Power module, circuit board and power conversion equipment

Abstract

The utility model provides a power module, a circuit board and power conversion equipment, and relates to the technical field of accessories of the power conversion equipment, the power module comprises a base, a cover plate and a power device, a groove is formed in the base, the power device is installed in the groove, the cover plate is connected with the base, and the cover plate is connected with the base. The base pin assembly is used for being electrically connected with a circuit substrate, and the base pin assembly of the power device is used for being electrically connected with the circuit substrate. Before the circuit board is produced, the power device is fixed through the cooperation of the cover plate and the base, then the pin assembly of the fixed power device and the circuit substrate of the power conversion equipment are welded, and a pressing plate in the prior art does not need to be inserted between the circuit substrate and the power device in the process, so that the production efficiency is improved. Therefore, the production efficiency of the circuit board is effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of accessories for power conversion devices, and more particularly, to a power module, a circuit board, and a power conversion device. Background Art

[0002] A power conversion device is a converter used to convert DC electrical energy into a fixed-frequency voltage or a frequency-modulated and voltage-regulated alternating current.

[0003] In the related art, a power conversion device usually adopts the following heat dissipation structure. For example, the power conversion device includes fastening screws, a circuit board, an insulating pad, and a radiator. The circuit board includes a pressing plate, a circuit substrate, and power devices. The fastening bolts sequentially pass through the circuit substrate, the pressing plate, the power devices, the insulating pad and are connected to the radiator, so as to tightly combine the power devices, the insulating pad, and the radiator by the pressing force acting on the pressing plate, and transfer the heat of the power devices to the radiator by heat conduction to achieve the heat dissipation effect of the power devices.

[0004] However, in the production process of the circuit board, for example, when welding the power devices to the circuit substrate, it is necessary to stably and accurately insert the pressing plate between the power devices and the circuit substrate, which affects the production efficiency of the circuit board. Summary of the Utility Model

[0005] The problem solved by the present disclosure is how to effectively improve the production efficiency of the circuit board in the power conversion device.

[0006] To solve the above problems, in a first aspect, the present disclosure provides a power module, which includes a base, a cover plate, and power devices. A groove is provided in the base, the power devices are installed in the groove, the cover plate is connected to the base to press the power devices in the base, and the pin assemblies of the power devices are used for electrical connection with the circuit substrate.

[0007] Optionally, the base includes a base body and a first buckle provided on the base body, the cover plate includes a cover body and a second buckle provided on the cover body, and the first buckle is snapped with the second buckle.

[0008] Optionally, the base includes two first buckles, the two first buckles are spaced along a first direction on the base body, the cover plate includes two second buckles, the two second buckles are spaced along the first direction on the cover body, and the two first buckles are respectively snapped with the corresponding second buckles.

[0009] Optionally, the first buckle is a through-hole structure, the second buckle is a protruding structure, and the protruding structure is inserted into the groove structure.

[0010] Optionally, the base further includes a first positioning structure disposed on the base body, and the cover plate further includes a second positioning structure disposed on the cover body, and the first positioning structure is in positioning connection with the second positioning structure.

[0011] Optionally, the end face of the cover body facing the base body has a crimping surface, and the crimping surface is closely arranged with the power device.

[0012] The crimping surface is a planar structure, or the crimping surface has a bump structure.

[0013] Optionally, the power module further includes a fastener. A first through hole is provided on the base, and a second through hole is provided on the cover plate. The fastener passes through the first through hole and the second through hole and is used to connect the radiator of the power conversion device.

[0014] Optionally, the base and the cover plate are connected by an adhesive bonding method.

[0015] Optionally, at least two grooves are provided on the base body, and one of the power devices is installed in the grooves.

[0016] Optionally, the base includes a base body, and a groove is provided on the base body. The groove includes a first installation groove and a second installation groove. The power device includes a power device body and the pin assembly electrically connected to the power device body. The power device body is installed in the first installation groove, and the pin assembly is installed in the second installation groove.

[0017] Optionally, the pin assembly includes a plurality of pin members arranged at intervals, and the plurality of pin members are fixed in the second installation groove by potting glue.

[0018] Optionally, the pin assembly includes a plurality of pin members arranged at intervals, and a plurality of partition ribs arranged at intervals are provided inside the second installation groove. The plurality of partition ribs are used to divide the second installation groove into a plurality of placement grooves, and the plurality of pin members are respectively located in the corresponding placement grooves;

[0019] The pin members in at least one of the placement grooves are fixed in the corresponding placement grooves by potting glue.

[0020] Optionally, the base further includes an insulating plate, and the insulating plate is disposed between the power device and the radiator of the power conversion device;

[0021] Two openings penetrating through opposite ends of the base body are provided at the first installation groove. One end of the power device body protrudes from one of the openings and is connected to the insulating plate, and the other end of the power device body protrudes from the other opening and is connected to the cover plate.

[0022] Optionally, there are two openings penetrating through opposite ends of the base body at the first installation groove. The base further includes a bottom plate, the bottom plate is connected to the edge of one of the openings of the base body, and the cover plate is connected to the edge of the other opening of the base body;

[0023] One end of the power device body is connected to the bottom plate, and the other end of the power device body protrudes from the other opening of the base body and is connected to the cover plate; a heat conduction structure is arranged between the bottom plate and the power device body.

