Foreign matter removing device for laser machining head and laser machining head

Abstract

The utility model belongs to the technical field of laser processing, and particularly relates to a foreign matter removing device for a laser processing head, the foreign matter removing device is arranged inside and / or outside a light outlet channel of the laser processing head, and the foreign matter removing device applies field acting force to change the movement track of foreign matter invading the light outlet channel. The utility model further provides the laser processing head which can effectively prevent waste residues from being attached to the protective glass and damaging the protective glass, the service life of the protective glass is prolonged, and the use experience of a user is improved.

Description

Technical Field

[0001] This application belongs to the technical field of laser processing equipment, and particularly relates to a foreign object removal device for a laser processing head and a laser processing head. Background Art

[0002] Laser processing uses a laser beam with a high energy density as a heat source to heat a workpiece. The energy radiated by the laser diffuses into the interior of the material through heat conduction, melting the material to form a specific molten pool to achieve the purpose of welding or cutting. When the anti-spatter structure of the laser processing head welds or cuts materials with relatively large spatter such as galvanized sheets, carbon steels, and irons, the residues and spatter generated directly hit the protective mirror, causing damage to the protective mirror and resulting in a high maintenance cost for users.

[0003] Currently, for the problems of residues and spatter clogging the gun barrel and damaging the protective mirror during the operation of the laser processing head, a separate protective cover is generally provided outside the laser processing head; however, this method can only collect and block part of the residues and cannot completely prevent the residues from entering the barrel of the laser processing head. Therefore, there is still a problem in the prior art that the residues generated during the operation of the laser processing head damage the protective mirror. Summary of the Utility Model

[0004] The purpose of this application is to provide a foreign object removal device for a laser processing head, aiming to solve the problem in the prior art that the residues generated during the operation of the laser processing head are likely to damage the protective mirror. To achieve the above purpose, the technical solution adopted in this application is: to provide a foreign object removal device for a laser processing head, the foreign object removal device is arranged inside and / or outside the light output channel of the laser processing head, and the foreign object removal device changes the movement trajectory of the foreign objects invading the light output channel by applying a field force.

[0005] In one embodiment, the movement trajectory of the invading foreign objects is to move in a direction deviating from the protective mirror.

[0006] In one embodiment, the foreign object removal device includes one or more of an electrostatic action module, an electromagnetic action module, a foreign object capture module, and an ultrasonic action module.

[0007] In one embodiment, the electrostatic action module includes a positive electrode plate and a negative electrode plate; the positive electrode plate and the negative electrode plate are relatively fixedly arranged, and the foreign object capture module is connected between the positive electrode plate and the negative electrode plate. After a voltage is applied to the positive electrode plate, a voltage difference is formed between the positive electrode plate and the negative electrode plate, so that the foreign object capture module can capture foreign objects statically or movably between the positive electrode plate and the negative electrode plate.

[0008] In one embodiment, the electromagnetic action module includes an electromagnetic pulse generator for generating a high-intensity magnetic field and electric field. The electromagnetic pulse generator emits a pulse signal that acts on the foreign object, causing the foreign object to become charged and be subjected to a force in the magnetic field and electric field, and fall into the capture range of the foreign object capture module.

[0009] In one embodiment, the inner wall of the light output channel, the electrostatic action module, and the electromagnetic action module are provided with inwardly recessed collection grooves for collecting the foreign objects. A dumping port communicating the collection groove with the outside is also provided on the side wall of the light output channel and at the bottom of the collection groove.

[0010] In one embodiment, the foreign object capture module further includes a combination of a conductive filter or a conductor and an insulating filter. The filter has a porous structure through which air can pass.

[0011] The conductive filter structure is a conductive filter mesh arranged radially along the cross-section of the light output channel or a conductive filter core arranged axially along the light output channel.

[0012] In one embodiment, the ultrasonic action module includes an ultrasonic vibrating plate, which is attached to the electrostatic action module, the electromagnetic action module, or the foreign object capture module.

[0013] In one embodiment, the foreign object removal device further includes a control system for controlling the operating frequency and intensity of the field force to adapt to different working environments and foreign object concentrations.

