Cutting forming die for semiconductor lead frame

Through the combination of cutting components and fixed-centered components, the problems of slow cutting speed and inaccurate fixed-centered centering are solved, and the efficient, precise neutralization and cutting of the lead frame is achieved, and the product quality is improved.

CN223129467UActive Publication Date: 2025-07-22WUXI YAOYU PRECISION MOLD CO LTD
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Patent Information

Application Number
CN202422233991.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-11
Publication Date
2025-07-22
Estimated Expiration
2034-09-11

AI Technical Summary

Technical Problem

The existing cutting device has a slow cutting speed and lacks effective centering function, which leads to the easy deviation of the lead frame during the cutting process, affecting the cutting effect and quality.

Method used

The cutting assembly and centering assembly are adopted. The cutting assembly achieves efficient cutting through the eccentric cam drives the sliding frame. The centering assembly achieves accurate centering of the lead frame through a bidirectional threaded rod and slide rod system, combining limit blocks and soft pad protection to ensure the stability of the cutting process.

Benefits of technology

It realizes efficient, precise neutralization and cutting of the lead frame, avoids crooked cutting, and improves product quality and cutting efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a cutting forming die for a semiconductor lead frame, which comprises a workbench, a cutting assembly is fixedly arranged on the top of the workbench, the cutting assembly comprises a first fixing frame and a first motor, the first fixing frame is fixedly arranged on the top of the workbench, the first motor is fixedly arranged on one side of the first fixing frame, and the first motor is fixedly arranged on the other side of the first fixing frame. The output end of the first motor is fixedly connected with a speed reducer, the output end of the speed reducer is fixedly connected with a rotating shaft, the side wall of the rotating shaft is fixedly connected with an eccentric cam, and one side of the first fixing frame is provided with a sliding groove. According to the cutting-off forming die for the semiconductor lead frame, the lead frame can be cut through the cutting assembly, continuous and efficient cutting can be achieved, cutting is simple and convenient, the situation that complete cutting-off cannot be achieved through single-time cutting is avoided, the cutting-off effect is better, the product quality of the lead frame is improved accordingly, and the production efficiency is improved. And the use effect is better.
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Description

Technical Field

[0001] The utility model relates to the technical field of lead frame processing, in particular to a cutting and forming die for a semiconductor lead frame. Background Technique

[0002] The cutting of semiconductor lead frames is an important process in the semiconductor packaging process, usually carried out in the process of cutting and forming the lead frame. Its purpose is to cut and separate the outer pins of the originally connected lead frame and bend them into the designed shape, but it cannot damage the epoxy resin sealing state and avoid pin distortion.

[0003] The "cutting and forming die for a semiconductor lead frame" disclosed in the patent publication number "CN212703909U" includes a processing table and a cutting and forming die. The cutting and forming die is located above the processing table. The upper surface of the processing table is fixedly connected with a first conveyor belt, a second conveyor belt and a cutting table, and the cutting table is located between the first conveyor belt and the second conveyor belt. The cutting and forming die includes fixed guide posts, an upper cutting frame, a fixing plate and a cutting tool holder. The cutting and forming die is connected to the processing table through the fixed guide posts. The upper cutting frame is located above the fixed guide posts. The utility model relates to the technical field of forming dies. This cutting and forming die for a semiconductor lead frame can automatically load and unload materials, improve the cutting and forming efficiency of the semiconductor lead frame. At the same time, it can fix both ends of the semiconductor lead frame during the cutting process to prevent the semiconductor lead frame from deforming during cutting and improve the cutting quality of the semiconductor lead frame.

[0004] In view of the above-related problems, the cutting speed of the existing cutting device is slow, which will affect the cutting effect during the actual cutting process. Moreover, it does not have a good centering function, and the lead frame is prone to deviation, which will affect its cutting effect.

[0005] Therefore, the utility model provides a cutting and forming die for a semiconductor lead frame to solve the above problems. Summary of the Utility Model

[0006] In view of the deficiencies of the prior art, the utility model provides a cutting and forming die for a semiconductor lead frame, which solves the problems that the cutting speed of the existing cutting device is slow and it will affect the cutting effect during the actual cutting process.

