Solder ball cleaning device

Abstract

The utility model relates to a solder ball cleaning device which comprises a base, a first millstone, a lifting assembly, a heating assembly connected with the first millstone, a motor installed at the lifting end of the lifting assembly, a second millstone connected with the motor and a solvent spraying assembly connected with the base. The heating assembly is used for heating the first millstone, the second millstone is located above the first millstone, and the motor drives the second millstone to rotate. The first grinding disc and the second grinding disc grind and clean solder balls, the solvent spraying assembly sprays chemical agents to improve the cleaning effect, the heating assembly heats the first grinding disc and the solder balls to further improve the cleaning effect, and meanwhile the lifting assembly controls the downward pressing pressure of the second grinding disc to avoid excessive grinding. The solder ball can be fully ensured to be cleaned, friction loss is reduced, and production and manufacturing cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of solder ball production and preparation, and more specifically, to a cleaning device for solder balls. Background Art

[0002] Solder balls are new welding materials developed to meet the development of modern microelectronics industry. As an important auxiliary material for BGA and CSP in IC production, solder balls are widely used in modern microelectronics. They are essential process auxiliary materials in the production of functional ICs for products such as laptop computers, mobile communication devices, computer motherboards, light-emitting diodes, liquid crystal displays, PDAs, digital cameras, etc. They play a crucial role especially in the microfabrication process of large-scale integrated circuits. The market demand for solder balls is extremely large, with an annual growth rate of nearly 90%. In particular, the specifications of high-precision and small-diameter solder balls are seriously out of stock.

[0003] In the application of solder balls, there are relatively high requirements for the cleanliness of high-precision and small-diameter solder balls. Currently, the cleaning of solder balls generally adopts simple chemical treatment or physical cleaning, etc. Such methods are difficult to completely remove the dirt and inclusions on the surface of the solder balls. The dirt and inclusions therein will affect the encapsulation effect, and the cleaned solder balls are difficult to meet the high-precision encapsulation requirements. Moreover, higher material losses will occur during the treatment process using these methods, and the sphericity will be damaged, resulting in higher production and manufacturing costs. Especially when cleaning precious metal solder balls such as gold-tin solder microspheres and gold-germanium solder balls, the economic losses caused by the losses are greater and the manufacturing costs are higher. Summary of the Utility Model

[0004] The utility model aims to overcome the defects that simple chemical treatment or physical cleaning in the above-mentioned prior art is difficult to completely remove the dirt and inclusions on the surface of the solder balls and has large material losses, and provides a cleaning device for solder balls, which improves the cleaning effect, reduces the material loss, and reduces the manufacturing cost.

[0005] To solve the above technical problems, the technical solution adopted by the utility model is: a cleaning device for solder balls, comprising: a base, a first grinding disc and a lifting assembly respectively installed on the base, a heating assembly connected to the first grinding disc, a motor installed on the lifting end of the lifting assembly, a second grinding disc connected to the motor, and a solvent spraying assembly connected to the base. The heating assembly is used to heat the first grinding disc. The second grinding disc is located above the first grinding disc, and the motor drives the second grinding disc to rotate.

[0006] The lifting component is used to drive the motor and the second grinding disc to lift. When putting in the solder balls, the lifting component drives the motor and the second grinding disc to rise, and then drives the motor and the second grinding disc to descend, so that the motor drives the second grinding disc to polish and clean the solder balls. The solvent spraying component is used to spray chemical agents, such as chemical cleaning agents, etc., to cooperate with the friction of the first grinding disc and the second grinding disc to further improve the cleaning effect and also provide lubrication for the solder balls, reducing the friction between the first grinding disc and the second grinding disc and the solder balls to a certain extent, thereby reducing the friction loss and production cost. Further, when performing polishing and cleaning, the lifting component controls the downward pressure of the second grinding disc to control the friction between the solder balls and the first grinding disc and the second grinding disc within a reasonable range, avoiding excessive polishing and further reducing the loss; on this basis, a heating component is provided. The heating component is fixedly connected to the first grinding disc and heats the first grinding disc during cleaning, thereby heating the solder balls and the chemical agents, improving the activity of the chemical agents and the cleaning effect of the chemical agents. At the same time, in a high-temperature environment, the dirt and inclusions on the solder balls are more likely to fall off, further improving the cleaning effect. Specifically, the heating temperature of the heating component is associated with the melting point of the solder balls, and the heating temperature is less than the melting point of the solder balls.

