Double-shaft grinding wheel scribing machine with automatic feeding and discharging functions

Abstract

The utility model relates to the technical field of generic semiconductor scribing processing, and discloses a double-shaft grinding wheel scribing machine capable of automatically loading and unloading, which comprises a loading and unloading machine used for conveying workpieces in a material box to a loading station during loading and conveying the processed workpieces on the loading station into the material box during unloading; the workbench is used for limiting and fixing a workpiece; the feeding and discharging mechanical arm is used for conveying the workpieces on the feeding station to the workbench. The cutting assembly is used for cutting and scribing the workpiece which is limited and fixed on the workbench; the feeding and discharging mechanical arm is used for conveying the cut and scribed workpieces back to the feeding station from the workbench, and the workpieces are discharged through the feeding and discharging machine. According to the utility model, the double-spindle and multi-station full-automatic feeding and cutting-up are adopted, the scribing precision and efficiency are effectively improved, meanwhile, the Y-axis precision guide rail and the Z-axis lead screw are externally mounted, and the workbench is arranged behind the machine base, so that the structure is compact, the bearing capacity of the equipment is improved, and the operation stability of the whole system is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of pan-semiconductor dicing processing, in particular to a double-axis grinding wheel dicing machine with automatic loading and unloading. Background Technique

[0002] The grinding wheel dicing machine is a super-precision device integrating water, gas, electricity, air static pressure high-speed spindle, precision mechanical transmission, sensors and automatic control. With the popularization of the application fields of pan-semiconductors, the application scope of dicing machines is becoming wider and wider. The traditional PCB deburring is carried out by numerically controlled milling to remove the outer frame. With the upgrading of display technology, the dimensional accuracy requirements for large-size high-definition Mini-LED direct display modules are getting higher and higher. It is very difficult for traditional milling machines to meet the corresponding processing requirements. The grinding wheel dicing machine is a very mature cutting process for cutting PCB substrates. The conventional clamping method of grinding wheel dicing uses a film sticking process. The steel ring carries the adhesive film, and the workpiece is pasted on the adhesive film. The workpiece is fixed by vacuum adsorbing the adhesive film. For COB packaged products, since there are electronic components on the back of the product and the adhesive film cannot be fixed, when the dicing machine processes the workpiece, the removed scraps are easy to move and then the tool breakage occurs, which is not conducive to the stable processing of the workpiece by the dicing machine. At the same time, the film sticking efficiency is low, manual intervention is required and the film cost is increased. For products such as Mini-LED COB that need to remove the frame, it is urgent to develop a precision dicing machine device with high automation, automatic loading and unloading, high cutting accuracy, high efficiency, and adaptable to products of different materials, different sizes and different specifications. Content of the Utility Model

[0003] (1) Technical Problems to be Solved

[0004] In view of the deficiencies of the prior art, the utility model has developed a double-axis grinding wheel dicing machine with automatic loading and unloading. The clamping method of the working disk can be switched according to customer needs, and the workpiece can be clamped in a multi-piece film-free manner, or the suction cup can be replaced to adopt film sticking clamping; at the same time, the preferably automatic loading and unloading device can realize automatic loading and unloading; the preferably gantry bed is distributed with an automatic loading and unloading device and a cutting area in front, and the compact design method can greatly save the floor area of the machine.

[0005] (2) Technical Solutions

[0006] To achieve the above purposes, the utility model is realized through the following technical solutions:

[0007] An automatic loading and unloading double-axis grinding wheel dicing machine, comprising: a loading and unloading machine, which is used to transport the pan-semiconductor workpieces in the cassette to the loading station when loading, and transport the processed workpieces on the loading station to the cassette when unloading; a workbench, which is used to limit and fix the workpiece; a loading and unloading manipulator, which is used to transport the workpiece on the loading station to the workbench; a cutting assembly, which is used to cut and slice the workpiece limited and fixed on the workbench; a vision module is fixedly connected to one side of the connecting frame, which is used to accurately identify and align the workpiece or the work disk before cutting, and observe the cutting appearance of the processed workpiece on the workbench after cutting; a non-contact height measurement module is arranged on the machine base, which is used to detect the wear condition of the maximum outer diameter of the cutting edge; the loading and unloading manipulators are symmetrically arranged above the workbench, and one of the loading and unloading manipulators is used to transport the cut and sliced workpiece from the workbench back to the loading station, and the loading and unloading machine is used for unloading.

