Slicing side nozzle and silicon wafer slicing structure using same

Abstract

The utility model relates to the field of wafer inserting machines, in particular to a wafer separating side nozzle and a silicon wafer separating structure using the same. The fragmentation side nozzle comprises an installation body and a duckbilled nozzle body, the installation body is provided with a liquid inlet cavity, the duckbilled nozzle body is installed on the installation body and communicated with the liquid inlet cavity, and an outlet of the duckbilled nozzle body right faces the corner of a silicon wafer, is in a long strip shape and extends in the thickness direction of the silicon wafer. The duckbilled nozzle body is adopted, blocking is not prone to occurring, and the slicing effect is good.

Description

Technical Field

[0001] The utility model relates to the field of wafer inserters, and particularly relates to a wafer splitting side nozzle and a wafer splitting structure using the same. Background Art

[0002] During the process of wafer insertion and cleaning, the wafer splitting side nozzle needs to cooperate with the main nozzle to spray water towards the stacked wafers, so that the wafers are separated in water and then transported away one by one. The existing wafer splitting side nozzle has two rows of spray holes, and water flows out from the spray holes.

[0003] Because the water in the slot of the wafer inserter is relatively turbid, contains silicon powder, and contains a certain amount of cleaning agent, the spray holes of the side nozzle are easily blocked. The cleaning and installation adjustment of a single side nozzle take a long time. On average, it takes 30 minutes to clean one, which seriously reduces the production efficiency, occupies more working hours of production personnel, and increases the production cost. At the same time, the original side nozzle is prone to aging and cracking, has a short service life, and replacing the new side nozzle also increases the production cost. Moreover, the water flows sprayed from the two rows of spray holes of the existing wafer splitting side nozzle are in a scattered state, with intermittent flow, resulting in poor splitting effect, easy occurrence of double wafers or even a stack of wafers, and causing defects such as cracking, edge damage, chipping, corner breakage, and hidden cracks on the wafers. Summary of the Invention

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide a wafer splitting side nozzle, which adopts a duckbill nozzle body, is not easy to be blocked, is firm and durable, has high stability, and has a good splitting effect.

[0005] To solve the above technical problem, the technical solution of the utility model is: a wafer splitting side nozzle, comprising a mounting body and a duckbill nozzle body. The mounting body has a liquid inlet cavity. The duckbill nozzle body is mounted on the mounting body and communicates with the liquid inlet cavity. The outlet of the duckbill nozzle body faces the corner of the wafer, is in a long strip shape, and extends along the thickness direction of the wafer.

[0006] Further, the mounting body includes a mounting main body and a protruding part. The protruding part is fixedly connected to the mounting main body. The protruding part has a mounting surface. The projection of the mounting surface on the horizontal plane is a straight line, and the included angle between the projected straight line and the mounting main body is an included angle β, and the included angle β is an obtuse angle. The duckbill nozzle body is vertically mounted on the mounting surface, and the spraying direction is perpendicular to the mounting surface.

[0007] Further, the degree of the included angle β is 140 ± 3 degrees.

[0008] Further, the material of the duckbill nozzle body is stainless steel.

[0009] Further, a threaded rod is fixed on the mounting body.

[0010] Further, the water pressure of the duckbill nozzle body is 0.5 Mpa.

[0011] The utility model also relates to a silicon wafer slicing structure, which includes two slicing side nozzles.

[0012] After adopting the above technical solution, the slicing side nozzle of the utility model adopts a duckbill nozzle body, which is not easy to be blocked, has a long service life, reduces the consumption of spare parts, and also reduces the amount of manual labor. Moreover, the sprayed water line is a continuous line without interruption, ensuring that the silicon wafers are separated and conveyed one by one without double wafers, with good slicing effect and no broken wafers. Description of the Drawings

[0013] Figure 1 is a schematic structural view of the slicing side nozzle of the utility model;

[0014] Figure 2 is Figure 1 the top view of;

[0015] Figure 3 is Figure 1 the cross-sectional view of;

[0016] Figure 4 is a schematic structural view of the silicon wafer slicing structure of the utility model;

[0017] Figure 5 is Figure 4 the enlarged view of part A of;

[0018] In the figure, 1 is an installation body; 11 is a liquid inlet cavity; 12 is an installation main body; 13 is a protruding part; 131 is an installation surface; 2 is a duckbill nozzle body; 3 is a threaded rod; 4 is a feeding crystal tray; 5 is a water tank; 6 is an installation bracket. Detailed Embodiments

[0019] In order to make the content of the utility model easier to be clearly understood, the following further details the utility model according to specific embodiments and in combination with the drawings.

[0020] Embodiment 1

[0021] As Figures 1-3 shown, a slicing side nozzle includes an installation body 1 and a duckbill nozzle body 2. The installation body 1 has a liquid inlet cavity 11. The duckbill nozzle body 2 is installed on the installation body 1 and communicates with the liquid inlet cavity 11. The outlet of the duckbill nozzle body 2 faces the corner of the silicon wafer, is in a long strip shape, and extends along the thickness direction of the silicon wafer.

[0022] Specifically, the segmented side nozzle in this embodiment adopts a duckbill nozzle body 2, which is not easily blocked, has a long service life, reduces the consumption of spare parts, and also reduces the amount of manual labor. Moreover, the sprayed water line is a continuous line without interruption, ensuring that the silicon wafers are separated and conveyed one by one without double wafers, with good segmentation effect and no fragmentation of the silicon wafers.

[0023] Generally, the duckbill nozzle body 2 sprays at the corner of stacked silicon wafers. There is a preferred angle range between the sprayed water line and the edge of the silicon wafer. In order to conveniently make the spraying direction of the duckbill nozzle body 2 within the expected range during the assembly of the segmented side nozzle, this purpose can be achieved by reasonably and ingeniously setting the structure of the mounting body 1. The following examples are used for illustration.

