MOSFET device performance testing device
By designing a MOSFET device performance test device, simultaneous testing of multiple devices is realized, the problem of inefficiency in the prior art is solved, detection efficiency is improved and damage rate is reduced.
Patent Information
- Application Number
- CN202421180796.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The prior art is difficult to test multiple MOSFET devices simultaneously, resulting in low detection efficiency and high device damage rate.
A MOSFET device performance testing device is designed, including a test box, a connecting plate, a control mechanism and a testing mechanism. Through the cooperation of the pressing plate and the support column, the simultaneous pressure measurement of multiple MOSFET devices is realized, and the rubber connecting column and elastic test needle are used to reduce pressure and avoid damage.
It improves the testing efficiency of MOSFET devices and reduces the device damage rate, reduces the work intensity of staff, and increases the convenience and safety of testing.
Smart Images

Figure CN223155045U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a performance detection device, specifically a performance test device for MOSFET devices, belonging to the technical field of MOSFET devices. Background Technique
[0002] Metal-oxide-semiconductor field-effect transistor, abbreviated as MOSFET, is a field-effect transistor that can be widely used in analog circuits and digital circuits. MOSFET can be divided into two types, "N-type" and "P-type", according to the polarity of the working carriers, and is usually also called NMOSFET and PMOSFET.
[0003] According to the patent with the patent number CN207908630U, a performance test device for MOSFET devices is disclosed, including a base. A support is fixedly connected to the base, and a mounting seat is fixedly connected to the base. A test needle assembly is horizontally movably arranged on the mounting seat, and a pressing plate for pressing and fixing the test needle assembly is arranged on the mounting seat. The test needle assembly includes an adjusting block horizontally movably connected to the mounting seat and two test needles connected to the adjusting block.
[0004] Although the above solution can reduce the pressure measurement force and avoid damage to the transistor pins during the implementation process, however, during the implementation of the above solution, it is difficult to test multiple transistors simultaneously, and each transistor needs to be detected separately, resulting in a low detection efficiency of the transistors. Therefore, we provide a performance test device for MOSFET devices to solve the above problems. Content of the Utility Model
[0005] (1) Technical Problem to be Solved
[0006] The purpose of the utility model is to provide a performance test device for MOSFET devices to solve the problem that it is difficult to test multiple transistors simultaneously in the above technology.
[0007] (2) Technical Solution
[0008] The utility model is realized through the following technical solutions: A performance test device for MOSFET devices includes a test box. A cavity is opened inside the test box. A connecting plate is arranged inside the cavity, and a control mechanism is arranged inside the cavity. The control mechanism includes a first pressing plate. A first support column is hinged in the middle of the first pressing plate. One end of the first pressing plate is hinged to a second pressing plate. A second support column is hinged in the middle of the second pressing plate. A rubber connecting column is fixedly connected to the end of the second pressing plate far from the first pressing plate. The rubber connecting column is fixedly connected to the connecting plate.
[0009] Preferably, a limiting post is fixedly connected to the surface of the pressing plate I that penetrates the test chamber and is located outside the test chamber. An articulated frame is arranged below the limiting post, and the articulated frame is fixedly connected to the test chamber. The staff controls the pressing and testing effect of the device by pressing the pressing plate I.
[0010] Preferably, an articulated rod is articulated inside the articulated frame. The articulated rod is clamped with a clamping post left on the outer surface of the limiting post. A plurality of jacks adapted to the clamping post are opened on one side of the articulated rod close to the limiting post.
[0011] Preferably, a plurality of testing mechanisms are arranged on the bottom surface of the connecting plate. The testing mechanism includes a test plate, and the test plate is fixedly connected to the connecting plate. The plurality of testing mechanisms can increase the number of MOSFET devices tested simultaneously.
[0012] Preferably, two groups of test needles are fixedly connected to the outer surface of the test plate, and a sleeve is fixedly connected to the bottom surface of the test plate. The test needles have a certain elasticity.
[0013] Preferably, a pressing column is slidably connected inside the sleeve. The top end of the pressing column is fixedly connected to a telescopic spring, and the end of the telescopic spring away from the pressing column is fixedly connected to the test plate. The spring force of the telescopic spring can enable the pressing column to press the MOSFET device.
[0014] Preferably, a test bench is slidably connected inside the test chamber. An observation window is opened on the outer surface of the test chamber, and a shielding plate is fixedly connected to the outer surface of the test chamber. A glass mirror is installed outside the observation window.
[0015] The utility model provides a MOSFET device performance testing device, and the beneficial effects thereof are as follows:
[0016] 1. Through the arrangement of the pressing plate I, the support column I, the pressing plate II, the support column II, the rubber connecting column, the connecting plate and the testing mechanism, when the pressing plate I is pressed, under the support of the support column I, the pressing plate I can drive the pressing plate II to lift. When the end of the pressing plate II articulated with the pressing plate I lifts, under the support of the support column II, the rubber connecting column will squeeze the connecting plate so that a plurality of testing mechanisms on the bottom surface of the connecting plate can all have a pressing and testing effect on the MOSFET device in the groove, reducing the working intensity of the staff, improving the testing efficiency of the MOSFET device, and reducing the testing damage rate of the MOSFET device.
