High-silicon seed crystal ball-milling device for producing pure silicon CHA molecular sieve

Through the design of sliding plate and mobile component, the combination of liner plates and heat dissipation fin fans is solved, and the problems of complex disassembly and heat accumulation of liner plates in traditional ball mills are improved, and maintenance efficiency and material quality are improved.

CN223171003UActive Publication Date: 2025-08-01LUOYANG JALON MICRO NANO NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202422088383.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-27
Publication Date
2025-08-01
Estimated Expiration
2034-08-27

AI Technical Summary

Technical Problem

The disassembly of the inner lining plate of the traditional ball mill is complicated, the maintenance cost is high, and the accumulation of heat during the ball milling process affects the quality of the material and the life of the equipment.

Method used

A sliding plate and moving assembly are designed to drive the half-cylinder opening and closing, the inner lining plate is easily disassembled, and the heat dissipation efficiency is improved through the heat dissipation fins and fans.

Benefits of technology

It simplifies the disassembly process of the inner lining board, reduces maintenance costs, improves work efficiency, and effectively controls heat accumulation, ensuring material quality and equipment life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a high-silicon seed crystal ball-milling device for producing a pure silicon CHA molecular sieve, and relates to the technical field of ball-milling devices. The utility model comprises: a base; the number of the sliding plates is two, the two sliding plates are symmetrically distributed and slidably installed at the top of the base, supporting plates are fixedly installed at the tops of the two sliding plates, half cylinders are rotatably installed on the adjacent sides of the two supporting plates, and when the adjacent sides of the two half cylinders are attached, the two half cylinders are fixed through bolts; the number of the positioning plates is multiple. The two sliding plates are driven by the moving assembly to be far away from each other, the two half barrels are separated, then the lining plate is directly drawn, the inserting plate is moved out of the positioning plate, and therefore the whole lining plate is drawn out of the half barrels, operation is easy, convenient and fast, use by people is facilitated, the labor intensity of maintenance personnel and the maintenance cost are greatly reduced, and the service life of the maintenance personnel is prolonged. And the working efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of ball milling devices, and specifically relates to a high-silica seed ball milling device for the production of pure-silica CHA molecular sieve. Background Technique

[0002] Pure-silica CHA molecular sieve is a zeolite molecular sieve material composed of pure silicon. It has a unique pore structure and surface catalytic activity. This material has potential application value in the petrochemical industries such as adsorption, separation, and catalysis. Its performance is closely related to its microscopic crystal structure. The characteristics of pure-silica CHA molecular sieve are higher thermal stability, special hydrophobicity, and better electrical conductivity. These characteristics make it play an important role in the separation of small molecule organic substances, which can significantly reduce the cost of industrial separation. During the production process, the pure-silica CHA molecular sieve seeds will be ball milled by a high-silica seed ball milling device to obtain finer crystals and amorphous particles.

[0003] In the design of traditional ball mills, as an important part inside the ball mill, the lining plate is usually connected to the cylinder of the ball mill in a fixed connection manner. Although this design ensures the stability and durability of the ball mill to a certain extent, there are also some obvious deficiencies. First of all, the fixed-connected lining plate is not convenient for disassembly and replacement, which is particularly inconvenient when regular maintenance or replacement of worn parts is required. Secondly, even if the lining plates of some ball mills are designed with a detachable structure, the disassembly process is often relatively complex, consuming a large amount of manpower and time. This not only increases the maintenance cost but also reduces the work efficiency. In addition, during the operation of the ball mill, a large amount of heat will be generated by the collision and friction between the material and the grinding medium. These heats will cause a significant increase in the temperature of the material and the equipment, which may affect the quality of the material and the service life of the ball mill. During the processing of some temperature-sensitive materials, too high a temperature may even cause a change in the properties of the material, affecting the quality of the final product. Content of the Utility Model

[0004] The purpose of the utility model is to provide a high-silica seed ball milling device for the production of pure-silica CHA molecular sieve to solve the problems mentioned in the above background technique.

