Wafer box cleaning device

Abstract

The utility model belongs to the technical field of wafer box cleaning, and discloses a wafer box cleaning device. The wafer box cleaning device comprises a supporting frame, a loading frame and a cleaning assembly. The loading frame is rotationally arranged on the supporting frame and used for loading a wafer box. The cleaning assembly comprises a first spraying set, a second spraying set, a third spraying set and a fourth spraying set. The first spraying set and the second spraying set are arranged in the circumferential direction of the rotating path of the loading frame at intervals. The third spraying set and the fourth spraying set are arranged between the first spraying set and the second spraying set, the third spraying set is arranged above the loading frame, and the fourth spraying set is arranged below the loading frame. By using the wafer box cleaning device, particles with different sizes on the wafer box can be cleaned; the spraying mode can ensure that ultrapure water can be continuously used for cleaning the surface of the wafer box; and meanwhile, the multi-angle spraying groups can spray all the surfaces of the wafer box in the rotating process of the wafer box, so that impurities are prevented from being retained or transferred, and the cleanliness of all the surfaces of the wafer box is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cassette cleaning, in particular to a wafer cassette cleaning device. Background Art

[0002] In the process of wafer production, wafer cassettes are needed to hold wafers. During the use of wafer cassettes, they may be contaminated with dust particles, organic substances, AMC gaseous molecules and other pollutants. In order to ensure that wafers are in a clean environment, the wafer cassettes need to be cleaned.

[0003] In the prior art, the wafer cassette is mostly placed in a cleaning tank for ultrasonic cleaning. There are multiple frequencies of ultrasonic waves, and each frequency is targeted at different particle sizes of the pollutants to be cleaned, making it difficult to remove particles of different sizes on the surface of the wafer cassette. In addition, impurities are likely to accumulate in the water in the cleaning tank, failing to achieve the best cleaning effect and unable to effectively remove pollutants. In addition, there are also some devices that use the spraying method for cleaning, but it is difficult to spray all surfaces of the wafer cassette during spraying, and impurities on the surface of the wafer cassette are likely to remain during spraying or transfer from one surface to the remaining surfaces, making it difficult to ensure the cleanliness of all surfaces of the wafer cassette. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer cassette cleaning device to improve the cleaning effect on the wafer cassette.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] A wafer cassette cleaning device, comprising:

[0007] A support frame;

[0008] A loading rack, rotatably arranged on the support frame, and the loading rack is used for loading wafer cassettes;

[0009] A cleaning assembly, the cleaning assembly includes a first spraying group, a second spraying group, a third spraying group and a fourth spraying group. The first spraying group and the second spraying group are arranged at intervals in the circumferential direction of the rotation path of the loading rack, and the central angle of the inferior arc corresponding to the first spraying group and the second spraying group on the rotation path is greater than or equal to 60° and less than or equal to 120°. The third spraying group and the fourth spraying group are arranged between the first spraying group and the second spraying group, and the third spraying group is arranged above the loading rack, and the fourth spraying group is arranged below the loading rack.

[0010] Preferably, a plurality of loading racks are arranged along the circumferential direction of the support frame, and the cleaning assembly further includes a fifth spraying group, and the fifth spraying group is arranged at the center of the support frame.

[0011] Preferably, the first spraying group, the second spraying group and the fifth spraying group all include spray pipes arranged in the vertical direction, and the spray pipes include a plurality of nozzles arranged at intervals.

[0012] Preferably, the nozzles include adjustable-angle nozzles and fixed nozzles, and the adjustable-angle nozzles and the fixed nozzles are arranged alternately along the length direction of the spray pipe.

[0013] Preferably, the adjustable-angle nozzle includes a nozzle head and a rotating shaft, and the nozzle head is connected to the spray pipe through the rotating shaft.

[0014] Preferably, the third spraying group and the fourth spraying group both include a plurality of nozzles arranged radially along the rotation path of the loading rack, the nozzles of the third spraying group are arranged downward, and the nozzles of the fourth spraying group are arranged upward.

[0015] Preferably, the first spraying group, the second spraying group, the third spraying group, the fourth spraying group and the fifth spraying group can selectively spray liquid or gas.

[0016] Preferably, the support frame includes an upper turntable and a lower turntable. A plurality of upper mounting positions are arranged along the circumference of the upper turntable, and a plurality of lower mounting positions are arranged along the circumference of the lower turntable. The plurality of upper mounting positions and the plurality of lower mounting positions are arranged in one-to-one correspondence. One end of the loading rack is fixed to the upper mounting position, and the other end is fixed to the lower mounting position.

