Portal frame for preventing vibration of circuit board in gantry line electroplating process

Abstract

The utility model relates to a portal frame for preventing vibration of a circuit board in a gantry line electroplating process, and relates to the technical field of gantry line electroplating, the portal frame comprises a frame body, a mounting seat and a driving assembly, the mounting seat is slidably arranged on the frame body, an electroplating liquid tank used for electroplating a PCB is arranged on the mounting seat, and the driving assembly is used for driving the mounting seat to slide; the driving assembly drives the mounting base to slide in the direction close to the PCB and enables the PCB to be immersed in the electroplating liquid tank. The PCB is clamped through the clamp on the portal frame, the portal frame drives the clamp clamping the PCB to move left and right to a designated position, then it is guaranteed that the PCB is immovable, the driving assembly drives the mounting base to slide in the direction close to the PCB, and finally the PCB is completely immersed in an electroplating solution in the electroplating solution tank. The electroplating process of the PCB is realized, and the probability of shaking of the PCB in the electroplating process is reduced.

Description

Technical Field

[0001] This application relates to the technical field of gantry line electroplating, and in particular to a gantry for preventing vibration of circuit boards in a gantry line electroplating process. Background Art

[0002] The gantry line electroplating process is widely recognized in the electroplating of PCB circuit boards and is regarded as an effective means to solve the problem of high - efficiency electroplating. The core equipment of this process is a huge gantry that can handle the electroplating tasks of multiple circuit boards simultaneously. This gantry is equipped with double - parallel sliding rails and is equipped with multiple clamps that can slide freely on the rails. Each clamp has a strong clamping ability and can firmly fix a PCB circuit board to assist it in completing the electroplating process.

[0003] Currently, the operation mode of this system is as follows: When all the clamps carrying the PCB circuit boards reach above the electroplating solution tank, the clamps will start to move downwards, gradually immersing the PCB circuit boards into the electroplating solution for electroplating. After electroplating is completed, the clamps will carry the PCB circuit boards away from the electroplating solution tank and send them to the next process or directly for subsequent processing.

[0004] In the traditional gantry line electroplating process, the electroplating solution tank is in a static state, and the PCB circuit board clamps immerse the circuit boards into the electroplating solution tank by moving up and down for electroplating. After electroplating is completed, the PCB circuit boards are lifted and removed from the electroplating solution tank and enter the next process flow. During this process, the clamps need to grasp the PCB circuit boards and move them left and right, and then sink them into the electroplating solution tank. During this process, the PCB circuit boards will shake. When there are a large number of PCB circuit boards moving left - right and up - down simultaneously on the gantry, resonance may occur between these PCB circuit boards, thus exacerbating the shaking. If the shaking PCB circuit boards enter the electroplating solution tank, it will affect the quality and effect of electroplating. Therefore, how to reduce the shaking of PCB circuit boards is an urgent problem to be solved in the gantry electroplating process. Summary of the Utility Model

[0005] In order to reduce the probability of shaking of PCB circuit boards during the electroplating process, this application provides a gantry for preventing vibration of circuit boards in a gantry line electroplating process.

[0006] A gantry for preventing vibration of circuit boards in a gantry line electroplating process provided by this application adopts the following technical solutions:

[0007] A gantry for preventing the vibration of a circuit board in a gantry line electroplating process, comprising a frame body, a mounting seat and a driving assembly. The mounting seat is slidably arranged on the frame body in a direction close to or away from the PCB circuit board. An electroplating solution tank for electroplating the PCB circuit board is arranged on the mounting seat. The driving assembly is arranged on the frame body and is used to drive the mounting seat to slide. The driving assembly drives the mounting seat to slide in a direction close to the PCB circuit board, so that the PCB circuit board is immersed in the electroplating solution tank.

[0008] By adopting the above technical solution, the PCB circuit board is clamped by the fixture on the gantry. The gantry drives the fixture with the clamped PCB circuit board to move left and right to the designated position. Then, ensuring that the PCB circuit board does not move, the driving assembly drives the mounting seat to slide in a direction close to the PCB circuit board. Finally, the PCB circuit board is completely immersed in the electroplating solution in the electroplating solution tank, realizing the electroplating process of the PCB circuit board and reducing the probability of the PCB circuit board shaking during the electroplating process.

[0009] Furthermore, the driving assembly includes:

[0010] Guide columns. Multiple groups of the guide columns are arranged on the frame body at intervals and pass through the mounting seat. The multiple groups of guide columns are used to guide the sliding of the mounting seat.

[0011] A sliding driving member. The sliding driving member is arranged on the frame body and is used to drive the mounting seat to slide.