[0005] To achieve the above object, the present utility model provides the following technical solution: A high-silica seed ball milling device for the production of pure silicon CHA molecular sieve, comprising: a base; two sliding plates, the two sliding plates are symmetrically distributed and slidably mounted on the top of the base, and support plates are fixedly mounted on the tops of the two sliding plates. Semi-cylinders are rotatably mounted on the adjacent sides of the two support plates. When the adjacent sides of the two semi-cylinders are in contact, the two are fixed by bolts; a plurality of positioning plates, the plurality of positioning plates are fixedly mounted on the inner peripheral side of the semi-cylinder in an annular array. An inner lining plate is provided inside the semi-cylinder, and a plurality of insertion plates are fixedly mounted on the outer peripheral side of the inner lining plate. The plurality of insertion plates are respectively inserted on the plurality of positioning plates.

[0006] As a further preference of this technical solution, a moving component for driving the two sliding plates to approach or move away from each other is installed on the base. The moving component includes a rotating gear rotatably mounted on the bottom of the base. Two moving toothed plates are slidably mounted on the bottom of the base. Both of the two moving toothed plates are engaged with the rotating gear. The two moving toothed plates are respectively fixedly connected to the two sliding plates. A cylinder is fixedly mounted on the bottom of the base, and the telescopic end of the cylinder is fixedly connected to one end of one of the moving toothed plates.

[0007] As a further preference of this technical solution, two sliding grooves are formed on the base. Connecting plates are slidably mounted on the inner walls of the two sliding grooves. One ends of the two connecting plates are fixedly connected to the bottoms of the sliding plates, and the other ends of the two connecting plates are respectively fixedly connected to one ends of the two moving toothed plates.

[0008] As a further preference of this technical solution, a shock-absorbing pad is fixedly mounted on the inner peripheral side of the semi-cylinder, and the inner peripheral side of the shock-absorbing pad is in contact with the outer peripheral side of the inner lining plate.

[0009] As a further preference of this technical solution, a support plate is fixedly mounted on the top of the sliding plate. A ring plate is fixedly sleeved on the outer peripheral surface of the semi-cylinder, and the support plate is rotatably connected to the ring plate.

[0010] As a further preference of this technical solution, heat dissipation fins are fixedly mounted on the outer peripheral side of the semi-cylinder. The number of the heat dissipation fins is multiple, and the multiple heat dissipation fins are fixedly mounted on the outer peripheral side of the semi-cylinder in an annular array.

[0011] As a further preference of this technical solution, a mounting plate is fixedly mounted on one side of the support plate, and a heat dissipation fan is fixedly mounted on the mounting plate. The heat dissipation fan faces the outer peripheral side of the semi-cylinder.

[0012] The utility model provides a high-silica seed ball milling device for the production of pure silicon CHA molecular sieve, which has the following beneficial effects:

[0013] (1) In the utility model, the moving component drives two sliding plates to move away from each other, realizing the separation of the two semi-cylinders. Then, the inner lining plate is directly pulled out, so that the insertion plate moves out of the positioning plate, and thus the whole inner lining plate is pulled out of the semi-cylinder. The operation is simple, convenient and fast, which is convenient for people to use, greatly reduces the labor intensity of maintenance personnel and the maintenance cost, and improves the work efficiency.

[0014] (2) Through the cooperation of the heat dissipation fins and the heat dissipation fan, the utility model can quickly dissipate the heat inside the two semi-cylinders, further enhance the heat dissipation effect, improve the heat exchange efficiency, effectively control the heat generated during the ball milling process, and ensure the processing quality of the materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the three-dimensional structure diagram of the utility model;

[0016] Figure 2 is the utility model Figure 1 The sectional three-dimensional structure diagram of the side view;

[0017] Figure 3 is the utility model Figure 1 The sectional three-dimensional structure diagram of the top view;

[0018] Figure 4 is the utility model Figure 1 Another three-dimensional structure diagram.