[0024] Optionally, the base body and the bottom plate are of an integral structure.

[0025] Optionally, the base body and the bottom plate are of a spliced structure.

[0026] The beneficial effects of the power module of the present disclosure are as follows: The power module can be assembled offline in the following manner. For example, the power module mainly includes a base, a cover plate, and a power device. The power device can be installed in the groove of the base, and the cover plate is connected to the base to press the power device in the groove of the base, so as to realize the press-fit and fixed installation of the power device between the base and the cover plate; the circuit board substrate of the circuit board can be arranged on the cover plate. In other words, before the production of the circuit board, the power device is fixed first through the cooperation of the cover plate and the base, and then the pin assembly of the fixed power device is welded to the circuit board substrate. In this process, it is not necessary to insert the pressing plate in the prior art between the circuit board substrate and the power device, thereby effectively improving the production efficiency of the circuit board.

[0027] In a second aspect, the present disclosure provides a circuit board, including a circuit board substrate and the power module as described above, and the circuit board substrate is arranged on the cover plate of the power module.

[0028] Thus, since the circuit board includes the power module, the circuit board at least has all the technical effects of the power module, which will not be elaborated here.

[0029] In a third aspect, the present disclosure provides a power conversion device, including the circuit board as described above.

[0030] Thus, since the power conversion device includes the power module, the power conversion device at least has all the technical effects of the circuit board, which will not be elaborated here.

[0031] Optionally, the power conversion device further includes a radiator, and the fastener of the power module passes through the circuit board substrate, the cover plate, the base and is connected to the radiator. Description of the Drawings

[0032] Figure 1One of the schematic structural diagrams of a power conversion device in the prior art;

[0033] Figure 2 Another schematic structural diagram of a power conversion device in the prior art;

[0034] Figure 3 Exploded structural diagram of a power module in an embodiment of the present disclosure;

[0035] Figure 4 One of the exploded structural diagrams of a cover plate and a base in an embodiment of the present disclosure;

[0036] Figure 5 One of the schematic structural diagrams of a cover plate in an embodiment of the present disclosure;

[0037] Figure 6 Schematic structural diagram of a base in an embodiment of the present disclosure;

[0038] Figure 7 Another exploded structural diagram of a base and a cover plate in an embodiment of the present disclosure;

[0039] Figure 8 Assembled structural diagram of a base and a cover plate in an embodiment of the present disclosure;

[0040] Figure 9 Another exploded structural diagram of a base and a cover plate in an embodiment of the present disclosure;

[0041] Figure 10 Another schematic structural diagram of a cover plate in an embodiment of the present disclosure;

[0042] Figure 11 Another schematic structural diagram of a cover plate in an embodiment of the present disclosure;

[0043] Figure 12 Another schematic structural diagram of a cover plate in an embodiment of the present disclosure;

[0044] Figure 13 One of the schematic structural diagrams of a power conversion device in an embodiment of the present disclosure;

[0045] Figure 14 Exploded structural diagram of a base and power devices in an embodiment of the present disclosure;

[0046] Figure 15 Assembled structural diagram of a base and power devices in an embodiment of the present disclosure;

[0047] Figure 16 Partial schematic structural diagram of a power module in an embodiment of the present disclosure;

[0048] Figure 17 Schematic structural diagram of a base in an embodiment of the present disclosure;

[0049] Figure 18 One of the structural schematic diagrams of the pin assembly encapsulated with potting glue in the embodiments of the present disclosure;

[0050] Figure 19 Another structural schematic diagram of the pin assembly encapsulated with potting glue in the embodiments of the present disclosure;

[0051] Figure 20 Still another structural schematic diagram of the pin assembly encapsulated with potting glue in the embodiments of the present disclosure;

[0052] Figure 21 The sectional structural schematic diagram of the base without a bottom surface in the embodiments of the present disclosure;

[0053] Figure 22 The structural schematic diagram of the base without a bottom surface in the embodiments of the present disclosure;

[0054] Figure 23 The sectional structural schematic diagram of the base with a bottom surface in the embodiments of the present disclosure;

[0055] Figure 24 The structural schematic diagram of the base with a bottom surface in the embodiments of the present disclosure;

[0056] Figure 25 One of the structural schematic diagrams of the base body and the bottom plate in the embodiments of the present disclosure;

[0057] Figure 26 Another structural schematic diagram of the base body and the bottom plate in the embodiments of the present disclosure;

[0058] Figure 27 The schematic diagram of the assembly process of the power module in the embodiments of the present disclosure;

[0059] Figure 28 Another structural schematic diagram of the power conversion device in the embodiments of the present disclosure.

[0060] Explanation of reference numerals:

[0061] 1'- fastening screw; 2'- circuit board'; 3'- pressing plate; 4'- power device; 41'- power device body; 42'- pin assembly; 5'- insulating pad; 6'- radiator;

[0062] 1 - Base; 11 - Base body; 111 - First through - hole; 112 - Groove; 1121 - First mounting groove; 1122 - Second mounting groove; 12 - First buckle; 13 - First positioning structure; 14 - Partition rib; 15 - Insulating plate; 16 - Bottom plate; 2 - Cover plate; 21 - Cover body; 211 - Crimping surface; 212 - Second through - hole; 22 - Second buckle; 23 - Second positioning structure; 3 - Power device; 31 - Power device body; 32 - Pin assembly; 321 - Pin component; 4 - Circuit board; 5 - Fastener; 6 - Heat sink; 7 - Potting glue. Detailed implementation manners

[0063] To make the above - mentioned objects, features, and advantages of the present disclosure more obvious and understandable, the following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. Although some embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments described herein. On the contrary, these embodiments are provided to more thoroughly and completely understand the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not used to limit the protection scope of the present disclosure.

