Active heat dissipation single-chip microcomputer device

Abstract

The utility model relates to the technical field of single-chip microcomputers, in particular to an active heat dissipation single-chip microcomputer device, which comprises a shell, a single-chip microcomputer body, a connecting piece and a heat dissipation assembly, the single-chip microcomputer body comprises electrical elements and a substrate, a plurality of groups of electrical elements are arranged on the substrate, the shell comprises a top plate, a [-shaped protection plate and a mounting plate, and the mounting plate is arranged on the top plate. The design of the heat dissipation assembly provides a good heat dissipation condition for the single-chip microcomputer device. The heat dissipation frame is embedded in the top plate and serves as an installation base of the heat dissipation fan, the heat dissipation fan can generate forced airflow when working, heat generated by a single-chip microcomputer body (especially electrical elements on the substrate in the working process) is rapidly taken away, the heat is dissipated to the surrounding environment in time, heat accumulation in the shell is avoided, and the service life of the single-chip microcomputer is prolonged. Therefore, the working temperature of the single-chip microcomputer body is effectively reduced, and stable operation of the single-chip microcomputer body in a proper temperature environment is guaranteed. The single-chip microcomputer body is detachably connected with the shell, so that the single-chip microcomputer is convenient to disassemble, maintain and check, and is convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of single-chip microcomputers, and specifically relates to a single-chip microcomputer device with active heat dissipation. Background Art

[0002] A single-chip microcomputer, also known as a microcontroller, is an integrated circuit chip;

[0003] The application number is CN202123288899.6, a single-chip microcomputer protective case and a single-chip microcomputer, including an outer protective case and a single-chip microcomputer body. The outer protective case is wrapped outside the single-chip microcomputer body; the outer protective case is a hollow structure with an open lower part, and clamping columns are arranged on two opposite inner side walls thereof; the clamping columns are divided into two sections, and the two sections are connected by an elastic member in the middle. A clamping groove is opened on the outer wall of the single-chip microcomputer body, and the clamping groove is used for installing the clamping columns. Through the setting of the outer protective case, which covers the outside of the single-chip microcomputer body, it plays a protective role for the single-chip microcomputer body, preventing impact and buffering; through the clamping cooperation between the clamping columns and the single-chip microcomputer body, it plays a connecting role for the single-chip microcomputer body, fixing the single-chip microcomputer body in the outer protective case, facilitating installation and disassembly. It solves the problem that after the single-chip microcomputer is connected to the circuit board, it is usually directly exposed outside, with less protection for the single-chip microcomputer and being easily damaged by impact.

[0004] The above structure provides protection for the single-chip microcomputer, but it will cause the problem that the device is not convenient for heat dissipation, thereby resulting in a low service life of the device. Content of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] In view of the deficiencies of the prior art, the utility model provides a single-chip microcomputer device with active heat dissipation.

[0007] (2) Technical Solutions

[0008] To achieve the above object, the utility model provides the following technical solution: A single-chip microcomputer device with active heat dissipation, including a housing, a single-chip microcomputer body, a connecting member and a heat dissipation component. The single-chip microcomputer body includes electrical components and a substrate, and several groups of electrical components are arranged on the substrate. The housing includes a top plate, a U-shaped protective plate and a mounting plate. The top plate is arranged on the top wall of the protective plate, and the mounting plates are symmetrically arranged on both sides of the two free ends of the protective plate. A sliding groove for sliding connection with the substrate is arranged inside the protective plate. A connecting member for connecting with the substrate is arranged on the housing. The heat dissipation component includes a heat dissipation frame, a heat dissipation fan and a dust-proof cover. The heat dissipation frame is embedded on the top plate, a heat dissipation fan is further arranged on the heat dissipation frame, and the dust-proof cover is arranged on the top of the heat dissipation frame.

[0009] In order to facilitate the disassembly and assembly of the substrate, the present utility model is improved in that the connecting member includes an elastic member and an arc-shaped block, a plurality of groups of arc-shaped grooves are symmetrically arranged on the left and right sides of the substrate, the protective plate and the mounting plate are provided with movable grooves for carrying the connecting member, the movable grooves penetrate through the sliding grooves, and both ends of the elastic member are respectively connected to the inner wall of the movable groove and one end of the arc-shaped block.

[0010] Preferably, the elastic member includes a spring and a telescopic rod, the spring is sleeved on the telescopic rod, and both ends of the spring and the telescopic rod are respectively connected to the inner wall of the movable groove and the arc-shaped block.

[0011] In order to facilitate the fixing of the device, the present utility model is improved in that mounting holes are further provided on the front and rear sides of each mounting plate.