[0019] In the figure: 1, base; 2, sliding plate; 3, support plate; 4, semi-cylinder; 5, positioning plate; 6, inner lining plate; 7, insertion plate; 8, moving component; 81, rotating gear; 82, moving toothed plate; 83, cylinder; 9, shock pad; 10, support plate; 11, ring plate; 12, heat dissipation fins; 13, mounting plate; 14, heat dissipation fan; 15, chute; 16, connecting plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the utility model.

[0021] The utility model provides a technical solution: as Figures 1-4 shown, in this embodiment, a high-silica seed ball milling device for the production of pure silicon CHA molecular sieve includes: a base 1;

[0022] There are two sliding plates 2, and the two sliding plates 2 are symmetrically distributed and slidably mounted on the top of the base 1. Support plates 3 are fixedly mounted on the tops of the two sliding plates 2. One side of the two adjacent support plates 3 is rotatably mounted with a semi-cylindrical body 4. When the adjacent sides of the two semi-cylindrical bodies 4 are in contact, they are fixed by bolts; a feed port is provided on one of the semi-cylindrical bodies 4, and a cover is provided thereon. A driving member is mounted on the sliding plate 2 for driving one of the semi-cylindrical bodies 4 to rotate to achieve overall ball milling.

[0023] There are multiple positioning plates 5, and the multiple positioning plates 5 are fixedly mounted on the inner peripheral side of the semi-cylindrical body 4 in an annular array. An inner lining plate 6 is arranged inside the semi-cylindrical body 4. A plurality of insertion plates 7 are fixedly mounted on the outer peripheral side of the inner lining plate 6, and the plurality of insertion plates 7 are respectively inserted on the plurality of positioning plates 5. A moving component 8 for driving the two sliding plates 2 to approach or move away from each other is mounted on the base 1. The moving component 8 includes a rotating gear 81 rotatably mounted on the bottom of the base 1. Two moving toothed plates 82 are slidably mounted on the bottom of the base 1. The two moving toothed plates 82 are both engaged with the rotating gear 81. The two moving toothed plates 82 are respectively fixedly connected to the two sliding plates 2. A cylinder 83 is fixedly mounted on the bottom of the base 1, and the telescopic end of the cylinder 83 is fixedly connected to one end of one of the moving toothed plates 82.

[0024] There are two sliding plates 2, which are symmetrically distributed on the top of the base 1 and are connected to the base 1 by a sliding installation method. A support plate 3 is fixedly installed on the top of each sliding plate 2. A semi-cylindrical body 4 is rotatably installed on the adjacent side of the support plate 3. When the two semi-cylindrical bodies 4 are fitted, they are fixed by bolts to form the cylindrical part of the ball milling device. On the inner peripheral side of the semi-cylindrical body 4, a plurality of positioning plates 5 are fixedly installed in an annular array. These positioning plates 5 are used to fix and support the inner lining plate 6 inside. The inner lining plate 6 is arranged inside the semi-cylindrical body 4, and a plurality of insertion plates 7 are fixedly installed on its outer peripheral side. These insertion plates 7 are respectively inserted into the positioning plates 5 to form a structure that is convenient for disassembly and replacement, so as to quickly disassemble the inner lining plate 6 inside the cylinder without affecting its normal use after installation. In order to move the sliding plates 2 closer to or away from each other, a moving component 8 is installed on the base 1. The moving component 8 is composed of a rotating gear 81, a moving toothed plate 82, and a cylinder 83. The rotating gear 81 is installed at the bottom of the base 1 and is rotated by the drive of the cylinder 83. The moving toothed plate 82 is slidably installed at the bottom of the base 1 and meshes with the rotating gear 81, ensuring that the sliding plate 2 can move smoothly. The cylinder 83 is fixed to the bottom of the base 1, and its telescopic end is fixedly connected to one end of the rotating gear 81. By the telescopic action of the cylinder 83, one of the moving toothed plates 82 is controlled to move. Since the rotating gear 81 meshes with the two moving toothed plates 82, when one moving toothed plate 82 moves, it can drive the other moving toothed plate 82 to move, and then drive the two sliding plates 2 to move closer to or away from each other, realizing the opening and closing actions of the two semi-cylindrical bodies 4.