[0007] To achieve the above object, the utility model is realized by the following technical solutions: A cutting and forming die for a semiconductor lead frame, including a workbench, a cutting component is fixedly installed on the top of the workbench. The cutting component includes a first fixed frame and a first motor. The first fixed frame is fixedly installed on the top of the workbench, and the first motor is fixedly installed on one side of the first fixed frame. The output end of the first motor is fixedly connected with a reducer, the output end of the reducer is fixedly connected with a rotating shaft, an eccentric cam is fixedly connected to the side wall of the rotating shaft, a chute is opened on one side of the first fixed frame, a sliding frame is slidably connected to one side of the chute, a blade is arranged on the inner side wall of the sliding frame, a U-shaped frame is fixedly installed on the top of the sliding frame, and the eccentric cam is hinged with the U-shaped frame.

[0008] Further, a centering component is fixedly installed on the top of the workbench. The centering component includes a second fixed frame and a sliding rod. The second fixed frame is fixedly installed on the top of the workbench, the sliding rod is slidably connected to one side of the second fixed frame, one end of the sliding rod is fixedly connected with a centering plate, a connecting frame is installed on the top of the centering plate, an installation frame is fixedly installed at the bottom of the workbench, a bidirectional threaded rod is connected to the inner side wall of the installation frame through a bearing, the connecting frame is threadedly connected with the bidirectional threaded rod, a first pulley is fixedly connected to the side wall of the bidirectional threaded rod, and a power component is arranged on one side of the installation frame.

[0009] By adopting the above technical solution, the lead frame can be centered, and the centering is convenient.

[0010] Further, the power component includes a second motor and a second pulley. The second motor is fixedly installed on one side of the installation frame, the second pulley is fixedly connected with the output end of the second motor, and the second pulley and the first pulley are tensioned and connected through a transmission belt.

[0011] By adopting the above technical solution, power can be provided to facilitate the centering work.

[0012] Further, the centering component further includes a limit block, and the limit block is fixedly connected to one end of the sliding rod.

[0013] By adopting the above technical solution, a good limiting effect can be achieved.

[0014] Further, the centering component further includes a soft pad, and the soft pad is arranged on one side of the centering plate.

[0015] By adopting the above technical solution, the lead frame can be prevented from being damaged.

[0016] Further, reinforcing rods are respectively fixedly installed on both sides of the workbench, and the two reinforcing rods are arranged opposite to each other.

[0017] Adopting the above technical solution can enhance the effect and make the workbench more reliable in use.

[0018] Furthermore, a cutting groove is formed at the top of the workbench, and the cutting groove is located below the blade.

[0019] Adopting the above technical solution makes it easier to cut the lead frame.

[0020] Beneficial effects

[0021] The utility model provides a cutting and forming die for semiconductor lead frames. Compared with the prior art, it has the following beneficial effects:

[0022] 1. The cutting and forming die for semiconductor lead frames can perform the cutting work on the lead frame through the cutting component, and can continuously cut efficiently. The cutting is simple and convenient, so as to prevent incomplete cutting in a single cut, making the cutting effect better, and the product quality of the lead frame will also increase accordingly, making the use effect better.

[0023] 2. The cutting and forming die for semiconductor lead frames can perform the centering work on the lead frame through the centering component, making it keep straight, and also making the cutting effect better. Moreover, the cutting process will not be skewed, ensuring the product quality and making the use effect better. Description of the drawings

[0024] In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 is the overall structural schematic diagram of the present utility model;

[0026] Figure 2 is the present utility model Figure 1 the enlarged view of the structure at A in;

[0027] Figure 3 is the side view of the overall structure of the present utility model;

[0028] Figure 4 is the present utility model Figure 3 the enlarged view of the structure at B in.