[0017] Preferably, the wafer cassette cleaning device further includes a driving member, and at least one of the upper turntable and the lower turntable is connected to the output end of the driving member. The driving member can drive the connected turntable to rotate clockwise or counterclockwise.

[0018] Preferably, at least two wafer cassette loading positions are arranged at intervals along the height direction of the loading rack.

[0019] Beneficial effects:

[0020] The wafer cassette cleaning device provided by the present utility model is provided with a support frame, a loading frame and a cleaning component. The loading frame is rotatably arranged on the support frame and can drive the wafer cassette to rotate. In addition, a cleaning component is provided. The cleaning component includes a multi-angle spraying group. The central angle of the inferior arc corresponding to the first spraying group and the second spraying group on the rotation path is greater than or equal to 60° and less than or equal to 120°. When cleaning the wafer cassette, the wafer cassette on the loading frame rotates. When the opening of the wafer cassette faces between the first spraying group and the second spraying group, at this time, the first spraying group and the second spraying group can simultaneously spray the circumferential surface of the wafer cassette. The third spraying group and the fourth spraying group can spray the upper and lower surfaces of the wafer cassette. After the wafer cassette rotates a certain angle, the ultrapure water sprayed by the cleaning component can fully sweep through all surfaces of the wafer cassette and clean the surface of the wafer cassette. Using a loading frame that can drive the wafer cassette to rotate and cooperating with a multi-angle spraying group can ensure that particles of different particle sizes attached to the wafer cassette can be removed; and using the spraying method can ensure that the surface of the wafer cassette can be continuously cleaned with ultrapure water; at the same time, the multi-angle spraying group can spray all surfaces of the wafer cassette simultaneously when the wafer cassette rotates to a certain angle, avoiding the transfer of impurities and ensuring the cleanliness of all surfaces of the wafer cassette. Description of the Drawings

[0021] Figure 1 is the overall schematic diagram of the wafer cassette cleaning device provided by the present utility model;

[0022] Figure 2 is the schematic diagram of the other side of the overall wafer cassette cleaning device provided by the present utility model;

[0023] Figure 3 is the top view of the wafer cassette cleaning device provided by the present utility model;

[0024] Figure 4 is the view of the wafer cassette being sprayed inside the wafer cassette cleaning device provided by the present utility model.

[0025] In the figure:

[0026] 1 - First spraying group; 11 - First spray pipe; 12 - Second spray pipe;

[0027] 2 - Second spraying group; 21 - Third spray pipe; 22 - Fourth spray pipe;

[0028] 3 - Third spraying group;

[0029] 4 - Fourth spraying group;

[0030] 5 - Fifth spraying group; 51 - Fifth spray pipe; 52 - Sixth spray pipe;

[0031] 6 - Adjustable angle nozzle;

[0032] 7 - Fixed nozzle;

[0033] 8 - Loading rack;

[0034] 9 - Wafer cassette;

[0035] 10 - Support frame; 101 - Lower turntable; 102 - Upper turntable. Detailed implementation manners

[0036] The present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that, for the sake of convenience of description, only the parts related to the present utility model rather than all the structures are shown in the accompanying drawings.

[0037] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0038] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above the upper side", and "on the upper side" of the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below the lower side", and "on the lower side" of the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is lower than that of the second feature.

[0039] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "right", etc. are based on the orientation or positional relationships shown in the accompanying drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0040] As Figures 1 - 4As shown in the figure, in this embodiment, a wafer cassette cleaning device is provided, which includes a support frame 10, a loading rack 8 and a cleaning assembly. The loading rack 8 is rotatably arranged on the support frame 10, and the loading rack 8 is used to load the wafer cassette 9. When the loading rack 8 loads the wafer cassette 9, it can drive the wafer cassette 9 to rotate together. The cleaning assembly includes a first spray group 1, a second spray group 2, a third spray group 3 and a fourth spray group 4. The first spray group 1 and the second spray group 2 are arranged at intervals in the circumferential direction of the rotation path of the loading rack 8, and the central angle of the inferior arc corresponding to the first spray group 1 and the second spray group 2 on the rotation path is greater than or equal to 60° and less than or equal to 120°. The third spray group 3 and the fourth spray group 4 are arranged between the first spray group 1 and the second spray group 2, and the third spray group 3 is arranged above the loading rack 8, and the fourth spray group 4 is arranged below the loading rack 8.

