Film forming device for thin film transistor production

Abstract

The utility model belongs to the technical field of thin film transistor film forming equipment, and particularly relates to a film forming device for thin film transistor production, which comprises an equipment main body, and a loading box, a loading-out box and a deposition box which are arranged above the equipment main body, a limiting frame is arranged above the carrying table, a top plate in the limiting frame abuts against a silicon wafer so that the silicon wafer can be positioned to the center position of the surface of the carrying table, a plug plate in butt joint with a clamping base on the outer side of the carrying table is arranged below the limiting frame, a boss is arranged above the position, close to the outer side, of the carrying table, and a base is arranged in the limiting frame. When the limiting frame is pressed downwards, the abutting boss is extruded inwards to slide, so that the using position of the top plate is controlled. Products are automatically positioned in the mode that the adjacent top plates move at the same time, the products are placed at the preset positions and are automatically fixed through the pressing plates, the effect of accurate deposition film forming is achieved, meanwhile, the follow-up operation difficulty is lowered, and the production efficiency, quality and using effect of equipment are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of thin film transistor film forming equipment, and particularly relates to a film forming device for the production of thin film transistors. Background Art

[0002] A thin film transistor, also known as a TFT, is an important electronic device and is widely used in fields such as display devices. During the production process, a thin film deposition device is required to prepare a thin film layer with specific functions. This layer of film can be an insulating compound, polycrystalline semiconductor silicon, metal, etc., and is an important part of the TFT structure.

[0003] Currently, when the existing thin film deposition device is in use, it is necessary to pre-place the silicon wafer in the middle position on the surface of the carrier table. However, the silicon wafer is small while the carrier table is large, which makes the positioning operation of the silicon wafer difficult and affects the subsequent thin film deposition effect.

[0004] To solve the above problems, a film forming device for the production of thin film transistors is proposed in this application. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a film forming device for the production of thin film transistors, which solves the problems raised in the above background art.

[0006] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0007] The utility model provides a film forming device for the production of thin film transistors, including: a device main body, and a loading box, an unloading box and a deposition box above it. A carrier table is arranged inside the loading box; a limiting frame is arranged above the carrier table. The silicon wafer is positioned at the center position of the surface of the carrier table by the top plate inside. A plug plate is arranged below the limiting frame and is docked with the clamping seat on the outer side of the carrier table. A convex platform is arranged above the adjacent outer side position of the carrier table. A base is arranged inside the limiting frame. When the limiting frame is pressed down, the base presses against the convex platform and is squeezed inward to form a slip, so as to control the use position of the top plate; a hanging plate is arranged below the top plate to adapt to the distance between the top plate and the surface of the carrier table. A seat plate is arranged below the hanging plate and is attached to the surface of the carrier table to maintain the lateral state with a pressing plate on one side at the top plate. The pressing plate is used to squeeze the silicon wafer to fix it for the operation of the carrier table.

[0008] Further, side plates are arranged at both ends of the top plate for rotatably installing connecting rods inside the limiting frame. The other ends of the connecting rods are rotatably installed outside the upper shaft of the base.

[0009] Further, a sliding seat is arranged at the upper end of the shaft of the base and is slidably installed inside the side groove on the inner side of the limiting frame.

[0010] Furthermore, a T-shaped slideway is connected above the side groove for installing the adapter block, and the elastic telescopic rods on both sides thereof are connected to the slide seat to drive it to automatically reset and slide to both sides.

[0011] Furthermore, a protruding block is provided on the outer side of the plug plate, which is squeezed and fixed by the blocking pad inside the card seat.

[0012] Furthermore, the blocking pad forms a positioning groove after squeezing the protruding block to cover it so as to increase the installation stability of the plug plate.

[0013] Furthermore, a horizontal handle is provided above the limit frame, and the limit frame can be retracted at any time when the carrier is installed inside the loading box.

