Cooling device for metal material manufacturing

Through the cooling device composed of refrigeration semiconductor and thermally conductive plate, the shortcomings of water cooling and liquid nitrogen cooling methods are solved, and the temperature controllable cooling driven by electric energy is achieved, ensuring rapid solidification of metal liquid and casting quality, which is suitable for metal material manufacturing.

CN223129329UActive Publication Date: 2025-07-22新疆纳杨科技有限公司
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202422403741.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-29
Publication Date
2025-07-22
Estimated Expiration
2034-09-29

AI Technical Summary

Technical Problem

In the prior art, water cooling and liquid nitrogen cooling methods are insufficient in the manufacturing of metal materials. Water cooling can easily lead to sputtering of magnesium alloys, liquid nitrogen cooling speed is uncontrollable and inconvenient to use, and it is difficult to effectively control the mold temperature to ensure rapid solidification and high-quality molding of metal liquid.

Method used

The cooling device consisting of a refrigeration semiconductor and a thermal conductor plate is used to adjust the gas temperature by controlling the number of refrigeration semiconductors, and the gas circulation cooling is achieved using the ‘S’-shaped air duct and air pump. Combined with the heat sink and the insulated shell structure, temperature control and efficient cooling are achieved.

Benefits of technology

It realizes controllable temperature cooling driven by electrical energy, avoids the disadvantages of water cooling and liquid nitrogen, ensures rapid solidification of metal liquid and the mechanical properties of metal castings, which are easy to use and energy-saving and environmentally friendly.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223129329U_ABST
    Figure CN223129329U_ABST
Patent Text Reader

Abstract

The utility model relates to a cooling device for metal material manufacturing. Comprising a shell, an air inlet and an air outlet are formed in the shell, at least two partition plate assemblies are arranged in the shell to divide an inner cavity of the shell into three or more air chambers, and communicating openings are formed between the air chambers to form an S-shaped air channel. Each partition plate assembly comprises a heat insulation shell, a heat conduction plate and a plurality of refrigeration semiconductors, the heat conduction plates are located in the heat insulation shells, the ends of the heat conduction plates penetrate out of the shells, and cooling fins are arranged on the parts, penetrating out of the shells, of the heat conduction plates. The refrigeration semiconductors are installed on the heat insulation shell, the hot ends are tightly attached to the heat conduction plate, and the cold ends are located in the corresponding air chambers. The air outlet is provided with an air outlet pipe used for being communicated with an inlet of a cooling channel in the mold, and an air pump is arranged on the air outlet pipe. The device can work as long as being electrified, the defects caused by water cooling, liquid nitrogen and other modes in the prior art are overcome, the temperature of gas at the gas outlet can be controlled by controlling the working number of the refrigeration semiconductors, and the device is convenient to use.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of cooling equipment, and particularly relates to a cooling device for manufacturing metal materials. Background Art

[0002] When forming liquid metal, a forming die is required. The molten metal liquid is poured into the forming die, and after cooling and forming, the corresponding metal casting can be obtained. The microstructure of the metal material determines its mechanical properties. Therefore, it is necessary to cool the die to accelerate its forming. If the die temperature is high, the forming time of the metal liquid is long, the crystal grains are easy to grow, and the mechanical properties are reduced. Most of the die cooling uses water cooling, but when manufacturing active metals such as magnesium alloys, the presence of water needs to be avoided, and the molten magnesium liquid is easy to splash when encountering water. Using liquid nitrogen for cooling, the temperature is not easy to control, and the cooling speed is too fast, which will cause the metal liquid to form too fast, resulting in internal defects, slag inclusions, and pores. Moreover, liquid nitrogen needs to be frequently purchased and replaced, which is inconvenient to use. China is a country with very abundant electric energy. Therefore, a cooling device that uses electric energy for refrigeration and is easy to control the temperature is needed for the manufacture of metal materials. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a cooling device for manufacturing metal materials to solve the above technical problems existing in the prior art.

[0004] To achieve the above purpose, a cooling device for manufacturing metal materials of the utility model adopts the following technical scheme: A cooling device for manufacturing metal materials includes a housing. An air inlet and an air outlet are provided on the housing. At least two partition components are spaced between the air inlet and the air outlet inside the housing to divide the inner cavity of the housing into more than three air chambers. There are communication ports between the air chambers to form an "S"-shaped air passage; each partition component includes a heat insulation housing, a heat conducting plate, and a plurality of thermoelectric coolers. The heat conducting plate is located inside the heat insulation housing and its end extends out of the housing. Heat dissipation fins are provided on the part of the heat conducting plate extending out of the housing; the thermoelectric coolers are installed on the heat insulation housing, and their hot ends are closely attached to the heat conducting plate, and their cold ends are located in the corresponding air chambers for heat exchange with the flowing gas; an air outlet pipe is provided at the air outlet for communicating with the inlet of the cooling channel on the die, and an air pump is provided on the air outlet pipe.

