Semiconductor chip spring cover plate and fixing assembly

Abstract

The utility model provides a semiconductor chip shrapnel cover plate and a fixing assembly, the shrapnel cover plate is used for pressing an elastic arm of a chip fixing shrapnel, the shrapnel cover plate comprises a cover plate main body, the front surface of the cover plate main body is a surface far away from the elastic arm, and the back surface of the cover plate main body is a surface in contact with the elastic arm. The cover plate main body is divided into a connecting part in the center and pressing parts located on the two sides of the connecting part, the pressing parts protrude out of the connecting part on the back face of the cover plate main body and are divided into two thickening areas and a transition area in the length direction, the transition area is located between the two thickening areas, a height difference exists between the transition area and the thickening areas, and the height difference ranges from 0.01 mm to 0.15 mm. The semiconductor chip fixing assembly comprises the elastic sheet cover plate. The surface of the cover plate main body, which is in contact with the elastic sheet, is designed into a structure with a thin middle part and two thick ends, so that the force of the cover plate for pressing the elastic sheet at the initial stage can be ensured, the deviation of tilting deformation of the two ends of the cover plate after long-time use can be counteracted, the positioning precision of the semiconductor chip fixing assembly is further improved, the service life is prolonged, and the cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip detection, in particular to a shrapnel cover plate and a fixing component for a semiconductor chip. Background Art

[0002] With the rapid development of semiconductor technology, the demand for various electronic component chips is increasing, and the size design of the chips is becoming more and more delicate. When bonding and welding or testing the chips, a stable and safe carrier is needed to fix them to ensure the normal operation of subsequent operations. At present, the commonly used semiconductor chip fixing components include a cover plate, a shrapnel, and a bottom plate. The chip is placed in the chip slot of the bottom plate, and the cover plate presses on the shrapnel, driving the shrapnel to expand and elastically fix the chip in the chip slot. Since the screws for locking the cover plate are generally arranged in the middle of the cover plate, and the surface of the cover plate in contact with the shrapnel arm is a flat surface, after long-term use, affected by the reaction force of the shrapnel, the two ends of the cover plate will deform upward. After deformation, when pressing the shrapnel, the pressure is uneven in the overall length direction of the cover plate, and the pressure at both ends becomes weak, resulting in the chip not being firmly clamped, being prone to position offset during the testing stage, affecting the test results, and shortening the service life of the fixing component. Therefore, it is necessary to improve the cover plate to solve the above problems and avoid potential hazards. Summary of the Utility Model

[0003] The utility model provides a shrapnel cover plate and a fixing component for a semiconductor chip, which have a simple structure, are convenient to use, and have high efficiency. The following technical solutions are adopted.

[0004] A shrapnel cover plate for a semiconductor chip, which is used to press the shrapnel arm for fixing the chip, includes a cover plate main body. The front surface of the cover plate main body is the side away from the shrapnel arm, and the back surface of the cover plate main body is the side in contact with the shrapnel arm. The cover plate main body is divided into a central connecting part and pressing parts located on both sides of the connecting part. On the back surface of the cover plate main body, the pressing parts protrude from the connecting part. The pressing part includes two thickening areas and a transition area along the length direction. The transition area is located between the two thickening areas, and there is a height difference between the transition area and the thickening area, and the height difference is 0.01 - 0.15 mm.

[0005] As a further improved technical solution of the utility model, the ratio of the transition area to the thickening area is 3:1.

[0006] As a further improved technical solution of the utility model, on the back surface of the cover plate main body, the pressing part is an arc-shaped surface, and the transition area to the thickening area is an integral arc.

[0007] As a further improved technical solution of the utility model, on the back surface of the cover plate main body, the pressing part is a stepped surface, the transition area is a flat surface, and the thickening area protrudes from the transition area, and the two areas are distributed in a stepped manner.

[0008] As a further improved technical solution of the present utility model, the thickened area is a plane.

[0009] As a further improved technical solution of the present utility model, the thickened area is a multi-layer stepped plane, and the height difference and width of adjacent layers of steps in the thickened area are the same.