[0012] Furthermore, in order to facilitate the fixing of the housing and the substrate, the present utility model is improved in that a positioning groove is further provided on the substrate, a bolt is further provided on the top plate, and the lower part of the bolt is inserted into the positioning groove.

[0013] Preferably, a storage groove adapted to the end of the bolt is further provided above the top plate.

[0014] Preferably, a plurality of groups of hollow holes are further provided on the side of the protective plate away from its free end, and the bolt is provided at one end away from the hollow holes.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the present utility model provides a single-chip microcomputer device with active heat dissipation, which has the following beneficial effects:

[0017] For the single-chip microcomputer device with active heat dissipation, the design of the heat dissipation component provides good heat dissipation conditions for the single-chip microcomputer device. The heat dissipation frame is embedded in the top plate as the installation basis for the heat dissipation fan. When the heat dissipation fan works, it can generate a forced air flow, quickly take away the single-chip microcomputer body (especially the heat generated by the electrical components on the substrate during operation), and dissipate the heat into the surrounding environment in time, avoiding the accumulation of heat in the housing, thereby effectively reducing the working temperature of the single-chip microcomputer body and ensuring its stable operation in a suitable temperature environment;

[0018] The single-chip microcomputer body and the housing are set to be detachably connected, which is convenient for disassembly, maintenance and inspection, and is easy to use. Description of the drawings

[0019] Figure 1 It is the first front view schematic diagram of the structure of the present utility model;

[0020] Figure 2 It is the second front view schematic diagram of the structure of the present utility model;

[0021] Figure 3This is an explosion schematic diagram of the structure of the present utility model;

[0022] Figure 4 This is the structure of the present utility model Figure 3 in which is a partial enlarged schematic diagram.

[0023] In the figure: 1. Electrical component; 2. Substrate; 3. Top plate; 4. Protection plate; 5. Mounting plate; 6. Heat dissipation frame; 7. Heat dissipation fan; 8. Dust-proof cover; 9. Arc-shaped block; 10. Spring; 11. Telescopic rod; 12. Mounting hole; 13. Bolt; 14. Storage groove; 15. Hollow hole. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1-4 , a single-chip microcomputer device with active heat dissipation, including a housing, a single-chip microcomputer body, a connecting member, and a heat dissipation component. The single-chip microcomputer body includes an electrical component 1 and a substrate 2. A number of groups of electrical components are arranged on the substrate 2. The housing includes a top plate 3, a U-shaped protection plate 4, and a mounting plate 5. The top plate 3 is arranged on the top wall of the protection plate 4. The mounting plates 5 are symmetrically arranged on both sides of the two free ends of the protection plate 4. A sliding groove for sliding connection with the substrate 2 is arranged inside the protection plate 4. A connecting member for connecting with the substrate 2 is arranged on the housing. The heat dissipation component includes a heat dissipation frame 6, a heat dissipation fan 7, and a dust-proof cover 8. The heat dissipation frame 6 is embedded in the top plate 3. A heat dissipation fan 7 is also arranged on the heat dissipation frame 6. The dust-proof cover 8 is arranged on the top of the heat dissipation frame 6.

[0026] The substrate 2 is slidably connected to the protective plate 4, and the protective plate 4 provides stable support for the top plate 3. The housing with the single-chip microcomputer can be assembled with the corresponding device through the mounting plate 5. After the single-chip microcomputer device is powered on, the single-chip microcomputer body starts to work. Each electrical component 1 (such as CPU, memory, I / O port, etc.) on the substrate 2 performs operations such as data processing and signal transmission according to a preset program. During this process, the electrical component 1 generates heat, causing the temperature inside the housing to gradually rise. The heat dissipation component starts to function. The heat dissipation rack 6 is embedded in the top plate 3, and the heat dissipation rack 6 provides stable support for the radiator fan 7. The radiator fan 7 is powered on and starts, and the fan blades start to rotate. Under the action of the radiator fan 7, the surrounding air is sucked into the housing (the air enters from the hollow holes 15 of the protective plate 4 and other gaps). After passing through the surface of the electrical component 1 and taking away the heat, the hot air is discharged upward through the heat dissipation rack 6 under the action of the forced air flow generated by the radiator fan 7. The dust-proof cover 8 blocks the outside dust from entering the housing along with the air, ensuring that the entering air is relatively clean and preventing the dust from affecting the normal operation and heat dissipation performance of the electrical component 1. In this way, the radiator fan 7 continuously operates, continuously discharging the hot air inside the housing, keeping the temperature inside the housing within a relatively low range suitable for the normal operation of the single-chip microcomputer body, ensuring that each electrical component 1 of the single-chip microcomputer body can operate stably and reliably, avoiding situations such as performance degradation and component damage caused by overheating, and extending the service life of the single-chip microcomputer device.

