside the sealing groove 13, enhancing the pressure between the roller 17 and the sliding rod 3, prolonging the stability of the sliding frame 4 sliding inside the cleaning tank 2, and extending the service life.

[0024] Meanwhile, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

Claims

1. An automated semiconductor manufacturing device, comprising a semiconductor ultrasonic cleaning machine (1) and a cleaning tank (2) opened inside the semiconductor ultrasonic cleaning machine (1), characterized in that: Inside the cleaning tank (2), sliding rods (3) are fixedly connected at equal intervals. Inside the cleaning tank (2), a sliding frame (4) is hermetically and slidably connected. Inside the sliding frame (4), a positioning frame (5) is fixedly connected. On the surface of the positioning frame (5), a first magnet (6) is fixedly connected. On the surface of the first magnet (6), a second magnet (7) is adsorbed. On the surface of the second magnet (7), a metal filter screen (8) is fixedly connected. On the surface of the metal filter screen (8), a pull rod (9) is fixedly connected. Inside the sliding frame (4), a fixed cylinder (10) is fixedly connected. At the top and bottom of the inside of the fixed cylinder (10), sealing cylinders (11) are fixedly connected. On the outer surface of the fixed cylinder (10), a fixed block (12) is fixedly connected. Inside the fixed block (12), a sealing groove (13) is formed. Inside the sealing groove (13), a sealing plate (14) is hermetically and slidably connected. On the surface of the sealing plate (14), a connecting block (15) is fixedly connected. On the surface of the connecting block (15), an inner rotor motor (16) is fixedly installed. On the outer ring of the inner rotor motor (16), a roller (17) is fixedly connected. Inside the fixed block (12), an adjustment cavity (18) is formed. Inside the adjustment cavity (18), an adjustment block (19) is hermetically and slidably connected. Inside the adjustment block (19), a first bearing (21) is fixedly connected. Inside the first bearing (21), a bolt (20) is fixedly connected. On the outer surface of the bolt (20), a second bearing (22) is fixedly installed.

2. An automated semiconductor manufacturing apparatus according to claim 1, characterized in that: On the outer surface of the second bearing (22), it is fixedly installed inside the sliding frame (4). One end of the bolt (20) away from the fixed block (12) extends to the bottom of the sliding frame (4).

3. An automated semiconductor manufacturing apparatus according to claim 1, characterized in that: The outer surface of the sliding rod (3) is inserted into the inside of the sealing cylinder (11), and the outer surface of the sliding rod (3) is hermetically and slidably connected to the inner wall of the sealing cylinder (11).

4. An automated semiconductor manufacturing apparatus according to claim 1, characterized in that: On the outer surface of the sealing plate (14), a sealing ring is fixedly installed. The surface of the roller (17) is arc-shaped, and the surface of the roller (17) abuts against the outer surface of the sliding rod (3).

5. An automated semiconductor manufacturing apparatus according to claim 1, characterized in that: The inside of the top of the adjustment cavity (18) is communicated with the inside of the sealing groove (13). The outer surface of the cleaning tank (2) is threadedly engaged and rotatably connected to the center inside the adjustment block (19).

6. An automated semiconductor manufacturing apparatus according to claim 1, wherein: Inside the sliding frame (4), a storage battery and a waterproof control switch electrically connected to the inner rotor motor (16) are fixedly installed.

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