[0005] The heat insulation housing is of a split structure. The heat insulation housing includes a left housing and a right housing. The above-mentioned thermoelectric coolers are provided on both the left housing and the right housing. The left housing and the right housing are fixed together by gluing or a clamp, so that the hot ends of each thermoelectric cooler are closely attached to the heat conducting plate.

[0006] A support frame is fixed on the thermoelectric cooler, and each side housing tightly attaches the hot end of the thermoelectric cooler to the heat conducting plate through the limit fit with the support frame.

[0007] Mounting grooves are provided on each side housing. After the left and right side housings are butted, the mounting grooves on them form a mounting cavity for installing the heat conduction plate. The cables of each refrigeration semiconductor are located in the mounting cavity and pass through the housing. Heat insulation cotton is provided in the mounting cavity to cover the cables on the inner wall of the heat insulation housing.

[0008] A left wire groove is provided between the left side of the heat conduction plate and the left housing, and a right wire groove is provided between the right side of the heat conduction plate and the right housing.

[0009] An air inlet pipe is provided at the air inlet for communicating with the outlet of the cooling channel on the metal mold to form a recycling of the cooling gas. A three-way valve is provided on the pipeline between the air inlet and the outlet of the cooling channel on the metal mold, which can discharge the gas with a higher temperature after multiple exchanges into the air.

[0010] A fresh air pipe is provided on the air outlet pipe, and a valve is provided on the fresh air pipe.

[0011] The beneficial effects of the present utility model: When the mold needs to be cooled, the refrigeration semiconductor is powered on to work, the cold end starts to refrigerate, the heat at the hot end is transferred through the heat conduction plate and dissipated through the heat sink. The air pump is used to make the air flow. The gas passes through the "S" - shaped air duct with a longer path, ensuring that the gas has sufficient heat exchange time with the refrigeration semiconductor. The present utility model can work as long as it is powered on, solving the disadvantages of the existing technologies such as using water cooling and liquid nitrogen, etc. Moreover, the cooling device of the present utility model can control the temperature of the gas at the air outlet by controlling the number of working refrigeration semiconductors, which is relatively convenient to use and has a good promotion prospect. Brief Description of the Drawings

[0012] Figure 1 is a schematic structural diagram of an embodiment of a cooling device for manufacturing metal materials of the present utility model;

[0013] Figure 2 is Figure 1 a schematic structural diagram of the middle partition component in

[0014] Figure 3 is Figure 2 a partial enlarged view of A in Detailed Embodiments

[0015] For the convenience of understanding the present utility model, the present utility model will be described in more detail below with reference to the drawings and specific embodiments. The preferred embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure content of the present utility model more thorough and comprehensive.

[0016] It should be noted that, unless otherwise defined, the technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model.

[0017] An embodiment of a cooling device for manufacturing a metal material according to the present utility model is as Figures 1 - 3 shown, including a housing 1, an air inlet 3 and an air outlet 4 are provided on the housing, an air outlet pipe 6 is provided at the air outlet, an air pump 7 is provided on the air outlet pipe, an air inlet pipe 5 is provided at the air inlet, a fresh air pipe 8 is provided on the air inlet pipe, and a valve 9 is provided on the fresh air pipe. In this embodiment, there are two cooling methods for this cooling device: one is that the air outlet pipe is used to communicate with the cooling channel on the mold for metal forming, and the cold air cools the mold through the mold, and the gas after heat exchange is directly discharged into the surrounding environment through the cooling channel. At this time, the valve on the fresh air pipe is not enabled and is always in a closed state. The second is that the cooling channel of the mold is communicated with the air inlet pipe to form a recycling of the cooling gas, which can make better use of the cooling gas, but it cannot be recycled continuously. Continuously recycling will cause the temperature of the recycled gas to rise and not drop, resulting in a significant reduction in the cooling effect. Therefore, it is necessary to regularly open the fresh air pipe, and at the same time, a three-way valve is provided on the pipeline connecting the air inlet pipe and the outlet of the cooling channel on the metal mold, which can discharge the gas with a higher temperature after multiple exchanges into the air. These two cooling methods can be selected by customers for use.

