Scraping device for chip processing

Abstract

The utility model relates to the technical field of chip processing, in particular to an edge scraping device for chip processing, which effectively improves the edge scraping quality and efficiency and is suitable for wafers with different sizes. Comprising a base, a workbench, a lifting mechanism, a clamping mechanism, an edge scraping mechanism and a collecting mechanism, the workbench is arranged on the base, the lifting mechanism is arranged on the workbench, the clamping mechanism is arranged at the bottom of the lifting mechanism, the edge scraping mechanism is arranged on the side wall of the workbench and is perpendicular to the clamping mechanism, and the collecting mechanism is arranged in the base; the lifting mechanism comprises a first telescopic rod and a supporting plate, the first telescopic rod is fixedly connected with the side wall of the workbench, and the supporting plate is arranged at the bottom of the first telescopic rod; the clamping mechanism comprises a base, the base is fixedly connected with the bottom of the first telescopic rod, a plurality of second telescopic rods are evenly distributed on the side wall of the base, a driving motor is arranged at the tail end of each second telescopic rod, a supporting wheel is arranged at the output end of each driving motor, and the supporting wheels are connected with the wafers in a clamped mode.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to an edge scraping device for chip processing. Background Art

[0002] A chip, also known as an integrated circuit (IC), is a microelectronic device or component. It integrates various elements in a circuit (such as transistors, resistors, capacitors, connecting wires, etc.) by means of fine processing on a semiconductor material (usually silicon) to achieve specific electronic functions. Chips are the core components of modern electronic devices and are widely used in various products such as computers, smartphones, automobiles, and household appliances.

[0003] During the chip manufacturing process, it is necessary to perform edge scraping on the wafer. The existing edge scraping device does not have a suitable clamping device installed at the position for fixing the wafer, which is not convenient for users to perform edge scraping on wafers of different sizes and types. The versatility and adaptability of the device are poor, which limits its application on wafers of different sizes. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model provides an edge scraping device for chip processing that can effectively improve the edge scraping quality and efficiency and is applicable to wafers of different sizes.

[0005] An edge scraping device for chip processing of the utility model includes a base, a workbench, a lifting mechanism, a clamping mechanism, an edge scraping mechanism, and a collection mechanism. The workbench is arranged on the base, the lifting mechanism is arranged on the workbench, the clamping mechanism is arranged at the bottom of the lifting mechanism, the edge scraping mechanism is arranged on the side wall of the workbench, and the edge scraping mechanism is vertically arranged with the clamping mechanism. The collection mechanism is arranged inside the base. The lifting mechanism includes a first telescopic rod and a support plate. The first telescopic rod is fixedly connected to the side wall of the workbench, and the support plate is arranged at the bottom of the first telescopic rod. The clamping mechanism includes a base, the base is fixedly connected to the bottom of the first telescopic rod, a plurality of second telescopic rods are evenly distributed on the side wall of the base, a driving motor is arranged at the end of the second telescopic rod, and a support wheel is arranged at the output end of the driving motor. The support wheel is clamped with the wafer.

[0006] Further, a clamping portion corresponding to the wafer is arranged on the outer circumference of the support wheel.

[0007] Further, an anti-slip layer is wrapped outside the support wheel.

[0008] Further, the edge scraping mechanism includes a third telescopic rod, a fixing plate is arranged at the end of the third telescopic rod, a tool holder is arranged on the side wall of the fixing plate, and an edge scraping knife is arranged on the tool holder.

[0009] Further, a placement groove is provided inside the workbench, a placement tray is provided inside the placement groove, and the diameter of the placement tray is smaller than the diameter of the wafer.

[0010] Further, an air inlet groove is provided on the side wall of the placement groove, a plurality of air inlet holes communicating the air inlet groove and the placement groove are provided on the side wall of the air inlet groove, and the air inlet holes are communicated with the collection mechanism through a first transmission pipeline.

[0011] Further, an installation groove corresponding to the edge scraping mechanism is provided on the side wall of the placement groove, and a plurality of the air inlet holes are distributed on both sides of the installation groove.