[0025] When it is necessary to disassemble and replace the inner lining plate 6, the bolts fixing the two semi-cylindrical bodies 4 are removed. The cylinder 83 extends, pushing one of the moving toothed plates 82 to move, thereby driving the rotating gear 81 to rotate, and then making the two moving toothed plates 82 move away from each other, so as to push the two sliding plates 2 to move away from each other, realizing the separation of the two semi-cylindrical bodies 4. Then, the inner lining plate 6 is directly pulled out, so that the insertion plate 7 is removed from the positioning plate 5, and thus the inner lining plate 6 is pulled out of the semi-cylindrical body 4 as a whole. The operation is simple, convenient, and fast, which facilitates people's use, greatly reduces the labor intensity of maintenance personnel and the maintenance cost, and improves the work efficiency.

[0026] As Figure 4 shown, two sliding grooves 15 are constructed on the base 1. On the inner walls of the two sliding grooves 15, connecting plates 16 are slidably installed. One end of each of the two connecting plates 16 is fixedly connected to the bottom of the sliding plate 2, and the other ends of the two connecting plates 16 are respectively fixedly connected to one end of the two moving toothed plates 82.

[0027] The connecting plate 16 slides in the sliding groove 15, which is convenient for the stable movement of the sliding plate 2. The movement of the moving toothed plate 82 can drive the connecting plate 16 to move, and then drive the sliding plate 2 connected to it to move, and further separate the two semi-cylindrical bodies 4.

[0028] As shown Figure 2 in the figure, a shock pad 9 is fixedly installed on the inner peripheral side of the semi-cylindrical body 4, and the inner peripheral side of the shock pad 9 is attached to the outer peripheral side of the inner lining plate 6.

[0029] When the sphere moves in the cylinder, it will impact the inner lining plate 6, resulting in vibration of the device. By arranging the shock pad 9 between the inner lining plate 6 and the semi-cylindrical body 4, the vibration can be reduced to a certain extent, thereby reducing the harm of vibration to the device and further increasing the service life of this device.

[0030] As shown Figures 2-3 in the figure, a support plate 10 is fixedly installed on the top of the sliding plate 2, and an annular plate 11 is fixedly sleeved on the outer peripheral side of the semi-cylindrical body 4, and the support plate 10 is rotatably connected to the annular plate 11.

[0031] The annular plate 11 is used to support the semi-cylindrical body 4 so that it can rotate stably.

[0032] As shown Figure 1 in the figure, heat dissipation fins 12 are fixedly installed on the outer peripheral side of the semi-cylindrical body 4. The number of the heat dissipation fins 12 is multiple, and the multiple heat dissipation fins 12 are fixedly installed on the outer peripheral side of the semi-cylindrical body 4 in an annular array distribution.

[0033] The heat dissipation fins 12 are distributed in a linear array and are arc-shaped, which is used to increase the contact area with the air, so as to increase the heat dissipation area, improve the heat dissipation efficiency, further enhance the heat dissipation effect, and improve the heat exchange efficiency.

[0034] As shown Figure 1 in the figure, a mounting plate 13 is fixedly installed on one side of the support plate 10, and a heat dissipation fan 14 is fixedly installed on the mounting plate 13. The heat dissipation fan 14 faces the outer peripheral side of the semi-cylindrical body 4.

[0035] The heat dissipation fan 14 is used to blow air to the outer peripheral side of the semi-cylindrical body 4 and the heat dissipation fins 12, so as to increase the rate of air flow, enable the heat dissipation fins 12 and the semi-cylindrical body 4 to dissipate heat quickly, improve the heat exchange efficiency, effectively control the heat generated during the ball milling process, and ensure the processing quality of the material.