[0014] This application also provides a laser processing head, including the foreign object removal device as described above.

[0015] The laser processing head further includes a gas delivery member provided on the light output channel. The gas delivery member is used to deliver gas in a direction at a preset angle to the axis of the protective mirror; and / or,

[0016] The laser processing head further includes a gas suction member provided on the light output channel. The gas suction member is used to suck gas in a direction at a preset angle to the axis of the protective mirror.

[0017] This application has at least the following beneficial effects:

[0018] The laser processing head of the present application includes a hollow light-emitting channel for transmitting a laser beam, a protective mirror and a nozzle respectively arranged at both ends of the light-emitting channel, and a foreign object removal device fixedly connected to the light-emitting channel; the light-emitting channel of the laser processing head transmits the laser beam, and the foreign object removal device is used to change the movement trajectory of the waste residue invading the light-emitting channel, so that it moves in a direction deviating from the protective mirror, avoiding the waste residue from adhering to the protective mirror and causing damage to the protective mirror, which is beneficial to extending the service life of the protective mirror. At the same time, it avoids the influence of the external protective cover on the operator's field of view and improves the user's experience. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic diagram of the principle of the foreign object removal device of the present application;

[0021] Figure 2 It is a cross-sectional view of the first case of the laser processing head provided in the first embodiment of the present application Figure 1 ;

[0022] Figure 3 It is a cross-sectional view of the first case of the laser processing head provided in the first embodiment of the present application Figure 2 ;

[0023] Figure 4 It is a cross-sectional view of the second case of the laser processing head provided in the first embodiment of the present application;

[0024] Figure 5 It is a top view structural diagram of the first case of the first blocking member when the laser processing head provided in the first embodiment of the present application is not in use;

[0025] Figure 6 It is a top view structural diagram of the first case of the first blocking member when the laser processing head provided in the first embodiment of the present application is in use;

[0026] Figure 7 It is a top view structural diagram of the second case of the first blocking member when the laser processing head provided in the first embodiment of the present application is not in use;

[0027] Figure 8 It is a cross-sectional view of the laser processing head provided in the second embodiment of the present application.

[0028] Among them, the reference numerals in the drawings:

[0029] 1. Laser processing head; 11. Light output channel; 111. Collection groove; 12. Protective mirror; 13. Nozzle; 14. Sliding assembly; 141. Guide rail; 142. Slide block; 15. Sealing cover plate; 2. Foreign object removal device; 21. Fixed frame; 22. Electrostatic field plate; 23. Inductive coil; 24. Protective sleeve; 25. Installation area; 3. First blocking member; 31. Structure to be broken down; 32. Hole to be enlarged; 33. Laser avoidance hole; 34. Magnetic adsorption layer; 4. Second blocking member; 41. Conical cylindrical structure; 411. First port; 412. Second port; 42. Installation part; 5. Gas delivery member; 6. Suction member. Detailed implementation manners

[0030] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as a limitation of the present application.

[0031] In the description of the present application, it should be understood that the terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.

[0032] In addition, the terms "first", "second", etc. are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0033] In the present application, unless otherwise clearly specified and defined, the terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0034] Such as Figure 1 and Figure 2As shown in the figure, a foreign object removal device 2 applicable to a laser processing head 1 provided by the embodiments of the present application is disposed inside and / or outside the light output channel 11 of the laser processing head. The light output channel 11 of the laser processing head 1 transmits a laser beam. The foreign object removal device 2 changes the movement trajectory of the waste residue invading the light output channel 11 by applying a field force, so that it moves in a direction deviating from the protective mirror 12, avoiding metal dust and invading splashing waste residue from adhering to the protective mirror 12 and causing damage to the protective mirror 12. The foreign object removal device 2 may include one or more of an electrostatic action module, an electromagnetic action module, a foreign object capture module, and an ultrasonic action module.

[0035] When the foreign object removal device 2 is an electrostatic action module, it includes a positive electrode plate, a negative electrode plate, a metal dust catcher, and a dust collection trough. The metal dust catcher may be a conductive filter body or a combination of a metal conductor and an insulating filter body, and the filter body has a porous structure for the protective air flow in the laser processing head to pass through smoothly.