[0041] Specifically, the loading rack 8 can rotate around a fixed rotation axis on the support frame 10, thereby driving the wafer cassette 9 loaded thereon to rotate around the rotation axis. When the cleaning assembly works, ultrapure water can be sprayed out. The sprayed ultrapure water can remove the dirt existing on the wafer cassette 9 and keep it away from the wafer cassette 9. When the wafer cassette 9 rotates around the rotation axis, the spray cleaning assembly can spray onto the surface of the wafer cassette 9 at different angles, thereby cleaning the entire wafer cassette 9. Further, the first spray group 1 and the second spray group 2 of the cleaning assembly are arranged in a triangular pattern with the rotation axis. When the wafer cassette 9 rotates to a certain angle, the ultrapure water sprayed by the first spray group 1 and the second spray group 2 can be sprayed onto the surface of the wafer cassette 9 from different angles simultaneously. Among them, the wafer cassette 9 has a cover. After the cover is opened, the opening of the wafer cassette 9 faces away from the rotation axis. Further, the wafer cassette 9 has two open ends, and the other open end is arranged at one end of the wafer cassette 9 close to the rotation axis.

[0042] Furthermore, when one side opening of the wafer cassette 9 faces between the first spray group 1 and the second spray group 2, the first spray group 1 and the second spray group 2 can simultaneously spray ultrapure water onto the wafer cassette 9 to clean all circumferential surfaces of the wafer cassette 9. When the wafer cassette 9 rotates further, the first spray group 1 and the second spray group 2 can be sprayed onto the other side of the wafer cassette 9 to fully clean the circumferential surface of the wafer cassette 9. At the same time, the settings of the third spray group 3 and the fourth spray group 4 enable the third spray group 3 to spray ultrapure water downward to clean the upper surface of the wafer cassette 9 and the fourth spray group 4 to spray ultrapure water upward to clean the lower surface of the wafer cassette 9 when the wafer cassette 9 rotates to the position between the first spray group 1 and the second spray group 2. Then, in cooperation with the first spray group 1 and the second spray group 2, the circumferential surface and the upper and lower surfaces of the wafer cassette 9 can be sprayed simultaneously. Therefore, with the cooperation of the four spray groups of the cleaning assembly, the dirt on the surface of the wafer cassette 9 can be fully cleaned.

[0043] Specifically, a plurality of loading racks 8 are circumferentially arranged on the support frame 10. The cleaning assembly further includes a fifth spraying group 5, and the fifth spraying group 5 is arranged at the center of the support frame 10. Further, the number of the loading racks 8 is four, and the four loading racks 8 are evenly arranged along the circumference of the rotating shaft. At the same time, due to the arrangement of a plurality of loading racks 8, one side of the wafer cassette 9 arranged on the loading rack 8 close to the rotating shaft cannot be sprayed by the first spraying group 1 and the second spraying group 2. And a fifth spraying group 5 is arranged at the center of the support frame 10, and the spraying direction of the fifth spraying group 5 is away from the rotating shaft. Therefore, the fifth spraying group 5 can spray ultrapure water to clean the end of the wafer cassette 9 close to the rotating shaft.

[0044] Specifically, each of the first spraying group 1, the second spraying group 2 and the fifth spraying group 5 includes a spray pipe arranged in the vertical direction, and the spray pipe includes a plurality of nozzles arranged at intervals. The spray pipe is arranged in the vertical direction, and the nozzles arranged at intervals on the spray pipe can spray ultrapure water at the same time to clean the wafer cassette 9. Since the wafer cassette 9 has a certain height, the nozzles arranged at intervals in the vertical direction can simultaneously clean the surfaces at different heights on the wafer cassette 9, avoiding cleaning dead corners in the height direction of the wafer cassette 9.

[0045] Further, the nozzles include adjustable-angle nozzles 6 and fixed nozzles 7, and the adjustable-angle nozzles 6 and the fixed nozzles 7 are arranged alternately along the length direction of the spray pipe. The adjustable-angle nozzles 6 can adjust the angle of the spraying surface of the ultrapure water they spray, so that the ultrapure water can be better sprayed onto the wafer cassette 9. The fixed nozzles 7 can spray ultrapure water towards the direction of the rotating shaft. The ultrapure water sprayed by the nozzles forms a spraying surface to clean the wafer cassette in a large range. Specifically, different spraying surfaces can be formed by setting different nozzles. For example, spiral nozzles can be set, and the water flow forms a conical spraying surface at each interface by hitting the layered interface of the spiral; solid conical nozzles can also be set to make the liquid move centrifugally through a specific blade design inside the nozzle, so as to eject a complete conical spray. The adjustable-angle nozzles 6 and the fixed nozzles 7 work together to completely clean the wafer cassette 9 in the vertical direction.