[0012] By adopting the above technical solution, the sliding driving member drives the mounting seat to slide, and the guide columns guide the sliding of the mounting seat, thereby improving the stability of the sliding of the mounting seat.

[0013] Furthermore, an auxiliary support assembly for supporting the mounting seat and reducing the acting force of the mounting seat on the driving assembly is arranged on the frame body. The auxiliary support assembly includes:

[0014] Support frames. Multiple groups of the support frames are arranged on the frame body at intervals and are located on opposite sides of the mounting seat.

[0015] Support blocks. The support blocks are slidably arranged on the support frames. The sliding direction of the support blocks is perpendicular to the sliding direction of the mounting seat in the opposite direction. The support blocks are used to support the bottom of the mounting seat.

[0016] Support driving members. The support driving members are arranged on the support frames and are used to drive the support blocks to slide.

[0017] By adopting the above technical solution, when the mounting seat slides to the designated position, due to the long electroplating time, the support driving block is used to push the support block to slide on the support frame, thereby supporting the bottom of the mounting seat and reducing the acting force of the mounting seat on the driving assembly.

[0018] Further, a sliding hole facilitating the sliding of the support block is formed in the support frame. An installation groove is formed at the bottom of the sliding hole, and a plurality of groups of roller shafts are rotatably arranged in the installation groove. The support block is in rolling connection with the roller shafts.

[0019] By adopting the above technical solution, when the support block slides in the sliding hole, the roller shafts rotatably installed in the installation groove are used to roll-support the support block, so as to facilitate the sliding of the support block in the sliding hole.

[0020] Further, the auxiliary support components on both sides of the mounting seat are symmetrical to each other. An inclined support surface is arranged on the top of the end of the support block away from the support driving member, and the height of the inclined support surface near the support driving member is higher than the height of the end away from the support driving member.

[0021] By adopting the above technical solution, when the support block slides towards the side close to the mounting seat, the support force of the support block on the mounting seat is gradually increased through the inclined support surface. At the same time, through the symmetrical auxiliary support components, the horizontal force between the support block and the mounting seat is offset, and finally the support effect of the support block on the mounting seat is improved.

[0022] Further, a control component for controlling the sliding speed of the mounting seat is arranged on the support frame. The control component includes:

[0023] An inductor, which is arranged on the support frame and used to detect the position of the electroplating solution tank;

[0024] A controller, which is arranged on the frame body and electrically connected to the inductor. The controller controls the driving speed of the sliding driving member on the mounting seat according to the detection result of the inductor.

[0025] By adopting the above technical solution, when the inductor detects the electroplating solution tank, the distance between the surface PCB circuit board and the electroplating solution tank is small. The controller reduces the sliding speed of the mounting seat, which facilitates the slow and stable insertion of the PCB circuit board into the electroplating solution tank, so as to improve the electroplating effect of the PCB circuit board.

[0026] Further, a plurality of groups of mounting seats and driving components for driving the mounting seats to slide are arranged at intervals on the frame body. Solution tanks for acid degreasing, water washing and micro-etching of the PCB circuit board are respectively arranged on the mounting seats.

[0027] By adopting the above technical solution, the plurality of groups of mounting seats and driving components installed at intervals perform different processes respectively, so as to realize processes such as acid degreasing, water washing and micro-etching of the PCB circuit board.

[0028] Further, a buffer groove is formed in the frame body, and a buffer pad for buffering the bottom of the mounting seat is arranged in the buffer groove. The buffer pad can undergo elastic deformation and has a thickness greater than the depth of the buffer groove when no external force is applied.

[0029] By adopting the above technical solution, when the mounting seat slides towards one end close to the frame body, it first abuts tightly against the buffer pad, thereby buffering the sliding speed of the mounting seat. Finally, the mounting seat is supported by the bottom of the frame body, reducing the force exerted on the driving component when the mounting seat is in its original position.

[0030] In summary, the present application includes at least one of the following beneficial technical effects:

[0031] The jig on the gantry clamps the PCB circuit board. The gantry drives the jig with the clamped PCB circuit board to move left and right to a specified position. Then, ensuring that the PCB circuit board does not move, the sliding driving member drives the mounting seat to slide towards the direction close to the PCB circuit board, and the guiding column guides the sliding of the mounting seat. Finally, the PCB circuit board is completely immersed in the electroplating solution in the electroplating solution tank, realizing the electroplating process of the PCB circuit board and reducing the probability of the PCB circuit board shaking during the electroplating process. Description of the Drawings

[0032] Figure 1 is a schematic structural diagram of a part of the gantry of the present application;

[0033] Figure 2 is Figure 1 the cross-sectional view taken along A-A in

[0034] Figure 3 is Figure 2 the enlarged view of part B in

[0035] Reference numerals: 1, frame body; 11, buffer groove; 12, buffer pad; 2, mounting seat; 21, electroplating solution tank; 3, driving component; 31, guiding column; 32, sliding driving member; 4, auxiliary support component; 41, support frame; 411, sliding hole; 412, mounting groove; 413, roller; 42, support block; 421, inclined support surface; 5, control component; 51, inductor; 52, controller. Detailed Description of the Embodiment

[0036] The following further elaborates on the present application in conjunction with the attached Figures 1-3 drawings.