[0012] Further, the collection mechanism includes a collection chamber and an air pump. The collection chamber is communicated with the air outlet end of the air pump through a second transmission pipeline, and an air outlet channel communicating with the outside is provided on the collection chamber.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] The position of the entire clamping mechanism is adjusted through the first telescopic rod to ensure that the wafer is at the optimal processing height, which helps to improve the quality and accuracy of edge scraping; the second telescopic rod is telescopically adjusted according to the diameter of the wafer to ensure that the support wheel can closely fit the edge of the wafer, providing a stable clamping force and improving the adaptability and versatility of the device; when the driving motor is started, the support wheel rotates, and then drives the clamped wafer to rotate. The edge scraping mechanism contacts the edge of the wafer for edge scraping. The wafer is stably clamped and rotated throughout the process, reducing errors caused by manual operation and improving the consistency and product quality of the entire edge scraping process; the collection mechanism is used to collect the waste generated during the edge scraping process by the edge scraping mechanism, which helps to keep the working area clean and simplifies the subsequent cleaning work. Description of the Drawings

[0015] The present utility model will be further described below with reference to the drawings.

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 is a schematic cross-sectional structural diagram of the present utility model;

[0018] Figure 3 is a schematic structural diagram of the edge scraping mechanism of the present utility model;

[0019] Reference numerals in the drawings: 1, base; 2, workbench; 21, placement groove; 22, placement tray; 23, air inlet hole; 24, first transfer pipeline; 3, lifting mechanism; 31, first telescopic rod; 32, support plate; 4, clamping mechanism; 41, base; 42, second telescopic rod; 43, drive motor; 44, support wheel; 45, clamping part; 5, edge scraping mechanism; 51, third telescopic rod; 52, fixing plate; 53, tool holder; 54, edge scraping knife; 6, collection mechanism; 61, collection chamber; 62, air pump; 63, second transfer pipeline; 64, air outlet channel. Detailed implementation manners

[0020] The following combines the drawings and embodiments to further describe in detail the specific implementation manners of the present utility model. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0021] As Figures 1 to 3 shown, a chip processing edge scraping device of the present utility model includes a base 1, a workbench 2, a lifting mechanism 3, a clamping mechanism 4, an edge scraping mechanism 5 and a collection mechanism 6. The workbench 2 is arranged on the base 1, the lifting mechanism 3 is arranged on the workbench 2, the clamping mechanism 4 is arranged at the bottom of the lifting mechanism 3, the edge scraping mechanism 5 is arranged on the side wall of the workbench 2, and the edge scraping mechanism 5 is vertically arranged with the clamping mechanism 4. The collection mechanism 6 is arranged inside the base 1; the lifting mechanism 3 includes a first telescopic rod 31 and a support plate 32. The first telescopic rod 31 is fixedly connected to the side wall of the workbench 2, and the support plate 32 is arranged at the bottom of the first telescopic rod 31; the clamping mechanism 4 includes a base 41. The base 41 is fixedly connected to the bottom of the first telescopic rod 31. A plurality of second telescopic rods 42 are uniformly distributed on the side wall of the base 41. A drive motor 43 is arranged at the end of the second telescopic rod 42. A support wheel 44 is arranged at the output end of the drive motor 43. The support wheel 44 is clamped with the wafer.

[0022] The position of the entire clamping mechanism 4 is adjusted by the first telescopic rod 31 to ensure that the wafer is at the optimal processing height, which helps to improve the quality and accuracy of edge scraping; the second telescopic rod 42 is telescopically adjusted according to the diameter of the wafer to ensure that the support wheel 44 can closely fit the edge of the wafer, providing a stable clamping force and improving the adaptability and versatility of the device; when the drive motor 43 is started, the support wheel 44 rotates, thereby driving the clamped wafer to rotate. The edge scraping mechanism 5 contacts the edge of the wafer for edge scraping. The wafer is stably clamped and rotated throughout the process, reducing errors caused by manual operation and improving the consistency and product quality of the entire edge scraping process; the collection mechanism 6 is used to collect the waste generated during the edge scraping process by the edge scraping mechanism 5, which helps to keep the working area clean and simplifies the subsequent cleaning work.

