Spacing device for electroplating pretreatment of integrated circuit with exposed base island

Abstract

The utility model relates to a spacing device for electroplating pretreatment of an integrated circuit with an exposed base island, which comprises a bottom plate, a laminate group is mounted on the bottom plate and consists of a plurality of laminates arranged in parallel in the vertical direction, and circuit positioning mechanisms are arranged on the bottom plate and the laminates; the circuit positioning mechanism comprises positioning stand columns, and two rows of positioning stand columns are arranged in the middle of the top face of the bottom plate and the middle of the top face of the laminate. The adjacent layer plates are connected through interlayer stand columns, and the layer plate located at the bottom and the bottom plate are connected through interlayer stand columns. According to the utility model, the lead frame is spaced by the positioning columns, so that the softening liquid medicine effectively soaks the integrated circuit, and the flash of the integrated circuit is removed, thereby avoiding copper exposure of a base island and contamination of a plastic package body. The stand column positioning interval is designed in the middle of the device, positioning is faster and more accurate, and operation inconvenience caused by too long positioning of the two sides of the lead frame is solved. The top of the positioning column is semispherical, so that the friction scratch of the positioning column to the lead frame in the operation process is effectively reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronics and relates to a spacing device for the pretreatment of exposed base island integrated circuits before electroplating. Background Art

[0002] In the existing soaking device for pretreatment before electroplating, it is found that the base island of the exposed base island integrated circuit is copper-exposed and the plastic package is contaminated after electroplating. Moreover, in the softening process of the pretreatment before electroplating, the lead frames are stacked without gaps in the soaking device, and the softening solution cannot fully soak the integrated circuits, resulting in incomplete removal of the flash of the integrated circuits and residual flash, causing copper exposure on the base island of the integrated circuits and poor contamination of the plastic package. Summary of the Invention

[0003] The purpose of the utility model is to provide a spacing device for the pretreatment of exposed base island integrated circuits before electroplating, which can solve the problem of poor contamination of the plastic package and can effectively adjust the number of single operations.

[0004] According to the technical solution provided by the utility model: a spacing device for the pretreatment of exposed base island integrated circuits before electroplating includes a bottom plate, on which a layer plate group is installed. The layer plate group consists of several layer plates arranged in parallel in the vertical direction. Circuit positioning mechanisms are provided on the bottom plate and the layer plates. The circuit positioning mechanism includes positioning columns. Two rows of positioning columns are provided at the middle positions of the top surfaces of the bottom plate and the layer plates. The adjacent layer plates and the layer plate at the bottom and the bottom plate are connected by interlayer columns. The upper and lower sections of the interlayer column are respectively a positioning column and a support column. The positioning surface is between the positioning column and the support column. A positioning hole adapted to the positioning column is provided at the bottom of the support column. Connection holes are provided around the layer plate.

[0005] As a further improvement of the utility model, the bottom of the positioning column has a threaded structure. Two rows of threaded holes are provided on the bottom plate and the layer plates. The positioning column is installed on the bottom plate and the layer plates through the threaded structure.

[0006] As a further improvement of the utility model, for the interlayer column installed on the bottom plate, the bottom of the support column is fixed on the bottom plate by a welding process. The positioning column at the top of the interlayer column passes through the connection holes around the layer plate, and the layer plate abuts against the positioning surface.

[0007] As a further improvement of the utility model, the lower section of the positioning column is located in the connection hole. After the upper end of the positioning column extends out of the layer plate, a second interlayer column is sleeved on it, and then another layer plate is installed on the positioning column at the top of the second interlayer column.

[0008] As a further improvement of the utility model, guardrails are provided on both sides of the circuit positioning mechanism.

[0009] As a further improvement of the utility model, the number of the guardrails is two and they are horizontally arranged.

[0010] As a further improvement of the present utility model, both ends of the guardrail are fixedly connected to the interlayer columns.

[0011] As a further improvement of the present utility model, a handle is installed on the bottom plate.

[0012] The positive and progressive effects of this application are as follows:

[0013] 1. The present utility model adopts positioning columns to space the lead frame, enabling the softening potion to effectively soak the integrated circuit, removing the flash of the integrated circuit completely, thereby preventing the copper exposure of the base island and the contamination of the plastic package. The positioning interval of the columns is designed in the middle of the device, with faster and more accurate positioning, solving the inconvenience in operation caused by the too long positioning on both sides of the lead frame. The top of the positioning column is hemispherical, effectively reducing the possible friction and scratching of the positioning column on the lead frame during the operation.

[0014] 2. The height of the positioning column of the present utility model is less than the height of the lead frame, and it can also be compatible with other lead frames of narrower widths, and reduce the contact between the positioning column and the lead frame, effectively reducing friction and scratching. The positioning column adopts a detachable structure, and if the column is damaged, it can be replaced independently, effectively reducing the maintenance cost and time of the device.

[0015] 3. The present utility model adopts a three-layer detachable stacking design, which can effectively adjust the number of operations per time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the front view of the present utility model.

[0017] Figure 2 is the side view of the present utility model.

[0018] Figure 3 is the top view of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other. The present utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0020] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0021] It should be noted that in the description, claims and above-mentioned drawings of the present utility model, terms such as "first", "second", etc. are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances for the embodiments of the present utility model described herein. In addition, similar terms such as "comprising" and "having" mean that in addition to the content already listed in "comprising" and "having", other content not yet listed can also be "comprised" and "had"; for example, a process, method, system, product or device that can include a series of steps or units does not have to be limited to the steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0022] Due to the drawing angle problem, some components may not be drawn, but their positions and connection relationships can be understood according to the text description part.