[0037] The embodiment of the present application discloses a gantry for preventing the vibration of a circuit board in a gantry line electroplating process.

[0038] Refer to Figure 1, A gantry for preventing the vibration of a PCB board in a gantry line electroplating process, including a frame body 1, a mounting seat 2 and a driving component 3. The mounting seat 2 is slidably arranged on the frame body 1 in a direction close to or away from the PCB board. An electroplating liquid tank 21 for electroplating the PCB board is arranged on the mounting seat 2. The driving component 3 is arranged on the frame body 1 and is used to drive the mounting seat 2 to slide. The driving component 3 drives the mounting seat 2 to slide in a direction close to the PCB board, so that the PCB board is immersed in the electroplating liquid tank 21.

[0039] Refer to Figure 1 and Figure 2 , The PCB board is clamped by a fixture on the gantry. The upper part of the gantry drives the fixture clamping the PCB board to move left and right to a specified position. The frame body 1 is fixedly installed on the workbench. The frame body 1 is located below the fixture of the PCB board. The mounting seat 2 is slidably installed on the frame body 1 in a direction close to or away from the PCB board; The driving component 3 includes a guide post 31 and a sliding driving member 32. The guide post 31 is fixedly installed on the upper surface of the frame body 1. The axis of the guide post 31 is parallel to the sliding direction of the mounting seat 2; Multiple groups of guide posts 31 are installed on the frame body 1 at intervals. All the multiple groups of guide posts 31 are slidably connected to the mounting seat 2. The sliding of the mounting seat 2 is guided by the multiple groups of guide posts 31, so as to improve the stability of the sliding of the mounting seat 2; The sliding driving member 32 is fixedly installed on the frame body 1. The sliding driving member 32 is used to drive the mounting seat 2 to slide; The sliding driving member 32 in this embodiment can be one of structures such as a hydraulic cylinder, a pneumatic cylinder, and an electric push rod that can push the mounting seat 2 to perform linear reciprocating motion. Among them, the sliding driving member 32 in this embodiment selects a hydraulic cylinder.

[0040] Refer to Figure 1 and Figure 2 , An electroplating liquid tank 21 for electroplating the PCB board is fixedly installed at one end of the mounting seat 2 away from the frame body 1. After the gantry drives the fixture clamping the PCB board to move left and right to a specified position, the sliding driving member 32 pushes the mounting seat 2 to slide in a direction close to the PCB board, and finally the PCB board is completely immersed in the electroplating liquid tank 21. The PCB board remains stationary during the movement of the mounting seat 2, so as to reduce the probability of the PCB board shaking during the electroplating process.

[0041] Refer to Figure 2 and Figure 3, an auxiliary support assembly 4 for assisting in supporting the mounting seat 2 and reducing the acting force of the mounting seat 2 on the driving assembly 3 is provided on the frame body 1. The auxiliary support assembly 4 includes a support frame 41, a support block 42, and a support driving member. The support frame 41 is fixedly installed on the frame body 1, and multiple groups of support frames 41 are fixedly installed. The multiple groups of support frames 41 are respectively located on opposite sides of the mounting seat 2; a plurality of sliding holes 411 are formed in the support frame 41. The sliding holes 411 are square holes. The support block 42 is slidably installed on the support frame 41. The support block 42 is engaged with the sliding holes 411 and slides in the sliding holes 411. The sliding direction of the support block 42 is perpendicular to the sliding direction of the mounting seat 2. The support block 42 is used to support the bottom of the mounting seat 2.

[0042] Referring to Figure 3 , in order to facilitate the sliding of the support block 42 in the sliding hole 411, an installation groove 412 is formed at the bottom of the sliding hole 411. The installation groove 412 is located on the side of the sliding hole 411 close to the support driving member. A plurality of roller shafts 413 are rotatably installed in the installation groove 412. The axis of the roller shaft 413 is perpendicular to the sliding direction of the support block 42. The upper surface of the roller shaft 413 is flush with the bottom of the sliding hole 411, so as to facilitate the sliding of the support block 42 in the sliding hole 411.

