Automatic wafer separator for thick film circuit substrate

Abstract

The utility model discloses a thick film circuit substrate automatic wafer separator which comprises a machine frame, a discharging frame is arranged on the outer wall of one side of the top of the machine frame, a first sliding rail is installed on one side of the inner wall of the discharging frame through bolts, a first sliding block is connected to the outer portion of the first sliding rail in a sliding mode, and a feeding tension spring piece is arranged on the outer wall of one side of the top of the first sliding block. The other end of the feeding tension spring piece is fixed into the discharging frame, an air cylinder installation base is installed on one side of the inner wall of the discharging frame through bolts, a feeding air cylinder is installed on the outer wall of one side of the air cylinder installation base through bolts, and a piece pushing plate is installed at the output end of the feeding air cylinder through bolts. According to the utility model, the continuous feeding of the substrates can be realized, the substrates enter the blanking frame, the substrates are broken by smashing in the process, the types of the substrates are changed from 10 to 2 + 8, then the two sections of substrates can be fragmented through the cooperation of the Z-direction cutting structure, the Y-direction cutting structure and other cutting structures, the substrates can be fragmented continuously in the process, manual assistance is not needed during feeding, the production efficiency is improved, and the production cost is reduced. And the wafer separating efficiency of the wafer separator can be greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thick film circuit substrate processing, and particularly relates to an automatic slicing machine for thick film circuit substrates. Background Art

[0002] The development of electronic technology requires higher and higher integration of components, and the performance such as reliability and environmental resistance is also correspondingly improved. The rise and development of thick film circuits are the products of such technological development. Thick film circuit substrates are made by sintering high-purity alumina and then slicing and grinding.

[0003] For example, an automatic slicing machine with the application number CN201822111365.8 and the publication date February 14, 2020. The automatic slicing machine of the utility model includes a processing column and a collection column. The processing column is used to place the materials to be sliced. An electric cylinder for pushing the materials upward one by one is arranged below the processing column. The automatic slicing machine also includes a first guide rail, a slicing component and a clamping component. The slicing component slides between the processing column and the collection column along the first guide rail. When slicing, the slicing component grabs the uppermost material, and the clamping component clamps the lower materials, so that the slicing component slices the uppermost material and sends it to the collection column. The automatic slicing machine of the utility model realizes the automatic slicing of hard disk substrates, saves labor costs and increases production efficiency.

[0004] The existing thick film circuit substrates are made of ceramic materials. There are 10 individual substrates on the substrate before slicing, and subsequent separate small pieces are required. When the traditional slicing machine slices, it can only slice a part of the substrate, resulting in a low slicing effect of the slicing machine. Therefore, it is urgent to design an automatic slicing machine for thick film circuit substrates to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to provide an automatic slicing machine for thick film circuit substrates to solve the above deficiencies in the prior art.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An automatic slicing machine for thick film circuit substrates, comprising a frame. On one side of the top outer wall of the frame, there is a blanking rack. On one side of the inner wall of the blanking rack, a first slide rail is installed by bolts, and a first slider is slidably connected to the outside of the first slide rail. On one side of the top outer wall of the first slider, there is a feeding spring piece, and the other end of the feeding spring piece is fixed inside the blanking rack. On one side of the inner wall of the blanking rack, a cylinder mounting seat is installed by bolts, and a feeding cylinder is installed by bolts on one side of the outer wall of the cylinder mounting seat. The output end of the feeding cylinder is installed with a pushing plate by bolts. On one side of the bottom inner wall of the frame, there is a slicing support plate. The bottom end of the blanking rack is provided with a blanking rack bottom plate, and the blanking rack bottom plate is stuck on the top of the slicing support plate. Inside the blanking rack, there are a front middle baffle and a front baffle respectively, and the front middle baffle is stuck on the front baffle. On one side of the top outer wall of the frame, a wheel blocking piece is installed by bolts, and one side of the wheel blocking piece extends into the blanking rack. On one side of the top outer wall of the blanking rack bottom plate, a rear baffle is installed by bolts, and a U-shaped blocking strip is installed by bolts on one side of the outer wall of the rear baffle. On both outer walls of the blanking rack, there are blanking rack fixing seats. Inside the blanking rack, there is a front upper baffle. On one side of the bottom inner wall of the frame, a second slide rail is installed by bolts, and a second slider is slidably connected to the outside of the second slide rail. On the bottom inner wall of the frame, there is a sheet moving cylinder, and an inclined plate is provided at the output end of the sheet moving cylinder. There is a sheet moving buffer on one side of the inclined plate. The inclined plate is installed on the second slider by bolts. On one side of the bottom inner wall of the frame, there is a second sheet moving spring, and the other end of the second sheet moving spring is fixed on the inclined plate. On one side of the bottom inner wall of the frame, there is a sheet moving buffer, and the sheet moving buffer is in contact with the inclined plate.

[0008] Further, on one side of the top inner wall of the frame, a Z-direction guiding piece is installed by bolts, and a Z-direction slicing cylinder is provided on one side of the outer wall of the Z-direction guiding piece. The output end of the Z-direction slicing cylinder is installed with a Z-direction punch mounting plate by bolts.

[0009] Further, a Z-direction slicing spring is provided on one side of the outer wall of the Z-direction punch mounting plate, and the other end of the Z-direction slicing spring is arranged on one side of the inner wall of the frame. A Z-direction slicing punch is installed by bolts on one side of the outer wall of the Z-direction punch mounting plate.

[0010] Further, a sheet moving plate is slidably connected to one side of the outer wall of the slicing support plate, and a sheet moving photoelectric sensing baffle is installed by bolts on one side of the outer wall of the sheet moving plate. A sheet moving guiding wheel is provided on one side of the outer wall of the second slider, and the sheet moving guiding wheel is in contact with the inclined plate. A first sheet moving spring is provided on one side of the outer wall of the sheet moving plate, and the other end of the first sheet moving spring is installed by bolts on one side of the bottom inner wall of the frame.

[0011] Further, a spring rotating base is provided on one side of the outer wall of the slicing support plate, and a rotating shaft is provided inside the spring rotating base. A front rotating plate is provided outside the rotating shaft, and a rear rotating plate is provided on one side of the outer wall of the front rotating plate. A base spring installed on the spring rotating base is provided on one side of the rear rotating plate.