[0008] Preferably, the loading and unloading machine includes a support base and a lifting platform arranged on the support base that can move vertically up and down. A synchronous belt guide rail for temporarily storing the cassette is arranged up and down on one side of the support base. The synchronous belt guide rail can transport the cassette to the lifting platform. A guide rail and a mechanical pusher are arranged at the loading station on the support base. A pushing cylinder is arranged on one side of the support base, which is used to push the workpiece in the cassette to the guide rail at the loading station. The mechanical pusher is used to push the workpiece placed on the guide rail by the loading and unloading manipulator into the cassette on the lifting platform.

[0009] Preferably, a connecting shell is fixedly connected to one side of the support base. An installation groove for installing the pushing cylinder is arranged on the connecting shell. A driving lead screw is rotatably connected to the support base. The driving lead screw is in transmission connection with the lifting platform. The lower end of the driving lead screw is in transmission connection with a driving component.

[0010] Preferably, the workbench is arranged on the machine base through an X-axis slide rail and an X-axis slide table. A DD motor is fixedly connected to the X-axis slide table. The workbench is fixedly installed on the DD motor. The workbench can move along the X-axis direction on the machine base along the X-axis slide rail with the X-axis slide table. A workpiece limiting and fixing component is arranged on the workbench, which is used to limit and fix the workpiece.

[0011] Preferably, a frame is fixedly arranged on the machine base. A Y-axis slide table is slidably connected to the frame through a Y-axis slide rail. A Z-axis slide table is slidably connected to the Y-axis slide table through a Z-axis slide rail. A first linear module is fixedly connected to the Y-axis slide table and drives the Z-axis slide table to slide through the first linear module. The two Y-axis slide tables are symmetrically arranged on the Y-axis slide rail. A cutting spindle is fixedly connected to the Z-axis slide table through a connecting frame. A cutting edge and a cooling water component for cooling and cooling the cutting edge are fixedly connected to the cutting spindle.

[0012] Preferably, a Y-axis guide rail is fixedly arranged on the upper end surface of the frame, the Y-axis slide is slidably connected to the Y-axis guide rail, and the two Y-axis slides are arranged on the Y-axis slide rail.

[0013] Preferably, the loading and unloading manipulator includes a mounting base frame fixedly arranged on the frame. Two manipulator sliding blocks with opposite strokes are linearly driven and connected on the mounting base frame. An X-shaped member is installed on the manipulator sliding block through a fitting frame. A lifting cylinder for driving the X-shaped member to lift is fixedly connected to the fitting frame. A vacuum suction nozzle is adjustably installed on the X-shaped member.

[0014] Preferably, the manipulator slider is linearly driven by a second linear drive module arranged on the mounting base frame.

[0015] (III) Beneficial effects

[0016] The utility model has the following beneficial effects:

[0017] For the double-axis grinding wheel dicing machine with automatic loading and unloading, through the arranged loading and unloading machine and the loading and unloading manipulator, the workpieces in the cartridge can be quickly and accurately independently loaded onto the workbench for the subsequent cutting assembly to perform efficient cutting and dicing; at the same time, the workpieces after cutting and dicing on the workbench can be transported to the unloading station again by the loading and unloading manipulator and stored in the cartridge by the loading and unloading machine for subsequent overall unloading; through the arranged workbench and the cutting assembly, the workpieces transported by the loading and unloading manipulator can be stably limited and fixed; at the same time, the cutting assembly is cooperated to stably slice and cut the limited and fixed pan-semiconductor material. The whole dicing machine can realize the automatic loading of pan-semiconductor workpieces, workpiece limit fixation, cutting and dicing, and unloading and storage in the cartridge, effectively improving the cutting and dicing efficiency of pan-semiconductor material workpieces such as wafers and ensuring the processing quality. Description of the drawings