[0027] During the actual use process, the connecting member includes an elastic member and an arc-shaped block 9. A plurality of groups of arc-shaped grooves are symmetrically arranged on the left and right sides of the substrate 2. The protective plate 4 and the mounting plate 5 are provided with movable grooves for carrying the connecting member, and the movable grooves penetrate the sliding grooves. Both ends of the elastic member are respectively connected to the inner wall of the movable groove and one end of the arc-shaped block 9. The elastic member includes a spring 10 and a telescopic rod 11. The spring 10 is sleeved on the telescopic rod 11, and both ends of the spring 10 and the telescopic rod 11 are respectively connected to the inner wall of the movable groove and the arc-shaped block 9. If operations such as maintenance, inspection, or replacement of the single-chip microcomputer body are required, it is necessary to disassemble it from the housing. The operator first needs to cut off the power supply to ensure operation safety, apply a pulling force to the substrate 2, and press the arc-shaped block 9 into the arc-shaped groove (overcoming the elastic force of the spring 10), so that the arc-shaped block 9 disengages from the arc-shaped groove of the substrate 2, releasing the clamping and fixing relationship between the substrate 2 and the housing on the side. The telescopic rod 11 ensures the stability of the movement of the arc-shaped block 9. At this time, it is convenient to disassemble the single-chip microcomputer body and the housing.

[0028] During actual use, it is necessary to stably fix the substrate 2 to the housing. To this end, a positioning groove is further provided on the substrate 2, and a bolt 13 is further provided on the top plate 3. The lower part of the bolt 13 is inserted into the positioning groove, and a receiving groove 14 adapted to the end of the bolt 13 is further provided above the top plate 3 so that the bolt 13 can be stably received after being assembled with the substrate 2. A plurality of groups of hollow holes 15 are further provided on the side of the protection plate 4 away from its free end, and the bolt 13 is arranged at the end away from the hollow holes 15 to increase the heat dissipation efficiency.

[0029] References to "embodiments" in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The term "embodiment" as used in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0030] Unless otherwise defined, the meanings of the technical terms used herein are the same as those commonly understood by those skilled in the technical field to which this application belongs; the use of the relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. An active heat dissipation single-chip microcomputer device, comprising a housing, a single-chip microcomputer body, a connecting member and a heat dissipation component, characterized in that: The single-chip microcomputer body includes electrical components (1) and a substrate (2). A number of groups of electrical components are arranged on the substrate (2). The housing includes a top plate (3), a U-shaped protective plate (4), and a mounting plate (5). The top plate (3) is arranged on the top wall of the protective plate (4). The mounting plates (5) are symmetrically arranged on both sides of the two free ends of the protective plate (4). A chute for sliding connection with the substrate (2) is arranged inside the protective plate (4). A connecting member for connecting with the substrate (2) is arranged on the housing. The heat dissipation assembly includes a heat dissipation frame (6), a heat dissipation fan (7), and a dust-proof cover (8). The heat dissipation frame (6) is embedded in the top plate (3). The heat dissipation fan (7) is also arranged on the heat dissipation frame (6). The dust-proof cover (8) is also arranged on the top of the heat dissipation frame (6).

2. The single-chip microcomputer device with active heat dissipation according to claim 1, wherein: The connecting member includes an elastic member and an arc-shaped block (9). A number of groups of arc-shaped grooves are symmetrically arranged on the left and right sides of the substrate (2). An activity groove for carrying the connecting member is arranged on the protective plate (4) and the mounting plate (5). The activity groove penetrates through the chute. The two ends of the elastic member are respectively connected with the inner wall of the activity groove and one end of the arc-shaped block (9).

3. The single-chip microcomputer device with active heat dissipation according to claim 2, characterized in that: The elastic member includes a spring (10) and a telescopic rod (11). The spring (10) is sleeved on the telescopic rod (11). The two ends of the spring (10) and the telescopic rod (11) are respectively connected with the inner wall of the activity groove and the arc-shaped block (9).

4. The single-chip microcomputer device with active heat dissipation according to claim 3, characterized in that: Mounting holes (12) are also arranged on the front and rear sides of each mounting plate (5).

5. An active heat dissipation single-chip microcomputer device according to claim 4, characterized in that: A positioning groove is also arranged on the substrate (2). A bolt (13) is also arranged on the top plate (3). The lower part of the bolt (13) is inserted into the positioning groove.

6. The active heat dissipation single-chip microcomputer device according to claim 5, characterized in that: A storage groove (14) adapted to the end of the bolt (13) is also arranged above the top plate (3).

7. An active heat dissipation single-chip microcomputer device according to claim 6, characterized in that: A number of groups of hollow holes (15) are also arranged on one side of the protective plate (4) away from its free end. The bolt (13) is arranged at one end away from the hollow holes (15).

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