[0010] As a further improved technical solution of the present utility model, the thickened area and the transition area are in the shape of an inclined parallelogram, and the inclined direction is set corresponding to the inclined arrangement direction of the lower elastic arm on the elastic sheet.

[0011] As a further improved technical solution of the present utility model, a pair of adjustment holes are opened on the connecting portion, symmetrically distributed about the center of the connecting portion, and the adjustment holes are located within the transition area corresponding to the pressing portion.

[0012] A semiconductor chip fixing assembly includes the semiconductor chip elastic sheet cover plate as described in any one of the above, and further sequentially includes a fixing plate, an elastic sheet, a positioning plate, and a bottom plate. The cover plate body is arranged above the fixing plate, and the cover plate body is movably arranged on the fixing plate through screws.

[0013] As a further improved technical solution of the present utility model, the elastic sheet includes a skeleton and elastic arms symmetrically distributed on both sides of the skeleton. The elastic arms are arranged at equal intervals along the length direction of the skeleton, and the pressing portion is movably arranged on the elastic arms.

[0014] By optimizing the structure of the semiconductor chip elastic sheet cover plate of the present utility model, the surface of the cover plate body in contact with the elastic sheet is designed to have a structure that is thin in the middle and thick at both ends. The proportion of the thin area in the middle is high, and the height difference between the thinnest part and the thickest part is between 0.12 mm and 0.18 mm. In this way, it can not only ensure the force of the cover plate pressing the elastic sheet in the initial stage, but also offset the deviation of the two ends of the cover plate warping and deforming during long-term use, thereby improving the positioning accuracy of the semiconductor chip fixing assembly, extending the service life, and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of the cover plate body of the present utility model.

[0016] Figure 2 It is a side schematic view of Embodiment 1.

[0017] Figure 3 It is a side schematic view of Embodiment 2.

[0018] Figure 4 It is a side schematic view of Embodiment 3.

[0019] Figure 5 It is a schematic diagram of the regional distribution of the back pressing portion of the cover plate body in Embodiment 3.

[0020] Figure 6 It is a schematic diagram of a shrapnel.

[0021] Figure 7 It is a schematic exploded view of the structure of the semiconductor chip fixing component in Embodiment 4. Detailed implementation manners

[0022] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. Embodiment 1

[0023] Referring to Figure 1 、 Figure 2 and Figure 7 , a semiconductor chip shrapnel cover plate in this embodiment is used to press the shrapnel arm 320 of the chip fixing shrapnel 300, and includes a cover plate main body 100. The front surface a of the cover plate main body 100 is the surface away from the shrapnel arm 320, and the back surface b of the cover plate main body 100 is the surface in contact with the shrapnel arm 320. The cover plate main body 100 is divided into a connecting portion 110 in the middle and pressing portions 120 located on both sides of the connecting portion 110, and the pressing portions 120 on both sides have the same structure. On the back surface b of the cover plate main body 100, the pressing portion 120 protrudes from the connecting portion 110. On the front surface a of the cover plate main body 100, the connecting portion 110 protrudes from the pressing portion 120. The pressing portion 120 includes two thickening regions 121 and a transition region 122 along the length direction. The transition region 122 is located between the two thickening regions 121, and there is a height difference H between the transition region 122 and the thickening region 121, making the back surface b of the cover plate main body 100 form a shape that is thin in the middle and thick at both ends. The height difference H is 0.01 - 0.15 mm, and in this embodiment, the height difference is preferably 0.04 mm or 0.05 mm or 0.06 mm.

[0024] Furthermore, the ratio of the transition region 122 to the thickening region 121 is 3:1. The two thickening regions 121 together account for one-fourth of the area of the pressing portion 120, and the two thickening regions are equally divided, that is, the ratio of the first thickening region, the transition region, and the second transition region arranged in sequence along the length direction of the pressing portion 120 is 1:6:1.

