Condensation water taking device based on semiconductor refrigeration

Abstract

The utility model relates to the technical field of condensing equipment, in particular to a condensing water taking device based on semiconductor refrigeration, which comprises a supporting shell, a vibration frame is fixedly connected to the bottom of the supporting shell, a liquid collecting hopper is fixedly connected to the inner wall of the supporting shell, and a water taking barrel is screwed and sleeved at the bottom end of the liquid collecting hopper. According to the utility model, the driving motor can drive the rotating rod and the eccentric blocks at the two ends to rotate, the four corners of the vibration frame are slidably connected with the limiting columns, and the vibration frame can be extruded by the buffer springs to quickly reset, so that the supporting shell can always vibrate up and down in a reciprocating manner; in this way, liquid drops separated out of the heat exchange cavity plate and the inner wall of the supporting shell can be conveniently and timely vibrated off, then the prepared water drops are collected through the liquid collecting hopper, it can be guaranteed that the heat exchange cavity plate continuously provides cold energy for a cooling area by timely vibrating off the liquid drops on the heat exchange cavity plate, and the situation that the heat exchange efficiency of wet air is reduced due to too many water drops on the surface is prevented; therefore, the water production efficiency is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of condensation equipment, in particular to a condensation water intake device based on semiconductor refrigeration. Background Technique

[0002] Condensation water intake by semiconductor refrigeration is a method of extracting moisture from the air using semiconductor refrigeration technology. Its basic principle is based on the Peltier effect of semiconductors, that is, when direct current passes through a circuit composed of two different conductive materials, heat absorption or heat release will occur at the junctions. This effect is applied to the refrigeration field. The air is cooled by a semiconductor refrigeration sheet, so that the water vapor in the air liquefies into small water droplets in the condensation chamber, and then is collected as fresh water.

[0003] The water intake device by semiconductor refrigeration is usually used in fields such as outdoor camping and camp posts. In the outdoor environment lacking water resources, fresh water can be directly extracted from the air through the device. However, the air may contain tiny impurities such as suspended dust and microorganisms. These impurities may adhere to the condensed water during the condensation process, resulting in the water being not clean enough and causing harm to the human body. The existing semiconductor refrigeration water intake devices lack the function of filtering the air. Therefore, the water produced by condensation needs to be filtered before use. Moreover, the water droplets on the heat exchange fins in the existing semiconductor refrigeration devices need to drip by themselves to complete the collection, which will affect the heat exchange efficiency of the fins for humid air, and thus reduce the water production efficiency of the device. Content of the Utility Model

[0004] The purpose of the utility model is to provide a condensation water intake device based on semiconductor refrigeration to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A condensation water intake device based on semiconductor refrigeration, comprising:

[0007] A support shell, the bottom of the support shell is fixedly connected with a vibration frame, the inner wall of the support shell is fixedly connected with a liquid collecting hopper, and the bottom end of the liquid collecting hopper is screwed and sleeved with a water fetching bucket;

[0008] A semiconductor refrigeration sheet, one side of the semiconductor refrigeration sheet is fixedly connected with a heat conduction block fixedly connected to the side plate of the support shell, one side of the semiconductor refrigeration sheet is fixedly connected with a temperature guiding plate, a plurality of heat exchange cavity plates are fixedly connected to the side wall of the temperature guiding plate at equal intervals, the end of the heat exchange cavity plate is fixedly connected with the inner wall of the support shell, and two U-shaped copper tubes are fixedly arranged in the heat conduction block, and a plurality of heat dissipation fins are fixedly connected between the two U-shaped copper tubes at equal intervals.

[0009] Further, a rotating rod is rotatably connected in the vibration frame, eccentric blocks are fixedly connected to both ends of the rotating rod, and the end of the rotating rod is fixedly connected to the output end of the driving motor.

[0010] Further, limiting columns are slidably sleeved at the four corners of the vibration frame. A non-slip bottom plate is fixedly connected between the bottoms of the four limiting columns, and a buffer spring fixedly connected to the non-slip bottom plate is sleeved outside the limiting columns.

[0011] Further, limiting seats are fixedly connected to the opposite side walls of the support shell. Solar panels are rotatably connected to both limiting seats. A jack is opened at the center position of the top of the solar panel. A limiting plug is slidably inserted into the jack. A positioning plate fixedly connected to the side wall of the support shell is slidably sleeved outside the limiting plug. Extrusion springs are fixedly connected to both ends of the limiting plug.