[0043] Referring to Figure 2 and Figure 3 , the auxiliary support assemblies 4 on both sides of the mounting seat 2 are symmetrical with each other. An inclined support surface 421 is formed on the top of the end of the support block 42 away from the driving member. The height of the inclined support surface 421 at the end close to the support driving member is higher than the height at the end away from the support driving member. When the support block 42 slides toward the side close to the mounting seat 2, the supporting force of the support block 42 on the mounting seat 2 is gradually increased through the inclined support surface 421. At the same time, through the mutually symmetrical auxiliary support assemblies 4, the acting force of the support block 42 and the mounting seat 2 in the horizontal direction is offset, and finally the supporting effect of the support block 42 on the mounting seat 2 is improved.

[0044] Referring to Figure 3 , the support driving member is fixedly installed on the support frame 41. The support driving member is used to drive the support block 42 to slide. The support driving member in this embodiment can be a hydraulic cylinder, a pneumatic cylinder, an electric push rod, etc., which can push the support block 42 to perform linear reciprocating motion. Among them, the support driving member in this embodiment selects a hydraulic cylinder.

[0045] Referring to Figure 2 and Figure 3, when the mounting base 2 is located below, the support driving member drives the support block 42 to retract into the sliding hole 411, facilitating the sliding of the mounting base 2; when the sliding driving member 32 drives the mounting base 2 to slide upward and finally completely immerses the PCB circuit board into the electroplating solution, the support driving member drives the support block 42 to slide, and part of the support block 42 slides out of the sliding hole 411, so that the upper surface of the support block 42 sliding out of the sliding hole 411 supports the lower surface of the mounting base 2, thereby reducing the acting force of the mounting base 2 on the sliding driving member 32 and further increasing the service life of the sliding driving member 32.

[0046] Referring to Figure 1 and Figure 2 , a control assembly 5 for controlling the sliding speed of the mounting base 2 is provided on the support frame 41. The control assembly 5 includes a sensor 51 and a controller 52. The sensor 51 is fixedly installed on the support frame 41 and is used to detect the position of the electroplating solution tank 21; the controller 52 is fixedly installed on the frame body 1, and the controller 52 is electrically connected to the sensor 51. The controller 52 controls the driving speed of the sliding driving member 32 for the mounting base 2 based on the detection result of the sensor 51; specifically, when the sliding driving member 32 drives the mounting base 2 to slide upward, as the mounting base 2 moves upward, the sensor 51 first senses the electroplating solution tank 21. When the sensor 51 senses the electroplating solution tank 21, it sends an electrical signal to the controller 52, and then the controller 52 controls the driving speed of the sliding driving member 32, thereby reducing the sliding speed of the mounting base 2 and improving the electroplating effect on the PCB circuit board; when the sliding driving member 32 drives the mounting base 2 to move downward, as the mounting base 2 moves downward, the sensor 51 no longer senses the electroplating solution tank 21 and no longer sends an electrical signal to the controller 52, and the controller 52 no longer decelerates the sliding speed of the sliding driving member 32, facilitating the quick reset of the mounting base 2.

[0047] Referring to Figure 1 , multiple groups of mounting bases 2 and driving assemblies 3 for driving the mounting bases 2 to slide are spacedly installed on the frame body 1. Solution tanks for acid degreasing, water washing, micro-etching, copper plating, pickling, and tin plating of the PCB circuit board are respectively installed on the mounting bases 2, thereby realizing processes such as acid degreasing, water washing, micro-etching, copper plating, pickling, and tin plating of the PCB circuit board.

[0048] Referring to Figure 1 and Figure 2, when the mounting base 2 returns to its original position, the bottom of the mounting base 2 abuts tightly against the upper surface of the frame body 1. In order to reduce the probability of damage to the mounting base 2 and the frame body 1 when the mounting base 2 presses against the frame body 1, a buffer groove 11 is provided on the frame body 1, and a buffer pad 12 for buffering the bottom of the mounting base 2 is fixedly installed in the buffer groove 11. The buffer pad 12 has a certain elastic deformation ability. The thickness of the buffer pad 12 is greater than the depth of the buffer groove 11 when there is no external force. When the mounting base 2 slides downward, the bottom of the mounting base 2 first abuts tightly against the buffer pad 12 and presses against the buffer pad 12, finally causing the buffer pad 12 to deform and the thickness of the buffer pad 12 to be equal to the depth of the buffer groove 11.