[0007] Preferably, it further includes a moving component connected to the base. The moving component includes a first sliding member slidably connected to the base in a first direction, and a first driving member connected to the first sliding member. The first grinding disc is mounted on the first sliding member, and the first driving member drives the first sliding member and the first grinding disc to move in the first direction.

[0008] Setting the moving component enables the first grinding disc to move relative to the base, and thus enables the first grinding disc to move relative to the second grinding disc, improving the rolling effect of the solder balls and further improving the polishing and cleaning effect. The first driving member drives the first sliding member to perform a linear reciprocating movement, thereby driving the first grinding disc to move. The first driving member can be a cylinder or an electric push rod, etc.

[0009] Preferably, the moving component further includes a mounting plate mounted on the first sliding member, a second sliding member slidably connected to the mounting plate in a second direction, and a second driving member connected to the second sliding member. The first grinding disc is mounted on the second sliding member and thus indirectly mounted on the first sliding member. The second driving member drives the second sliding member and the first grinding disc to move in the second direction, and the second direction is perpendicular to the first direction.

[0010] The mounting plate is mounted on the first sliding member, such that the first driving member can drive the mounting plate to move in the first direction. The second driving member is mounted on the mounting plate, and the second sliding member is slidably connected to the mounting plate in the second direction. The first grinding disc is mounted on the second sliding member. The second driving member drives the second sliding member to perform a linear reciprocating movement, thereby driving the first grinding disc to move in the second direction. The second direction is perpendicular to the first direction, such that the first grinding disc can move arbitrarily in two directions, improving the range of its movement, further enhancing the effect of rolling the solder balls, and enabling the solder balls to be polished more cleanly.

[0011] Preferably, the moving assembly further includes a first screw rod connected to the first driving member. The first screw rod is in threaded connection with the first sliding member. When the first screw rod rotates, it drives the first sliding member to move.

[0012] The first driving member is connected to the first screw rod, and the first sliding member is in threaded connection with the first screw rod. Specifically, the first sliding member is only slidably connected to the base and does not rotate relative to the base. When the first screw rod rotates, it can drive the first sliding member to move. The first screw rod is provided for transmission to improve the movement precision of the first sliding member, which is conducive to precise control.

[0013] Preferably, the moving assembly further includes a second screw rod connected to the second driving member. The second screw rod is in threaded connection with the second sliding member. When the second screw rod rotates, it drives the second sliding member to move.

[0014] The second sliding member is only slidably connected to the mounting plate and does not rotate relative to the mounting plate. The setting method of the second screw rod refers to that of the first screw rod.

[0015] Preferably, it further includes a sealing cover fixedly connected to the motor. The sealing cover simultaneously covers the first grinding disc and the second grinding disc. The sealing cover is provided with a first through hole, and the solvent spraying assembly sprays solvent through the first through hole.

[0016] The sealing cover is fixedly connected to the motor and moves up and down with the motor. When the sealing cover descends, it covers the first grinding disc and the second grinding disc, that is, covers the first grinding disc and the second grinding disc, which has the advantages of heat preservation, preventing chemical agents from splashing, and improving operation safety. It can also isolate the external air and reduce the oxidation of the solder balls.

[0017] Preferably, it further includes a placement groove provided at the top of the base. The first grinding disc is disposed in the placement groove, and the sealing cover is disposed above the placement groove.