[0046] Further, the adjustable-angle nozzles 6 include a nozzle head and a rotating shaft, and the nozzle head is connected to the spray pipe through the rotating shaft. The nozzle head can adjust its own spraying direction through the rotating shaft and make the spraying direction face the inside of the wafer cassette 9 so that the inside of the wafer cassette 9 is completely cleaned.

[0047] Specifically, each of the third spraying group 3 and the fourth spraying group 4 includes a plurality of nozzles arranged radially along the rotation path of the loading rack 8. The nozzles of the third spraying group 3 are arranged downward, and the nozzles of the fourth spraying group 4 are arranged upward. Since the wafer cassette 9 has a certain width, when the wafer cassette 9 rotates, the nozzles on the third spraying group 3 and the fourth spraying group 4 can simultaneously spray different positions on the upper and lower surfaces of the wafer cassette 9 along the radial direction of the rotation path, so as to completely clean the upper and lower surfaces of the wafer cassette 9.

[0048] Specifically, the first spraying group 1, the second spraying group 2, the third spraying group 3, the fourth spraying group 4 and the fifth spraying group 5 can all selectively spray out liquid or gas. Further, the first spraying group 1, the second spraying group 2 and the fifth spraying group 5 each have two spray pipes. One of the spray pipes can spray out ultrapure water, and the other spray pipe can spray out dry cleaning gas, such as nitrogen. The two spray pipes can also selectively spray out liquid or gas simultaneously. Furthermore, the first spraying group 1 has a first spray pipe 11 and a second spray pipe 12, and the two spray pipes are arranged circumferentially along the rotation path of the loading rack 8; the second spraying group 2 has a third spray pipe 21 and a fourth spray pipe 22, and the two spray pipes are arranged circumferentially along the rotation path of the loading rack 8; the fifth spraying group 5 has a fifth spray pipe 51 and a sixth spray pipe 52, and the two spray pipes are both near the center of the rotation path of the loading rack 8. The third spraying group 3 and the fourth spraying group 4 each have a spray pipe and a plurality of nozzles. According to needs, liquid or gas can enter the spray pipe, and then the nozzles of the third spraying group 3 and the fourth spraying group 4 spray out liquid or gas.

[0049] Specifically, the support frame 10 includes an upper turntable 102 and a lower turntable 101. A plurality of upper mounting positions are arranged along the circumference of the upper turntable 102, and a plurality of lower mounting positions are arranged along the circumference of the lower turntable 101. The plurality of upper mounting positions and the plurality of lower mounting positions are arranged in one-to-one correspondence. One end of the loading rack 8 is fixed to the upper mounting position, and the other end is fixed to the lower mounting position. Further, the mounting positions of the upper and lower turntables are fan-shaped holes, and the upper and lower ends of the loading rack 8 can be simultaneously clamped into the holes of the upper and lower turntables and then fixed to the upper and lower turntables. Furthermore, there are four mounting positions on each of the upper and lower turntables, and the upper and lower turntables can drive the loading rack 8 arranged therein to rotate. In some other embodiments, the number of mounting positions on the upper and lower turntables can also be other numbers.

[0050] Specifically, the wafer cassette cleaning device further includes a driving member. At least one of the upper turntable 102 and the lower turntable 101 is connected to the output end of the driving member, and the driving member can drive the turntable connected thereto to rotate clockwise or counterclockwise. Further, the driving member is a motor that can drive the output end to rotate, and the motor can drive the turntable connected thereto to rotate clockwise or counterclockwise at any time. It can be understood that when the opening of the wafer cassette 9 is arranged between the first spraying group 1 and the second spraying group 2, the motor can regularly change the rotation direction so that the inside of the wafer cassette 9 is continuously sprayed with ultrapure water, thereby improving the cleaning effect on the wafer cassette 9.

[0051] Specifically, at least two wafer cassette loading positions are provided on the loading rack 8 at intervals in the height direction. Further, three wafer cassettes 9 are provided on the loading rack 8 at intervals in the height direction, and the nozzles at different heights on the first spraying group 1 and the second spraying group 2 can simultaneously clean the three wafer cassettes 9. At the same time, four loading racks 8 are provided between the upper turntable 102 and the lower turntable 101, that is, the wafer cassette cleaning device can place twelve wafer cassettes 9 at the same time and clean the twelve wafer cassettes 9.

[0052] Specifically, the wafer cassette mounting position on the loading rack 8 is of an open design. The wafer cassette mounting position includes an open surface and five grid-shaped limiting surfaces. Further, a clamping member is provided on the mounting position of the wafer cassette 9, and the clamping member can prevent the wafer cassette 9 from being thrown out during rotation.