[0012] Further, on one side of the bottom of the inner wall of the frame, a third slide rail is provided, and a third slider is slidably connected to the outside of the third slide rail. On one side of the third slider, a Y-directional sheet-dividing blanking cylinder is installed by bolts, and the output end of the Y-directional sheet-dividing blanking cylinder is installed with a sheet-dividing blanking moving block by bolts.

[0013] Further, on one side of the top outer wall of the sheet-dividing blanking moving block, a thimble mounting block is installed by bolts, and a thimble is provided on one side outer wall of the thimble mounting block. A blanking platform is provided on the top of the sheet-dividing support plate. An optoelectronic blanking member is provided on one side of the sheet-dividing blanking moving block. A tension spring is provided on one side of the bottom of the sheet-dividing blanking moving block, and one end of the tension spring is fixed to the frame by bolts. A sheet-taking insertion plate is provided on one side outer wall of the frame. An anti-tipping sheet pressing block is provided on one side outer wall of the top of the frame. A button module is installed on one side outer wall of the frame by bolts.

[0014] In the above technical solution, for an automatic sheet-dividing machine for thick film circuit substrates provided by the present utility model, the beneficial effects are as follows:

[0015] (1) For the sheet-dividing machine designed by the present utility model, continuous feeding of substrates can be realized during sheet division, enabling the substrates to enter the blanking frame. During this process, the substrates will be broken, changing the substrates from 10 pieces to a 2 + 8 pattern. Subsequently, through the cooperation of cutting structures in the Z-direction, Y-direction, etc., the two sections of substrates can be sheet-divided. This process can continuously sheet-divide the substrates, and manual assistance is not required during feeding, which can greatly improve the sheet-dividing efficiency of the sheet-dividing machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure provided for an embodiment of an automatic sheet-dividing machine for thick film circuit substrates of the present utility model.

[0018] Figure 2 It is a schematic diagram of the back structure of the frame provided for an embodiment of an automatic sheet-dividing machine for thick film circuit substrates of the present utility model.

[0019] Figure 3 It is a schematic diagram of the internal structure of the frame provided for an embodiment of an automatic sheet-dividing machine for thick film circuit substrates of the present utility model.

[0020] Figure 4 It is a schematic diagram of the side view structure of the frame and the sheet-transferring cylinder provided for an embodiment of an automatic sheet-dividing machine for thick film circuit substrates of the present utility model.

[0021] Figure 5 Schematic diagram of the frame and Z-direction slicing punch structure provided for an embodiment of an automatic slicing machine for thick film circuit substrates of the present utility model.

[0022] Figure 6 Schematic diagram of the frame and blanking platform structure provided for an embodiment of an automatic slicing machine for thick film circuit substrates of the present utility model.

[0023] Explanation of reference numerals:

[0024] 1. Frame; 2. Chip-taking insertion board; 3. Anti-side-falling chip pressing block; 4. Button module; 5. Blanking rack; 6. First slide rail; 7. First slider; 8. Feeding tension spring member; 9. Feeding cylinder; 10. Cylinder mounting seat; 11. Pushing plate; 12. Slicing support plate; 13. Blanking rack bottom plate; 14. Front baffle; 15. U-shaped retaining strip; 16. Rear baffle; 17. Retaining wheel member; 18. Front and middle baffle; 19. Z-direction slicing cylinder; 20. Z-direction slicing spring; 21. Z-direction guiding member; 22. Z-direction punch mounting plate; 23. Z-direction slicing punch; 24. First moving chip spring; 25. Second slide rail; 26. Second slider; 27. Moving chip guiding wheel; 28. Moving chip photoelectric sensing baffle; 29. Moving chip plate; 30. Moving chip cylinder; 31. Second moving chip spring; 32. Third slide rail; 33. Third slider; 34. Y-direction slicing and blanking cylinder; 35. Slicing and blanking moving block; 36. Thimble mounting block; 37. Thimble; 38. Rotating shaft; 39. Front rotating plate; 40. Tension spring; 41. Spring rotating base; 42. Rear rotating plate; 43. Photoelectric blanking member; 44. Blanking platform; 45. Inclined plate; 46. Moving chip buffer; 47. Blanking rack fixing seat; 48. Front upper baffle. Detailed implementation manners

[0025] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0026] As Figures 1-6As shown in the figure, an automatic slicing machine for a thick film circuit substrate provided by an embodiment of the present utility model includes a frame 1. On one side of the outer wall of the top of the frame 1, there is a blanking frame 5. On one side of the inner wall of the blanking frame 5, a first slide rail 6 is installed by bolts. A first slider 7 is slidably connected to the outside of the first slide rail 6. On one side of the outer wall of the top of the first slider 7, there is a feeding spring piece 8, and the other end of the feeding spring piece 8 is fixed inside the blanking frame 5. On one side of the inner wall of the blanking frame 5, a cylinder mounting seat 10 is installed by bolts. On one side of the outer wall of the cylinder mounting seat 10, a feeding cylinder 9 is installed by bolts. The output end of the feeding cylinder 9 is installed with a pushing plate 11 by bolts. On one side of the bottom of the inner wall of the frame 1, there is a slicing support plate 12. The bottom of the blanking frame 5 is provided with a blanking frame bottom plate 13, and the blanking frame bottom plate 13 is stuck on the top of the slicing support plate 12. Inside the blanking frame 5, there are respectively a front middle baffle 18 and a front baffle 14, and the front middle baffle 18 is stuck on the front baffle 14. On one side of the outer wall of the top of the frame 1, a wheel blocking piece 17 is installed by bolts, and one side of the wheel blocking piece 17 extends into the blanking frame 5. On one side of the outer wall of the top of the blanking frame bottom plate 13, a rear baffle 16 is installed by bolts, and on one side of the outer wall of the rear baffle 16, a U-shaped blocking strip 15 is installed by bolts. On both sides of the outer wall of the blanking frame 5, there are blanking frame fixing seats 47. Inside the blanking frame 5, there is a front upper baffle 48. On one side of the bottom of the inner wall of the frame 1, a second slide rail 25 is installed by bolts. A second slider 26 is slidably connected to the outside of the second slide rail 25. On the bottom of the inner wall of the frame 1, there is a sheet moving cylinder 30, and the output end of the sheet moving cylinder 30 is provided with an inclined plate 45. On one side of the inclined plate 45, there is a sheet moving buffer 46. The inclined plate 45 is installed on the second slider 26 by bolts. On one side of the bottom of the inner wall of the frame 1, there is a second sheet moving spring 31, and the other end of the second sheet moving spring 31 is fixed on the inclined plate 45. On one side of the bottom of the inner wall of the frame 1, there is a sheet moving buffer 46, and the sheet moving buffer 46 is in contact with the inclined plate 45.