[0012] Further, a sliding frame is slidably inserted into the support shell. An activated carbon plate is fixedly connected in the sliding frame. Both ends of the sliding frame are connected to the support shell by nuts.

[0013] Further, a cylinder body is fixedly connected to the top end of the support shell. A fan is fixedly arranged inside the cylinder body. A dust filtering mesh cover is fixedly connected to the top end of the cylinder body.

[0014] Further, two heat dissipation fans are symmetrically and fixedly connected to the bottoms of multiple heat dissipation fins. A positioning shell is fixedly connected to the top of the heat dissipation fins. One ends of two air ducts are fixedly connected to the positioning shell, and the other ends of the air ducts are communicated with the inside of the support shell.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. A heat conduction plate is fixed to the cold end of a semiconductor refrigeration sheet, and a plurality of heat exchange cavity plates are connected to the heat conduction plate, thereby increasing the heat exchange area and providing more cooling areas. In this way, a large amount of humid air will condense into water faster, enhancing the condensation water production effect of the device. Thus, when a direct current is applied to the semiconductor refrigeration sheet, its cold end will lower the temperature of the plurality of heat exchange cavity plates. Therefore, the outside humid air can be introduced into the support shell by a fan, and the temperature of the humid air can be lowered through the heat exchange cavity plates. When the temperature is lowered to the dew point temperature, the gaseous water vapor in the humid air changes into a liquid state and precipitates on the surface of the heat exchange cavity plates, and then small droplets gradually form on their surfaces. The driving motor can drive the rotating rod and the eccentric blocks at both ends to rotate. Since the vibration frame is slidably connected with the limiting columns at the four corners, the buffer springs can be used to squeeze the vibration frame to quickly reset. In this way, the support shell can be continuously vibrated up and down, which is convenient for timely shaking off the droplets precipitated on the heat exchange cavity plates and the inner wall of the support shell. Then, the collected water droplets are collected by a liquid collecting hopper. Timely shaking off the droplets on the heat exchange cavity plates can ensure that the heat exchange cavity plates continuously provide cold for the cooling area, prevent excessive water droplets on the surface from reducing the heat exchange efficiency of the humid air, and further cause the water production efficiency to decline.

[0017] 2. A dust filter net cover is arranged at the top of the fan. When introducing the outside air into the interior of the support shell, dust and large particles in the air can be intercepted, and then the air is further filtered by an activated carbon plate to filter out the tiny particles and impurities in the air. Thus, the condensed water droplets will not contain dust and impurities, and the device can produce clean water for people to use. When the device is in use, the limiting plug can be pulled out of the jack, and then the solar panel can be rotated to keep it in a horizontal state. Therefore, when camping outdoors, the solar panel can generate electricity to provide the electric energy required by the semiconductor refrigeration sheet for the device. When storing, the solar panel can be flipped back to its original position and limited by the limiting plug. Brief Description of the Drawings

[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0019] Figure 2 is a schematic diagram of the overall sectional structure of the present utility model;

[0020] Figure 3 is a schematic diagram of the structure of the present utility model in the use state;

[0021] Figure 4 is a schematic diagram of the structure of the solar panel in the present utility model;

[0022] Figure 5 is a schematic diagram of the bottom structure of the support shell in the present utility model;

[0023] Figure 6 is a schematic diagram of the internal structure of the support shell in the present utility model;

[0024] Figure 7 It is a schematic diagram of the connection structure of the thermoelectric cooler in the present utility model.

[0025] In the figure: 101, support shell; 102, vibration frame; 103, limit post; 104, buffer spring; 105, anti-slip bottom plate; 106, rotating rod; 107, drive motor; 108, eccentric block; 109, limit seat; 110, solar panel; 111, jack; 112, positioning plate; 113, limit insertion plate; 114, extrusion spring; 115, liquid collecting hopper; 116, water fetching bucket; 117, sliding frame; 118, activated carbon plate; 119, cylinder body; 120, fan; 121, dust filter cover; 201, heat exchange cavity plate; 202, thermoelectric cooler; 203, heat conduction block; 204, U-shaped copper pipe; 205, heat sink; 206, radiator fan; 207, positioning shell; 208, air duct; 209, temperature conduction plate. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0027] Please refer to Figures 1 to 7 , in the embodiment of the present utility model, a condensation water extraction device based on thermoelectric cooling includes:

[0028] A support shell 101, a vibration frame 102 is fixedly connected to the bottom of the support shell 101, a liquid collecting hopper 115 is fixedly connected to the inner wall of the support shell 101, and a water fetching bucket 116 is screwed and sleeved at the bottom end of the liquid collecting hopper 115;