[0018] Figure 1 It is a schematic diagram of the overall front view structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the overall rear view structure of the utility model;

[0020] Figure 3 It is a schematic diagram of the installation and layout structure of the loading and unloading manipulator of the utility model;

[0021] Figure 4 It is a schematic diagram of the installation and layout structure of the Y-axis slide of the utility model;

[0022] Figure 5 It is a schematic diagram of the structure of the workbench installed with a vacuum adsorption fixture of the utility model;

[0023] Figure 6 This is a schematic layout diagram of the loading and unloading manipulator and the loading and unloading machine of the present utility model;

[0024] Figure 7 This is a schematic layout diagram of the mechanical pusher and the guide rail of the present utility model;

[0025] Figure 8 This is a schematic layout diagram of the synchronous belt guide rail and the pushing cylinder of the present utility model.

[0026] In the figure: 1. Loading and unloading machine; 11. Support base; 12. Guide rail; 13. Mechanical pusher; 14. Lifting platform; 15. Driving lead screw; 16. Pushing cylinder; 17. Synchronous belt guide rail; 18. Connecting shell; 19. Installation groove; 2. Machine base; 21. X-axis slide rail; 22. X-axis slide table; 23. DD motor; 3. Workbench; 4. Cutting assembly; 41. Frame; 42. Y-axis slide rail; 43. Y-axis guide rail; 44. Y-axis slide table; 45. Z-axis slide table; 46. Z-axis slide rail; 47. First linear drive module; 48. Cutting spindle; 49. Cutting edge; 410. Cooling water assembly; 5. Loading and unloading manipulator; 51. Installation base frame; 52. Manipulator sliding block; 53. Second linear drive module; 54. Lifting cylinder; 55. Fitting frame; 56. X-shaped part; 57. Vacuum suction nozzle; 6. Vision module; 7. Non-contact height measurement module; 8. Workpiece clamping assembly; 9. Magazine. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Please refer to Figure 1 , the present utility model provides a technical solution: a double-axis grinding wheel dicing machine with automatic loading and unloading, including: a loading and unloading machine 1, which is used to transport the pan-semiconductor material workpiece in the magazine to the loading station during loading, and transport the processed workpiece on the loading station to the magazine during unloading; a workbench 3, which is used to limit and fix the workpiece; a loading and unloading manipulator 5, which is used to transport the pan-semiconductor material workpiece on the loading station to the workbench 3; a cutting assembly 4, which is used to cut and slice the workpiece limited and fixed on the workbench 3; the loading and unloading manipulators 5 are symmetrically arranged above the workbench 3, and one loading and unloading manipulator 5 is used to transport the cut and sliced workpiece from the workbench 3 back to the loading station, and the loading and unloading machine 1 is used for unloading.

[0029] In this utility model, through the feeding and discharging machine 1 and the feeding and discharging manipulator 5 provided, the workpieces in the cartridge can be quickly and accurately loaded independently onto the workbench 3 for subsequent efficient cutting and scribing by the cutting assembly 4. Meanwhile, the workpieces after cutting and scribing on the workbench 3 can be transported to the discharging work station again by the feeding and discharging manipulator 5 and stored in the cartridge by the feeding and discharging machine 1 for subsequent overall discharging. Through the workbench 3 and the cutting assembly 4 provided, the workpieces transported by the feeding and discharging manipulator 5 can be limited and fixed by the workbench 3. Meanwhile, the cutting assembly 4 is coordinated to perform stable scribing and cutting on the limited and fixed workpieces. The clamping method of the working disk of the whole dicing machine can be switched according to customer requirements, and multiple workpieces can be clamped in a film-free manner, or the suction cups can be replaced to clamp with a film. Meanwhile, the preferably automatic feeding and discharging device can realize automatic feeding and discharging. The automatic feeding and discharging device and the cutting area are preferably distributed in front of the gantry bed body, and the compact design can greatly save the floor area of the machine.