[0029] In the figure: 1, workbench; 2, cutting component; 21, first fixing frame; 22, first motor; 23, reducer; 24, rotating shaft; 25, eccentric cam; 26, sliding groove; 27, sliding frame; 28, blade; 29, U-shaped frame; 3, cutting groove; 4, centering component; 41, second fixing frame; 42, sliding rod; 43, centering plate; 44, connecting frame; 45, mounting frame; 46, bidirectional threaded rod; 47, first pulley; 48, limiting block; 49, soft pad; 5, power component; 51, second motor; 52, second pulley. Detailed implementation mode

[0030] It should be noted that in the description of the embodiments of the present application, the orientation or positional relationship indicated by terms such as "front, back", "left, right", "up, down", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. The terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] The present application will be further elaborated in detail below through the drawings and embodiments.

[0032] Referring to Figures 1 to 4 , the embodiment of the present application provides a cutting and forming die for a semiconductor lead frame, including a workbench 1. Strengthening rods are respectively and fixedly installed on both sides of the workbench 1, and the two strengthening rods are arranged opposite to each other. A cutting component 2 is fixedly installed on the top of the workbench 1. The cutting component 2 includes a first fixing frame 21 and a first motor 22. The first fixing frame 21 is fixedly installed on the top of the workbench 1, the first motor 22 is fixedly installed on one side of the first fixing frame 21, the output end of the first motor 22 is fixedly connected to a reducer 23, the output end of the reducer 23 is fixedly connected to a rotating shaft 24, an eccentric cam 25 is fixedly connected to the side wall of the rotating shaft 24, a sliding groove 26 is opened on one side of the first fixing frame 21, a sliding frame 27 is slidably connected to one side of the sliding groove 26, a blade 28 is arranged on the inner side wall of the sliding frame 27, a U-shaped frame 29 is fixedly installed on the top of the sliding frame 27, the eccentric cam 25 is hinged to the U-shaped frame 29, and a cutting groove 3 is opened on the top of the workbench 1. The cutting groove 3 is located below the blade 28.

[0033] In this embodiment, the first motor 22 is then started and can be decelerated by the speed reducer 23. Then, the speed reducer 23 drives the rotating shaft 24 to move, so that the rotating shaft 24 can drive the sliding frame 27 to slide inside the sliding groove 26 through the eccentric cam 25 to cut the lead frame. It is simple and efficient to use, thus improving work efficiency.

[0034] Referring to Figures 1 to 4 , in one aspect of this embodiment, a centering component 4 is fixedly installed on the top of the workbench 1. The centering component 4 includes a second fixing frame 41 and a sliding rod 42. The second fixing frame 41 is fixedly installed on the top of the workbench 1. The sliding rod 42 is slidably connected to one side of the second fixing frame 41. One end of the sliding rod 42 is fixedly connected to a centering plate 43. A connecting frame 44 is installed on the top of the centering plate 43. An installation frame 45 is fixedly installed at the bottom of the workbench 1. The inner side wall of the installation frame 45 is connected to a bidirectional threaded rod 46 through a bearing. The connecting frame 44 is threadedly connected to the bidirectional threaded rod 46. A first pulley 47 is fixedly connected to the side wall of the bidirectional threaded rod 46. A power component 5 is arranged on one side of the installation frame 45. The power component 5 includes a second motor 51 and a second pulley 52. The second motor 51 is fixedly installed on one side of the installation frame 45. The second pulley 52 is fixedly connected to the output end of the second motor 51. The second pulley 52 and the first pulley 47 are tensioned and connected by a transmission belt.

[0035] In this embodiment, first, the lead frame is placed on the top of the workbench 1. Then, when the second motor 51 is started, the second pulley 52 can drive the first pulley 47 to rotate by means of a belt, so that the bidirectional threaded rod 46 can drive the connecting frame 44 to move, and also enable the centering plate 43 to slide on one side of the second fixing frame 41 through the sliding rod 42. Thus, the centering plate 43 can center the lead frame, and the centering is simple and convenient.

[0036] Referring to Figures 1 to 4 , in one aspect of this embodiment, the centering component 4 further includes a limit block 48, and the limit block 48 is fixedly connected to one end of the sliding rod 42.

[0037] In this embodiment, it can achieve a good limiting effect.