[0027] Specifically, in this embodiment, it includes a frame 1 which is composed of a left side plate, an insertion plate platform, a sheet dropping step, a right side plate, and an HMI. On one side of the outer wall at the top of the frame 1, there is a blanking frame 5. The blanking platform 44 is laterally installed on the insertion plate platform of the frame 1, and there is a gap between the blanking platform 44 and the insertion plate platform of the frame 1. The sheet-taking insertion plate 2 is inserted into it along the gap; the insertion plate platform is fixed to the sheet splitting support plate 12 and the left side plate of the frame 1 by bolts; there is a step between the blanking platform and the sheet-taking insertion plate 2 as the blanking platform. When the split blanking moving block 35 pushes the split substrate to be blanked out of the blanking platform 44, the substrate falls onto the sheet-taking insertion plate 2 by gravity and detaches from the split blanking moving block 35. To prevent the substrate falling onto the sheet-taking insertion plate 2 from tipping forward, a movable anti-tipping sheet pressing block 3 is placed near the substrate on the sheet-taking insertion plate 2, and during the sheet dropping process, it moves synchronously with the split blanking moving block 35 and the substrate; on one side of the inner wall of the blanking frame 5, a slide rail 6 is installed by bolts, and a slide block 7 is slidably connected to the outside of the slide rail 6. On one side of the outer wall at the top of the slide block 7, there is a feeding spring piece 8, and the other end of the feeding spring piece 8 is fixed inside the blanking frame 5. On one side of the inner wall of the blanking frame 5, a cylinder mounting seat 10 is installed by bolts, and on one side of the outer wall of the cylinder mounting seat 10, a feeding cylinder 9 is installed by bolts. The output end of the feeding cylinder 9 is installed with a pushing plate 11 by bolts. The bottom plate 13 of the blanking frame is fixed to the left side plate of the frame 1 and the blanking frame 5 of the frame 1 with screws. The slide rail 6 is installed on the bottom plate 13 of the blanking frame, and the slide block 7 is installed on the slide rail 6. The slide block 7 is installed with an L-shaped pushing plate 11. One end of the feeding spring piece 8 is fixed to the rear side of the pushing plate 11, and the other end is fixed to the bottom plate 13 of the blanking frame with screws; the side plate of the feeding frame is installed on the bottom plate 13 of the blanking frame, the cylinder mounting seat 10 is fixed to the side plate of the feeding frame, the feeding cylinder 9 is installed on the cylinder mounting seat 10, the substrate sliding seat is installed on the bottom plate 13 of the blanking frame, and the substrates to be split and joined are neatly arranged on the substrate sliding seat. On one side at the bottom of the inner wall of the frame 1, there is a sheet splitting support plate 12. At the bottom end of the blanking frame 5, there is a bottom plate 13 of the blanking frame, and the bottom plate 13 of the blanking frame is stuck on the top of the sheet splitting support plate 12. Inside the blanking frame 5, there are a front middle baffle 18 and a front baffle 14 respectively, and the front middle baffle 18 is stuck on the front baffle 14. On one side of the outer wall at the top of the frame 1, a retaining wheel part 17 is installed by bolts, and one side of the retaining wheel part 17 extends into the blanking frame 5. On one side of the outer wall at the top of the bottom plate 13 of the blanking frame, a rear baffle 16 is installed by bolts, and on one side of the outer wall of the rear baffle 16, a U-shaped retaining strip 15 is installed by bolts. There are blanking frame fixing seats 47 on both outer walls of the blanking frame 5. Inside the blanking frame 5, there is a front upper baffle 48. The falling substrate finally falls onto the U-shaped retaining strip 15. During this process, the gaps between the front baffle 14, the front middle baffle 18, the rear baffle 16 and the blanking frame 5 can just accommodate one sheet thickness of the substrate, and the retaining wheel part 17 can adjust the falling speed of the substrate;When the Z-direction slicing cylinder 19 extends, it pushes the Z-direction punch mounting plate 22 and the Z-direction slicing punch 23 to move, thereby breaking the multi-connected substrate that has fallen on the U-shaped stop bar 15 in the Z direction. Immediately, the horizontally double-connected substrate that has been broken off freely falls onto the bottom plate of the blanking rack 5. When the Z-direction slicing cylinder 19 contracts subsequently, the Z-direction slicing tension spring 20 pulls the punch back. At the same time, the upper connected substrate plate falls onto the U-shaped stop bar 15 again; on one side of the bottom of the inner wall of the frame 1, a second slide rail 25 is installed by bolts, and a second slider 26 is slidably connected to the outside of the second slide rail 25. A sheet moving cylinder 30 is provided at the bottom of the inner wall of the frame 1, and a diagonal plate 45 is provided at the output end of the sheet moving cylinder 30. A sheet moving buffer 46 is provided on one side of the diagonal plate 45. The diagonal plate 45 is installed on the second slider 26 by bolts. A second sheet moving spring 31 is provided on one side of the bottom of the inner wall of the frame 1, and the other end of the second sheet moving spring 31 is fixed to the diagonal plate 45. A sheet moving buffer 46 is provided on one side of the bottom of the inner wall of the frame 1, and the sheet moving buffer 46 is in contact with the diagonal plate 45; when the sheet moving cylinder 30 extends, it pushes the diagonal plate 45 and the second slider 26 to move forward along the second slide rail 25. At the same time, under the action of the hypotenuse of the diagonal plate 45, the second sheet moving tension spring 31, and the sheet moving guide wheel 27, the sheet moving plate 29 is pulled to the left by the second sheet moving tension spring 31, and the horizontally double-connected substrate that has been broken off in the Z direction and has fallen is also pushed to the left by the sheet moving plate. The sheet moving buffer 46 is used to buffer the sheet moving process to prevent the substrate from being displaced excessively due to too fast sheet moving; when the sheet moving cylinder 30 contracts, due to the pulling force of the first sheet moving tension spring 24, the diagonal plate 45 returns backward along the second slide rail 25. Under the action of the hypotenuse of the diagonal plate 45 and the sheet moving guide wheel 27, the sheet moving plate 29 is moved back to the right, that is, a sheet moving process is completed.

