Vacuum adsorption device for automatic die bonder

Abstract

The utility model discloses a vacuum adsorption device for an automatic die bonder, which comprises a vertical plate, the upper end of the vertical plate is fixedly connected with a top plate, one end of the outer side of the vertical plate is fixedly connected with a motor, the output end of the motor penetrates through the vertical plate and is inwards provided with a lead screw, the lead screw is in threaded connection with a threaded block, the top plate is provided with an open slot, and the open slot is provided with a through hole. According to the vacuum adsorption device, the whole vacuum adsorption assembly can be driven to move longitudinally by arranging the driving assembly and the lead screw, so that the position of the adsorption assembly is adjusted, adjustment is conducted according to different machining conditions, and the application range of the device is widened; and meanwhile, the positioning assembly is arranged at the joint of the first air cylinder and the vacuum adsorption assembly, so that workers can disassemble and assemble the adsorption assembly conveniently, subsequent regular maintenance by the workers is facilitated, replacement by the workers can be facilitated, and the using effect of the vacuum adsorption device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounters, in particular to a vacuum adsorption device for an automatic chip mounter. Background Technique

[0002] Chip mounter: also known as "chip placer", "chip mounter", "surface mount system", in the production line, it is configured after the dispenser or screen printer, and it is a device that accurately places surface mount components on the PCB pads by moving the placement head. SMT chip mounting refers to the abbreviation of a series of process flows based on the PCB.

[0003] In the prior art, components are adsorbed by a vacuum chuck, but it is not convenient to adjust the position of the chuck, which has certain limitations. Moreover, the existing vacuum adsorption components are directly fixedly installed inside the device, and it is difficult to perform maintenance and replacement when a failure occurs, which is time-consuming and laborious. Content of the Utility Model

[0004] The purpose of the utility model is to provide a vacuum adsorption device for an automatic chip mounter, which solves the problem that it is not convenient to adjust the position of the chuck when the vacuum chuck adsorbs components in the prior art, and has certain limitations.

[0005] To achieve the above purpose, a vacuum adsorption device for an automatic chip mounter is provided, including a vertical plate, the upper end of the vertical plate is fixedly connected with a top plate, one end of the outer side of the vertical plate is fixedly connected with a motor, the output end of the motor penetrates the vertical plate and is provided with a lead screw inward, the lead screw is threadedly connected with a threaded block, a slot is opened on the top plate, and the threaded block is slidably connected inside the slot;

[0006] The lower end of the threaded block is fixedly connected with a cylinder I, the extending end of the cylinder I is fixedly connected with a connection disc, a vacuum chuck is correspondingly installed at the lower end of the connection disc, a fixing ring is fixedly connected to the upper end of the vacuum chuck, an installation groove is opened inside the connection disc, and the fixing ring corresponds to the installation groove.

[0007] According to the vacuum adsorption device for an automatic chip mounter, a vacuum tube penetrates through one side of the vacuum chuck, and positioning holes are opened at the four outer ends of the fixing ring.

[0008] According to the vacuum adsorption device for an automatic chip mounter, limiting grooves are opened at the four inner ends of the connection disc, and springs are fixedly connected to the inner ends of the limiting grooves.

[0009] According to the vacuum adsorption device for an automatic chip mounter, the other end of the spring is fixedly connected with a limiting plate, the other end of the limiting plate is fixedly connected with a positioning post, and the positioning post corresponds to the positioning hole.

[0010] According to the vacuum adsorption device for an automatic chip mounter, one end of the inner side of the vertical plate is fixedly connected with a first connecting seat. The outer end of the first connecting seat is fixedly connected with a second cylinder. The extending end of the second cylinder penetrates through the first connecting seat and is provided with a first slider inward. A first sliding groove is formed inside the first connecting seat. The first slider penetrates through the first sliding groove and is fixedly connected with the vertical plate outward.

[0011] According to the vacuum adsorption device for an automatic chip mounter, the other end of the inner side of the vertical plate is fixedly connected with a second connecting seat. A second sliding groove is formed inside the second connecting seat. A sliding rod is fixedly connected inside the second sliding groove. A second slider is slidably connected to the sliding rod. The second slider penetrates through the second sliding groove and is also fixedly connected with the vertical plate outward.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. In this patent, by setting the driving component and the lead screw, the entire vacuum adsorption component can be driven to move longitudinally, thereby adjusting the position of the adsorption component, making adjustments for different processing situations, improving the applicable range of the device. At the same time, setting the positioning component at the connection between the first cylinder and the vacuum adsorption component can facilitate the disassembly and assembly of the adsorption component by the staff, which is convenient for the staff to carry out subsequent regular maintenance and also convenient for the staff to replace it, improving the use effect of the vacuum adsorption device;

[0014] 2. In this patent, by setting the cylinder sliding component at the inner end of the vertical plate, the longitudinal position of the vacuum adsorption component can be moved, enabling the entire device to have the adjustment effect in both horizontal and vertical directions and improving the processing efficiency of the device.