[0038] Referring to Figures 1 to 4 , in one aspect of this embodiment, the centering component 4 further includes a soft pad 49, and the soft pad 49 is arranged on one side of the centering plate 43.

[0039] In this embodiment, it can make the centering effect better and will not damage the lead frame.

[0040] Working principle: First, place the lead frame on the top of the workbench 1, and then start the second motor 51. The second motor 51 can drive the first pulley 47 to rotate through the second pulley 52 and the belt, so that the bidirectional threaded rod 46 can drive the connecting frame 44 to move, and also enable the centering plate 43 to slide on one side of the second fixing frame 41 through the slide rod 42, thereby allowing the centering plate 43 to perform centering work on the lead frame.

[0041] Then start the first motor 22. The first motor 22 can be decelerated through the speed reducer 23, and then the speed reducer 23 drives the rotating shaft 24 to move, so that the rotating shaft 24 can drive the sliding frame 27 to slide inside the chute 26 through the eccentric cam 25.

[0042] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0043] Although the embodiments of the present application have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A cutting and forming die for a semiconductor lead frame, comprising a workbench (1), characterized in that: A cutting component (2) is fixedly installed on the top of the workbench (1). The cutting component (2) includes a first fixing frame (21) and a first motor (22). The first fixing frame (21) is fixedly installed on the top of the workbench (1), and the first motor (22) is fixedly installed on one side of the first fixing frame (21). The output end of the first motor (22) is fixedly connected to a speed reducer (23), the output end of the speed reducer (23) is fixedly connected to a rotating shaft (24), an eccentric cam (25) is fixedly connected to the side wall of the rotating shaft (24), a chute (26) is opened on one side of the first fixing frame (21), a sliding frame (27) is slidably connected to one side of the chute (26), a blade (28) is arranged on the inner side wall of the sliding frame (27), a U-shaped frame (29) is fixedly installed on the top of the sliding frame (27), and the eccentric cam (25) is hinged to the U-shaped frame (29).

2. The cutting and forming die for a semiconductor lead frame according to claim 1, characterized in that: A centering component (4) is fixedly installed on the top of the workbench (1). The centering component (4) includes a second fixing frame (41) and a sliding rod (42). The second fixing frame (41) is fixedly installed on the top of the workbench (1), the sliding rod (42) is slidably connected to one side of the second fixing frame (41), one end of the sliding rod (42) is fixedly connected to a centering plate (43), a connecting frame (44) is installed on the top of the centering plate (43), an installation frame (45) is fixedly installed at the bottom of the workbench (1), a bidirectional threaded rod (46) is connected to the inner side wall of the installation frame (45) through a bearing, the connecting frame (44) is threadedly connected to the bidirectional threaded rod (46), a first pulley (47) is fixedly connected to the side wall of the bidirectional threaded rod (46), and a power component (5) is arranged on one side of the installation frame (45).

3. The cutting and forming die for a semiconductor lead frame according to claim 2, wherein: The power component (5) includes a second motor (51) and a second pulley (52). The second motor (51) is fixedly installed on one side of the installation frame (45), the second pulley (52) is fixedly connected to the output end of the second motor (51), and the second pulley (52) is tensioned and connected to the first pulley (47) through a transmission belt.

4. A cutting and forming die for a semiconductor lead frame according to claim 2, characterized in that: The centering component (4) further includes a limiting block (48), and the limiting block (48) is fixedly connected to one end of the sliding rod (42).

5. A cutting and forming die for a semiconductor lead frame according to claim 2, characterized in that: The centering component (4) further includes a soft pad (49), and the soft pad (49) is arranged on one side of the centering plate (43).

6. The cutting and forming die for a semiconductor lead frame according to claim 1, wherein: Reinforcing rods are fixedly installed on both sides of the workbench (1) respectively, and the two reinforcing rods are arranged oppositely.

7. A cutting and forming die for a semiconductor lead frame according to claim 1, characterized in that: A cutting groove (3) is opened on the top of the workbench (1), and the cutting groove (3) is located below the blade (28).

Citation Information

Patent Citations

  • Cutting and forming die for semiconductor lead frame

    CN212703909U