[0028] An automatic slicing machine for thick film circuit substrates provided by the present utility model can realize continuous feeding of substrates during slicing, enabling the substrates to enter the blanking rack 5. During this process, the substrates will be broken, changing the substrates from 10 pieces to a 2 + 8 pattern. Subsequently, through the cooperation of structures such as the Z direction and the Y direction, the two sections of substrates can be sliced. This process can continuously slice the substrates, and no manual assistance is required during feeding, which can greatly improve the slicing efficiency of the slicing machine.

[0029] In an embodiment provided by the present utility model, as Figures 4-5As shown in the figure, on one side of the top of the inner wall of the frame 1, a Z-direction guiding member 21 is installed by bolts. On the outer wall of one side of the Z-direction guiding member 21, a Z-direction slicing cylinder 19 is provided. The output end of the Z-direction slicing cylinder 19 is installed with a Z-direction punch mounting plate 22 by bolts. On the outer wall of one side of the Z-direction punch mounting plate 22, a Z-direction slicing spring 20 is provided, and the other end of the Z-direction slicing spring 20 is arranged on one side of the inner wall of the frame 1. On the outer wall of one side of the Z-direction punch mounting plate 22, a Z-direction slicing punch 23 is installed by bolts. A sheet moving plate 29 is slidably connected to the outer wall of one side of the slicing support plate 12. On the outer wall of one side of the sheet moving plate 29, a sheet moving photoelectric sensing baffle 28 is installed by bolts. A sheet moving guide wheel 27 is provided on the outer wall of one side of the slider two 26, and the sheet moving guide wheel 27 is in contact with the inclined plate 45. A first sheet moving spring 24 is provided on the outer wall of one side of the sheet moving plate 29, and the other end of the first sheet moving spring 24 is installed on one side of the bottom of the inner wall of the frame 1 by bolts. When the Z-direction slicing cylinder 19 extends, it pushes the Z-direction punch mounting plate 22 and the Z-direction slicing punch 23 to move, so as to break the multi-connected sheet substrates falling on the U-shaped retaining strip 15 in the Z-direction. Immediately, the horizontally double-connected sheet substrates broken are freely dropped onto the bottom plate of the blanking frame 5. When the Z-direction slicing cylinder 19 contracts, the Z-direction slicing tension spring 20 pulls the punch back. At the same time, the upper connected sheet substrates fall onto the U-shaped retaining strip 15 again. When the sheet moving cylinder 30 extends, it pushes the inclined plate 45 and the slider two 26 to move forward along the second slide rail 25. At the same time, under the action of the hypotenuse of the inclined plate 45, the second sheet moving spring 31 and the sheet moving guide wheel 27, the sheet moving plate 29 is pulled to the left by the second sheet moving spring 31, and the horizontally double-connected sheet substrates broken and falling in the Z-direction are also pushed to the left by the sheet moving plate. The sheet moving buffer 46 is used to buffer the sheet moving process to prevent the sheet moving from being too fast and causing excessive deviation of the sheet moving position of the substrates. When the sheet moving cylinder 30 contracts, due to the pulling force of the first sheet moving spring 24, the inclined plate 45 returns backward along the second slide rail 25. Under the action of the hypotenuse of the inclined plate 45 and the sheet moving guide wheel 27, the sheet moving plate 29 is moved back to the right, that is, a sheet moving process is completed.

[0030] In another embodiment provided by the present utility model, as Figures 4-6 shown; a spring rotating base 41 is provided on the outer wall of one side of the slicing support plate 12. A rotating shaft 38 is arranged inside the spring rotating base 41. A front rotating plate 39 is arranged outside the rotating shaft 38. A rear rotating plate 42 is provided on the outer wall of one side of the front rotating plate 39. A base spring installed on the spring rotating base 41 is provided on one side of the rear rotating plate 42. After the sheet moving action is completed, the Y-direction slicing and blanking cylinder 34 extends, pushing the slicing and blanking moving block 35 forward, driving the ejector pin 37 to push against the Y-direction slicing front rotating plate 39. The front rotating plate 39 and the rear rotating plate 42 drive the horizontally double-connected sheet substrates to rotate along the rotating shaft 38. Since half of the horizontally double-connected sheet substrates is inside the rotating body formed by the front rotating plate 39 and the rear rotating plate 42, and the other half is inside the U-shaped retaining strip 15, the horizontally double-connected sheet substrates are twisted and divided into two to complete the Y-direction slicing during rotation.

[0031] In another embodiment provided by the utility model, as Figure 5 shown; on one side of the bottom inside wall of the frame 1, a third slide rail 32 is provided, and a third slider 33 is slidably connected to the outside of the third slide rail 32. A Y-direction piece-splitting blanking cylinder 34 is installed on one side of the third slider 33 through bolts, and a piece-splitting blanking moving block 35 is installed on the output end of the Y-direction piece-splitting blanking cylinder 34 through bolts. On one side of the top outer wall of the piece-splitting blanking moving block 35, a thimble mounting block 36 is installed through bolts, and a thimble 37 is provided on the outer wall of one side of the thimble mounting block 36. When the Y-direction piece-splitting blanking cylinder 34 extends, it pushes the piece-splitting blanking moving block 35 forward, driving the thimble 37 to push against the Y-direction pre-rotation plate 39 before piece-splitting. The pre-rotation plate 39 and the post-rotation plate 42 drive the horizontal double-linked substrate to rotate along the rotation shaft 38. Since half of the horizontal double-linked substrate is inside the rotating body formed by the pre-rotation plate 39 and the post-rotation plate 42, and the other half is inside the U-shaped retaining strip 15, the horizontal double-linked substrate is twisted into two during rotation to complete the Y-direction piece-splitting; when the Y-direction piece-splitting blanking cylinder 34 contracts, the pull spring 40 pulls the piece-splitting blanking moving block 35 back, the thimble 37 disengages from the Y-direction pre-rotation plate 39 before piece-splitting, and at the same time, the spring installed on the spring rotating base 41 rotates the post-rotation plate 42 in the reverse direction to reset, completing one process of Y-direction piece-splitting. After the sheet transfer is completed, since there is a certain distance between the thimble 37 and the Y-direction pre-rotation plate 39 before piece-splitting, when the Y-direction piece-splitting blanking cylinder 34 extends, the blanking and the Y-direction piece-splitting are not synchronized, that is, the Y-direction rotational piece-splitting lags behind the blanking by a certain time; when the Y-direction piece-splitting blanking cylinder 34 contracts, the pull spring 40 pulls the piece-splitting blanking moving block 35 back, the piece-splitting blanking moving block 35 resets and the thimble 37 disengages from the Y-direction pre-rotation plate 39 before piece-splitting; a blanking platform 44 is provided on the top of the piece-splitting support plate 12, a photoelectric blanking component 43 is provided on one side of the piece-splitting blanking moving block 35, a pull spring 40 is provided on one side of the bottom of the piece-splitting blanking moving block 35, and one end of the pull spring 40 is fixed to the frame 1 through bolts. A sheet-taking insertion plate 2 is provided on the outer wall of one side of the frame 1, and an anti-tipping sheet pressing block 3 is provided on the outer wall of one side of the top of the frame 1. When the piece-splitting blanking moving block 35 pushes the piece-split and to-be-blanked substrate out of the blanking platform 44, the substrate falls onto the sheet-taking insertion plate 2 by gravity and disengages from the piece-splitting blanking moving block 35. Since there is an anti-tipping sheet pressing block 3 at the front end, the substrate falling onto the sheet-taking insertion plate 2 cannot lean forward. A button module 4 is installed on the outer wall of one side of the frame 1 through bolts, and operating the button module 4 can control the operation of the device.