[0014] The utility model has the following beneficial effects:

[0015] The utility model can cooperate with the plug plate and the card seat to drive the connecting rod to rotate to push the top plate when the carrier is pressed down to different positions through the boss. At this time, the top plates on the four sides press against the edge positions of the silicon wafer, so that it moves to the center position of the carrier surface to form a positioning, so as to ensure the subsequent deposition effect and guarantee the film quality;

[0016] The utility model can hoist the hanging plate, and the base plate can ensure the lateral state of the pressure plate when the top plate moves inward, so as to ensure that the pressure plate automatically squeezes the edge position of the adjacent top plate when it is against the silicon wafer to form a limit. At this time, the carrier can be directly placed inside the loading box without worrying about the silicon wafer being misplaced. Its simple operation can greatly reduce the difficulty of operation and improve work efficiency.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a schematic diagram of the overall appearance structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the device body and its internal platform structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the appearance structure of the platform of the utility model;

[0022] Figure 4Schematic cross-sectional structure diagram of the stage of the present utility model;

[0023] Figure 5 Schematic diagram of the internal partial structure of the limit frame of the present utility model;

[0024] Figure 6 Schematic diagram of the partial enlarged structure of part A of the present utility model;

[0025] Figure 7 Schematic diagram of the partial structure of the top plate of the present utility model;

[0026] In the drawings, the list of components represented by each reference numeral is as follows:

[0027] In the figure: 1, equipment main body; 2, loading box; 3, unloading box; 4, deposition box; 5, stage; 6, limit frame; 7, top plate; 8, side plate; 9, connecting rod; 10, convex platform; 11, hanging plate; 12, side groove; 13, plug plate; 14, card seat; 15, sliding seat; 16, base; 17, elastic telescopic rod; 18, adapter block; 19, protruding block; 20, blocking pad; 21, positioning groove; 22, seat plate; 23, pressing plate. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] In the description of the present utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery", etc. indicating the orientation or positional relationship are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0030] Please refer to Figure 1-7 As shown, the present utility model is a film forming device for thin film transistor production, including: an equipment main body 1 and a loading box 2, an unloading box 3 and a deposition box 4 above it. The inside of the loading box 2 is provided with a stage 5;

[0031] Above the stage 5, a limit frame 6 is provided. The top plate 7 inside presses against the silicon wafer to position it at the center of the surface of the stage 5. Below the limit frame 6, a plug plate 13 is provided which is docked with the outer card seat 14 of the stage 5. Above the adjacent outer position of the stage 5, a boss 10 is provided. Inside the limit frame 6, a base 16 is provided. When the limit frame 6 presses down, it presses against the boss 10 and is squeezed inward to form a slip, so as to control the use position of the top plate 7;

[0032] Below the top plate 7, a hanging plate 11 is provided to adapt to the distance between the top plate 7 and the surface of the stage 5. Below the hanging plate 11, a seat plate 22 is provided which fits on the surface of the stage 5 to maintain the lateral state with the pressing plate 23 on one side of the top plate 7. The pressing plate 23 is used to squeeze the silicon wafer to fix it, which is convenient for the operation of the stage 5;

[0033] This embodiment provides a thin film deposition device with accurate film formation position. By the way that adjacent top plates 7 move simultaneously, the product is automatically positioned, placed at a predetermined position and automatically fixed by the pressing plate 23, reducing the subsequent operation difficulty, so as to improve the production efficiency, quality and use effect of the device.

[0034] Among them, at both ends of the top plate 7, side plates 8 are provided for rotatably installing the connecting rods 9 inside the limit frame 6. The other ends of the connecting rods 9 are rotatably installed outside the upper shafts of the base 16. Both ends of the connecting rods 9 are transfer block mechanisms with through holes inside.

[0035] Among them, at the upper end of the shaft of the base 16, a sliding seat 15 is provided, which is slidably installed inside the side groove 12 on the inner side of the limit frame 6. The sliding seat 15 and the base 16 below it are symmetrically distributed at both ends of each side of the limit frame 6.

[0036] Among them, a T-shaped slideway is connected above the side groove 12 for installing the transfer block 18. Through the elastic telescopic rods 17 on both sides of it, it is docked with the sliding seat 15 to drive it to automatically reset and slide to both sides, achieving the effect of automatically storing the top plate 7, and at the same time being convenient for the next use.

[0037] Among them, a raised block 19 is provided on the outside of the plug plate 13, which is squeezed and fixed by the blocking pad 20 inside the card seat 14. Through this, the plug plate 13 can be fixed at different depths to position silicon wafers of different sizes.

[0038] Among them, after the blocking pad 20 squeezes the raised block 19, a positioning groove 21 is formed to wrap it to increase the installation stability of the plug plate 13.

[0039] Among them, a horizontal handle is provided above the limit frame 6 to retract the limit frame 6 at any time when the stage 5 is installed into the loading box 2.