[0049] The working principle of the embodiment of the present application is as follows:

[0050] The PCB circuit board is clamped by the fixture on the gantry. The gantry drives the fixture holding the PCB circuit board to move left and right to the specified position. Then, ensuring that the PCB circuit board does not move, the sliding drive member 32 drives the mounting base 2 to slide towards the direction close to the PCB circuit board. The guide post 31 guides the sliding of the mounting base 2. Finally, the PCB circuit board is completely immersed in the electroplating solution in the electroplating solution tank 21, realizing the electroplating process of the PCB circuit board and reducing the probability of the PCB circuit board shaking during the electroplating process.

[0051] The above are all the preferred embodiments of the present application. The protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A gantry for preventing the vibration of a circuit board in a gantry line electroplating process, characterized in that: It includes a frame body (1), a mounting seat (2) and a driving component (3). The mounting seat (2) is slidably arranged on the frame body (1) in a direction close to or away from the PCB circuit board. An electroplating liquid tank (21) for electroplating the PCB circuit board is arranged on the mounting seat (2). The driving component (3) is arranged on the frame body (1) and is used to drive the mounting seat (2) to slide. The driving component (3) drives the mounting seat (2) to slide in a direction close to the PCB circuit board, so that the PCB circuit board is immersed in the electroplating liquid tank (21).

2. The gantry for preventing the vibration of the circuit board in the gantry line electroplating process according to claim 1, characterized in that: The driving component (3) includes: Guide columns (31). Multiple groups of the guide columns (31) are arranged on the frame body (1) at intervals and pass through the mounting seat (2). Multiple groups of the guide columns (31) are used to guide the sliding of the mounting seat (2); A sliding driving member (32). The sliding driving member (32) is arranged on the frame body (1) and is used to drive the mounting seat (2) to slide.

3. The gantry for preventing the vibration of the circuit board in the gantry line electroplating process according to claim 2, characterized in that: An auxiliary support component (4) for auxiliary support of the mounting seat (2) and reduction of the acting force of the mounting seat (2) on the driving component (3) is arranged on the frame body (1). The auxiliary support component (4) includes: Support frames (41). Multiple groups of the support frames (41) are arranged on the frame body (1) at intervals and are located on opposite sides of the mounting seat (2); Support blocks (42). The support blocks (42) are slidably arranged on the support frames (41). The sliding direction of the support blocks (42) is perpendicular to the sliding direction of the mounting seat (2) in the opposite direction. The support blocks (42) are used to support the bottom of the mounting seat (2); A support driving member. The support driving member is arranged on the support frame (41) and is used to drive the support block (42) to slide.

4. A gantry for preventing vibration of a circuit board in a gantry line electroplating process according to claim 3, characterized in that: A sliding hole (411) facilitating the sliding of the support block (42) is formed on the support frame (41). An installation groove (412) is formed at the bottom of the sliding hole (411). Multiple groups of roller shafts (413) are rotatably arranged in the installation groove (412). The support block (42) is in rolling connection with the roller shafts (413).

5. The gantry for preventing the vibration of the circuit board in the gantry line electroplating process according to claim 3, wherein: The auxiliary support components (4) on both sides of the mounting seat (2) are symmetrical to each other. An inclined support surface (421) is arranged on the top of the end of the support block (42) away from the support driving member. The height of the inclined support surface (421) at the end close to the support driving member is higher than the height at the end away from the support driving member.

6. The gantry for preventing the vibration of the circuit board in the gantry line electroplating process according to claim 3, wherein: A control component (5) for controlling the sliding speed of the mounting seat (2) is arranged on the support frame (41). The control component (5) includes: An inductor (51). The inductor (51) is arranged on the support frame (41) and is used to detect the position of the electroplating liquid tank (21); A controller (52). The controller (52) is arranged on the frame body (1) and is electrically connected to the inductor (51). The controller (52) controls the driving speed of the sliding driving member (32) for the mounting seat (2) according to the detection result of the inductor (51).

7. The gantry for preventing the vibration of the circuit board in the gantry line electroplating process according to claim 1, characterized in that: A plurality of mounting seats (2) and a driving assembly (3) for driving the mounting seats (2) to slide are arranged at intervals on the frame body (1), and solution tanks for acid degreasing, water washing and micro-etching of the PCB circuit board are respectively arranged on the mounting seats (2).

8. The gantry for preventing the vibration of the circuit board in the gantry line electroplating process according to claim 1, wherein: A buffer groove (11) is formed in the frame body (1), a buffer pad (12) for buffering the bottom of the mounting seat (2) is arranged in the buffer groove (11), the buffer pad (12) can undergo elastic deformation and has a thickness greater than the depth of the buffer groove (11) when no external force acts.

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