[0064] In the accompanying drawings, the Z - axis represents the vertical direction, that is, the up - and - down position, and the positive direction of the Z - axis represents the upper side, and the negative direction of the Z - axis represents the lower side; the X - axis in the accompanying drawings represents the horizontal direction and is designated as the left - and - right position, and the positive direction of the X - axis represents the right side, and the negative direction of the X - axis represents the left side; the Y - axis in the accompanying drawings represents the front - and - back position, and the positive direction of the Y - axis represents the front side, and the negative direction of the Y - axis represents the back side. At the same time, it should be noted that the above - mentioned meanings represented by the Z - axis, Y - axis, and X - axis are only for facilitating the description of the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present disclosure.

[0065] The term "including" and its variants used herein are open - ended, that is, "including but not limited to"; the term "based on" is "at least partially based on"; the term "an embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiment". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts such as "first" and "second" mentioned in the present disclosure are only used to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependent relationships.

[0066] It should be noted that the modification of "one" and "multiple" mentioned in this disclosure is illustrative rather than restrictive. Those skilled in the art should understand that unless clearly specified otherwise in the context, it should be understood as "one or more".

[0067] In the related art, a power conversion device is a converter used to convert DC electrical energy into a fixed-frequency voltage or a frequency-modulated and voltage-regulated alternating current.

[0068] In the related art, the power conversion device usually adopts the following heat dissipation structure. Combining Figure 1 and Figure 2 As shown, for example, the power conversion device includes fastening screws 1', a circuit board, an insulating pad 5', and a heat sink 6'. The circuit board includes a pressing plate 3', a circuit substrate, and a power device 4'. The fastening bolts sequentially pass through the circuit substrate, the pressing plate 3', the power device 4', the insulating pad 5' and are connected to the heat sink 6', so as to tightly combine the power device 4', the insulating pad 5', and the heat sink 6' through the pressing force acting on the pressing plate 3', and transfer the heat of the power device 4' to the heat sink 6' through heat conduction, so as to achieve the heat dissipation effect of the power device 4'. Among them, there is no fixed connection (adhesion or screw locking) relationship between the pressing plate 3' and the circuit substrate 2' above it and the power device 4' below it before assembly, so that the pressing plate 3', the circuit substrate 2', and the power device 4' are in a floating installation form.

[0069] However, during the production process of the circuit board, for example, when welding the power device 4' to the circuit substrate, it is necessary to smoothly and accurately insert the pressing plate 3' between the power device 4' and the circuit substrate, thus affecting the production efficiency of the circuit board. Among them, the production operation of the circuit board refers to welding and fixing the pin assembly 42' of the power device 4' below the pressing plate 3' to the circuit substrate above the pressing plate 3'.

[0070] In view of the problems existing in the above-mentioned related art, this embodiment provides a power module.

[0071] As Figure 3 shown, a power module provided by an embodiment of the present disclosure includes a base 1, a cover plate 2, and a power device 3. A groove 112 is provided in the base 1. The power device 3 is installed in the groove 112. The cover plate 2 is connected to the base 1 to press the power device 3 in the base 1. The pin assembly 32 of the power device 3 is used for electrical connection with a circuit substrate 4.

[0072] Specifically, the bottom area of the groove 112 is slightly larger than the surface area of the power device 3, so as to facilitate the smooth installation of the power device 3 into the groove 112. When the power device 3 is installed in the groove 112 and the cover plate 2 is connected to the base 1, the surface of the power device 3 can contact the cover plate 2, so as to press the power device 3 tightly in the groove 112 of the base 1 through the cover plate 2.

[0073] The pin assembly 32 of the power device 3 can be electrically connected to the circuit board 4 in the following manner. For example, the pin assembly 32 of the power device 3 can pass through the via holes on the circuit board 4 and be welded to the circuit board 4 by wave soldering.

[0074] During the production process of the circuit board, for example, before or after the pin assembly 32 of the power device 3 is welded to the circuit board 4, the circuit board 4 in the circuit board can be installed on the cover plate 2 and fixed, so that at least one of the base 1 and the cover plate 2 is in contact with the circuit board 4; wherein, at least one of the base 1 and the cover plate 2 being in contact with the circuit board 4 means that the base 1 is in contact with the circuit board 4, or the cover plate 2 is in contact with the circuit board 4, or both the base 1 and the cover plate 2 are in contact with the circuit board 4.

[0075] In this embodiment, the power module can be assembled offline in the following manner. For example, the power module mainly includes a base 1, a cover plate 2 and a power device 3. The power device 3 can be installed in the groove 112 of the base 1, and the cover plate 2 is connected to the base 1 to press the power device 3 tightly in the groove 112 of the base 1, so as to realize the crimping and fixed installation of the power device 3 between the base 1 and the cover plate 2; the circuit board 4 of the circuit board can be arranged on the cover plate 2, so that at least one of the base 1 and the cover plate 2 is used to be in contact with the circuit board 4. In other words, before the production of the circuit board, the power device 3 is fixed first through the cooperation of the cover plate 2 and the base 1, and then the pin assembly 32 of the already fixed power device 3 is welded to the circuit board 4. In this process, it is not necessary to insert the pressing plate in the prior art between the circuit board 4 and the power device 3, thereby effectively improving the production efficiency of the circuit board.