[0025] On the front surface a of the cover plate main body 100, the pressing portion 120 is a plane. On the back surface b of the cover plate main body, the pressing portion 120 is an arc-shaped surface, and the transition from the transition region 122 to the thickening region 121 is an integral arc, as shown in Figure 2 . A pair of adjustment holes 111 are opened on the connecting portion 110 for installing adjustment screws 112 to connect the cover plate main body 100 to the fixing plate 200. Each pair of adjustment holes 111 is symmetrically distributed about the center of the connecting portion 110, and the adjustment holes 111 are located within the transition region 122 of the corresponding pressing portion 120. Positioning holes 113 are also provided outside each pair of adjustment holes 111. Example 2

[0026] The difference from the solution of Example 1 is that on the back surface b of the cover plate body 100, the pressing portions 120 on both sides of the connecting portion 110 are stepped surfaces, the transition region 122 is a flat surface, and the thickening region 121 protrudes from the transition region 122, and the two regions are distributed in a stepped manner. The thickening region 121 is also a flat surface, as Figure 3 . Example 3

[0027] The difference from the solution of Example 1 is that on the back surface b of the cover plate body 100, the pressing portions 120 on both sides of the connecting portion 110 are stepped surfaces, the transition region 122 is a flat surface, the thickening region 121 protrudes from the transition region 122, and the two regions are distributed in a stepped manner. The thickening region 121 is a multi-layer stepped flat surface. Preferably, the thickening region 121 is two-layer stepped flat surfaces 121a and 121b. The height difference and width of adjacent layers of steps in the thickening region 121 are the same, and the transition region 122 and the thickening region 121 are in the shape of an inclined parallelogram. The inclination directions of the transition region 122 and the thickening region 121 are set corresponding to the inclined arrangement direction of the lower elastic arms 320 on the skeleton 310. For corresponding reference Figure 4 , Figure 5 and Figure 6 .

[0028] It should be clear that these three regions, namely the two thickening regions 121 and the transition region 122, are effective functional regions, that is, these three regions correspondingly cover and contact all the elastic arms 320. There may also be non-functional regions that do not contact the elastic arms 320 outside the two thickening regions 121, without specific restrictions and requirements, and may have the same thickness as the adjacent thickening regions 121.

[0029] Since the actual height difference between the thickening region 121 and the transition region 122 on the back surface b of the pressing portion 120 is difficult to observe with the naked eye, so in this article, whether the back surface b of the pressing portion 120 is arc-shaped, stepped or flat, in the Figures 2 - 4 attachments are not in actual enlarged scale, and are specially enlarged for clearly showing and distinguishing the shapes of the thickening region 121 and the transition region 122. Example 4

[0030] Combined with Figures 1 - 7 , a semiconductor chip fixing component of this embodiment includes the cover plate body 100 of any one of the above embodiments, and further sequentially includes a fixing plate 200, a spring piece 300, a positioning plate 400, and a bottom plate 500. The cover plate body 100 is arranged above the fixing plate 200, and the cover plate body 100 is movably arranged on the fixing plate 200 by adjusting screws 112.

[0031] Specifically, the elastic piece 300 includes a framework 310 and elastic arms 320 that are symmetrically distributed on both sides of the framework 310 in a central symmetry manner. The elastic arms 320 are arranged at equal intervals and obliquely along the length direction of the framework 310, are integrally formed with the framework 131, and are made of stainless steel material. For example, Figure 6 The elastic arms 320 are arc-shaped, and a right-angle notch is provided at the outer end of the elastic arms 320. The pressing part 120 is movably pressed on the elastic arms 320 to press the arc-shaped elastic arms 320.

[0032] Furthermore, the framework 131 of the elastic piece is fixed on the bottom plate 110. Connecting holes 600 are provided at corresponding positions at both ends of the framework 310 of the elastic piece 300, both ends of the fixing plate 200, the positioning plate 400, and the bottom plate 500. Fixing screws pass through the connecting holes 600 to fix the fixing plate 200, the elastic piece 300, and the positioning plate 400 on the bottom plate 500. Two rows of chip slots 510 are symmetrically arranged on the bottom plate 500, and the number is preferably 24 - 48, in even pairs, and the specific number can be set according to needs. A positioning slot 410 is provided on the positioning plate 400, and the positioning slot 410 corresponds to the chip slot 510 one by one. The positioning slot 410 is a through hole, and the chip slot 510 is a groove.