[0036] The conductive filter structure is a conductive filter mesh arranged radially along the cross-section of the light output channel or a conductive filter core arranged axially along the light output channel.

[0037] The positive electrode plate may be solid cylindrical, and the negative electrode plate is a closed cylindrical cathode plate surrounding the cylindrical positive electrode plate. The two are horizontally and relatively fixedly arranged, and the negative electrode is grounded. The metal filter mesh is horizontally fixedly connected to the bottoms of the positive electrode plate and the negative electrode plate respectively. After a voltage is applied to the positive electrode plate, for example, after applying a high-voltage positive electricity of 3 to 8 kV, the negative electrode plate is grounded, and a voltage difference is formed between the positive electrode plate and the negative electrode plate, that is, a high-voltage electric field is formed to achieve the function of electrostatic dust removal. Dust collection troughs are respectively fixed below the positive electrode plate and the negative electrode plate to collect dust, facilitating centralized treatment of the dust.

[0038] In order to improve the dust capture ability, a foreign object capture module is also provided. The foreign object capture module may be a dust collection bag, a dust collection box, a metal filter mesh, a filter core, or other dust collection devices; it may also be a combination of a metal conductor and an insulating filter body. For example, the metal dust catcher is placed on an insulating screen and moves reciprocally to capture dust.

[0039] The mass of the metal dust catcher is small and it can roll freely between the positive electrode plate and the negative electrode plate. Since its surface will carry charges, when a high-voltage electric field is formed between the positive electrode plate and the negative electrode plate, the positive electrode plate is positively charged and the negative electrode plate is negatively charged. Due to the charges on the surface of the metal dust catcher, according to the principle of like charges repelling each other, it rolls reciprocally between the positive and negative electrode plates. During the collision with the positive and negative electrodes, since the type of the charges carried will be changed, the previously adsorbed dust will be bounced off, causing the dust to fall into the dust collection trough.

[0040] The shapes of the positive electrode plate and the negative electrode plate are not limited, as long as an electric field is formed by their cooperation. For example, the positive electrode plate and the negative electrode plate can also be plate-shaped, and they can be relatively fixedly arranged.

[0041] When the foreign object removal device 2 is an electromagnetic action module, the module includes an electromagnetic pulse generator for generating a high-intensity magnetic field and electric field. The electromagnetic pulse generator emits a pulse signal that acts on tiny metal spatter, making it charged and subject to a force in the magnetic field and electric field, causing it to fall into the dust collection trough or dust collection device.

[0042] When the foreign object removal device 2 is an ultrasonic action module, the ultrasonic action module includes an ultrasonic vibrating plate. The ultrasonic vibrating plate can be attached to the electrostatic action module, electromagnetic action module, or foreign object capture module. By vibrating at a super-high speed of tens of thousands of times per second, it achieves the purpose of dust removal. It utilizes the vibration of the dust-containing gas under the action of sound waves or ultrasonic waves to cause the dust particles to resonate, causing the dust particles to collide and aggregate with each other into larger particles and settle down, thereby achieving the effect of removing fine dust and ash. Its dust removal efficiency can reach 80 - 95%.

[0043] The ultrasonic action module can be arranged along the axial direction of the light output channel 11, or longitudinally arranged along the height direction of the electrostatic action module, electromagnetic action module, or foreign object capture module, or transversely arranged along the width direction of the electrostatic field plate 22, or arranged in an array along the light output channel 11 or along the above directions of the foreign object removal device 2.

[0044] In addition, the foreign object removal device further includes a control system. The control system is connected to the control unit of the laser processing head and is used to control the operating frequency and intensity of the field force to adapt to different working environments and foreign object concentrations. Embodiment

[0045] As Figure 1 and Figure 2 shown, in the laser processing head 1 involved in the first embodiment of the present application, the foreign object removal device 2 includes a fixing frame 21 fixedly connected to the light output channel 11 and an electrostatic field plate 22 fixedly connected to the fixing frame 21.