[0015] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following further illustrates the present utility model in conjunction with the drawings and embodiments;

[0017] Figure 1 It is the front view of a vacuum adsorption device for an automatic chip mounter of the present utility model;

[0018] Figure 2 It is the side view of a vacuum adsorption device for an automatic chip mounter of the present utility model;

[0019] Figure 3 It is the top view of the vacuum adsorption component of a vacuum adsorption device for an automatic chip mounter of the present utility model;

[0020] Figure 4 It is the bottom view of the vacuum adsorption component of a vacuum adsorption device for an automatic chip mounter of the present utility model;

[0021] Figure 5 The vacuum adsorption device for an automatic chip bonder of the present utility model Figure 3 The structural schematic diagram of A in it.

[0022] In the figure: 1. Top plate; 2. First cylinder; 3. Vacuum tube; 4. Vacuum suction head; 5. First connecting seat; 6. First chute; 7. First slider; 8. Positioning column; 9. Second cylinder; 10. Second connecting seat; 11. Vertical plate; 12. Slot; 13. Threaded block; 14. Lead screw; 15. Second chute; 16. Slide bar; 17. Second slider; 18. Connecting plate; 19. Fixed ring; 20. Positioning hole; 21. Installation groove; 22. Limiting groove; 23. Limiting plate; 24. Spring; 25. Motor. Specific implementation manner

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figures 1-5 , the present utility model provides a technical solution: A vacuum adsorption device for an automatic chip bonder, including a vertical plate 11. The upper end of the vertical plate 11 is fixedly connected with a top plate 1. One end of the outer side of the vertical plate 11 is fixedly connected with a motor 25. The output end of the motor 25 penetrates through the vertical plate 11 and is provided with a lead screw 14 inside. A threaded block 13 is threadedly connected to the lead screw 14. A slot 12 is opened on the top plate 1, and the threaded block 13 is slidably connected inside the slot 12. The whole device can be installed on the workbench of the chip bonder for use. Starting the motor 25 can drive the lead screw 14 to rotate. Under the action of threaded connection, the threaded block 13 can drive the whole adsorption assembly to be adjusted longitudinally, ensuring that the electronic components can correspond to the installation positions on the PCB pads, and improving the accuracy of the device;

[0025] The lower end of the threaded block 13 is fixedly connected with a first cylinder 2. The extending end of the first cylinder 2 is fixedly connected with a connecting plate 18. A vacuum suction head 4 is correspondingly installed at the lower end of the connecting plate 18. The upper end of the vacuum suction head 4 is fixedly connected with a fixed ring 19. An installation groove 21 is opened inside the connecting plate 18. The fixed ring 19 corresponds to the installation groove 21. A vacuum tube 3 penetrates through one side of the vacuum suction head 4. Four ends of the outer side of the fixed ring 19 are provided with positioning holes 20. The vacuum tube 3 is connected to a vacuum pump. The corresponding installation groove 21 and the fixed ring 19 can facilitate the disassembly and assembly of the vacuum adsorption assembly;

[0026] The inner four ends of the connecting plate 18 are provided with limiting grooves 22. The inner ends of the limiting grooves 22 are fixedly connected with springs 24. The other ends of the springs 24 are fixedly connected with limiting plates 23. The other ends of the limiting plates 23 are fixedly connected with positioning columns 8. The positioning columns 8 correspond to the positioning holes 20. When the staff needs to disassemble and replace the vacuum adsorption component, pull the limiting plate 23 outwards. Under the action of the spring 24, the limiting plate 23 can drive the positioning column 8 to move inwards. At this time, the positioning column 8 can leave the inside of the positioning hole 20. The staff can pull the vacuum suction head 4 downwards to disassemble and take it out, so as to facilitate the staff to disassemble and replace it and improve the convenience of the device;

[0027] One end of the inner side of the vertical plate 11 is fixedly connected with a first connecting seat 5. The outer end of the first connecting seat 5 is fixedly connected with a second cylinder 9. The extending end of the second cylinder 9 penetrates through the first connecting seat 5 and is provided with a first slider 7 inside. A first sliding groove 6 is opened inside the first connecting seat 5. The first slider 7 penetrates through the first sliding groove 6 and is fixedly connected with the vertical plate 11 outside. Start the second cylinder 9 to drive the first slider 7 to slide inside the first sliding groove 6, so as to adjust the horizontal position of the vacuum adsorption component and make it correspond to the electronic components on the conveyor belt. Then start the first cylinder 2 to drive the vacuum suction head 4 to descend and contact the electronic components. Start the vacuum pump connected to the vacuum tube 3 to complete the adsorption operation of the electronic components;