[0032] Embodiment 1

[0033] An automatic slicing machine for thick film circuit substrates, comprising a frame 1, which is composed of a left side plate, an insertion plate platform, a sheet dropping step, a right side plate, and an HMI. On one side of the outer wall at the top of the frame 1, there is a blanking rack 5. The blanking platform 44 is laterally installed on the insertion plate platform of the frame 1, and there is a gap between the blanking platform 44 and the insertion plate platform of the frame 1. The sheet-taking insertion plate 2 is inserted along the gap; the insertion plate platform is fixed to the slicing support plate 12 and the left side plate of the frame 1 by bolts; there is a step between the blanking platform and the sheet-taking insertion plate 2 as the blanking platform. When the sliced blanking moving block 35 pushes the sliced substrate to be blanked out of the blanking platform 44, the substrate falls onto the sheet-taking insertion plate 2 by gravity and disengages from the sliced blanking moving block 35. To prevent the substrate falling onto the sheet-taking insertion plate 2 from tipping forward, a movable anti-tipping sheet pressing block 3 is placed near the substrate on the sheet-taking insertion plate 2, and during the sheet dropping process, it moves synchronously with the sliced blanking moving block 35 and the substrate; on one side of the inner wall of the blanking rack 5, a slide rail 6 is installed by bolts, and a slider 7 is slidably connected to the outside of the slide rail 6. On one side of the outer wall at the top of the slider 7, there is a feeding spring member 8, and the other end of the feeding spring member 8 is fixed inside the blanking rack 5. On one side of the inner wall of the blanking rack 5, a cylinder mounting seat 10 is installed by bolts, and on one side of the outer wall of the cylinder mounting seat 10, a feeding cylinder 9 is installed by bolts. The output end of the feeding cylinder 9 is installed with a pusher plate 11 by bolts. The blanking rack bottom plate 13 is fixed to the left side plate of the frame 1 and the blanking rack 5 of the frame 1 with screws. The slide rail 6 is installed on the blanking rack bottom plate 13, and the slider 7 is installed on the slide rail 6. The slider 7 is installed with an L-shaped pusher plate 11. One end of the feeding spring member 8 is fixed to the rear side of the pusher plate 11, and the other end is fixed to the blanking rack bottom plate 13 with screws; the feeding rack side plate is installed on the blanking rack bottom plate 13, the cylinder mounting seat 10 is fixed to the feeding rack side plate, the feeding cylinder 9 is installed on the cylinder mounting seat 10, the substrate sliding seat is installed on the blanking rack bottom, 13, and the substrates to be sliced and connected are neatly arranged on the substrate sliding seat. On one side at the bottom of the inner wall of the frame 1, there is a slicing support plate 12. At the bottom end of the blanking rack 5, there is a blanking rack bottom plate 13, and the blanking rack bottom plate 13 is stuck on the top of the slicing support plate 12. Inside the blanking rack 5, there are a front middle baffle 18 and a front baffle 14 respectively, and the front middle baffle 18 is stuck on the front baffle 14. On one side of the outer wall at the top of the frame 1, a retaining wheel member 17 is installed by bolts, and one side of the retaining wheel member 17 extends into the blanking rack 5. On one side of the outer wall at the top of the blanking rack bottom plate 13, a rear baffle 16 is installed by bolts, and on one side of the outer wall of the rear baffle 16, a U-shaped retaining strip 15 is installed by bolts. The falling substrate finally falls onto the U-shaped retaining strip 15. During this process, the gaps between the front baffle 14, the front middle baffle 18, the rear baffle 16 and the blanking rack 5 can just accommodate one thickness of the substrate, and the retaining wheel member 17 can adjust the falling speed of the substrate;When the Z-direction slicing cylinder 19 extends, it pushes the Z-direction punch mounting plate 22 and the Z-direction slicing punch 23 to move, thereby breaking the multi-connected sheet substrate falling on the U-shaped retaining bar 15 in the Z-direction. Immediately, the horizontally double-connected sheet substrate that has been cut off freely falls onto the bottom plate of the blanking rack 5. When the Z-direction slicing cylinder 19 contracts subsequently, the Z-direction slicing tension spring 20 pulls the punch back. At the same time, the upper connecting sheet substrate falls onto the U-shaped retaining bar 15 again; on one side of the bottom of the inner wall of the frame 1, a second slide rail 25 is installed by bolts, and a second slider 26 is slidably connected to the outside of the second slide rail 25. A sheet transfer cylinder 30 is provided at the bottom of the inner wall of the frame 1, and an inclined plate 45 is provided at the output end of the sheet transfer cylinder 30. A sheet transfer buffer 46 is provided on one side of the inclined plate 45. The inclined plate 45 is installed on the second slider 26 by bolts. A second sheet transfer spring 31 is provided on one side of the bottom of the inner wall of the frame 1, and the other end of the second sheet transfer spring 31 is fixed to the inclined plate 45. A sheet transfer buffer 46 is provided on one side of the bottom of the inner wall of the frame 1, and the sheet transfer buffer 46 is in contact with the inclined plate 45; when the sheet transfer cylinder 30 extends, it pushes the inclined plate 45 and the second slider 26 to move forward along the second slide rail 25. At the same time, under the action of the inclined side of the inclined plate 45, the second sheet transfer spring 31, and the sheet transfer guide wheel 27, the sheet transfer plate 29 is pulled to the left by the second sheet transfer spring 31, and the horizontally double-connected sheet substrate that has been broken in the Z-direction and fallen is also pushed to the left by the sheet transfer plate. The sheet transfer buffer 46 is used to buffer the sheet transfer process to prevent the sheet from moving too fast and causing excessive deviation of the sheet transfer position; when the sheet transfer cylinder 30 contracts, due to the pulling force of the first sheet transfer spring 24, the inclined plate 45 returns backward along the second slide rail 25. Under the action of the inclined side of the inclined plate 45 and the sheet transfer guide wheel 27, the sheet transfer plate 29 is moved back to the right, that is, a sheet transfer process is completed.