[0046] The fixing bracket 21 suspends the electrostatic field plate 22 on the circumferential side of the light-emitting channel 11; the fixing bracket 21 is fixedly connected to the light-emitting channel 11, and the electrostatic field plate 22 is stably installed at a preset position through the fixing bracket 21, that is, on the circumferential side of the light-emitting channel 11. The electric field force or electromagnetic force generated by the electrostatic field plate 22 is used to adsorb the waste residue invading the light-emitting channel 11. By controlling the current magnitude of the electrostatic field plate 22 through the control system, the intensity and direction of the electric field force of the electrostatic field plate 22 are controlled, so as to change the movement track of the waste residue, make it move in a direction deviating from the protective mirror 12, avoid the waste residue adhering to the protective mirror 12, and damage to the protective mirror 12, which is beneficial to extending the service life of the protective mirror 12.

[0047] Optionally, a sliding component 14 for slidably connecting the fixing bracket 21 is arranged on the light-emitting channel 11. The fixing bracket 21 is slidably connected to the light-emitting channel 11 by using the sliding component 14, so that the fixing bracket 21 can slide relative to the light-emitting channel 11, thereby driving the electrostatic field plate 22 arranged on the fixing bracket 21 to slide relative to the light-emitting channel 11. Users can adjust the position of the electrostatic field plate 22 according to the usage requirements or usage scenarios, effectively increasing its applicable range.

[0048] Optionally, the sliding component 14 includes a guide rail 141 arranged around the outer wall of the light-emitting channel 11, a slider 142 slidably arranged on the guide rail 141 and fixedly connected to the fixing bracket 21, and a locking member for restricting the slider 142 from sliding relative to the guide rail 141. By driving the slider 142 connected to the fixing bracket 21 to slide relative to the light-emitting channel 11 along the guide rail 141, the electrostatic field plate 22 connected to the fixing bracket 21 is driven to move relative to the light-emitting channel 11, so that while the electrostatic field plate 22 is suspended on the outer periphery of the light-emitting channel 11, it can move around the outer periphery of the light-emitting channel 11 and be adjusted to the position required by the user; when the electrostatic field plate 22 moves to the designated position of the user, the locking member is used to restrict the slider 142 from sliding relative to the guide rail 141, thereby restricting the fixing bracket 21 from moving relative to the light-emitting channel 11, and further locking the electrostatic field plate 22 at the designated position and performing operations. The electric field force generated by the electrostatic field plate 22 is used to adsorb the waste residue invading the light-emitting channel 11, change the movement track of the waste residue, make it move in a direction deviating from the protective mirror 12, avoid the waste residue adhering to the protective mirror 12, and damage to the protective mirror 12, which is beneficial to extending the service life of the protective mirror 12.

[0049] As Figures 2 to 7As shown in the figure, in the laser processing head 1 involved in the first embodiment of the present application, the laser processing head 1 further includes a blocking component disposed between the protective mirror 12 and the nozzle 13. The installation position of the blocking component is not limited thereto, and it may also be disposed on the nozzle 13. The blocking component includes at least one first blocking member 3. The specific structure and number of the first blocking member 3 are not limited herein; the first blocking member 3 may be a blocking sheet, a blocking block, a blocking ring, etc.; optionally, a structure to be penetrated 31 is disposed on the first blocking member 3; or, a hole to be enlarged 32 is disposed on the first blocking member 3. The structure to be penetrated 31 is used for the laser beam projected onto the light output channel 11 to penetrate through, so as to form a laser avoidance hole 33; the hole to be enlarged 32 is used for the laser beam projected onto the light output channel 11 to further penetrate the edge, so as to form a laser avoidance hole 33 with a larger aperture; by the first blocking member 3, the aperture of the light output channel 11 for transmitting the laser beam is minimized as much as possible to block substances such as spatter and debris generated during processing.