[0023] A clamping portion 45 corresponding to the wafer is provided on the outer circumference of the support wheel 44; good contact is formed between the clamping portion 45 and the edge of the wafer, ensuring that the wafer will not slip during the clamping process, avoiding the edge scraping quality problem caused by sliding, and improving the stability and reliability of the edge scraping process.

[0024] As a preference of the above embodiment, an anti-slip layer is wrapped around the support wheel 44; the friction between the support wheel 44 and the wafer is increased through the anti-slip layer. After the driving motor 43 is started, the support wheel 44 is driven to rotate, and then the wafer is driven to rotate together through the friction between the anti-slip layer and the edge of the wafer, preventing the wafer from sliding or slipping during the rotation process, and further improving the accuracy and quality of edge scraping; the anti-slip layer is made of a soft and elastic material, ensuring good contact with the edge of the wafer and helping to protect the wafer from damage.

[0025] As a preference of the above embodiment, the edge scraping mechanism 5 includes a third telescopic rod 51. A fixing plate 52 is provided at the end of the third telescopic rod 51. A tool holder 53 is provided on the side wall of the fixing plate 52, and an edge scraping knife 54 is provided on the tool holder 53; the position of the edge scraping knife 54 relative to the wafer is adjusted by the telescopic movement of the third telescopic rod 51 to adapt to wafers of different sizes, ensuring the accuracy and consistency of the edge scraping process; the fixing plate 52 is used to fix the tool holder 53 to ensure the stability of the edge scraping knife 54 during operation; the tool holder 53 is used to install and fix the edge scraping knife 54, improving the convenience of installation and disassembly of the edge scraping knife 54.

[0026] As a preference of the above embodiment, a placement groove 21 is provided inside the workbench 2, a placement tray 22 is provided inside the placement groove 21, and the diameter of the placement tray 22 is smaller than the diameter of the wafer; through this design, when the wafer is placed on the placement tray 22, the edge of the wafer will extend beyond the edge of the placement tray 22, facilitating the operation of the clamping mechanism 4 and the edge scraping mechanism 5.

[0027] As a preference of the above embodiment, an air inlet groove is provided on the side wall of the placement groove 21. A plurality of air inlet holes 23 communicating the air inlet groove and the placement groove 21 are provided on the side wall of the air inlet groove. The air inlet holes 23 are communicated with the collection mechanism 6 through a first transfer pipeline 24; through this design, the waste generated during the edge scraping process can be sucked out from the inside of the placement groove 21 by using air flow and conveyed to the collection mechanism 6, which helps to keep the workbench 2 clean, simplifies the waste treatment process, and reduces the maintenance cost.

[0028] As a preference of the above embodiment, an installation groove corresponding to the edge scraping mechanism 5 is provided on the side wall of the placement groove 21, and a plurality of air inlet holes 23 are distributed on both sides of the installation groove; the installation groove provides a stable installation position for the edge scraping mechanism 5, and the distribution of the air inlet holes 23 ensures that the waste inside the placement groove 21 during edge scraping is evenly and effectively sucked in, improving the processing efficiency.

[0029] Preferably, as in the above embodiments, the collection mechanism 6 includes a collection chamber 61 and an air pump 62. The collection chamber 61 is communicated with the air outlet end of the air pump 62 through a second transfer pipeline 63, and an air outlet channel 64 communicating with the outside is provided on the collection chamber 61. The collection chamber 61 is used to collect the waste materials transported by air flow from the placement groove 21, facilitating the regular cleaning of the waste materials. The air pump 62 is used to generate negative pressure, prompting the air and waste materials to enter the collection chamber 61 from the placement groove 21 through the transfer channel. As the air pump 62 continuously sucks air and waste materials, the air pressure inside the collection chamber 61 will gradually decrease, and the clean air is discharged through the air outlet channel 64 to maintain the air pressure balance between the inside of the collection chamber 61 and the external environment, avoiding affecting the normal operation of the air pump 62 and causing pressure problems inside the collection chamber 61 due to excessive air pressure difference, thereby improving work efficiency and safety.