[0076] Optionally, as shown in combination with Figure 4 the base 1 includes a base body 11 and a first buckle 12 arranged on the base body 11, the cover plate 2 includes a cover body 21 and a second buckle 22 arranged on the cover body 21, and the first buckle 12 is snapped with the second buckle 22.

[0077] Specifically, the first buckle 12 can be arranged on the base body 11, and the second buckle 22 can be arranged on the cover body 21.

[0078] In this alternative embodiment, the second fastener 22 provided on the cover body 21 is snap-fitted with the second fastener 22 provided on the base body 11 to achieve the quick and stable assembly of the cover plate 2 and the base 1.

[0079] Optionally, as shown in Figures 5 to 8 FIG. 5, the base 1 includes two first fasteners 12, the two first fasteners 12 are spaced along a first direction on the base body 11, the cover plate 2 includes two second fasteners 22, the two second fasteners 22 are spaced along the first direction on the cover body 21, and the two first fasteners 12 are respectively snap-fitted with the corresponding second fasteners 22.

[0080] Specifically, as shown in Figure 5 and Figure 6 FIG. 6, the first fastener 12 is a slot structure, and the second fastener 22 is a plug structure; specifically, as shown in Figure 5 FIG. 7, two second fasteners 22 are installed at intervals along the first direction on one end surface of the cover body 21 facing the base 1, and as shown in Figure 6 FIG. 8, two first fasteners 12 are installed at intervals along the first direction on one end surface of the base body 11 facing the cover plate 2. When the cover body 21 is covered on the base body 11, the second fasteners 22 are respectively inserted into the corresponding first fasteners 12, wherein the first direction is parallel to the Y-axis direction in the Figure 5 coordinate system.

[0081] For another example, as shown in Figure 7 and Figure 8 FIG. 9, the first fastener 12 is a plug structure, and the second fastener 22 has a jack. For example, the first fasteners 12 are respectively installed at both ends of the upper end surface of the base body 11 along the first direction, and the corresponding second fasteners 22 are respectively installed on two side walls of the cover body 21 along the first direction; when the cover plate 2 and the base 1 are assembled, the first fastener 12 can be inserted into the corresponding second fastener 22.

[0082] In this alternative embodiment, the two second fasteners 22 provided on the cover body 21 are correspondingly snap-fitted with the two first fasteners 12 provided on the base body 11, so that the snap-fitting stability of the cover plate 2 and the base 1 can be improved by increasing the number of snap points.

[0083] Optionally, as shown in Figure 9 FIG. 10, the first fastener 12 is a through-hole structure, the second fastener 22 is a protrusion structure, and the protrusion structure is inserted into the groove structure.

[0084] Specifically, a first buckle member 12 with a through-hole structure can be provided on one side of the base body 11 where the groove 112 is located, and a second buckle member 22 with a convex structure can be formed by extending the corresponding part on the cover body 21 towards the base 1.

[0085] A clamping groove can be provided on the inner wall of the through-hole structure, and an elastic piece can be provided on the second buckle member 22. When the convex structure is inserted into the through-hole structure, the elastic piece is clamped with the clamping groove, further improving the clamping stability between the cover plate 2 and the base 1.

[0086] Optionally, in combination with Figures 5 to 6 As shown, the base 1 further includes a first positioning structure 13 provided on the base body 11, and the cover plate 2 further includes a second positioning structure 23 provided on the cover body 21. The first positioning structure 13 is positioned and connected to the second positioning structure 23.

[0087] Specifically, in combination with Figure 6 As shown, the first positioning structure 13 can be a positioning hole; in combination with Figure 5 As shown, the second positioning structure 23 can be a columnar structure; alternatively, if the first positioning structure 13 is a columnar structure, then the second positioning structure 23 is a positioning hole.

[0088] The number of the first positioning structure 13 and the second positioning structure 23 can be two respectively, as shown in Figure 5 and Figure 6 shown.

[0089] In this optional embodiment, when the cover plate 2 and the base 1 are assembled, for example, when the cover body 21 is covered on the base body 11, the second positioning structure 23 provided on the cover body 21 is positioned and connected to the first positioning structure 13 provided on the base body 11, which can improve the accuracy of assembling the cover plate 2 and the base 1 and avoid problems such as offset in the assembly of the cover plate 2 and the base 1.

[0090] Optionally, the end face of the cover body 21 facing the base body 11 has a pressing surface 211, and the pressing surface 211 is closely arranged with the power device 3.

[0091] The pressing surface 211 is a planar structure, or the pressing surface 211 has a convex block structure.

[0092] Specifically, in combination with Figure 5As shown, since the cover plate 2 is used to press the power device 3 into the groove 112 of the base 1, when the cover plate 2 is connected to the base 1, the pressing surface 211 (such as the bottom surface of the cover body 21) corresponding to the end surface of the cover body 21 facing the base body 11 is in close contact with the upper surface of the power device 3, so as to stably press the power device 3 into the base 1 by using the pressing surface 211. The surface area of the pressing surface 211 can be less than or equal to the end surface area of the power device body 31 of the power device 3, so as to avoid the edge of the base body 11 interfering with the pressing of the pressing surface 211 on the end surface of the power device body 31.