[0018] A placement groove is provided on the base, and the first grinding disc is set therein. When the sealing cover descends, a relatively sealed space is jointly formed with the placement groove, improving the use effect of the sealing cover. The placement groove also has the function of gathering chemical agents.

[0019] Preferably, it further includes an atmosphere device connected to the base. A second through hole is provided on the sealing cover, and the atmosphere device inputs gas into the sealing cover through the second through hole.

[0020] The atmosphere device is used to input inert gas into the sealing cover, thereby exhausting the oxygen in the sealing cover and further reducing the oxidation of the solder balls.

[0021] Preferably, the lifting assembly includes a third driving member connected to the base, a third screw rod connected to the third driving member, and a connecting member vertically slidably connected to the base. The third screw rod is threadedly connected to the connecting member, and when the third screw rod rotates, it drives the connecting member to lift and lower.

[0022] The connecting member is only vertically slidably connected to the base and does not rotate relative to the base. When the third screw rod rotates, it drives the connecting member to lift and lower.

[0023] Preferably, a display screen and several operation buttons are provided on the base.

[0024] The display screen and the operation buttons are used for convenient operation. The display screen is an ordinary display screen or a touch screen.

[0025] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0026] The first grinding disc and the second grinding disc polish and clean the solder balls. The solvent spraying assembly sprays chemical agents to improve the cleaning effect. The heating assembly heats the first grinding disc and the solder balls to further improve the cleaning effect. At the same time, the lifting assembly controls the downward pressure of the second grinding disc to avoid excessive polishing, fully ensuring that the solder balls can be cleaned while reducing friction loss and lowering the production and manufacturing cost. Description of the Drawings

[0027] Figure 1 is the overall structure schematic diagram of a cleaning device for solder balls of the present utility model Figure One ;

[0028] Figure 2 is the overall structure schematic diagram of a cleaning device for solder balls of the present utility model Figure Two ;

[0029] Figure 3 is the internal mechanism schematic diagram of a cleaning device for solder balls of the present utility model.

[0030] In the figure: 1. Base; 101. Placing groove; 2. First grinding disc; 3. Lifting assembly; 301. Third driving member; 302. Third screw; 303. Connecting member; 4. Heating assembly; 5. Motor; 6. Second grinding disc; 7. Solvent spraying assembly; 8. First sliding member; 9. First driving member; 10. Mounting plate; 11. Second sliding member; 12. Second driving member; 13. First screw; 14. Second screw; 15. Sealing cover; 1501. First through hole; 1502. Second through hole; 16. Atmosphere device; 17. Display screen; 18. Operation button; 19. Elastic member. Detailed implementation manners

[0031] The attached drawings are only for illustrative purposes and should not be construed as limitations on this patent; for better illustration of this embodiment, some components in the attached drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the attached drawings may be omitted. The positional relationships described in the attached drawings are only for illustrative purposes and should not be construed as limitations on this patent.

[0032] In the attached drawings of the embodiments of the present utility model, the same or similar reference numerals correspond to the same or similar components; in the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", "long", "short", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the attached drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the attached drawings are only for illustrative purposes and should not be construed as limitations on this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0033] The technical solutions of the present utility model will be further specifically described below through specific embodiments and in conjunction with the attached drawings:

[0034] Embodiment 1

[0035] As Figures 1-3 shown, a cleaning device for solder balls includes: a base 1, a first grinding disc 2 and a lifting assembly 3 respectively installed on the base 1, a heating assembly 4 connected to the first grinding disc 2, a motor 5 installed on the lifting end of the lifting assembly 3, a second grinding disc 6 connected to the motor 5, and a solvent spraying assembly 7 connected to the base 1. The heating assembly 4 is used to heat the first grinding disc 2. The second grinding disc 6 is located above the first grinding disc 2, and the motor 5 drives the second grinding disc 6 to rotate.