[0050] As Figures 5 to 7 shown, in the laser processing head 1 involved in the first embodiment of the present application, when the structure to be penetrated 31 is disposed on the first blocking member 3, the first blocking member 3 may be a structure member without an opening, which can block the hollow light output channel 11, so that it can play a blocking role before the user uses it (such as during storage before manufacturing, selling, and using), thereby being able to better prevent foreign objects from entering the light output channel 11 and damaging the inside of the laser processing head 1. When the hole to be enlarged 32 is disposed on the first blocking member 3, the first blocking member 3 may be a structure member with an opening. At this time, the first blocking member 3 is disposed in the hollow light output channel 11 to partially block the light output channel 11; during the specific welding process, the laser beam is projected onto the first blocking member 3. A part of the laser in the laser beam directly passes through the hole to be enlarged 32 and continues to transmit, and another part of the laser will be projected onto the edge area of the hole to be enlarged 32 of the first blocking member 3, penetrate this part of the area, and realize the outward expansion of the edge of the hole to be enlarged 32, and finally enlarge the aperture of the hole to be enlarged 32 to form a laser avoidance hole 33.

[0051] Due to the high collimation of the laser beam, during the process of the laser beam penetrating the structure to be penetrated 31 or the hole to be enlarged 32, the structure to be penetrated 31 or the hole to be enlarged 32 can form a laser avoidance hole 33 that is exactly the same size as the laser beam. The aperture of the laser avoidance hole 33 formed by the structure to be penetrated 31 or the hole to be enlarged 32 will not be much larger than the laser beam, so as to ensure that the laser beam is projected while avoiding the situation that the laser avoidance hole 33 is too large and the blocking performance becomes weak, and can effectively block substances such as spatter and debris generated during processing.

[0052] Optionally, part or all of the first blocking member 3 is a permanent magnet and / or an electromagnet. The first blocking member 3 can be disposed near the nozzle 13 or the protective mirror 12, or directly on the nozzle 13 or the protective mirror 12; alternatively, a magnetic adsorption layer 34 is provided on the surface of the first blocking member 3 facing the nozzle 13.

[0053] Optionally, the number of the first blocking members 3 is plural, and at least one of the first blocking members 3 is a permanent magnet and / or an electromagnet. A magnetic adsorption layer 34 is provided on the surface of at least one of the first blocking members 3 facing the nozzle 13. Specifically, the first blocking member 3 provided with the magnetic adsorption layer 34 and the first blocking member 3 that is a permanent magnet and / or an electromagnet are sequentially disposed between the nozzle 13 and the protective mirror 12. Further, the first blocking member 3 provided with the magnetic adsorption layer 34 disposed near the nozzle 13 is used for primarily blocking the splashed substances, so that while the first blocking member 3 blocks the splashed substances, it can magnetically adsorb the splashed substances, thereby achieving the effect of collecting the splashed substances; some of the unblocked splashed substances are blocked by the first blocking member 3 that is a permanent magnet and / or an electromagnet disposed behind it. Further, the first blocking member 3 that is an electromagnet can control the direction and intensity of the magnetic adsorption force of the first blocking member 3 by controlling the current, so as to avoid dust, splashed substances, etc. from contaminating the new protective mirror 12 and the cavity of the protective mirror 12 during the process of replacing the protective mirror 12.

[0054] As Figures 3 to 4 As shown, in the laser processing head 1 according to the first embodiment of the present application, the blocking assembly further includes a second blocking member 4 disposed between the protective mirror 12 and the nozzle 13. Both the first blocking member 3 and the second blocking member 4 are disposed in the hollow light-emitting channel 11. The first blocking member 3 is used for blocking waste residues, and the second blocking member 4 is disposed between the first blocking member 3 and the protective mirror 12 and is used for reducing the flow rate of the air flow carrying the waste residues, thereby alleviating the problem of the invasion of the waste residues. The second blocking member 4 includes a hollow conical cylindrical structure 41 and an annular mounting portion 42. The mounting portion 42 is used for fixedly connecting the conical cylindrical structure 41 to the inner wall of the light-emitting channel 11; the specific structure of the conical cylindrical structure 41 is not limited herein; the conical cylindrical structure 41 can be a conical cylinder structure or a multi-pyramid cylinder structure. The conical cylindrical structure 41 has a first port 411 facing the nozzle 13 and a second port 412 facing the protective mirror 12. The end face diameter of the first port 411 is smaller than the end face diameter of the second port 412. When the air flow mixed with waste residues flows through the second blocking member 4 and passes through the conical cylindrical structure 41, since the flow area of the conical cylindrical structure 41 gradually increases in the inflow direction of the waste residues, the flow rate of the air flow mixed with waste residues will decrease, thereby achieving the purpose of reducing the flow rate of the air flow mixed with waste residues, and further alleviating the invasion of the waste residues towards the area closer to the protective mirror 12.