[0034] Embodiment 2

[0035] This embodiment further limits on the basis of Embodiment 1. Among them, a Z-direction guiding member 21 is installed on one side of the top inner wall of the frame 1 through bolts, and a Z-direction slicing cylinder 19 is provided on the outer wall of one side of the Z-direction guiding member 21. The output end of the Z-direction slicing cylinder 19 is installed with a Z-direction punch mounting plate 22 through bolts; a Z-direction slicing spring 20 is provided on the outer wall of one side of the Z-direction punch mounting plate 22, and the other end of the Z-direction slicing spring 20 is arranged on one side of the inner wall of the frame 1. A Z-direction slicing punch 23 is installed on the outer wall of one side of the Z-direction punch mounting plate 22 through bolts; a wafer moving plate 29 is slidably connected to the outer wall of one side of the slicing support plate 12, and a wafer moving photoelectric sensing baffle 28 is installed on the outer wall of one side of the wafer moving plate 29. A wafer moving guide wheel 27 is provided on the outer wall of one side of the slider two 26, and the wafer moving guide wheel 27 is in contact with the inclined plate 45. A first wafer moving spring 24 is provided on the outer wall of one side of the wafer moving plate 29, and the other end of the first wafer moving spring 24 is installed on one side of the bottom inner wall of the frame 1 through bolts. When the Z-direction slicing cylinder 19 extends, it pushes the Z-direction punch mounting plate 22 and the Z-direction slicing punch 23 to move, so as to break the multi-connected wafer substrate falling on the U-shaped retaining strip 15 in the Z direction. Immediately, the horizontally double-connected wafer substrate broken is freely dropped onto the bottom plate of the blanking frame 5. When the Z-direction slicing cylinder 19 contracts, the Z-direction slicing tension spring 20 pulls the punch back, and at the same time the upper connected wafer substrate falls onto the U-shaped retaining strip 15 again; when the wafer moving cylinder 30 extends, it pushes the inclined plate 45 and the slider two 26 to move forward along the second slide rail 25. At the same time, under the action of the inclined side of the inclined plate 45, the second wafer moving spring 31 and the wafer moving guide wheel 27, the wafer moving plate 29 is pulled to the left by the second wafer moving spring 31, and the horizontally double-connected wafer substrate broken and falling in the Z direction is also pushed to the left by the wafer moving plate. The wafer moving buffer 46 is used to buffer the wafer moving process to prevent the wafer from moving too fast and causing excessive deviation of the wafer moving position; when the wafer moving cylinder 30 contracts, due to the pulling force of the first wafer moving spring 24, the inclined plate 45 returns backward along the second slide rail 25. Under the action of the inclined side of the inclined plate 45 and the wafer moving guide wheel 27, the wafer moving plate 29 is moved back to the right, that is, a wafer moving process is completed; a spring rotating base 41 is provided on the outer wall of one side of the slicing support plate 12, and a rotating shaft 38 is provided inside the spring rotating base 41. A front rotating plate 39 is provided outside the rotating shaft 38, and a rear rotating plate 42 is provided on the outer wall of one side of the front rotating plate 39. A base spring installed on the spring rotating base 41 is provided on one side of the rear rotating plate 42; after the wafer moving action is completed, the Y-direction slicing and blanking cylinder 34 extends, pushing the slicing and blanking moving block 35 forward, driving the ejector pin 37 to push against the Y-direction slicing front rotating plate 39. The front rotating plate 39 and the rear rotating plate 42 drive the horizontally double-connected wafer substrate to rotate along the rotating shaft 38. Since half of the horizontally double-connected wafer substrate is inside the rotating body formed by the front rotating plate 39 and the rear rotating plate 42, and the other half is inside the U-shaped retaining strip 15, the horizontally double-connected wafer substrate is twisted and divided into two to complete the Y-direction slicing during rotation;On one side of the bottom of the inner wall of the frame 1, there is a third slide rail 32, and a third slider 33 is slidably connected to the outside of the third slide rail 32. On one side of the third slider 33, a Y-direction piece-dividing blanking cylinder 34 is installed by bolts, and the output end of the Y-direction piece-dividing blanking cylinder 34 is installed with a piece-dividing blanking moving block 35 by bolts. On one side of the outer wall of the top of the piece-dividing blanking moving block 35, a thimble mounting block 36 is installed by bolts, and a thimble 37 is provided on the outer wall of one side of the thimble mounting block 36. When the Y-direction piece-dividing blanking cylinder 34 extends, it pushes the piece-dividing blanking moving block 35 forward, driving the thimble 37 to press against the Y-direction piece-dividing front rotating plate 39. The front rotating plate 39 and the rear rotating plate 42 drive the transverse double-link substrate to rotate along the rotating shaft 38. Since half of the transverse double-link substrate is inside the rotating body formed by the front rotating plate 39 and the rear rotating plate 42, and the other half is inside the U-shaped retaining strip 15, the transverse double-link substrate is twisted into two during rotation to complete the Y-direction piece-dividing; when the Y-direction piece-dividing blanking cylinder 34 contracts, the tension spring 40 pulls the piece-dividing blanking moving block 35 back, the thimble 37 disengages from the Y-direction piece-dividing front rotating plate 39, and at the same time, the spring installed on the spring rotating base 41 rotates the rear rotating plate 42 in the reverse direction to reset, completing one process of Y-direction piece-dividing. After the sheet transfer is completed, since there is a certain distance between the thimble 37 and the Y-direction piece-dividing front rotating plate 39, when the Y-direction piece-dividing blanking cylinder 34 extends, the blanking and the Y-direction piece-dividing are not synchronized, that is, the Y-direction rotary piece-dividing lags behind the blanking by a certain time; when the Y-direction piece-dividing blanking cylinder 34 contracts, the tension spring 40 pulls the piece-dividing blanking moving block 35 back, the piece-dividing blanking moving block 35 resets and the thimble 37 disengages from the Y-direction piece-dividing front rotating plate 39; on the top of the piece-dividing support plate 12, there is a blanking platform 44. On one side of the piece-dividing blanking moving block 35, there is an optoelectronic blanking component 43. On one side of the bottom of the piece-dividing blanking moving block 35, there is a tension spring 40, and one end of the tension spring 40 is fixed to the frame 1 by bolts. On the outer wall of one side of the frame 1, there is a sheet-taking insertion plate 2. On the outer wall of one side of the top of the frame 1, there is an anti-tipping sheet pressing block 3. When the piece-dividing blanking moving block 35 pushes the piece-divided and to-be-blanked substrate out of the blanking platform 44, the substrate falls onto the sheet-taking insertion plate 2 by gravity and disengages from the piece-dividing blanking moving block 35. Due to the anti-tipping sheet pressing block 3 at the front end, the substrate falling onto the sheet-taking insertion plate 2 cannot tilt forward. On the outer wall of one side of the frame 1, a button module 4 is installed by bolts. Operating the button module 4 can control the operation of the device.;