[0017] 2. With the settings of the test bench, observation window, connecting plate, test mechanism and baffle plate, the staff first pull out the test bench from the test box through the handle on the test bench, place several MOSFET devices to be tested in the grooves of the test bench, and then push the test bench back into the interior of the test box. By pressing the pressing plate to squeeze the connecting plate, several test mechanisms on the bottom surface of the connecting plate test the MOSFET devices, increasing the number of MOSFET devices that can be tested simultaneously, improving the work efficiency of the staff, enhancing the convenience for the staff to observe the operation of the device, and reducing the possibility of damage to the MOSFET devices during testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0019] Figure 2 is a structural sectional view of the control mechanism and test mechanism of the present utility model;
[0020] Figure 3 is a schematic diagram of the control mechanism of the present utility model;
[0021] Figure 4 is a schematic diagram of the test mechanism of the present utility model.
[0022]
SYMBOLS DESCRIPTION OF MAIN COMPONENTS
[0023] 1. Test box; 2. Test bench; 3. Observation window; 4. Cavity; 5. Connecting plate;
[0024] 6. Test mechanism; 601. Test board; 602. Test needle; 603. Sleeve; 604. Pressure test column; 605. Telescopic spring;
[0025] 7. Control mechanism; 701. First pressing plate; 702. First support column; 703. Second pressing plate; 704. Second support column; 705. Rubber connecting column; 706. Limit column; 707. Hinge frame; 708. Hinge rod;
[0026] 8. Baffle plate. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0027] The embodiment of the present utility model provides a MOSFET device performance testing device, which can test multiple transistors simultaneously and solves the problem that the staff needs to manually detect transistors one by one in the above-mentioned technology.
[0028] Please refer to FIGS. 1 and Figure 2, a cavity 4 is provided inside the test box 1. A test bench 2 is slidably connected inside the test box 1. A handle is fixed on the outer surface of the test bench 2, which facilitates the staff to pull out the test bench 2 through the handle. Two grooves for placing MOSFET devices are left on the surface of the test bench 2, which facilitates the device to test multiple MOSFET devices simultaneously.
[0029] An observation window 3 is provided on the outer surface of the test box 1. A glass mirror is installed outside the observation window 3, which facilitates the staff to observe the inside of the device, observe whether the pins of the MOSFET device are accurately covered and whether the MOSFET device is pressed stably.
[0030] Please refer to Figure 2 and Figure 4 , a connecting plate 5 is provided inside the cavity 4. A number of test mechanisms 6 are provided on the bottom surface of the connecting plate 5. Each test mechanism 6 corresponds to detecting one MOSFET device. Through the settings of the connecting plate 5 and the test mechanism 6, the device can conveniently test multiple MOSFET devices simultaneously, greatly reducing the working intensity of the staff and improving the working efficiency.
[0031] The test mechanism 6 includes a test board 601. The test board 601 is fixedly connected to the connecting plate 5. Two groups of test needles 602 are fixedly connected to the outer surface of the test board 601. A sleeve 603 is fixedly connected to the bottom surface of the test board 601. The test needles 602 have a certain elasticity and their lengths are reasonably controlled according to the MOSFET device, so as to reduce the pressure test intensity, avoid damaging the pins of the MOSFET device and at the same time increase the service life of the test needles 602.
[0032] A pressure test column 604 is slidably connected inside the sleeve 603. The top end of the pressure test column 604 is fixedly connected to a telescopic spring 605. One end of the telescopic spring 605 away from the pressure test column 604 is fixedly connected to the test board 601. Through the setting of the telescopic spring 605, the spring force of the telescopic spring 605 can make the pressure test column 604 press the MOSFET device without causing too much pressure on the MOSFET device by the pressure test column 604, thus avoiding damage to the MOSFET device.
[0033] Please refer to Figure 2 and Figure 3 , a control mechanism 7 is provided inside the cavity 4. The control mechanism 7 includes a first pressing plate 701. A shielding plate 8 is fixedly connected to the outer surface of the test box 1. Through the setting of the shielding plate 8, the shielding plate 8 can protect and shield the first pressing plate 701, prevent the first pressing plate 701 from affecting the normal operation of the device due to external collision or other factors, and increase the safety and stability of the device.
[0034] A support column 702 is hinged to the middle of the first pressing plate 701. One end of the first pressing plate 701 is hinged to a second pressing plate 703. A support column 704 is hinged to the middle of the second pressing plate 703. By pressing one end of the first pressing plate 701 located outside the test box 1, the first pressing plate 701 can drive the second pressing plate 703 to rise under the support of the support column 702.