[0018] At least two partition assemblies 10 are spaced between the air inlet 3 and the air outlet 4 inside the housing 1 to divide the inner cavity of the housing into more than three air chambers, and there are communication ports between the air chambers to form an "S"-shaped air duct. The partition assembly 10 in this embodiment is as Figure 2 and Figure 3 shown, including a heat-insulating outer shell 11, a heat-conducting plate 12 and a plurality of refrigeration semiconductors 13. The refrigeration semiconductors are prior art, and the specific structure and working principle thereof will not be described in detail in this embodiment. Briefly speaking, the refrigeration semiconductors are refrigerated by electric energy, and they have a hot end and a cold end 16. The heat-conducting plate 12 is located inside the heat-insulating outer shell 11 and its end extends out of the housing, and heat sinks are provided on the part of the heat-conducting plate extending out of the housing. The refrigeration semiconductors are installed on the heat-insulating outer shell and their hot ends are closely attached to the heat-conducting plate, and the cold ends are located in the corresponding air chambers for heat exchange with the flowing gas. The heat-insulating outer shell is of a split structure, and the heat-insulating outer shell includes a left outer shell 17 and a right outer shell 18. The above refrigeration semiconductors are provided on both the left outer shell and the right outer shell, and the left outer shell and the right outer shell are fixed together by gluing or a clamp, so that the hot ends of the refrigeration semiconductors are closely attached to the heat-conducting plate. In this embodiment, the left outer shell and the right outer shell are fixed together by gluing.

[0019] In this embodiment, the number of the partition components 10 is three. The heat conduction plates on the middle partition component penetrate out from the lower end of the housing, and the partition components on both sides penetrate out from the upper end of the housing. The heat sink includes a lower heat sink 15 connected to the heat conduction plate penetrating out from the lower end of the housing, and an upper heat sink 14 connected to the two heat conduction plates penetrating out from the upper end of the housing. Support legs 2 are provided at the lower end of the housing to ensure that there is sufficient clearance between the lower end of the housing and the ground or the working surface, ensuring the heat dissipation space. The upper and lower heat sinks are prior arts, and their specific structures will not be described in detail in this embodiment. Briefly speaking, both the upper and lower heat sinks include copper plates and a plurality of heat dissipation fins provided on the copper plates.

[0020] Specifically, a support frame (not shown in the figure) is fixed on the refrigeration semiconductor. Through holes for the cold ends of the refrigeration semiconductors to penetrate out are provided on each side housing. Each side housing presses the hot end of the refrigeration semiconductor tightly against the heat conduction plate through the limit cooperation with the support frame. Installation grooves are provided on each side housing. After the left and right side housings are butted, the installation grooves on them form an installation cavity for installing the heat conduction plate. The cables 20 of each refrigeration semiconductor are located in the installation cavity and penetrate out of the housing for connection with the controller, which can provide electrical energy and control whether each refrigeration semiconductor works. Heat insulation cotton 21 for covering the cables on the inner wall of the heat insulation housing is provided in the installation cavity to protect the cables. Specifically, a left wire groove 19 is provided between the left side surface of the heat conduction plate and the left side housing, and a right wire groove is provided between the right side surface of the heat conduction plate and the right side housing.

[0021] In this embodiment, the number of the left wire grooves 19 is two, and the number of the right wire grooves is also two. Specifically, the cross section of the heat conduction plate is a rectangle with notches at the four end corners of the rectangle, and the notches are formed by the corresponding wire grooves on this cross section. Further, the heat conduction plate includes a middle body with a rectangular cross section. Protrusions are provided on the front and rear side surfaces of the middle body. The left and right sides of each protrusion are used to form corresponding wire grooves with the heat insulation housing, and the end of the protrusion contacts the heat insulation housing, playing a role of positioning, limiting, and fixing. For the two wire grooves on each side, either one can be selected for use, for example, one of them can be selected, or both can be used.

[0022] During use, when a cooling device is needed to cool the new mold, the number of refrigeration semiconductors that need to work is controlled according to requirements. The cold ends start to refrigerate, and the heat at the hot ends is transferred to the heat conduction plates and dissipated through the heat sinks outside the housing. The air pump is started. During the flow of the gas, it can continuously exchange heat with the cold ends of the refrigeration semiconductors in an "S"-shaped path. Finally, the cooled gas enters the mold through the air outlet pipe for cooling, ensuring the rapid solidification and molding of the liquid metal, obtaining the required metal microstructure, and ensuring the mechanical properties of the metal casting.