[0093] Among them, in combination with Figure 5 As shown, the pressing surface 211 can be a planar structure, and this planar structure can be parallel to the surface of the power device 3.

[0094] In combination with Figure 10 As shown, there is a bump structure on the pressing surface 211. In other words, the end surface of this bump structure is not in the same plane as the end surfaces of other parts of the pressing surface 211, so as to ensure the pressing effect on the power device 3 through the bump structure. Among them, the bump structure can be a strip-shaped block, and the extending direction of the strip-shaped block can be perpendicular to the extending direction of the cover body 21.

[0095] In combination with Figure 11 As shown, there are multiple bump structures on the pressing surface 211. Specifically, the multiple bump structures can be spaced along the width direction of the cover body 21, so as to improve the pressing effect on the power device 3 by increasing the number and area of the bump structures. Among them, the bump structure can be a strip-shaped block, and the extending direction of the strip-shaped block can be parallel to the extending direction of the cover body 21.

[0096] In combination with Figure 12 As shown, there is a bump structure on the pressing surface 211. Specifically, the bump structure can be a plate-shaped structure, so as to ensure the pressing effect on the power device 3 by increasing the area of the bump structure.

[0097] Optionally, in combination with Figure 4 and Figure 13 As shown, the power module further includes a fastener 5. A first through hole 111 is provided on the base 1, a second through hole 212 is provided on the cover plate 2, and the fastener 5 passes through the first through hole 111 and the second through hole 212 and is used to connect the radiator 6 of the power conversion device.

[0098] Specifically, in combination with Figure 4 As shown, a first through hole 111 is provided on the base body 11 of the base 1, a second through hole 212 is provided on the cover body 21 of the cover plate 2, and the positions of the first through hole 111 and the second through hole 212 correspond to each other. The fastener 5 is a bolt fastener.

[0099] In this optional embodiment, in combination withFigure 13 As shown, the power module can be fixedly connected to the radiator 6 of the power conversion device in the following manner. For example, the circuit board 4 can be disposed on the side of the cover plate 2 away from the base 1, the radiator 6 is disposed on the side of the base 1 away from the cover plate 2, and the fastener 5 vertically passes through the second through hole 212 of the circuit board 4 and the cover plate 2 and the first through hole 111 of the base body 11 and then is connected to the radiator 6, so that the power module is fixedly mounted on the radiator 6 through the fastener 5 and the circuit board 4, facilitating heat dissipation of the power device 3 in the power module by the radiator 6.

[0100] Optionally, the base 1 and the cover plate 2 are connected by an adhesive method.

[0101] Specifically, the base 1 and the cover plate 2 can be adhesively fixed in the following manner. For example, structural adhesive, glue, etc. can be coated at the connection between the base body 11 and the cover body 21 to achieve the fixed connection between the base 1 and the cover plate 2 by an adhesive method.

[0102] Optionally, in combination with Figure 14 as shown, at least two grooves 112 are provided on the base body 11, and one of the power devices 3 is installed in the grooves 112.

[0103] Specifically, in combination with Figure 14 as shown, at least two grooves 112 are provided on the base body 11. For example, the number of the grooves 112 can be two, and one power device 3 can be installed in each groove 112. And the distance between two adjacent grooves 112 can be adjusted according to the layout of the power module.

[0104] In this optional embodiment, by providing at least two grooves 112 on the base body 11, one power device 3 can be installed in each groove 112. During the later operation, if the power module needs to be expanded, new power devices 3 can be added to the empty grooves 112, thereby improving the expandability of the power module.

[0105] In addition, in combination with Figure 7 as shown, only one groove 112 can be provided on the base body 11. For example, one power device 3 is installed in the groove 112.

[0106] Optionally, in combination with Figure 14 as shown, the base 1 includes a base body 11, at least one groove 112 is provided on the base body 11, the groove 112 includes a first installation groove 1121 and a second installation groove 1122, the power device 3 includes a power device body 31 and a pin assembly 32 electrically connected to the power device body 31, the power device body 31 is installed in the first installation groove 1121, and the pin assembly 32 is installed in the second installation groove 1122.

[0107] Specifically, the groove 112 can be divided into two parts, such as a first mounting groove 1121 and a second mounting groove 1122, and the first mounting groove 1121 and the second mounting groove 1122 can be arranged along Figure 14 the Y-axis direction in the coordinate system.

[0108] The first mounting groove 1121 is used to mount the power device body 31, and the second mounting groove 1122 is used to accommodate a part of the pin assembly 32. The other part of the pin assembly 32 is bent and welded to the circuit board 4.

[0109] In this alternative embodiment, since the power device body 31 is mounted in the first mounting groove 1121 and a part of the pin assembly 32 is mounted in the second groove 112, the power device body 31 and the pin assembly 32 are separated by the two mounting grooves. Thus, when the cover plate 2 is covered on the first mounting groove 1121 of the base body 11, the cover plate 2 will not hinder the welding operation between the pin assembly 32 and the circuit board 4.

[0110] Combined with Figure 15 as shown, the area of the first mounting groove 1121 is larger than the end face area of the power device body 31.