[0040] It can be understood that the utility model automatically completes the positioning of the product by means of the simultaneous movement of adjacent top plates 7, places it at a predetermined position and is automatically fixed by the pressing plate 23, achieving the effect of precise film deposition, while reducing the subsequent operation difficulty, so as to improve the production efficiency, quality and use effect of the equipment.

[0041] A specific application of the operation process of this embodiment is as follows: When in use, first place the limit frame 6 above the stage 5 by docking the plug plate 13 with the card seat 14, and fix it by the blocking pad 20 pressing the raised block 19. At this time, the sliding seat 15 moves towards the middle position under the guidance of the boss 10 on the base 16, so that the connecting rod 9 rotates and gradually approaches a state perpendicular to the edge line of the limit frame 6, and then drives the adjacent top plates 7 to simultaneously press against the silicon wafer to position it at the center position on the surface of the stage 5. Through this, the positioning and placement operation is quickly completed. While facilitating the subsequent film deposition operation, by using the hoisting structure of the hanging plate 11, it can automatically rotate during the inward movement of the top plate 7 to adapt to the distance from the surface of the stage 5, and under the limiting effect of the seat plate 22, the pressing plate 23 always remains flat to press against the upper part of the edge position of the silicon wafer to achieve the fixing effect. At this time, the stage 5 can be directly placed into the loading box 2 for film deposition production operation, reducing the operation difficulty and improving the work efficiency, while ensuring the film deposition quality and improving the use effect of the equipment.

[0042] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. The embodiments selected and specifically described in this specification are to better explain the principle and practical application of the utility model, so that those skilled in the relevant technical field can well understand and utilize the utility model. The utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A film forming device for manufacturing thin film transistors, characterized in that, Including: The device main body (1), the loading box (2), the unloading box (3) and the deposition box (4) above it. A carrier table (5) is provided inside the loading box (2); Above the carrier table (5), a limiting frame (6) is provided. The silicon wafer is positioned at the center of the surface of the carrier table (5) by the internal top plate (7). Below the limiting frame (6), a plug plate (13) is provided which is docked with the outer clamping seat (14) of the carrier table (5). Above the outer adjacent position of the carrier table (5), a boss (10) is provided. Inside the limiting frame (6), a base (16) is provided. When the limiting frame (6) is pressed down, it presses against the boss (10) and is squeezed inward to form a slip, so as to control the use position of the top plate (7); Below the top plate (7), a hanging plate (11) is provided to adapt to the distance between the top plate (7) and the surface of the carrier table (5). Below the hanging plate (11), a seat plate (22) is provided which fits on the surface of the carrier table (5) to maintain the lateral state with a pressing plate (23) on one side at the top plate (7). The pressing plate (23) is used to squeeze the silicon wafer to fix it for the operation of the carrier table (5).

2. The film forming device for manufacturing a thin film transistor according to claim 1, wherein: At both ends of the top plate (7), side plates (8) are provided for rotatably installing the connecting rods (9) inside the limiting frame (6). The other ends of the connecting rods (9) are rotatably installed outside the upper rotating shaft of the base (16).

3. A film forming apparatus for manufacturing a thin film transistor according to claim 1, characterized in that: At the upper end of the rotating shaft of the base (16), a sliding seat (15) is provided, and the sliding seat is installed inside the side groove (12) inside the limiting frame (6).

4. A film forming device for manufacturing thin film transistors according to claim 3, characterized in that: Above the side groove (12), a T-shaped slideway is communicated for installing a transfer block (18). The transfer block (18) is docked with the sliding seat (15) through the elastic telescopic rods (17) on both sides to drive it to automatically reset and slide to both sides.

5. The film forming device for manufacturing thin film transistors according to claim 1, characterized in that: On the outer side of the plug plate (13), a raised block (19) is provided, which is fixed by being squeezed by the blocking pad (20) inside the clamping seat (14).

6. A film forming device for manufacturing a thin film transistor according to claim 5, characterized in that: After the blocking pad (20) squeezes the raised block (19), a positioning groove (21) is formed to wrap it to increase the installation stability of the plug plate (13).

7. A film forming device for manufacturing a thin film transistor according to claim 1, characterized in that: Above the limiting frame (6), a horizontal handle is provided to retract the limiting frame (6) at any time when the carrier table (5) is installed inside the loading box (2).

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