[0023] As Figure 1 shown, the present utility model is a spacer device for pre-treatment of integrated circuit electroplating with the base island exposed, including a bottom plate 6, a layer plate group is installed on the bottom plate 6, and the layer plate group is composed of several layer plates 4 arranged in parallel in the vertical direction. Circuit positioning mechanisms are provided on the bottom plate 6 and the layer plates 4.

[0024] The circuit positioning mechanism includes positioning columns 1. Two rows of positioning columns 1 are provided at the middle positions of the top surfaces of the bottom plate 6 and the layer plates 4. The bottom of the positioning column 1 has a threaded structure, and two rows of threaded holes are provided on the bottom plate 6 and the layer plates 4. The positioning column 1 is installed on the bottom plate 6 and the layer plates 4 through the threaded structure, which is convenient for later replacement.

[0025] As Figure 2 shown, the adjacent layer plates 4 and between the bottom layer plate 4 and the bottom plate 6 are connected by interlayer columns 2. The upper and lower sections of the interlayer column 2 are respectively a positioning column 2-1 and a support column 2-2. Between the positioning column 2-1 and the support column 2-2 is a positioning surface 2-3. A positioning hole adapted to the positioning column 2-1 is provided at the bottom of the support column 2-2, and connection holes are provided around the layer plate 4. For the interlayer column 2 installed on the bottom plate 6, the bottom of the support column 2-2 is fixed on the bottom plate 6 by a welding process. The positioning column 2-1 at the top of the interlayer column 2 passes through the connection holes around the layer plate 4, and the layer plate 4 abuts against the positioning surface 2-3 to complete the connection between the layer plate 4 and the bottom plate 6; the lower section of the positioning column 2-1 is located in the connection hole, and after the upper end of the positioning column 2-1 extends out of the layer plate 4, a second interlayer column 2 is sleeved on it, and then another layer plate 4 is installed on the positioning column 2-1 at the top of the second interlayer column 2 to complete the connection between the layer plates 4.

[0026] To prevent the integrated circuit placed in the circuit positioning mechanism from moving sideways, guardrails 3 are provided on both sides of the circuit positioning mechanism. The number of guardrails 3 is two, which are horizontally arranged, and both ends of the guardrails 3 are fixedly connected to the interlayer columns 2.

[0027] To facilitate the use of this device during manual operation, a handle 5 is installed on the bottom plate 6, and the handle 5 is located at both ends of the two rows of positioning columns 1.

[0028] The working process of the present utility model is as follows:

[0029] As Figure 3 shown, the lead frames 7 are placed at intervals through the positioning columns 1, so that the softening potion can fully soak the lead frames 7. Ensure that there is an interval between the lead frames 7, so that the softening potion can fully soak, remove the flash of the integrated circuit completely, thereby preventing the copper exposure of the base island and the contamination of the plastic package.

[0030] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present utility model. However, the present utility model is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present utility model, and these modifications and improvements are also regarded as the protection scope of the present utility model.

Claims

1. A spacer device for the pretreatment before electroplating of an integrated circuit with exposed base islands, comprising a bottom plate (6), characterized in that, A laminate group is installed on the bottom plate (6). The laminate group is composed of several laminates (4) arranged in parallel in the vertical direction. Circuit positioning mechanisms are provided on the bottom plate (6) and the laminates (4). The circuit positioning mechanism includes positioning columns (1). Two rows of positioning columns (1) are provided at the middle positions of the top surfaces of the bottom plate (6) and the laminates (4). The adjacent laminates (4) and the laminate (4) at the bottom and the bottom plate (6) are connected by interlayer columns (2). The upper and lower sections of the interlayer column (2) are respectively a positioning column (2-1) and a support column (2-2). A positioning surface (2-3) is between the positioning column (2-1) and the support column (2-2). A positioning hole adapted to the positioning column (2-1) is provided at the bottom of the support column (2-2). Connecting holes are provided around the laminate (4).

2. The spacer device for pre-treatment of exposed base island integrated circuit before electroplating according to claim 1, characterized in that, The bottom of the positioning column (1) has a threaded structure. Two rows of threaded holes are provided on the bottom plate (6) and the laminates (4). The positioning column (1) is installed on the bottom plate (6) and the laminates (4) through the threaded structure.

3. The spacer device for pre-treatment of exposed base island integrated circuit before electroplating according to claim 1, characterized in that, For the interlayer column (2) installed on the bottom plate (6), the bottom of the support column (2-2) is fixed to the bottom plate (6) by a welding process. The positioning column (2-1) at the top of the interlayer column (2) passes through the connecting holes around the laminate (4), and the laminate (4) abuts against the positioning surface (2-3).

4. The spacer device for pre-treatment of exposed base island integrated circuit before electroplating according to claim 3, characterized in that, The lower section of the positioning column (2-1) is located in the connecting hole. After the upper end of the positioning column (2-1) extends out of the laminate (4), a second interlayer column (2) is sleeved on it, and then another laminate (4) is installed on the positioning column (2-1) at the top of the second interlayer column (2).

5. The spacer device for pre-treatment of exposed base island integrated circuit before electroplating according to claim 1, characterized in that, Guardrails (3) are provided on both sides of the circuit positioning mechanism.

6. The spacer device for pre-treatment of exposed base island integrated circuit before electroplating according to claim 5, characterized in that, The number of the guardrails (3) is two and they are arranged horizontally.

7. The spacer device for pre-treatment of exposed base island integrated circuit before electroplating according to claim 5, characterized in that, Both ends of the guardrail (3) are fixedly connected to the interlayer column (2).

8. The spacer device for pre-treatment of island-exposed integrated circuit electroplating according to claim 1, wherein, A handle (5) is installed on the bottom plate (6).

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