[0053] Further, when the wafer cassette cleaning device is working, the upper and lower turntables rotate at high speed or low speed, driving the loading rack 8 and the wafer cassette 9 to rotate. The cleaning components sequentially cycle to perform single high-pressure spraying or multi-group combined spraying to remove pollutants. The wafer cassette will rotate clockwise or counterclockwise to perform cleaning in different orientations, so that every position on all surfaces of the wafer cassette 9 is completely covered and sprayed. After the spraying is completed, the turntable rotates at high speed or low speed. The wafer cassette 9 is restricted by the wafer cassette mounting position and will not be thrown out, while the residual droplets and dirt on the surface of the wafer cassette 9 are unrestricted and removed by centrifugation. After centrifugally removing the droplets and dirt, multiple spraying groups will spray clean gas such as nitrogen to impact and strip the droplets and dirt with gas, so as to remove the dirt on the surface of the wafer cassette 9 and achieve drying at the same time.

[0054] Obviously, the above-mentioned embodiments of the present invention are only examples for clearly explaining the present invention, and are not intended to limit the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A wafer cassette cleaning device, characterized in that Comprising: A support frame (10); A loading rack (8), rotatably arranged on the support frame (10), and the loading rack (8) is used for loading a wafer cassette (9); A cleaning assembly, the cleaning assembly includes a first spray group (1), a second spray group (2), a third spray group (3) and a fourth spray group (4), the first spray group (1) and the second spray group (2) are arranged at intervals in the circumferential direction of the rotation path of the loading rack (8), and the central angle of the inferior arc corresponding to the first spray group (1) and the second spray group (2) on the rotation path is greater than or equal to 60° and less than or equal to 120°, the third spray group (3) and the fourth spray group (4) are arranged between the first spray group (1) and the second spray group (2), and the third spray group (3) is arranged above the loading rack (8), and the fourth spray group (4) is arranged below the loading rack (8).

2. The wafer cassette cleaning device according to claim 1, characterized in that, A plurality of loading racks (8) are arranged along the circumferential direction of the support frame (10), and the cleaning assembly further includes a fifth spray group (5), and the fifth spray group (5) is arranged at the center of the support frame (10).

3. The wafer cassette cleaning device according to claim 2, characterized in that, The first spray group (1), the second spray group (2) and the fifth spray group (5) all include spray pipes arranged in the vertical direction, and the spray pipes include a plurality of nozzles arranged at intervals.

4. The wafer cassette cleaning device according to claim 3, wherein, The nozzles include adjustable-angle nozzles (6) and fixed nozzles (7), and the adjustable-angle nozzles (6) and the fixed nozzles (7) are arranged alternately along the length direction of the spray pipe.

5. The wafer cassette cleaning device according to claim 4, characterized in that, The adjustable-angle nozzle includes a nozzle head and a rotating shaft, and the nozzle head is connected to the spray pipe through the rotating shaft.

6. The wafer cassette cleaning device according to claim 1, characterized in that, The third spray group (3) and the fourth spray group (4) both include a plurality of nozzles arranged radially along the rotation path of the loading rack (8), the nozzles of the third spray group (3) are arranged downward, and the nozzles of the fourth spray group (4) are arranged upward.

7. The wafer cassette cleaning device according to claim 2, wherein, The first spray group (1), the second spray group (2), the third spray group (3), the fourth spray group (4) and the fifth spray group (5) can all selectively spray liquid or gas.

8. The wafer cassette cleaning device according to any one of claims 1-7, characterized in that, The support frame (10) includes an upper turntable (102) and a lower turntable (101), a plurality of upper mounting positions are arranged along the circumferential direction of the upper turntable (102), a plurality of lower mounting positions are arranged along the circumferential direction of the lower turntable (101), the plurality of upper mounting positions and the plurality of lower mounting positions are arranged in one-to-one correspondence, one end of the loading rack (8) is fixed to the upper mounting position, and the other end is fixed to the lower mounting position.

9. The wafer cassette cleaning device according to claim 8, characterized in that, The wafer cassette cleaning device further includes a driving member, at least one of the upper turntable (102) and the lower turntable (101) is connected to the output end of the driving member, and the driving member can drive the connected turntable to rotate in the clockwise or counterclockwise direction.

10. The wafer cassette cleaning device according to any one of claims 1-7, characterized in that, The loading rack (8) is provided with at least two wafer cassette loading positions at intervals in the height direction.

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