[0029] The semiconductor refrigeration sheet 202 is fixedly connected on one side with a heat conduction block 203 fixedly connected to the side plate of the support shell 101. One side of the semiconductor refrigeration sheet 202 is fixedly connected with a temperature guiding plate 209. A plurality of heat exchange cavity plates 201 are fixedly connected to the side wall of the temperature guiding plate 209 at equal intervals. The end of the heat exchange cavity plate 201 is fixedly connected to the inner wall of the support shell 101. Two U-shaped copper tubes 204 are fixedly arranged in the heat conduction block 203. A plurality of heat dissipation fins 205 are fixedly connected between the two U-shaped copper tubes 204 at equal intervals. A rotating rod 106 is rotatably connected in the vibration frame 102. Eccentric blocks 108 are fixedly connected to both ends of the rotating rod 106. The end of the rotating rod 106 is fixedly connected to the output end of a driving motor 107. The four corners of the vibration frame 102 are all slidably sleeved with limit posts 103. An anti-slip bottom plate 105 is fixedly connected between the bottoms of the four limit posts 103. A buffer spring 104 fixedly connected to the anti-slip bottom plate 105 is sleeved outside the limit post 103.

[0030] During specific implementation, a temperature guiding plate 209 is fixed at the cold end of the semiconductor refrigeration sheet 202, and a plurality of heat exchange cavity plates 201 are connected to the temperature guiding plate 209, thereby increasing the heat exchange area and providing more cooling areas. In this way, a large amount of humid air will condense into water faster, strengthening the condensation water production effect of the device. Therefore, when direct current is applied to the semiconductor refrigeration sheet 202, its cold end will lower the temperature of the plurality of heat exchange cavity plates 201. Thus, the external humid air can be introduced into the support shell 101 through a blower 120. The temperature of the humid air can be lowered through the heat exchange cavity plates 201. When the temperature is lowered to the dew point temperature, the gaseous water vapor in the humid air changes into a liquid state and precipitates on the surface of the heat exchange cavity plates 201, and then small droplets gradually form on its surface. The driving motor 107 can drive the rotating rod 106 and the eccentric blocks 108 at both ends to rotate. Since the four corners of the vibration frame 102 are slidably connected with the limit posts 103, the buffer spring 104 can be used to squeeze the vibration frame 102 to quickly reset. In this way, the support shell 101 can always be in reciprocating vibration up and down, which can facilitate the timely shaking off of the droplets precipitated on the heat exchange cavity plates 201 and the inner wall of the support shell 101. Then, the collected water droplets are collected through a liquid collecting hopper 115. By timely shaking off the droplets on the heat exchange cavity plates 201, it can ensure that the heat exchange cavity plates 201 continuously provide cold for the cooling area, prevent excessive water droplets on the surface from reducing the heat exchange efficiency of the humid air, and further cause the water production efficiency to decline.

[0031] Embodiment 1

[0032] Such as Figure 6As shown, in this embodiment, a sliding frame 117 is slidably inserted into the support shell 101. An activated carbon plate 118 is fixedly connected in the sliding frame 117. Both ends of the sliding frame 117 are connected to the support shell 101 through nuts. A cylinder 119 is fixedly connected to the top of the support shell 101. A fan 120 is fixedly arranged inside the cylinder 119. A dust filter net cover 121 is fixedly connected to the top of the cylinder 119.

[0033] In this embodiment, by providing a dust filter net cover 121 at the top of the fan 120, dust and large particles in the air can be intercepted when introducing external air into the support shell 101. Then, the air is further filtered by the activated carbon plate 118 to filter out fine particles and impurities in the air, so that the condensed water droplets do not contain dust and impurities, and the device can produce clean water for people to use.

[0034] Embodiment Two

[0035] As Figure 4 shown, in this embodiment, limiting seats 109 are fixedly connected to the opposite side walls of the support shell 101. Solar panels 110 are rotatably connected to both limiting seats 109. A jack 111 is opened at the center position of the top of the solar panel 110. A limiting insertion plate 113 is slidably inserted into the jack 111. A positioning plate 112 fixedly connected to the side wall of the support shell 101 is slidably sleeved outside the limiting insertion plate 113. Extrusion springs 114 are fixedly connected to both ends of the limiting insertion plate 113.