[0035] A rubber connecting column 705 is fixedly connected to the end of the second pressing plate 703 away from the first pressing plate 701. The rubber connecting column 705 is fixedly connected to the connecting plate 5. The rubber connecting column 705 can deform with the lifting and lowering of the second pressing plate 703, so that the connecting plate 5 always remains in a horizontal position. When the end of the second pressing plate 703 hinged to the first pressing plate 701 is raised, under the supporting action of the support column 704, the rubber connecting column 705 will squeeze the connecting plate 5, so that the testing mechanism 6 on the bottom surface of the connecting plate 5 can press and test the test bench 2.
[0036] A limiting column 706 is fixedly connected to the surface of the first pressing plate 701 that penetrates the test box 1 and is located outside the test box 1. An articulated frame 707 is arranged below the limiting column 706. A clamping column adapted to the articulated rod 708 is fixed to the outer surface of the limiting column 706, which is convenient for the staff to fix the first pressing plate 701 and ensure the stability of the device during operation.
[0037] The articulated frame 707 is fixedly connected to the test box 1. An articulated rod 708 is hinged inside the articulated frame 707. The articulated rod 708 is clamped with the clamping column left on the outer surface of the limiting column 706. A plurality of jacks adapted to the clamping column are arranged on one side of the articulated rod 708 close to the limiting column 706, which is convenient for the staff to adjust the pressing degree of the first pressing plate 701 according to the thickness of different MOSFET devices, so that the test of the MOSFET devices by the testing mechanism 6 is kept within an acceptable range, and the damage to the MOSFET devices caused by the pressing test is reduced.
[0038] Working principle: The staff first pulls out the test bench 2 from the test box 1 through the handle on the test bench 2, places several MOSFET devices to be tested in the grooves of the test bench 2, then pushes the test bench 2 back into the test box 1, and then presses the first pressing plate 701. Under the support of the support column 702, the first pressing plate 701 can drive the second pressing plate 703 to rise. When the end of the second pressing plate 703 hinged to the first pressing plate 701 is raised, under the supporting action of the support column 704, the rubber connecting column 705 will squeeze the connecting plate 5, so that several testing mechanisms 6 on the bottom surface of the connecting plate 5 can all press and test the MOSFET devices in the grooves, increasing the number of MOSFET devices tested at the same time and reducing the work intensity of the staff.
[0039] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and the descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.
Claims
1. A MOSFET device performance testing apparatus, comprising a test chamber (1), characterized in that: A cavity (4) is formed inside the test chamber (1). A connecting plate (5) is arranged inside the cavity (4), and a control mechanism (7) is arranged inside the cavity (4). The control mechanism (7) includes a first pressing plate (701). A first support column (702) is hinged in the middle of the first pressing plate (701). One end of the first pressing plate (701) is hinged to a second pressing plate (703). A second support column (704) is hinged in the middle of the second pressing plate (703). A rubber connecting column (705) is fixedly connected to the end of the second pressing plate (703) far from the first pressing plate (701). The rubber connecting column (705) is fixedly connected to the connecting plate (5).
2. The MOSFET device performance testing apparatus according to claim 1, characterized in that: The first pressing plate (701) penetrates through the test chamber (1), and a limiting column (706) is fixedly connected to the surface of the first pressing plate (701) located outside the test chamber (1). An articulated frame (707) is arranged below the limiting column (706), and the articulated frame (707) is fixedly connected to the test chamber (1).
3. The MOSFET device performance testing apparatus according to claim 2, wherein: An articulated rod (708) is hinged inside the articulated frame (707), and the articulated rod (708) is clamped with a clamping column left on the outer surface of the limiting column (706).
4. The MOSFET device performance testing apparatus according to claim 1, wherein: A plurality of test mechanisms (6) are arranged on the bottom surface of the connecting plate (5). The test mechanism (6) includes a test plate (601), and the test plate (601) is fixedly connected to the connecting plate (5).
5. The MOSFET device performance testing apparatus according to claim 4, characterized in that: Two groups of test needles (602) are fixedly connected to the outer surface of the test plate (601), and a sleeve (603) is fixedly connected to the bottom surface of the test plate (601).
6. The MOSFET device performance testing apparatus according to claim 5, characterized in that: A pressure testing column (604) is slidably connected inside the sleeve (603). A telescopic spring (605) is fixedly connected to the top end of the pressure testing column (604), and the end of the telescopic spring (605) far from the pressure testing column (604) is fixedly connected to the test plate (601).
7. The MOSFET device performance testing apparatus according to claim 1, characterized in that: A test bench (2) is slidably connected inside the test chamber (1). An observation window (3) is formed on the outer surface of the test chamber (1), and a shielding plate (8) is fixedly connected to the outer surface of the test chamber (1).
Citation Information
Patent Citations
Transistor chip capability test mechanism
CN207908630U
Cited By
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CN120779218A