[0111] Specifically, the area of the first mounting groove 1121 is larger than the end face area of the power device body 31, such as the upper end face or the lower end face. When the power device body 31 is mounted in the first mounting groove 1121, the gap between the periphery of the power device body 31 and the peripheral side walls of the first mounting groove 1121 is greater than zero. Thus, not only can the power device body 31 be smoothly mounted in the first mounting groove 1121, but also the first mounting groove 1121 provides a positioning function for the installation of the power device body 31.

[0112] Optionally, combined with Figure 16 as shown, the pin assembly 32 includes a plurality of pin members 321 arranged at intervals, and the plurality of pin members 321 are fixed in the second mounting groove 1122 by potting glue 7.

[0113] Specifically, the pin assembly 32 includes a plurality of pin members 321, and the plurality of pin members 321 are arranged at intervals. The second mounting groove 1122 can be a through groove structure. In other words, there are no other components in the second mounting groove 1122.

[0114] In this alternative embodiment, the pin assembly 32 including a plurality of pin members 321 arranged at intervals can be fixed in the second mounting groove 1122 by potting glue 7 to limit and fix the plurality of pin members 321 in the second mounting groove 1122, and correspondingly avoid problems such as contact short circuit between two adjacent pin members 321.

[0115] Optionally, combined with Figures 17 to 20As shown, the pin assembly 32 includes a plurality of pin members 321 arranged at intervals. A plurality of partition ribs 14 arranged at intervals are provided inside the second installation groove 1122. The plurality of partition ribs 14 are used to divide the second installation groove 1122 into a plurality of placement grooves, and the plurality of pin members 321 are respectively located in the corresponding placement grooves;

[0116] The pin member 321 in at least one of the placement grooves is fixed in the corresponding placement groove by potting glue 7.

[0117] Specifically, the base 1 further includes a plurality of partition ribs 14. The plurality of partition ribs 14 can be installed in the second installation groove 1122 at intervals along Figure 17 the X-axis direction of the coordinate system, so as to divide the second installation groove 1122 into a plurality of placement grooves through the plurality of partition ribs 14.

[0118] For example, when two partition ribs 14 are provided in the second installation groove 1122, the second installation groove 1122 can be divided into three placement grooves, as shown in Figure 17 the figure.

[0119] The number of the placement grooves of the second installation groove 1122 is greater than or equal to the number of the pin members 321 of the pin assembly 32, so as to ensure that all the pin members 321 of the power device 3 can be installed in the second installation groove 1122.

[0120] Combined with Figure 18 the figure, all three pin members 321 of the pin assembly 32 are fixed in the corresponding placement grooves by potting glue 7.

[0121] Combined with Figure 19 the figure, the pin member 321 in the middle position among the three pin members 321 of the pin assembly 32 is fixed in the corresponding placement groove by potting glue 7.

[0122] Combined with Figure 20 the figure, the first and third pin members 321 among the three pin members 321 of the pin assembly 32 are fixed in the corresponding placement grooves by potting glue 7.

[0123] In this alternative embodiment, by providing a plurality of partition ribs 14 in the second installation groove 1122 and dividing the second installation groove 1122 into a plurality of placement grooves through the plurality of partition ribs 14, when the plurality of pin members 321 of the pin assembly 32 are installed in the corresponding placement grooves, the insulation effect between adjacent pin members 321 can be increased through the plurality of partition ribs 14. Since the pin member 321 in at least one of the placement grooves is fixed in the corresponding placement groove by potting glue 7, not only can the pin members 321 of the pin assembly 32 be effectively fixed in the corresponding placement grooves by potting glue 7, but also the cooperation between the partition ribs 14 and the potting glue 7 can further improve the installation insulation effect of the plurality of pin members 321 in the pin assembly 32.

[0124] Optionally, in combination with Figure 21 and Figure 22 as shown, the base 1 further includes an insulating plate 15, and the insulating plate 15 is disposed between the power device 3 and the radiator 6 of the power conversion device;

[0125] The first mounting groove 1121 has two openings penetrating through opposite ends of the base body 11. One end of the power device body 31 protrudes from one of the openings and is connected to the insulating plate 15, and the other end of the power device body 31 protrudes from the other opening and is connected to the cover plate 2.

[0126] Specifically, the opposite ends of the base body 11 at the first mounting groove 1121 are respectively provided with openings, which means that the base body 11 is a rectangular frame structure without a top surface and a bottom surface.

[0127] The base 1 further includes an insulating plate 15. The insulating plate 15 and the base body 11 can be an integrally formed structure or a split structure. The insulating plate 15 can be a plate-like structure made of materials such as alumina or aluminum nitride ceramics.

[0128] Two end faces of the insulating plate 15 are respectively in contact with the power device body 31 and the radiator 6. At this time, the insulating plate 15 can be equivalent to the bottom surface of the base 1.

[0129] In this optional embodiment, in combination with Figure 22 as shown, after the power conversion device is assembled, one end of the power device body 31, such as the bottom end, protrudes from the lower opening of the base body 11 and is in contact with the insulating plate 15, so as to increase the insulation effect between the power device 3 and the radiator 6 through the insulating plate 15, and the other end of the power device body 31, such as the top end, protrudes from the top opening of the base body 11 and is in contact with the cover plate 2, so as to press the power device body 31 onto the insulating plate 15 through the cover plate 2.