[0033] The cover body 100 is movably arranged on the fixing plate 200 through the adjusting screw 112 on the top surface. By screwing the adjusting screw 112, the cover body 100 is pressed downward towards the elastic piece 300. Under the pressure of the pressing part 120, the arc-shaped elastic arms 320 expand, and the right-angle notch at the end of the elastic arms 320 pushes the chip to be fixed at the end corners of the positioning slot 410 and the chip slot 510. By screwing the adjusting screw 112 in the reverse direction, the fixing restriction is released. Under the action of the elastic restoring force of the elastic arms 320, the pressing part 120 rises, and the end of the elastic arms 322 retracts away from the chip, and the chip is in a free state. At this time, the chip can be removed from the fixing component.

[0034] Spatial relative position terms such as "upper" and "lower" used in this text are for the purpose of facilitating the description of the relationship between one feature and another as shown in the drawings. It can be understood that according to the different placement positions of the product, the spatial relative position terms can be intended to include different orientations other than the orientations shown in the drawings, and should not be construed as a limitation on the claims.

[0035] In addition, the above embodiments are only used to illustrate the present invention and do not limit the technical solutions described in the present invention. The understanding of this specification should be based on those skilled in the art of the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the relevant technical field can still modify the present invention or make equivalent substitutions, and all technical solutions and their improvements that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A semiconductor chip spring cover plate for pressing the spring arms of a chip-fixed spring, comprising a cover plate body. The front surface of the cover plate body is the side away from the spring arms, and the back surface of the cover plate body is the side in contact with the spring arms. It is characterized in that: The cover plate body is divided into a connecting part and pressing parts located on both sides of the connecting part. On the back of the cover plate body, the pressing parts protrude from the connecting part. The pressing parts are divided along the length direction to include two thickening areas and a transition area. The transition area is located between the two thickening areas. There is a height difference between the transition area and the thickening area, and the height difference is 0.01 - 0.15 mm.

2. The semiconductor chip spring sheet cover plate according to claim 1, characterized in that: The ratio of the transition area to the thickening area is 3:

1.

3. The semiconductor chip elastic sheet cover plate according to claim 1, wherein: On the back of the cover plate body, the pressing part is an arc-shaped curved surface, and the transition area to the thickening area is an integral arc.

4. The semiconductor chip elastic sheet cover plate according to claim 1, characterized in that: On the back of the cover plate body, the pressing part is a stepped surface, the transition area is a flat surface, and the thickening area protrudes from the transition area, and the two areas are distributed in a stepped manner.

5. The semiconductor chip spring sheet cover plate according to claim 4, wherein: The thickening area is a flat surface.

6. The semiconductor chip spring sheet cover plate according to claim 4, wherein: The thickening area is a multi-layer stepped flat surface, and the height difference and width of the adjacent layer steps of the thickening area are the same.

7. The semiconductor chip spring sheet cover plate according to claim 6, wherein: The thickening area and the transition area are in the shape of an inclined parallelogram, and the inclination direction is set corresponding to the inclined arrangement direction of the lower elastic arms on the elastic sheet.

8. The semiconductor chip elastic sheet cover plate according to claim 1, wherein: A pair of adjusting holes are opened on the connecting part, which are symmetrically distributed with respect to the center of the connecting part, and the adjusting holes are located within the range of the transition area corresponding to the pressing part.

9. A semiconductor chip fixing component, characterized in that: It includes the semiconductor chip elastic sheet cover plate according to any one of claims 1 - 7, and further sequentially includes a fixing plate, an elastic sheet, a positioning plate, and a bottom plate. The cover plate body is arranged above the fixing plate, and the cover plate body is movably arranged on the fixing plate through adjusting screws.

10. The semiconductor chip fixing component according to claim 9, wherein: The elastic sheet includes a skeleton and elastic arms symmetrically distributed on both sides of the skeleton at the center. The elastic arms are arranged at equal intervals along the length direction of the skeleton, and the pressing part is movably arranged on the elastic arms.

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