[0036] Working principle: When using this device, the prepared substrates can be neatly arranged on the top of the blanking rack 5. When the feeding cylinder 9 extends, it pushes the pusher plate 11 to push the connected substrates towards the blanking rack 5. When the feeding cylinder 9 contracts, the feeding tension spring member 8 pulls the pusher plate 11 back to the rear side. At this time, the substrates are in a relaxed state, and the frontmost connected substrate falls into the blanking rack 5 due to gravity; the falling substrates finally fall to the U-shaped retaining strip 15. During this process, the gaps between the front baffle 14, the front-middle baffle 18, the rear baffle 16 and the blanking rack 5 can just accommodate one substrate in thickness, and the retaining wheel member 17 can adjust the falling speed of the substrates; when the Z-direction splitting cylinder 19 extends, it pushes the Z-direction punch mounting plate 22 and the Z-direction splitting punch 23 to move, so as to break the multi-connected substrates on the U-shaped retaining strip 15 in the Z direction. Immediately, the horizontally double-connected substrates broken are freely dropped onto the bottom plate of the blanking rack 5. When the Z-direction splitting cylinder 19 contracts, the Z-direction splitting tension spring 20 pulls the punch back. At the same time, the upper connected substrates fall onto the U-shaped retaining strip 15 again; when the sheet-transferring cylinder 30 extends, it pushes the inclined plate 45 and the slider two 26 to move forward along the slide rail two 25. At the same time, under the action of the hypotenuse of the inclined plate 45, the sheet-transferring tension spring two 31 and the sheet-transferring guide wheel 27, the sheet-transferring plate 29 is pulled to the left by the sheet-transferring tension spring two 31, and the horizontally double-connected substrates broken and falling in the Z direction are also pushed to the left by the sheet-transferring plate. The sheet-transferring buffer 46 is used to buffer the sheet-transferring process to prevent the substrates from being transferred too fast and causing excessive deviation of the sheet-transferring position; when the sheet-transferring cylinder 30 contracts, due to the pulling force of the sheet-transferring tension spring one 24, the inclined plate 45 returns backward along the slide rail two 25. Under the action of the hypotenuse of the inclined plate 45 and the sheet-transferring guide wheel 27, the sheet-transferring plate 29 is moved back to the right, that is, a sheet-transferring process is completed; after the sheet-transferring action is completed, the Y-direction splitting and blanking cylinder 34 extends, pushing the splitting and blanking moving block 35 forward, driving the ejector pin 37 to push against the Y-direction splitting front rotating plate 39. The front rotating plate 39 and the rear rotating plate 42 drive the horizontally double-connected substrates to rotate along the rotating shaft 38. Since half of the horizontally double-connected substrates is inside the rotating body formed by the front rotating plate 39 and the rear rotating plate 42, and the other half is inside the U-shaped retaining strip 15, the horizontally double-connected substrates are twisted and divided into two to complete the Y-direction splitting when rotating; when the Y-direction splitting and blanking cylinder 34 contracts, the tension spring 40 pulls the splitting and blanking moving block 35 back, the ejector pin 37 disengages from the Y-direction splitting front rotating plate 39, and at the same time, the spring installed on the spring rotating base 41 rotates the rear rotating plate 42 in the reverse direction to reset, completing a process of Y-direction splitting; during the sheet-transferring action, the substrates that have been split in the Y direction are moved into the front slot of the splitting and blanking moving block 35; after the sheet-transferring is completed, the Y-direction splitting and blanking cylinder 34 extends, pushing the splitting and blanking moving block 35 forward, driving the splitting and blanking moving block 35 to translate forward. When the splitting and blanking moving block 35 pushes the substrates that have been split and are waiting to be blanked out of the blanking platform 44, the substrates fall onto the pick-up insert plate 2 due to gravity and disengage from the splitting and blanking moving block 35. Since there is an anti-tipping sheet pressing block 3 at the front end, the substrates falling onto the pick-up insert plate 2 cannot lean forward;Meanwhile, since there is a certain distance between the ejector pin 37 and the rotating plate 39 before Y-direction slicing, when the Y-direction slicing blanking cylinder 34 extends, the blanking and Y-direction slicing are not synchronous, that is, the Y-direction rotating slicing lags behind the blanking by a certain time; when the Y-direction slicing blanking cylinder 34 contracts, the tension spring 40 pulls the slicing blanking moving block 35 back, the slicing blanking moving block 35 resets and the ejector pin 37 disengages from the rotating plate 39 before Y-direction slicing; in order to count and control the number of slices, an optoelectronic blanking component 43 composed of an inner optoelectronic sensor and an outer optoelectronic sensor is installed on both sides of the slicing blanking moving block 35. The inner optoelectronic sensor counts the number of single slices at the inner end, and the outer optoelectronic sensor counts the number of single slices at the outer end; to facilitate the removal of the sliced substrate, when the inner and outer sides are counted to a certain number, the wafer extraction insertion plate can be taken out from the gap between the blanking platform 44 and the wafer extraction insertion plate 2, emptied and then inserted into the gap to wait for the wafer counting.