[0130] Optionally, in combination with Figure 23 and Figure 24 as shown, the first mounting groove 1121 has two openings penetrating through opposite ends of the base body 11. The base 1 further includes a bottom plate 16, and the bottom plate 16 is connected to the edge of one of the openings of the base body 11, and the cover plate 2 is connected to the edge of the other opening of the base body 11;

[0131] One end of the power device body 31 is connected to the bottom plate 16, and the other end of the power device body 31 protrudes from the other opening of the base body 11 and is connected to the cover plate 2; a heat conduction structure is provided between the bottom plate 16 and the power device body 31.

[0132] Specifically, the base body 11 is provided with openings at opposite ends of the first installation groove 1121, which means that the base body 11 is a rectangular frame structure without a top surface and a bottom surface. The bottom plate 16 is connected to the edge of one of the openings (such as the bottom opening) of the base body 11 to achieve the connection and fixation of the bottom plate 16 and the base body 11. The cover plate 2 is connected to the edge of the other opening (such as the top opening) of the base body 11 to achieve the connection and fixation of the cover plate 2 and the base body 11.

[0133] The base 1 further includes a bottom plate 16, and the bottom plate 16 can be made of an insulating material.

[0134] The heat-conducting structure can be heat-conducting glue, heat-conducting silicone grease, etc.

[0135] In this optional embodiment, in combination with Figure 24 As shown, after the power conversion device is assembled, one end of the power device body 31, such as the bottom end, contacts the bottom plate 16 to achieve the insulation effect between the power device 3 and the radiator 6 through the bottom plate 16, while the other end of the power device body 31, such as the top end, protrudes from the top opening of the base body 11 and contacts the cover plate 2 to press the power device body 31 onto the insulating plate 15 through the cover plate 2.

[0136] Optionally, in combination with Figure 25 As shown, the base body 11 and the bottom plate 16 are of an integral structure.

[0137] Specifically, the bottom plate 16 can be made of the same material as the above-mentioned insulating plate 15.

[0138] In this optional embodiment, since the base body 11 and the bottom plate 16 are of an integral structure, the production efficiency of the base 1 can be improved by reducing the insulating plate 15, and the mechanical strength of the base 1 can also be improved.

[0139] Optionally, in combination with Figure 26 As shown, the base body 11 and the bottom plate 16 are of a splicing structure.

[0140] Specifically, the bottom plate 16 can be made of an insulating material such as engineering plastic.

[0141] In this optional embodiment, the bottom plate 16 can be assembled to the edge of the bottom opening of the base body 11 by means of clamping, injection pre-installation, etc., and the fixed connection between the bottom plate 16 and the base body 11 can also be achieved.

[0142] In combination with Figure 27As shown, the power module can be assembled in the following manner. For example, in step S1, the base 1 is placed horizontally; in step S2, the power device 3 is then installed in the groove 112, where the power device body 31 is installed in the first installation groove 1121 and the pin assembly 32 is installed in the second installation groove 1122; in step S3, the pin assembly 32 in the second installation groove 1122 is then subjected to potting and sealing treatment manually or by equipment, and at this time, the potting amount should be less than or equal to the volume of the second installation groove 1122; in step S4, the cover plate 2 and the base 1 are then aligned vertically, for example, the positions of the first through hole of the base 1 and the second through hole of the cover plate are vertically aligned, and the positions of the first positioning structure of the base 1 and the second positioning structure of the cover plate are vertically aligned; in step S5, the cover plate 2 and the base 1 are snap - fixed, for example, the second snap - fitting member 22 on the cover body 21 is snap - fixed to the first snap - fitting member 12 of the base body 11, and the pressing surface 211 of the cover body 21 is closely attached to the upper end surface of the power device body 31, thus completing the assembly operation of the power module; finally, subsequent circuit board production operations are carried out. The power module is installed on the radiator 6, the circuit board 4 is installed on the cover plate 2 of the power module, and then the fastener 5 is sequentially passed through the circuit board 4, the cover plate 2, the base 1 and connected to the radiator 6, and finally the circuit board 4 is welded to the pin member 321 of the power device 3.

[0143] Combined with Figure 28 As shown, an embodiment of the present disclosure also provides a circuit board, which includes a circuit board 4 and the power module as described in the above embodiment, and the circuit board 4 is arranged on the cover plate 2 of the power module.

[0144] Specifically, the circuit board 4 can be installed on the side of the cover plate 2 away from the base 1, and the circuit board 4 is closely attached to the upper end surface of the cover plate 2.

[0145] Since the circuit board includes the power module, the circuit board at least has all the technical effects of the power module, which will not be elaborated here.

[0146] An embodiment of the present disclosure also provides a power conversion device, which includes the circuit board as described in the above embodiment.

[0147] Specifically, the power conversion device can be an inverter, an optimizer, etc. As long as it has the above - mentioned power module and various power conversion devices of the circuit board, they are applicable to this technical solution, and no specific limitation is made here.

[0148] The beneficial effects of the power conversion device in this embodiment compared with the prior art are the same as those of the above - mentioned circuit board, which will not be elaborated here.

[0149] Optionally, the power conversion device further includes a heat sink 6, and the fastener 5 of the power module passes through the circuit board 4, the cover plate 2, the base 1 and is connected to the heat sink 6.