[0028] The other end of the inner side of the vertical plate 11 is fixedly connected with a second connecting seat 10. A second sliding groove 15 is opened inside the second connecting seat 10. A sliding rod 16 is fixedly connected inside the second sliding groove 15. A second slider 17 is slidably connected to the sliding rod 16. The second slider 17 penetrates through the second sliding groove 15 and is also fixedly connected with the vertical plate 11 outside. Under the action of the sliding rod 16 and the second slider, the stability of the vacuum adsorption component during horizontal movement can be improved.

[0029] Working principle: When in use, start the second cylinder 9 to drive the first slider 7 to slide inside the first sliding groove 6, so as to adjust the horizontal position of the vacuum adsorption component and make it correspond to the electronic components on the conveyor belt. Then start the first cylinder 2 to drive the vacuum suction head 4 to descend and contact the electronic components. Start the vacuum pump connected to the vacuum tube 3 to complete the adsorption operation of the electronic components. Subsequently, drive the entire vacuum adsorption component to move through the second cylinder 9 to make it correspond to the PCB pad. Then start the motor 25 to drive the lead screw 14 to rotate. Under the action of the threaded connection, the threaded block 13 can drive the entire adsorption component to perform longitudinal adjustment to ensure that the electronic components can correspond to the installation positions on the PCB pad, improving the accuracy of the device. Finally, start the first cylinder 2 to drive the electronic components to move downwards and contact the PCB pad to complete its chip bonding operation.

[0030] The embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings. However, the present utility model is not limited to the above embodiments, and various changes can be made without departing from the gist of the present utility model within the scope of knowledge possessed by those of ordinary skill in the relevant art.

Claims

1. A vacuum adsorption device for an automatic chip mounter, comprising a vertical plate (11), characterized in that, The upper end of the vertical plate (11) is fixedly connected to a top plate (1). One outer end of the vertical plate (11) is fixedly connected to a motor (25). The output end of the motor (25) penetrates the vertical plate (11) and is provided with a lead screw (14) inward. A threaded block (13) is threadedly connected to the lead screw (14). A slot (12) is formed in the top plate (1), and the threaded block (13) is slidably connected inside the slot (12). The lower end of the threaded block (13) is fixedly connected to a first cylinder (2). The extending end of the first cylinder (2) is fixedly connected to a connection plate (18). A vacuum suction head (4) is correspondingly installed at the lower end of the connection plate (18). The upper end of the vacuum suction head (4) is fixedly connected to a fixing ring (19). An installation slot (21) is formed inside the connection plate (18), and the fixing ring (19) corresponds to the installation slot (21).

2. The vacuum adsorption device for an automatic chip mounter according to claim 1, wherein: One side of the vacuum suction head (4) is provided with a vacuum tube (3) penetrating through it. Four outer ends of the fixing ring (19) are provided with positioning holes (20).

3. The vacuum adsorption device for an automatic chip mounter according to claim 1, wherein: Four inner ends of the connection plate (18) are provided with limiting slots (22). Springs (24) are fixedly connected to the inner ends of the limiting slots (22).

4. The vacuum adsorption device for an automatic chip bonder according to claim 3, characterized in that: The other end of the spring (24) is fixedly connected to a limiting plate (23). The other end of the limiting plate (23) is fixedly connected to a positioning post (8), and the positioning post (8) corresponds to the positioning hole (20).

5. The vacuum adsorption device for an automatic chip mounter according to claim 1, wherein: One inner end of the vertical plate (11) is fixedly connected to a first connection seat (5). The outer end of the first connection seat (5) is fixedly connected to a second cylinder (9). The extending end of the second cylinder (9) penetrates the first connection seat (5) and is provided with a first slider (7) inward. A first sliding groove (6) is formed inside the first connection seat (5), and the first slider (7) penetrates the first sliding groove (6) and is fixedly connected to the vertical plate (11) outward.

6. The vacuum adsorption device for an automatic chip mounter according to claim 1, characterized in that: The other inner end of the vertical plate (11) is fixedly connected to a second connection seat (10). A second sliding groove (15) is formed inside the second connection seat (10). A sliding rod (16) is fixedly connected inside the second sliding groove (15). A second slider (17) is slidably connected to the sliding rod (16), and the second slider (17) penetrates the second sliding groove (15) and is also fixedly connected to the vertical plate (11) outward.

Images