[0055] It can be seen that during use, the first blocking member 3 is used to block part of the waste residue from invading the light-emitting channel 11. At the same time, part of the waste residue may continue to invade after passing through the first blocking member 3. This part of the waste residue can be decelerated when passing through the second blocking member 4, thereby alleviating its invasion towards the area closer to the protective mirror 12 and preventing the waste residue from invading into the light-emitting channel 11 and damaging the protective mirror 12 and other components.

[0056] Optionally, the number of the second blocking members 4 arranged between the nozzle 13 and the protective mirror 12 can be one or multiple; the number of the second blocking members 4 is not limited here. Optionally, the number of the second blocking members 4 is multiple, and the multiple second blocking members 4 are arranged at intervals between the nozzle 13 and the protective mirror 12, which can achieve multi-stage deceleration of the airflow mixed with waste residue, thereby further alleviating the invasion of waste residue.

[0057] Optionally, the conical tube structure 41 of the second blocking member 4 is fixedly connected to the inner wall of the light-emitting channel 11 through an annular mounting portion 42. The mounting portion 42 is arranged around the conical tube structure 41 and is fixedly connected to the outer conical surface of the conical tube structure 41. Optionally, magnetic adsorption surfaces are provided on the surface of the mounting portion 42 facing the nozzle 13 and the outer conical surface of the conical tube structure 41, that is, magnetic adsorption surfaces are provided on the windward surfaces of the second blocking member 4; during the operation process, part of the airflow mixed with waste residue blows onto the windward surfaces of the second blocking member 4 and is adsorbed by the magnetic adsorption surfaces provided on the windward surfaces, so that the second blocking member 4 has a strong active adsorption ability, further reducing the risk of waste residue invasion.

[0058] As Figure 8 shown, in the laser processing head 1 involved in the first embodiment of the present application, the laser processing head 1 further includes a slag removal member fixedly connected to the light-emitting channel or the foreign object removal device 2, that is, an ultrasonic action module, which is used to remove the waste residue in the light-emitting channel 11. The waste residue on the light-emitting channel 11 is removed in time through the slag removal member, preventing part of the waste residue from accumulating in the light-emitting channel 11 or on the foreign object removal device 2 and causing blockage, and preventing the laser avoidance hole 33 from being blocked. By vibrating at a super-high speed of tens of thousands of times per second, the waste residue adsorbed on the light-emitting channel 11 is shaken off to achieve the removal of the waste residue in the light-emitting channel 11.

[0059] Optionally, an inner wall of the light-emitting channel 11 of the laser processing head 1 is recessed inward to form a collection groove 111 for collecting waste residues in the light-emitting channel 11. A dumping port communicating the collection groove 111 with the outside is formed in a side wall of the light-emitting channel 11 and at the bottom of the collection groove 111. A sealing cover plate 15 is provided at the light-emitting channel 11 to cover the dumping port; during the operation, the waste residues invading the light-emitting channel 11 fall under the adsorption of the electric field force of the foreign object removal device 2, or fall after being blocked by the blocking assembly, or fall under the vibration of the slag removal member, and fall into the collection groove 111 on the light-emitting channel 11. By providing the collection groove 111 on the light-emitting channel 11, the falling waste residues can be collected in time, thereby avoiding the accumulation of some waste residues in the light-emitting channel 11 and preventing the laser avoidance hole 33 from being blocked; after the operation is completed, the operator opens the sealing cover plate 15 and uses the dumping port to dump the collected waste residues to remove the waste residues in the collection groove 111. The structure is simple and the operation is convenient.