[0036] The lifting assembly 3 is used to drive the motor 5 and the second grinding disc 6 to lift. When putting in the solder balls, the lifting assembly 3 drives the motor 5 and the second grinding disc 6 to rise, and then drives the motor 5 and the second grinding disc 6 to descend, so that the motor 5 drives the second grinding disc 6 to polish and clean the solder balls. The solvent spraying assembly 7 is used to spray chemical agents, such as chemical cleaning agents, etc., to cooperate with the friction of the first grinding disc 2 and the second grinding disc 6 to further improve the cleaning effect, and also provide lubrication for the solder balls, reducing the friction between the first grinding disc 2 and the second grinding disc 6 to a certain extent, thereby reducing the friction loss and the production cost. Further, when performing the grinding and cleaning, the lifting assembly 3 controls the downward pressure of the second grinding disc 6 to control the friction between the solder balls and the first grinding disc 2 and the second grinding disc 6 within a reasonable range, avoiding excessive grinding and further reducing the loss; on this basis, a heating assembly 4 is provided. The heating assembly 4 is fixedly connected to the first grinding disc 2 and heats the first grinding disc 2 during cleaning, thereby heating the solder balls and the chemical agents, improving the activity of the chemical agents and the cleaning effect of the chemical agents. At the same time, in a high-temperature environment, the dirt and inclusions on the solder balls are more likely to fall off, further improving the cleaning effect. Specifically, the heating temperature of the heating assembly 4 is associated with the melting point of the solder balls, and the heating temperature is less than the melting point of the solder balls.

[0037] The beneficial effects of this embodiment: The first grinding disc 2 and the second grinding disc 6 polish and clean the solder balls. The solvent spraying assembly 7 sprays chemical agents to improve the cleaning effect. The heating assembly 4 heats the first grinding disc 2 and the solder balls to further improve the cleaning effect. At the same time, the lifting assembly 3 controls the downward pressure of the second grinding disc 6 to avoid excessive grinding, fully ensuring that the solder balls can be cleaned while reducing the friction loss and the production and manufacturing cost.

[0038] Embodiment 2

[0039] As Figures 1-3 shown, based on Embodiment 1, the difference from Embodiment 1 is that:

[0040] It further includes a moving component connected to the base 1. The moving component includes a first sliding member 8 slidably connected to the base 1 in a first direction, and a first driving member 9 connected to the first sliding member 8. The first grinding disc 2 is mounted on the first sliding member 8, and the first driving member 9 drives the first sliding member 8 and the first grinding disc 2 to move in the first direction. The moving component further includes a mounting plate 10 mounted on the first sliding member 8, a second sliding member 11 slidably connected to the mounting plate 10 in a second direction, and a second driving member 12 connected to the second sliding member 11. The first grinding disc 2 is mounted on the second sliding member 11 and thus indirectly mounted on the first sliding member 8. The second driving member 12 drives the second sliding member 11 and the first grinding disc 2 to move in the second direction, and the second direction is perpendicular to the first direction. The moving component further includes a first screw rod 13 connected to the first driving member 9. The first screw rod 13 is threadedly connected to the first sliding member 8, and when the first screw rod 13 rotates, it drives the first sliding member 8 to move. The moving component further includes a second screw rod 14 connected to the second driving member 12. The second screw rod 14 is threadedly connected to the second sliding member 11, and when the second screw rod 14 rotates, it drives the second sliding member 11 to move. It further includes a sealing cover 15 fixedly connected to the motor 5. The sealing cover 15 covers both the first grinding disc 2 and the second grinding disc 6 at the same time. A first through hole 1501 is provided on the sealing cover 15, and the solvent spraying component 7 sprays the solvent through the first through hole 1501. It further includes a placement groove 101 provided at the top of the base 1. The first grinding disc 2 is disposed in the placement groove 101, and the sealing cover 15 is disposed above the placement groove 101.