[0024] As Figure 1 、 Figure 2 and Figure 3 shown, the mounting body 1 includes a mounting main body 12 and a protruding portion 13. The protruding portion 13 is fixedly connected to the mounting main body 12. The protruding portion 13 has a mounting surface 131. The projection of the mounting surface 131 on the horizontal plane is a straight line, and the included angle between the projected straight line and the mounting main body 12 is the included angle β, and the included angle β is an obtuse angle. The duckbill nozzle body 2 is vertically mounted on the mounting surface 131, and the spraying direction is perpendicular to the mounting surface 131.

[0025] With such a setting, there is no need to deliberately tilt and mount the mounting body 1 on the mounting bracket 6 of the silicon wafer segmentation structure as shown in Figure 5 . By ensuring that the mounting body 1 is installed in a conventional horizontal and vertical manner, the purpose of making the included angle between the water line sprayed by the duckbill nozzle body 2 and the edge of the silicon wafer reach the expected angle can be achieved, thereby reducing the installation difficulty of the mounting body 1 on the mounting bracket 6.

[0026] Preferably, the degree of the included angle β is 140 ± 3 degrees. In this way, when the mounting main body 12 is installed on the mounting bracket 6 in a direction parallel to the side of the silicon wafer, the included angle between the duckbill nozzle body 2 and the side of the silicon wafer is (β - 90) degrees, which is 50 ± 3 degrees. Spraying at this angle has been verified to have the best effect. Even for silicon wafers with a thickness of 130 μm, the segmentation effect is very good, without double wafers and no fragmentation.

[0027] In this embodiment, the material of the duckbill nozzle body 2 can be stainless steel, which has a long service life and is not easily damaged. It can be soaked in caustic soda or hydrochloric acid and then rinsed with tap water to achieve no mud and calcified attachments inside. The operation is simple and convenient. The duckbill nozzle body 2 is preferably pressed from 304 stainless steel.

[0028] In addition, in this embodiment, after verification, the water pressure of the duckbill nozzle body 2 is preferably 0.5 Mpa.

[0029] Embodiment Two

[0030] As Figure 1 and Figure 2 shown, based on the first embodiment, a threaded rod 3 is fixed on the mounting body 1.

[0031] Specifically, the mounting body 1 can be conveniently mounted on the mounting bracket 6 of the silicon wafer slicing structure through the threaded rod 3. A strip hole is provided on the mounting bracket 6. After the threaded rod 3 passes through the strip hole and a nut is screwed, the position of the mounting body 1 and the duckbill nozzle body 2 can also be adjusted after loosening the nut, so as to achieve the purpose of adjusting the distance between the duckbill nozzle body 2 and the silicon wafer.

[0032] Embodiment Three

[0033] As Figure 4 and Figure 5 shown, a silicon wafer slicing structure includes the slicing side nozzles in the first embodiment or the second embodiment.

[0034] As Figure 4 and Figure 5 shown, a silicon wafer slicing structure generally includes a loading crystal carrier 4, a water tank 5, a mounting bracket 6 and a water absorption plate. Stacked silicon wafers are placed inside the loading crystal carrier 4. The loading crystal carrier 4 and the silicon wafers therein are immersed in the water tank 5. The loading crystal carrier 4 is driven by an electric cylinder to feed upward, each time rising by the height of one silicon wafer thickness. The slicing side nozzles and the water absorption plate are both mounted on the mounting bracket 6.

[0035] During slicing, two slicing side nozzles face two corners of the silicon wafer, and cooperate with the main nozzle to separate the silicon wafer. The uppermost silicon wafer is conveyed by the conveying mechanism from the opening of the loading crystal carrier 4 facing the slicing side nozzle under the action of the water absorption plate, and then the loading crystal carrier 4 drives the stacked silicon wafers to rise by the height of one silicon wafer thickness, and so on, to achieve slicing.

[0036] Enlightened by the above ideal embodiments according to the present invention, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A segmented side nozzle, characterized in that: It includes a mounting body (1) and a duckbill nozzle body (2). The mounting body (1) has a liquid inlet cavity (11). The duckbill nozzle body (2) is mounted on the mounting body (1) and communicates with the liquid inlet cavity (11). The outlet of the duckbill nozzle body (2) faces the corner of the silicon wafer, is strip-shaped, and extends along the thickness direction of the silicon wafer.

2. The segmented side nozzle according to claim 1, characterized in that: The mounting body (1) includes a mounting main body (12) and a protruding portion (13). The protruding portion (13) is fixedly connected to the mounting main body (12). The protruding portion (13) has a mounting surface (131). The projection of the mounting surface (131) on the horizontal plane is a straight line, and the included angle between the projected straight line and the mounting main body (12) is the included angle β, and the included angle β is an obtuse angle. The duckbill nozzle body (2) is vertically mounted on the mounting surface (131), and the spraying direction is perpendicular to the mounting surface (131).

3. The segmented side nozzle according to claim 2, characterized in that: The degree of the included angle β is 140 ± 3 degrees.

4. The segmented side nozzle according to claim 1, characterized in that: The material of the duckbill nozzle body (2) is stainless steel.

5. The segmented side nozzle according to claim 1, characterized in that: A threaded rod (3) is fixed on the mounting body (1).

6. The segmented side nozzle according to claim 1, characterized in that: The water pressure of the duckbill nozzle body (2) is 0.5 Mpa.

7. A silicon wafer segmentation structure, characterized in that: It includes two segmented side nozzles according to any one of claims 1-6.

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