SOP16 multi-base-island packaging structure

Abstract

The utility model provides an SOP16 multi-base-island packaging structure, which is characterized in that a plurality of device units are arranged on a frame array, each device unit is of a rectangular structure, the upper side and the lower side of each device unit are provided with an upper pin unit and a lower pin unit which are oppositely distributed along the horizontal center line of the device unit, each device unit comprises three base islands, and the upper pin unit and the lower pin unit are arranged on the upper side and the lower side of each device unit respectively. Wherein at least one chip is arranged on each base island, the base islands are electrically connected with at least one of the upper pin unit and the lower pin unit, the integration level of a circuit is improved structurally, the application area of a product is improved, three or six chips are integrated on a single component functionally, and the same function as three to six components is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor integrated circuit packaging and testing, and particularly relates to an SOP16 multi-base island packaging structure. Background Art

[0002] SOP, namely Small Out line Package, is a small form packaging technology, referring to integrated electronic devices using surface mount packaging. Such devices usually have two rows of pins.

[0003] Currently, in the semiconductor integrated circuit packaging and testing industry, for the SOP16 packaging form, the products are basically mainly single-chip or two-chip co-packaged products. Generally, three to six discrete components are required on the terminal PCB board to achieve the function. In the supporting material market, there is no copper lead frame that can be co-packaged with six MOS (chips), which cannot meet the needs of customers. In order to meet the demand for such co-packaging functions, a copper lead frame that can be co-packaged with six MOS (chips) has been developed and designed, realizing the SOP16 packaged products. Content of the Utility Model

[0004] The utility model provides an SOP16 multi-base island packaging structure, aiming to solve the problems raised in the background art.

[0005] The utility model is implemented as follows. An SOP16 multi-base island packaging structure includes a frame, and a plurality of device units are arranged in an array on the frame. The device units are in a rectangular structure.

[0006] Upper pin units and lower pin units are arranged on the upper and lower sides of the device unit in a relative distribution along the horizontal center line of the device unit.

[0007] The device unit includes three base islands and a plastic package body. At least one chip is provided on each base island. The base island is electrically connected to at least one of the upper pin unit and the lower pin unit. The plastic package body is used to support the base island.

[0008] Preferably, the upper pin unit includes a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, and an eighth pin. The first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin, and the eighth pin are sequentially distributed along the extending direction of the upper pin unit. The base island is connected to at least one of the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin, and the eighth pin.

[0009] Preferably, the lower pin unit includes a ninth pin, a tenth pin, an eleventh pin, a twelfth pin, a thirteenth pin, a fourteenth pin, a fifteenth pin, and a sixteenth pin. The ninth pin, tenth pin, eleventh pin, twelfth pin, thirteenth pin, fourteenth pin, fifteenth pin, and sixteenth pin are sequentially distributed along the extension direction of the lower pin unit. The base island is connected to at least one of the ninth pin, tenth pin, eleventh pin, twelfth pin, thirteenth pin, fourteenth pin, fifteenth pin, and sixteenth pin.

[0010] Preferably, a glue locking hole is further provided on the device unit, and the glue locking hole is located inside the encapsulation area.

[0011] Preferably, strip-shaped holes are provided around the device unit.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] The SOP16 multi-base island packaging structure of the present utility model has multiple device units provided in the frame array. The device units are in a rectangular structure. Upper pin units and lower pin units are provided on the upper and lower sides of the device unit and are relatively distributed along the horizontal center line of the device unit. The device unit includes three base islands, and at least one chip is provided on each base island. The base island is electrically connected to at least one of the upper pin unit and the lower pin unit. Structurally, it improves the integration degree of the circuit and improves the application area of the product. Functionally, three or six chips are integrated on a single component, and it has the same functions as three to six components. Description of the Drawings

[0014] Figure 1 It is an overall top view of the SOP16 multi-base island packaging structure of the present utility model;

[0015] Figure 2 is Figure 1 a partial enlarged view at A in

[0016] Figure 3 It is a schematic structural diagram of the device unit in the present utility model;

[0017] Figure 4 It is a schematic structural diagram of the upper pin unit and the lower pin unit in the present utility model.