[0060] As Figure 3 shown, in the laser processing head 1 according to the first embodiment of the present application, the laser processing head 1 further includes a gas delivery member 5 provided on the light-emitting channel 11. The gas delivery member 5 is configured to deliver gas in a direction at a preset angle with respect to the axis of the protective mirror 12, so as to blow the splashes near the nozzle 13 to a safe range. Optionally, at least one circle of air outlet holes is provided on the gas delivery member 5, and the opening direction of the air outlet holes is inclined.

[0061] As Figure 4 shown, in another case of the laser processing head 1 according to the first embodiment of the present application, the laser processing head 1 further includes a gas suction member 6 provided on the light-emitting channel 11. The gas suction member 6 is configured to suck gas in a direction at a preset angle with respect to the axis of the protective mirror 12, so as to generate a negative pressure near the nozzle 13 and the workpiece and collect large-particle welding slag, splashes, etc. Embodiment

[0062] As Figure 8As shown in the figure, a laser processing head 1 involved in Embodiment 2 provided by the present application, a foreign object removal device 2 includes a fixing structure fixedly connected to the light output channel 11 and an inductance coil 23 wound around the outer periphery of the light output channel 11. The fixing structure is fixedly connected to the inductance coil 23 and is used to restrict the displacement of the inductance coil 23 relative to the light output channel 11. By sleeving the inductance coil 23 on the outer wall of the light output channel 11 and using the fixing structure fixedly connected to the laser processing head 1 to fixedly connect to the inductance coil 23, the displacement of the inductance coil 23 relative to the laser processing head 1 is restricted, thereby restricting the displacement of the inductance coil 23 relative to the light output channel 11, so that the inductance coil 23 can be stably arranged at a preset position, which is beneficial to ensuring the reliability of the foreign object removal device 2. The electromagnetic force generated by the inductance coil 23 is used to adsorb the waste slag invading into the light output channel 11. By controlling the magnitude of the current of the inductance coil 23, the intensity of the electromagnetic force of the inductance coil 23 is controlled, so as to change the movement trajectory of the waste slag invading into the light output channel 11, making it move in a direction deviating from the protective mirror 12, thereby avoiding the waste slag adhering to the protective mirror 12, which is beneficial to preventing the waste slag from damaging the protective mirror 12 and other internal components, beneficial to extending the service life of the protective mirror 12, and at the same time can avoid affecting the operation vision of the user and improve the user experience.

[0063] Optionally, the foreign object removal device 2 further includes a protective sleeve 24 sleeved on the light output channel 11. An installation area 25 for accommodating the inductance coil 23 is formed by enclosing between the protective sleeve 24 and the outer wall of the light output channel 11. By arranging the inductance coil 23 in the installation area 25 and using the fixing structure to restrict the displacement of the inductance coil 23 relative to the light output channel 11, on the one hand, the inductance coil 23 is stably installed at a preset position, which can play a protective role for the inductance coil 23 and is beneficial to improving the stability of the laser processing head 1; on the other hand, when the laser processing head 1 is in operation, when the inductance coil 23 is in an energized state, it can prevent the inductance coil 23 from accidentally touching other external structures, and there is a risk of short circuit, which is beneficial to improving the safety of the laser processing head 1. Embodiment

[0064] A laser processing head 1 involved in Embodiment 3 provided by the present application can be one of a handheld laser welding head, an automatic laser welding device, and an automatic laser cutting device.

[0065] In the third embodiment, the laser processing head 1 involved in the present application is a laser cutting device or a laser welding device. The protective mirror 12 and the nozzle 13 are selectively provided with structures such as a lens barrel, a cooling member, and a ceramic ring. The lens barrel, the cooling member, and the ceramic ring are assembled to form a light output channel 11 for transmitting a laser beam. The foreign object removal device 2 can be selectively provided at any position on the device body or the laser processing head 1, and only needs to be able to satisfy changing the movement trajectory of the waste residue invading the light output channel 11 and moving in a direction deviating from the protective mirror 12, which will not be elaborated in detail here.