[0037] Only some exemplary embodiments of the present invention have been described above by way of illustration. Without doubt, for those of ordinary skill in the art, various different ways can be used to modify the described embodiments without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. An automatic slicing machine for thick film circuit substrates, comprising a frame (1), characterized in that, On one side of the outer wall at the top of the frame (1), there is a blanking frame (5). On one side of the inner wall of the blanking frame (5), a first slide rail (6) is installed by bolts, and a first slider (7) is slidably connected to the outside of the first slide rail (6). On one side of the outer wall at the top of the first slider (7), there is a feeding spring piece (8), and the other end of the feeding spring piece (8) is fixed inside the blanking frame (5). On one side of the inner wall of the blanking frame (5), a cylinder mounting seat (10) is installed by bolts, and a feeding cylinder (9) is installed on the outer wall on one side of the cylinder mounting seat (10) by bolts. The output end of the feeding cylinder (9) is installed with a pushing plate (11) by bolts. On one side at the bottom of the inner wall of the frame (1), there is a slicing support plate (12). The bottom end of the blanking frame (5) is provided with a blanking frame bottom plate (13), and the blanking frame bottom plate (13) is stuck on the top of the slicing support plate (12). Inside the blanking frame (5), there are respectively a front middle baffle (18) and a front baffle (14), and the front middle baffle (18) is stuck on the front baffle (14). On one side of the outer wall at the top of the frame (1), a retaining wheel piece (17) is installed by bolts, and one side of the retaining wheel piece (17) extends into the blanking frame (5). On one side of the outer wall at the top of the blanking frame bottom plate (13), a rear baffle (16) is installed by bolts, and a U-shaped retaining strip (15) is installed on the outer wall on one side of the rear baffle (16). On both outer walls of the blanking frame (5), there are blanking frame fixing seats (47). Inside the blanking frame (5), there is a front upper baffle (48). On one side at the bottom of the inner wall of the frame (1), a second slide rail (25) is installed by bolts, and a second slider (26) is slidably connected to the outside of the second slide rail (25). On the bottom of the inner wall of the frame (1), there is a sheet shifting cylinder (30), and an inclined plate (45) is provided at the output end of the sheet shifting cylinder (30). On one side of the inclined plate (45), there is a sheet shifting buffer (46). The inclined plate (45) is installed on the second slider (26) by bolts. On one side at the bottom of the inner wall of the frame (1), there is a second sheet shifting spring (31), and the other end of the second sheet shifting spring (31) is fixed on the inclined plate (45). On one side at the bottom of the inner wall of the frame (1), there is a sheet shifting buffer (46), and the sheet shifting buffer (46) is in contact with the inclined plate (45).

2. The automatic slicing machine for thick film circuit substrates according to claim 1, wherein On one side at the top of the inner wall of the frame (1), a Z-direction guiding piece (21) is installed by bolts, and a Z-direction slicing cylinder (19) is provided on the outer wall on one side of the Z-direction guiding piece (21). The output end of the Z-direction slicing cylinder (19) is installed with a Z-direction punch mounting plate (22) by bolts.

3. An automatic slicer for thick film circuit substrates according to claim 2, characterized in that, On the outer wall on one side of the Z-direction punch mounting plate (22), there is a Z-direction slicing spring (20), and the other end of the Z-direction slicing spring (20) is arranged on one side of the inner wall of the frame (1). On the outer wall on one side of the Z-direction punch mounting plate (22), a Z-direction slicing punch (23) is installed by bolts.

4. An automatic slicer for thick film circuit substrates according to claim 1, characterized in that, A moving plate (29) is slidably connected to the outer wall of one side of the segmented support plate (12), and a moving plate photoelectric sensing baffle (28) is installed on the outer wall of one side of the moving plate (29) through bolts. A moving plate guide wheel (27) is arranged on the outer wall of one side of the slider two (26), and the moving plate guide wheel (27) is in contact with the inclined plate (45). A first moving plate spring (24) is arranged on the outer wall of one side of the moving plate (29), and the other end of the first moving plate spring (24) is installed on the bottom side of the inner wall of the frame (1) through bolts.

5. An automatic slicing machine for thick film circuit substrates according to claim 1, characterized in that, A spring rotating base (41) is arranged on the outer wall of one side of the segmented support plate (12), a rotating shaft (38) is arranged inside the spring rotating base (41), a front rotating plate (39) is arranged outside the rotating shaft (38), a rear rotating plate (42) is arranged on the outer wall of one side of the front rotating plate (39), and a base spring installed on the spring rotating base (41) is arranged on one side of the rear rotating plate (42).

6. The automatic slicer for thick film circuit substrates according to claim 5, characterized in that A third slide rail (32) is arranged on the bottom side of the inner wall of the frame (1), a third slider (33) is slidably connected to the outside of the third slide rail (32), a Y-direction segmented blanking cylinder (34) is installed on one side of the third slider (33) through bolts, and a segmented blanking moving block (35) is installed on the output end of the Y-direction segmented blanking cylinder (34) through bolts.

7. An automatic slicing machine for thick film circuit substrates according to claim 6, characterized in that, A thimble mounting block (36) is installed on the outer wall of the top side of the segmented blanking moving block (35) through bolts, a thimble (37) is arranged on the outer wall of one side of the thimble mounting block (36), a blanking platform (44) is arranged on the top of the segmented support plate (12), a photoelectric blanking part (43) is arranged on one side of the segmented blanking moving block (35), a tension spring (40) is arranged on the bottom side of one side of the segmented blanking moving block (35), one end of the tension spring (40) is fixed on the frame (1) through bolts, a pick-up plate (2) is arranged on the outer wall of one side of the frame (1), a side-fall prevention sheet pressing block (3) is arranged on the outer wall of the top side of the frame (1), and a button module (4) is installed on the outer wall of one side of the frame (1) through bolts.

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