[0150] Specifically, the power device 3 of the power module is installed on the upper part of the heat sink 6, and the circuit board 4 is installed on the cover plate 2 away from the base 1; the fastener 5 vertically passes through the circuit board 4, the second through hole 212 of the cover plate 2, and the first through hole 111 of the base 1 and is connected to the heat sink 6 to realize the assembly of the power conversion device.

[0151] Although the present disclosure is disclosed as above, the protection scope of the present disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and these changes and modifications will all fall within the protection scope of the present disclosure.

Claims

1. A power module, characterized in that, The power module includes a base (1), a cover plate (2) and a power device (3). A groove (112) is provided in the base (1), the power device (3) is installed in the groove (112), the cover plate (2) is connected to the base (1) to press the power device (3) in the base (1), and the pin assembly (32) of the power device (3) is used for electrical connection with a circuit board (4).

2. The power module according to claim 1, wherein The base (1) includes a base body (11) and a first buckle (12) provided on the base body (11). The cover plate (2) includes a cover body (21) and a second buckle (22) provided on the cover body (21). The first buckle (12) is snap-connected to the second buckle (22).

3. The power module according to claim 2, wherein The base (1) includes two first buckles (12). The two first buckles (12) are spaced along a first direction on the base body (11). The cover plate (2) includes two second buckles (22). The two second buckles (22) are spaced along the first direction on the cover body (21). The two first buckles (12) are respectively snap-connected to the corresponding second buckles (22).

4. The power module according to claim 2, characterized in that, The first buckle (12) is a through-hole structure, and the second buckle (22) is a protrusion structure. The protrusion structure is inserted into the groove structure.

5. The power module according to claim 2, characterized in that, The base (1) further includes a first positioning structure (13) provided on the base body (11), and the cover plate (2) further includes a second positioning structure (23) provided on the cover body (21). The first positioning structure (13) is positioned and connected to the second positioning structure (23).

6. The power module according to claim 2, wherein, The end face of the cover body (21) facing the base body (11) has a pressing surface (211), and the pressing surface (211) is in close contact with the power device (3). The pressing surface (211) is a planar structure, or the pressing surface (211) has a bump structure.

7. The power module according to claim 1, characterized in that It further includes a fastener (5). A first through-hole (111) is provided on the base (1), a second through-hole (212) is provided on the cover plate (2), and the fastener (5) passes through the first through-hole (111) and the second through-hole (212) and is used for connecting a radiator (6) of a power conversion device.

8. The power module according to claim 1, characterized in that, The base (1) and the cover plate (2) are connected by an adhesive method.

9. The power module according to claim 2, wherein At least two grooves (112) are provided on the base body (11), and one power device (3) is installed in the groove (112).

10. The power module according to any one of claims 1 to 9, characterized in that, The base (1) includes a base body (11). A groove (112) is provided on the base body (11). The groove (112) includes a first installation groove (1121) and a second installation groove (1122). The power device (3) includes a power device body (31) and the pin assembly (32) electrically connected to the power device body (31). The power device body (31) is installed in the first installation groove (1121), and the pin assembly (32) is installed in the second installation groove (1122).

11. The power module according to claim 10, wherein, The pin component (32) includes a plurality of pin members (321) arranged at intervals, and the plurality of pin members (321) are fixed in the second mounting groove (1122) by potting glue (7).

12. The power module according to claim 10, wherein The pin component (32) includes a plurality of pin members (321) arranged at intervals, and a plurality of partition ribs (14) arranged at intervals are provided inside the second mounting groove (1122). The plurality of partition ribs (14) are used to divide the second mounting groove (1122) into a plurality of placement grooves, and the plurality of pin members (321) are respectively located in the corresponding placement grooves; The pin member (321) in at least one of the placement grooves is fixed in the corresponding placement groove by potting glue (7).

13. The power module according to claim 10, wherein, The base (1) further includes an insulating plate (15), and the insulating plate (15) is disposed between the power device (3) and the radiator (6) of the power conversion device; The first mounting groove (1121) has two openings penetrating through opposite ends of the base body (11). One end of the power device body (31) protrudes from one of the openings and is connected to the insulating plate (15), and the other end of the power device body (31) protrudes from the other opening and is connected to the cover plate (2).

14. The power module according to claim 10, characterized in that, The first mounting groove (1121) has two openings penetrating through opposite ends of the base body (11). The base (1) further includes a bottom plate (16), and the bottom plate (16) is connected to the edge of one of the openings of the base body (11), and the cover plate (2) is connected to the edge of the other opening of the base body (11); One end of the power device body (31) is connected to the bottom plate (16), and the other end of the power device body (31) protrudes from the other opening of the base body (11) and is connected to the cover plate (2); a heat conduction structure is provided between the bottom plate (16) and the power device body (31).

15. The power module according to claim 14, wherein The base body (11) and the bottom plate (16) are of an integral structure.

16. The power module according to claim 14, wherein, The base body (11) and the bottom plate (16) are of a splicing structure.

17. A circuit board, characterized in that, It includes a circuit board (4) and the power module according to any one of claims 1 to 16, and the circuit board (4) is disposed on the cover plate (2) of the power module.

18. A power conversion device, characterized in that, It includes the circuit board according to claim 17.

19. The power conversion device according to claim 18, wherein, It further includes a radiator, and the fastener (5) of the power module passes through the circuit board (4), the cover plate (2), and the base (1) and is connected to the radiator (6).

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