[0023] In the above description of this specification, unless otherwise clearly defined and limited, terms such as "fixed", "installed", "connected" or "coupled" should be understood in a broad sense. For example, with respect to the term "connected", it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be the communication inside two components or the interaction relationship between two components. Therefore, unless otherwise clearly limited in this specification, those skilled in the art can understand the specific meanings of the above terms in this utility model according to specific circumstances.

[0024] According to the above description of this specification, those skilled in the art can also understand the terms used as follows. For example, terms indicating orientation or position relationship such as "upper", "lower", "front", "rear", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "center", "longitudinal", "transverse", "clockwise" or "counterclockwise" are based on the orientation or position relationship shown in the drawings of this specification. They are only for the purpose of facilitating the description of the solution of this utility model and simplifying the description, rather than explicitly or implicitly indicating that the device or component involved must have the specific orientation, be constructed and operated in the specific orientation. Therefore, the above terms of orientation or position relationship cannot be understood or interpreted as a limitation to the solution of this utility model.

[0025] In addition, terms such as "first" or "second" used in this specification to refer to numbers or ordinals are only for descriptive purposes and cannot be understood as explicitly or implicitly indicating relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" or "second" can explicitly or implicitly include at least one such feature. In the description of this specification, the meaning of "a plurality" is at least two, such as two, three or more, etc., unless otherwise clearly and specifically defined.

[0026] In other embodiments of this utility model, the left housing and the right housing can also be fixed by means of a clamp; the number of left wire troughs can also be 1; the number of right wire troughs can also be 1; the number of partition assemblies can be selected according to actual needs; the fresh air duct and the valve can also be not provided according to needs; the heat insulation cotton can also be replaced by a heat-resistant wire tube.

Claims

1. A cooling device for manufacturing a metal material, characterized in that: It includes a housing, on which an air inlet and an air outlet are provided. Inside the housing, at least two partition components are spaced between the air inlet and the air outlet to divide the inner cavity of the housing into more than three air chambers, and there are communication ports between the air chambers to form an "S" -shaped air duct; each partition component includes a heat-insulating outer shell, a heat-conducting plate, and a plurality of refrigeration semiconductors. The heat-conducting plate is located inside the heat-insulating outer shell and its end penetrates outside the housing, and heat sinks are provided on the part of the heat-conducting plate that penetrates the housing; the refrigeration semiconductors are installed on the heat-insulating outer shell, and their hot ends are closely attached to the heat-conducting plate, and the cold ends are located in the corresponding air chambers for heat exchange with the flowing gas; an outlet pipe is provided at the air outlet for communicating with the inlet of the cooling channel on the mold, and an air pump is provided on the outlet pipe.

2. The cooling device for manufacturing metal materials according to claim 1, characterized in that: The heat-insulating outer shell is of a split structure. The heat-insulating outer shell includes a left outer shell and a right outer shell. The above-mentioned refrigeration semiconductors are provided on both the left outer shell and the right outer shell. The left outer shell and the right outer shell are fixed together by gluing or a clamp, so that the hot ends of the refrigeration semiconductors are closely attached to the heat-conducting plate.

3. The cooling device for manufacturing metal materials according to claim 2, characterized in that: A support frame is fixed on the refrigeration semiconductor, and each side outer shell presses the hot end of the refrigeration semiconductor against the heat-conducting plate through a limit fit with the support frame.

4. The cooling device for manufacturing a metal material according to claim 2 or 3, characterized in that: Installation grooves are provided on each side outer shell. After the left and right outer shells are butted, the installation grooves on them form an installation cavity for installing the heat-conducting plate. The cables of each refrigeration semiconductor are located in the installation cavity and penetrate the housing, and heat-insulating cotton for covering the cables on the inner wall of the heat-insulating housing is provided in the installation cavity.

5. The cooling device for manufacturing a metallic material according to claim 4, characterized in that: A left wire groove is provided between the left side surface of the heat-conducting plate and the left outer shell, and a right wire groove is provided between the right side surface of the heat-conducting plate and the right outer shell.

6. The cooling device for manufacturing metal materials according to claim 1, characterized in that: An inlet pipe is provided at the air inlet for communicating with the outlet of the cooling channel on the metal mold to form a recycling of the cooling gas. A three-way valve is provided on the pipeline between the air inlet and the outlet of the cooling channel on the metal mold, which can discharge the gas with a higher temperature after multiple exchanges into the air.

7. The cooling device for manufacturing metal materials according to claim 6, wherein: A fresh air pipe is provided on the outlet pipe, and a valve is provided on the fresh air pipe.

Citation Information

Cited By

  • Cooling device for semiconductor manufacturing

    CN121230499A