[0036] The present invention provides a high-silica seed ball milling device for the production of pure silicon CHA molecular sieve, and the specific working principle is as follows:

[0037] When it is necessary to disassemble and replace the inner lining plate 6, the fixing of the two semi-cylinders 4 by the bolts is released, the cylinder 83 extends, pushes one of the moving toothed plates 82 to move, thereby driving the rotating gear 81 to rotate, and further separating the two moving toothed plates 82 from each other, so as to push the two sliding plates 2 away from each other, realizing the separation of the two semi-cylinders 4. Then, directly pull out the inner lining plate 6, so that the plug plate 7 moves out of the positioning plate 5, thereby pulling out the inner lining plate 6 as a whole from the semi-cylinder 4. The operation is simple, convenient and fast, which facilitates people's use, greatly reduces the labor intensity of maintenance personnel and the maintenance cost, and improves the work efficiency.

[0038] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-silica seed ball milling device for the production of pure silicon CHA zeolite, characterized in that Including: Base (1); Sliding plates (2), two in number, the two sliding plates (2) are symmetrically distributed and slidably mounted on the top of the base (1), support plates (3) are fixedly mounted on the tops of the two sliding plates (2), and semi-cylindrical bodies (4) are rotatably mounted on the adjacent sides of the two support plates (3). When the adjacent sides of the two semi-cylindrical bodies (4) are in contact, they are fixed by bolts; Positioning plates (5), multiple in number, the multiple positioning plates (5) are fixedly mounted on the inner peripheral side of the semi-cylindrical body (4) in an annular array. An inner lining plate (6) is arranged inside the semi-cylindrical body (4), and multiple insertion plates (7) are fixedly mounted on the outer peripheral side of the inner lining plate (6). The multiple insertion plates (7) are respectively inserted on the multiple positioning plates (5).

2. The high-silica seed ball milling device for the production of pure silicon CHA molecular sieve according to claim 1, characterized in that: A moving component (8) for driving the two sliding plates (2) to approach or move away from each other is mounted on the base (1). The moving component (8) includes a rotating gear (81) rotatably mounted on the bottom of the base (1). Two moving toothed plates (82) are slidably mounted on the bottom of the base (1). The two moving toothed plates (82) are both engaged with the rotating gear (81). The two moving toothed plates (82) are respectively fixedly connected to the two sliding plates (2). A cylinder (83) is fixedly mounted on the bottom of the base (1), and the telescopic end of the cylinder (83) is fixedly connected to one end of one of the moving toothed plates (82).

3. The high-silica seed ball milling device for the production of pure-silica CHA molecular sieve according to claim 2, wherein: Two sliding grooves (15) are formed on the base (1). Connecting plates (16) are slidably mounted on the inner walls of the two sliding grooves (15). One ends of the two connecting plates (16) are fixedly connected to the bottoms of the sliding plates (2), and the other ends of the two connecting plates (16) are respectively fixedly connected to one ends of the two moving toothed plates (82).

4. A high-silica seed ball milling device for the production of pure-silica CHA zeolite according to claim 1, characterized in that: A shock-absorbing pad (9) is fixedly mounted on the inner peripheral side of the semi-cylindrical body (4), and the inner peripheral side of the shock-absorbing pad (9) is in contact with the outer peripheral side of the inner lining plate (6).

5. A high-silica seed ball milling device for the production of pure silicon CHA molecular sieve according to claim 1, characterized in that: A support plate (10) is fixedly mounted on the top of the sliding plate (2). A ring plate (11) is fixedly sleeved on the outer peripheral side of the semi-cylindrical body (4), and the support plate (10) is rotatably connected to the ring plate (11).

6. The high-silica seed ball milling device for the production of pure silicon CHA molecular sieve according to claim 1, characterized in that: Heat dissipation fins (12) are fixedly mounted on the outer peripheral side of the semi-cylindrical body (4). The number of the heat dissipation fins (12) is multiple, and the multiple heat dissipation fins (12) are fixedly mounted on the outer peripheral side of the semi-cylindrical body (4) in an annular array.

7. A high-silica seed ball milling device for the production of pure silica CHA molecular sieve according to claim 5, characterized in that: An installation plate (13) is fixedly mounted on one side of the support plate (10), and a heat dissipation fan (14) is fixedly mounted on the installation plate (13). The heat dissipation fan (14) faces the outer peripheral side of the semi-cylindrical body (4).