[0041] A moving component is provided to enable the first grinding disc 2 to move relative to the base 1, and further enable the first grinding disc 2 to move relative to the second grinding disc 6, improving the rolling effect of the solder balls, and thus enhancing the grinding and cleaning effect. The first driving member 9 drives the first sliding member 8 to perform a linear reciprocating movement, thereby driving the first grinding disc 2 to move. The first driving member 9 can be a cylinder or an electric push rod, etc. The mounting plate 10 is mounted on the first sliding member 8, enabling the first driving member 9 to drive the mounting plate 10 to move in the first direction. The second driving member 12 is mounted on the mounting plate 10, and the second sliding member 11 is slidably connected to the mounting plate 10 in the second direction. The first grinding disc 2 is mounted on the second sliding member 11. The second driving member 12 drives the second sliding member 11 to perform a linear reciprocating movement, thereby driving the first grinding disc 2 to move in the second direction. The second direction is perpendicular to the first direction, enabling the first grinding disc 2 to move arbitrarily in two directions, increasing its movable range, further enhancing the rolling effect of the solder balls, and making the solder balls cleaner after grinding. The first driving member 9 is connected to the first screw rod 13, and the first sliding member 8 is threadedly connected to the first screw rod 13. Specifically, the first sliding member 8 is only slidably connected to the base 1 and does not rotate relative to the base 1. When the first screw rod 13 rotates, it can drive the first sliding member 8 to move. The first screw rod 13 is provided for transmission to improve the movement accuracy of the first sliding member 8, which is beneficial for precise control. The second sliding member 11 is only slidably connected to the mounting plate 10 and does not rotate relative to the mounting plate 10. The setting method of the second screw rod 14 refers to that of the first screw rod 13. The sealing cover 15 is fixedly connected to the motor 5 and moves up and down with the motor 5. When the sealing cover 15 descends, it covers the first grinding disc 2 and the second grinding disc 6, that is, covers the first grinding disc 2 and the second grinding disc 6, which has the advantages of heat preservation, preventing chemical agents from splashing, and improving operation safety. It can also isolate the external air and reduce the oxidation of the solder balls. A placement groove 101 is provided on the base 1, and the first grinding disc 2 is arranged therein. When the sealing cover 15 descends, it forms a relatively sealed space together with the placement groove 101, improving the use effect of the sealing cover 15. The placement groove 101 also has the function of gathering chemical agents.

[0042] The remaining features and working principles of this embodiment are the same as those of Embodiment 1.

[0043] Embodiment 3

[0044] As Figures 1-3 shown, on the basis of Embodiment 1 or Embodiment 2, further limitations are imposed on Embodiment 1 or Embodiment 2. The difference lies in:

[0045] It further includes an atmosphere device 16 connected to the base 1. A second through hole 1502 is provided on the sealing cover 15, and the atmosphere device 16 inputs gas into the sealing cover 15 through the second through hole 1502. The lifting assembly 3 includes a third driving member 301 connected to the base 1, a third screw rod 302 connected to the third driving member 301, and a connecting member 303 vertically slidably connected to the base 1. The third screw rod 302 is threadedly connected to the connecting member 303. When the third screw rod 302 rotates, it drives the connecting member 303 to lift and lower. A display screen 17 and a plurality of operation buttons 18 are provided on the base 1.

[0046] The atmosphere device 16 is used to input inert gas into the sealing cover 15, thereby exhausting the oxygen in the sealing cover 15 and further reducing the oxidation of the solder balls. The connecting member 303 is only vertically slidably connected to the base 1 and does not rotate relative to the base 1. When the third screw rod 302 rotates, it drives the connecting member 303 to lift and lower. The display screen 17 and the operation buttons 18 are used for convenient operation. The display screen 17 is an ordinary display screen 17 or a touch screen.

[0047] In this embodiment, the first driving member 9, the second driving member 12, and the third driving member 301 are all motors.