[0036] During specific implementation, when the device is in use, the limiting insertion plate 113 can be pulled out of the jack 111, and then the solar panel 110 is rotated to keep it in a horizontal state. Therefore, when camping outdoors, the solar panel 110 can generate electricity to provide the electric energy required by the semiconductor refrigeration sheet 202 for the device. When storing, the solar panel 110 can be flipped back to its original position and limited by the limiting insertion plate 113.

[0037] Embodiment Three

[0038] As Figure 7 shown, in this embodiment, two heat dissipation fans 206 are symmetrically fixedly connected to the bottoms of multiple heat dissipation fins 205. A positioning shell 207 is fixedly connected to the top of the heat dissipation fins 205. One ends of two air ducts 208 are fixedly connected to the positioning shell 207. The other ends of the air ducts 208 are communicated with the inside of the support shell 101.

[0039] During specific implementation, the heat generated at the hot end of the semiconductor refrigeration sheet 202 can be conducted to multiple heat dissipation fins 205 through the U-shaped copper tube 204. Then, the two heat dissipation fans 206 quickly dissipate heat from the heat dissipation fins 205, and the hot air generated by heat dissipation is introduced into the support shell 101 through the air ducts 208 for condensation and water extraction.

[0040] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0041] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A condensation water intake device based on semiconductor refrigeration, characterized in that, Including: A support shell (101), a vibration frame (102) is fixedly connected to the bottom of the support shell (101), a liquid collecting hopper (115) is fixedly connected to the inner wall of the support shell (101), and a water fetching bucket (116) is screwed and sleeved at the bottom end of the liquid collecting hopper (115); A semiconductor refrigeration sheet (202), a heat conducting block (203) fixedly connected to one side of the semiconductor refrigeration sheet (202) is fixedly connected to the side plate of the support shell (101), a temperature guiding plate (209) is fixedly connected to one side of the semiconductor refrigeration sheet (202), a plurality of heat exchange cavity plates (201) are fixedly connected to the side wall of the temperature guiding plate (209) at equal intervals, the end of the heat exchange cavity plate (201) is fixedly connected to the inner wall of the support shell (101), two U-shaped copper tubes (204) are fixedly arranged in the heat conducting block (203), and a plurality of heat dissipation fins (205) are fixedly connected between the two U-shaped copper tubes (204) at equal intervals.

2. The condensing water intake device based on semiconductor refrigeration according to claim 1, characterized in that, A rotating rod (106) is rotatably connected in the vibration frame (102), eccentric blocks (108) are fixedly connected to both ends of the rotating rod (106), and the end of the rotating rod (106) is fixedly connected to the output end of a driving motor (107).

3. The condensation water extraction device based on semiconductor refrigeration according to claim 1, characterized in that, Limiting columns (103) are slidably sleeved at the four corners of the vibration frame (102), an anti-slip bottom plate (105) is fixedly connected between the bottom ends of the four limiting columns (103), and a buffer spring (104) fixedly connected to the anti-slip bottom plate (105) is sleeved outside the limiting column (103).

4. The condensation water extraction device based on semiconductor refrigeration according to claim 1, characterized in that, Limiting seats (109) are fixedly connected to the opposite side walls of the support shell (101), a solar panel (110) is rotatably connected to both of the limiting seats (109), a jack (111) is opened at the center position of the top of the solar panel (110), a limiting insertion plate (113) is slidably inserted in the jack (111), a positioning plate (112) fixedly connected to the side wall of the support shell (101) is slidably sleeved outside the limiting insertion plate (113), and extrusion springs (114) are fixedly connected to both ends of the limiting insertion plate (113).

5. The condensing water intake device based on semiconductor refrigeration according to claim 1, characterized in that, A sliding frame (117) is slidably inserted into the support shell (101), an activated carbon plate (118) is fixedly connected in the sliding frame (117), and both ends of the sliding frame (117) are connected to the support shell (101) through nuts.

6. The condensing water intake device based on semiconductor refrigeration according to claim 1, characterized in that, A cylinder body (119) is fixedly connected to the top end of the support shell (101), a fan (120) is fixedly arranged inside the cylinder body (119), and a dust filtering mesh cover (121) is fixedly connected to the top end of the cylinder body (119).

7. A condensation water extraction device based on semiconductor refrigeration according to claim 1, characterized in that, Two heat dissipation fans (206) are symmetrically fixedly connected to the bottom of the plurality of heat dissipation fins (205), a positioning shell (207) is fixedly connected to the top of the heat dissipation fins (205), one ends of two air guide pipes (208) are fixedly connected to the positioning shell (207), and the other ends of the air guide pipes (208) are communicated with the inside of the support shell (101).

Images