[0018] In the figure:

[0019] 100, device unit;

[0020] 101, upper pin unit; 1, first pin; 2, second pin; 3, third pin; 4, fourth pin; 5, fifth pin; 6, sixth pin; 7, seventh pin; 8, eighth pin;

[0021] 102. Lower pin unit; 9. Ninth pin; 10. Tenth pin; 11. Eleventh pin; 12. Twelfth pin; 13. Thirteenth pin; 14. Fourteenth pin; 15. Fifteenth pin; 16. Sixteenth pin;

[0022] 103. Base island; 104. Chip; 105. Plastic package; 106. Sealant hole; 107. Strip-shaped hole. Detailed implementation manner

[0023] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments.

[0024] Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the present invention claimed, but merely represents the selected embodiments of the present invention.

[0025] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0028] Please refer to Figures 1 to 4 , the present invention provides a technical solution: an SOP16 multi-base island packaging structure, including a frame;

[0029] Specifically, the frame array is provided with a plurality of device units 100. Each device unit 100 finally produces an electronic component. The device unit 100 has a rectangular structure. Upper pin units 101 and lower pin units 102 are provided on the upper and lower sides of the device unit 100 and are relatively distributed along the horizontal center line of the device unit 100. The device unit 100 includes three base islands 103 and a plastic package 105. Among them, at least one chip 104 is provided on each base island 103. The base island 103 is electrically connected to at least one of the upper pin unit 101 and the lower pin unit 102. The plastic package 105 is used to support the base island 103.

[0030] More specifically, please refer to Figure 3 and Figure 4 , the upper pin unit 101 includes a first pin 1, a second pin 2, a third pin 3, a fourth pin 4, a fifth pin 5, a sixth pin 6, a seventh pin 7, and an eighth pin 8. The first pin 1, the second pin 2, the third pin 3, the fourth pin 4, the fifth pin 5, the sixth pin 6, the seventh pin 7, and the eighth pin 8 are sequentially distributed along the extending direction of the upper pin unit 101. The base island 103 is connected to one of the first pin 1, the second pin 2, the third pin 3, the fourth pin 4, the fifth pin 5, the sixth pin 6, the seventh pin 7, and the eighth pin 8.

[0031] Please refer to Figure 3 and Figure 4 , the lower pin unit 102 includes a ninth pin 9, a tenth pin 10, an eleventh pin 11, a twelfth pin 12, a thirteenth pin 13, a fourteenth pin 14, a fifteenth pin 15, and a sixteenth pin 16. The ninth pin 9, the tenth pin 10, the eleventh pin 11, the twelfth pin 12, the thirteenth pin 13, the fourteenth pin 14, the fifteenth pin 15, and the sixteenth pin 16 are sequentially distributed along the extending direction of the lower pin unit 102. The base island 103 is connected to one of the ninth pin 9, the tenth pin 10, the eleventh pin 11, the twelfth pin 12, the thirteenth pin 13, the fourteenth pin 14, the fifteenth pin 15, and the sixteenth pin 16. Among them, the three base islands 103 are located in the middle position between the upper pin unit 101 and the lower pin unit 102, which is convenient for determining the position of the base island 103 and the stability of the structure.

[0032] Among them, refer to Figure 3 and Figure 4 , at each pin, that is, in the shaded areas of Figure 3 and Figure 4 , a silver plating area is provided, which plays a role in improving the electrical connectivity of the product and the stability of the structure.

[0033] Specifically, at least one chip 104 is provided on each base island 103. When one chip 104 is provided on each base island 103, the SOP16 multi-base island packaging structure is a three-chip structure at this time. When two chips 104 are provided on each base island 103, the SOP16 multi-base island packaging structure is a six-chip structure at this time.