[0048] In this embodiment, the second grinding disc 6 is vertically slidably connected to the first sliding member 8. An elastic member 19 is further provided between the second grinding disc 6 and the first sliding member 8. The two ends of the elastic member 19 respectively abut against the second grinding disc 6 and the first sliding member 8. When the second grinding disc 6 is forced to descend, the elastic member 19 is compressed, further controlling the extrusion pressure on the solder balls, further improving the cleaning effect, and reducing the loss of the solder balls.

[0049] The remaining working principles and working processes of this embodiment are the same as those of Embodiment 1 or Embodiment 2.

[0050] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention and are not limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A cleaning device for solder balls, characterized in that, Comprising: A base (1), a first grinding disc (2) and a lifting assembly (3) respectively mounted on the base (1), a heating assembly (4) connected to the first grinding disc (2), a motor (5) mounted on the lifting end of the lifting assembly (3), a second grinding disc (6) connected to the motor (5), and a solvent spraying assembly (7) connected to the base (1). The heating assembly (4) is used to heat the first grinding disc (2). The second grinding disc (6) is located above the first grinding disc (2), and the motor (5) drives the second grinding disc (6) to rotate.

2. The cleaning device for solder balls according to claim 1, characterized in that: It further includes a moving assembly connected to the base (1). The moving assembly includes a first sliding member (8) slidably connected to the base (1) in a first direction, and a first driving member (9) connected to the first sliding member (8). The first grinding disc (2) is mounted on the first sliding member (8), and the first driving member (9) drives the first sliding member (8) and the first grinding disc (2) to move in the first direction.

3. The cleaning device for solder balls according to claim 2, wherein: The moving assembly further includes a mounting plate (10) mounted on the first sliding member (8), a second sliding member (11) slidably connected to the mounting plate (10) in a second direction, and a second driving member (12) connected to the second sliding member (11). The first grinding disc (2) is mounted on the second sliding member (11) and thus indirectly mounted on the first sliding member (8). The second driving member (12) drives the second sliding member (11) and the first grinding disc (2) to move in the second direction, and the second direction is perpendicular to the first direction.

4. The cleaning device for solder balls according to claim 2, characterized in that: The moving assembly further includes a first screw rod (13) connected to the first driving member (9). The first screw rod (13) is threadedly connected to the first sliding member (8). When the first screw rod (13) rotates, it drives the first sliding member (8) to move.

5. The cleaning device for solder balls according to claim 3, wherein: The moving assembly further includes a second screw rod (14) connected to the second driving member (12). The second screw rod (14) is threadedly connected to the second sliding member (11). When the second screw rod (14) rotates, it drives the second sliding member (11) to move.

6. The cleaning device for solder balls according to claim 1, wherein: It further includes a sealing cover (15) fixedly connected to the motor (5). The sealing cover (15) covers both the first grinding disc (2) and the second grinding disc (6) at the same time. A first through hole (1501) is provided on the sealing cover (15), and the solvent spraying assembly (7) sprays solvent through the first through hole (1501).

7. The cleaning device for solder balls according to claim 6, wherein: It further includes a placement groove (101) provided at the top of the base (1). The first grinding disc (2) is arranged in the placement groove (101), and the sealing cover (15) is arranged above the placement groove (101).

8. The cleaning device for solder balls according to claim 6, wherein: It further includes an atmosphere device (16) connected to the base (1). A second through hole (1502) is provided on the sealing cover (15), and the atmosphere device (16) inputs gas into the sealing cover (15) through the second through hole (1502).

9. A cleaning device for solder balls according to any one of claims 1-8, characterized in that: The lifting assembly (3) includes a third driving member (301) connected to the base (1), a third screw rod (302) connected to the third driving member (301), and a connecting member (303) vertically slidably connected to the base (1). The third screw rod (302) is threadedly connected to the connecting member (303). When the third screw rod (302) rotates, it drives the connecting member (303) to move up and down.

10. A cleaning device for solder balls according to any one of claims 1-8, characterized in that: A display screen (17) and a plurality of operation buttons (18) are provided on the base (1).

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