[0066] Optionally, the gas delivery member 5 or the suction member 6 can be selectively provided on one or several of the lens barrel, the cooling member, and the ceramic ring.

[0067] In the third embodiment, the laser processing head 1 involved in the present application is a handheld or automatic laser welding, cleaning, cutting, etc. processing head; a gun barrel structure with a certain length is provided between the protective mirror 12 and the nozzle 13, and the light output channel 11 for transmitting a laser beam is provided on the gun barrel structure.

[0068] Optionally, a protective film layer is provided on the protective mirror 12, and a hollowed-out area corresponding to the laser scanning pattern is reserved for normal processing. The protective film layer can, to a certain extent, prevent the splashes from damaging the protective mirror 12. Optionally, the protective film layer is a lubricating substance such as silicone oil coated on the surface of the protective mirror 12.

[0069] The laser processing head 1 provided with the foreign object removal device 2 of the present application can achieve the protective effect of the protective mirror 12, reduce the later maintenance cost of the user, has better economic benefits, and is beneficial to improving the user experience.

[0070] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A foreign object removal device for a laser processing head, characterized in that: The foreign object removal device is disposed inside and / or outside the light-emitting channel of the laser processing head, and the foreign object removal device changes the movement trajectory of the foreign object invading the light-emitting channel by applying a field force.

2. The foreign object removal device according to claim 1, wherein: A protective mirror is provided in the light-emitting channel, and the movement trajectory of the foreign object is to move in a direction deviating from the protective mirror.

3. The foreign object removal device according to claim 1, wherein: The foreign object removal device includes one or more of an electrostatic action module, an electromagnetic action module, a foreign object capture module, and an ultrasonic action module.

4. The foreign object removal device according to claim 3, wherein: The electrostatic action module includes a positive electrode plate and a negative electrode plate; the positive electrode plate and the negative electrode plate are relatively fixedly arranged, and the foreign object capture module is connected between the positive electrode plate and the negative electrode plate. After a voltage is applied to the positive electrode plate, a voltage difference is formed between the positive electrode plate and the negative electrode plate, so that the foreign object capture module can capture foreign objects statically or movably between the positive electrode plate and the negative electrode plate.

5. The foreign object removal device according to claim 3, wherein: The electromagnetic action module includes an electromagnetic pulse generator for generating a high-intensity magnetic field and electric field. The electromagnetic pulse generator emits a pulse signal to act on the foreign object, so that the foreign object is charged and is subjected to a force in the magnetic field and the electric field, and falls into the capture range of the foreign object capture module.

6. The foreign object removal device according to claim 3, wherein: An inwardly concave collection groove is provided on the inner wall of the light-emitting channel, the electrostatic action module, and the electromagnetic action module for collecting the foreign object. A dumping port communicating the collection groove with the outside is further provided on the side wall of the light-emitting channel and at the bottom of the collection groove.

7. The foreign object removal device according to claim 6, wherein: The foreign object capture module further includes a combination of a conductive filter body or a conductor and an insulating filter body, and the filter body has a porous structure through which air can pass. The foreign object capture module is a conductive filter net arranged radially along the cross section of the light-emitting channel or a conductive filter core arranged axially along the light-emitting channel.

8. The foreign object removal device according to claim 3, wherein: The ultrasonic action module includes an ultrasonic vibration plate, and the ultrasonic vibration plate is attached to the electrostatic action module, the electromagnetic action module, or the foreign object capture module.

9. The foreign object removal device according to claim 3, wherein: The foreign object removal device further includes a control system for controlling the operating frequency and intensity of the field force to adapt to different working environments and foreign object concentrations.

10. A laser processing head, characterized in that: Including the foreign object removal device according to any one of claims 1 to 9; The laser processing head further includes a gas delivery member provided on the light-emitting channel for delivering gas in a direction at a preset angle to the axis of the protective mirror; and / or, the laser processing head further includes a gas suction member provided on the light-emitting channel for sucking gas in a direction at a preset angle to the axis of the protective mirror.

Images