[0030] When the edge scraping device for chip processing of the present utility model is working, first place the wafer on the placement tray 22 on the workbench 2. The first telescopic rod 31 extends, lowering the position of the clamping mechanism 4 and approaching the wafer. Adjust the second telescopic rod 42 according to the size of the wafer, so that the clamping portion 45 on the supporting wheel 44 is in close contact with the edge of the wafer. Start the air pump 62 to generate negative pressure, causing the air inlet holes 23 inside the placement groove 21 to start sucking air. Start the drive motor 43 to drive the supporting wheel 44 to rotate, and then the wafer starts to rotate. Adjust the third telescopic rod 51 to make the edge scraping knife 54 approach the edge of the wafer for edge scraping operation. The waste materials generated during the edge scraping process are sucked in through the air inlet holes 23 and finally enter the collection chamber 61, and the clean air is discharged to the external environment through the air outlet channel 64. After the edge scraping is completed, turn off the drive motor 43 to stop the rotation of the wafer, turn off the air pump 62 to stop the air suction process of the collection chamber 61, adjust the third telescopic rod 51 and the second telescopic rod 42 to make the edge scraping knife 54 and the supporting wheel 44 away from the wafer, and the first telescopic rod contracts, raising the clamping mechanism 4 to remove the wafer with the edge scraping completed.

[0031] The installation method, connection method or setting method of the edge scraping device for chip processing of the present utility model are all common mechanical methods, and any implementation that can achieve its beneficial effects can be carried out.

[0032] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A scraping device for chip processing, characterized in that, It includes a base (1), a workbench (2), a lifting mechanism (3), a clamping mechanism (4), a scraping mechanism (5) and a collection mechanism (6). The workbench (2) is arranged on the base (1), the lifting mechanism (3) is arranged on the workbench (2), the clamping mechanism (4) is arranged at the bottom of the lifting mechanism (3), the scraping mechanism (5) is arranged on the side wall of the workbench (2), and the scraping mechanism (5) is vertically arranged with the clamping mechanism (4). The collection mechanism (6) is arranged inside the base (1). The lifting mechanism (3) includes a first telescopic rod (31) and a support plate (32). The first telescopic rod (31) is fixedly connected to the side wall of the workbench (2), and the support plate (32) is arranged at the bottom of the first telescopic rod (31). The clamping mechanism (4) includes a base (41). The base (41) is fixedly connected to the bottom of the first telescopic rod (31). A number of second telescopic rods (42) are evenly distributed on the side wall of the base (41). A driving motor (43) is arranged at the end of the second telescopic rod (42). A support wheel (44) is arranged at the output end of the driving motor (43), and the support wheel (44) is clamped with the wafer.

2. The edge scraping device for chip processing according to claim 1, characterized in that, A clamping part (45) corresponding to the wafer is arranged on the outer circumference of the support wheel (44).

3. The edge scraping device for chip processing according to claim 1, characterized in that, The outer of the support wheel (44) is wrapped with an anti-slip layer.

4. The edge scraping device for chip processing according to claim 1, wherein, The scraping mechanism (5) includes a third telescopic rod (51). A fixing plate (52) is arranged at the end of the third telescopic rod (51). A tool holder (53) is arranged on the side wall of the fixing plate (52), and a scraping knife (54) is arranged on the tool holder (53).

5. The edge scraping device for chip processing according to claim 1, characterized in that, A placement groove (21) is arranged inside the workbench (2). An object placement tray (22) is arranged inside the placement groove (21), and the diameter of the object placement tray (22) is smaller than the diameter of the wafer.

6. The edge scraping device for chip processing according to claim 5, characterized in that, An air inlet groove is arranged on the side wall of the placement groove (21). A number of air inlet holes (23) communicating the air inlet groove and the placement groove (21) are arranged on the side wall of the air inlet groove. The air inlet holes (23) are communicated with the collection mechanism (6) through a first transmission pipeline (24).

7. The edge scraping device for chip processing according to claim 6, wherein, An installation groove corresponding to the scraping mechanism (5) is arranged on the side wall of the placement groove (21), and a number of the air inlet holes (23) are distributed on both sides of the installation groove.

8. The edge scraping device for chip processing according to claim 1, characterized in that, The collection mechanism (6) includes a collection chamber (61) and an air pump (62). The collection chamber (61) is communicated with the air outlet end of the air pump (62) through a second transmission pipeline (63). An air outlet channel (64) communicating with the outside is arranged on the collection chamber (61).

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