[0034] As a preference, the base island 103 is connected to two of the first pin 1, the second pin 2, the third pin 3, the fourth pin 4, the fifth pin 5, the sixth pin 6, the seventh pin 7, and the eighth pin 8; the base island 103 is connected to two of the ninth pin 9, the tenth pin 10, the eleventh pin 11, the twelfth pin 12, the thirteenth pin 13, the fourteenth pin 14, the fifteenth pin 15, and the sixteenth pin 16. This makes the force on the base island 103 on the frame more reasonable and the structure more stable.

[0035] Further, please refer to Figure 3 and Figure 4 , a glue locking hole 106 is further provided on the device unit 100, and the glue locking hole 106 is located inside the packaging area.

[0036] When packaging, the glue locking hole 106 facilitates the locking of the encapsulant, makes the position of the plastic package 105 more accurate, and can better support the base island 103; among them, the chip 104 is connected to each pin through a lead, and the plastic package 105 can also play a role in firmly fixing the lead.

[0037] Further, please refer to Figure 1 , a strip hole 107 is provided on the periphery of the device unit 100.

[0038] A strip hole 107 is provided on the periphery of the device unit 100. The strip hole 107 is a process hole in the processing process. Its purpose is to reduce the connection part between the device unit 100 and the periphery, so as to facilitate punching out individual devices later, reduce the punching force, and thus reduce the pin deformation caused by the punching force.

[0039] The SOP16 multi-base island packaging structure of the present invention realizes an increase in the integration degree of the circuit and an improvement in the application area of the product in terms of structure, and realizes the integration of three or six chips on a single component and has the same functions as three to six components in terms of function. It should be noted that this SOP16 multi-base island packaging structure is also applicable to the ESOP16 packaging.

[0040] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An SOP16 multi-base island packaging structure, including a frame, wherein a plurality of device units (100) are arranged in an array on the frame, and the device units (100) are in a rectangular structure, characterized in that: Upper pin units (101) and lower pin units (102) are arranged on the upper and lower sides of the device unit (100) and are relatively distributed along the horizontal center line of the device unit (100); The device unit (100) includes three base islands (103) and a plastic package (105). At least one chip (104) is provided on each base island (103). The base island (103) is electrically connected to at least one of the upper pin unit (101) and the lower pin unit (102), and the plastic package (105) is used to support the base island (103).

2. The SOP16 multi-base island packaging structure according to claim 1, characterized in that: The upper pin unit (101) includes a first pin (1), a second pin (2), a third pin (3), a fourth pin (4), a fifth pin (5), a sixth pin (6), a seventh pin (7), and an eighth pin (8). The first pin (1), the second pin (2), the third pin (3), the fourth pin (4), the fifth pin (5), the sixth pin (6), the seventh pin (7), and the eighth pin (8) are sequentially distributed along the extending direction of the upper pin unit (101). The base island (103) is connected to at least one of the first pin (1), the second pin (2), the third pin (3), the fourth pin (4), the fifth pin (5), the sixth pin (6), the seventh pin (7), and the eighth pin (8).

3. A SOP16 multi-base island packaging structure according to claim 1, characterized in that: The lower pin unit (102) includes a ninth pin (9), a tenth pin (10), an eleventh pin (11), a twelfth pin (12), a thirteenth pin (13), a fourteenth pin (14), a fifteenth pin (15), and a sixteenth pin (16). The ninth pin (9), the tenth pin (10), the eleventh pin (11), the twelfth pin (12), the thirteenth pin (13), the fourteenth pin (14), the fifteenth pin (15), and the sixteenth pin (16) are sequentially distributed along the extending direction of the lower pin unit (102). The base island (103) is connected to at least one of the ninth pin (9), the tenth pin (10), the eleventh pin (11), the twelfth pin (12), the thirteenth pin (13), the fourteenth pin (14), the fifteenth pin (15), and the sixteenth pin (16).

4. A SOP16 multi-base island packaging structure according to claim 1, characterized in that: A glue locking hole (106) is further provided on the device unit (100), and the glue locking hole (106) is located inside the packaging area.

5. A SOP16 multi-base island packaging structure according to claim 1, characterized in that: A strip-shaped hole (107) is provided on the periphery of the device unit (100).

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