[0030] Referring to Figures 6 - 8 As shown, in this embodiment, the feeding and discharging machine 1 includes a support base 11 and a lifting platform 14 arranged on the support base 11 and capable of moving vertically up and down. On one side of the support base 11, a synchronous belt guide rail 17 for temporarily storing cartridges is arranged up and down. The synchronous belt guide rail 17 can transport the cartridge to the lifting platform 14. On the support base 11, a guide rail 12 and a mechanical pusher 13 are arranged at the feeding station. On one side of the support base 11, a pushing cylinder 16 is arranged to push the workpieces in the cartridge to the guide rail 12 at the feeding station, and the mechanical pusher 13 is used to push the workpieces placed on the guide rail 12 by the feeding and discharging manipulator 5 into the cartridge on the lifting platform 14. First, the cartridge loaded with the workpieces of the to-be-processed pan-semiconductor material can be placed on the synchronous belt guide rail 17. When the workpieces of the pan-semiconductor material need to be processed, the synchronous belt guide rail 17 is started to transport the cartridge to the lifting platform 14. During this process, the lifting platform 14 can move in the vertical direction to meet the cartridge transportation requirements of different levels of the synchronous belt guide rail 17. When the lifting platform 14 is lifted to the preset position, at this time, the pushing cylinder 16 can push the workpieces in the cartridge to the guide rail 12 and stop after reaching the predetermined feeding station. At this time, the unilateral feeding and discharging manipulator 5 can run the workpieces on the guide rail 12 at the feeding station to the workbench 3 for subsequent cutting and scribing processing. When the cutting and scribing processing is completed, at this time, the feeding and discharging manipulator 5 can transport the processed workpieces to the guide rail 12 at the feeding station corresponding to another feeding and discharging machine 1. At this time, the mechanical pusher 13 can be started to push the processed workpieces into the cartridge on the lifting platform 14 for storage. When a cartridge is full of processed workpieces, the lifting platform 14 can drive the full cartridge to the synchronous belt guide rail 17 corresponding to different levels for temporary storage, so as to facilitate other picking and sending equipment to take away the cartridge loaded with processed workpieces as a whole.

[0031] Refer to Figure 8 As shown, in this embodiment, a connection shell 18 is fixedly connected to one side of the support base 11. An installation groove 19 for installing the push cylinder 16 is arranged on the connection shell 18. A driving lead screw 15 is rotatably connected to the support base 11. The driving lead screw 15 is in transmission connection with the lifting platform 14, and the lower end of the driving lead screw 15 is in transmission connection with a driving assembly. By providing the connection shell 18 and the installation groove 19, it is possible to conveniently adjust the installation position of the push cylinder 16 according to needs, so as to adapt to the pushing requirements of workpieces of different sizes; the driving assembly drives the driving lead screw 15 to rotate, thereby realizing the lifting adjustment of the lifting platform 14. In actual application, a servo motor or a stepper motor can be used in cooperation with a reducer to drive the driving lead screw 15 to rotate. It is also possible to use a driving motor in cooperation with a sprocket chain or a gear belt drive method for driving.

[0032] Refer to Figure 4 And 5 As shown, in this embodiment, the workbench 3 is arranged on the machine base 2 through the X-axis slide rail 21 and the X-axis slide table 22. A DD motor 23 is fixedly connected to the X-axis slide table 22, and the workbench 3 is fixedly installed on the DD motor 23. The workbench 3 can move along the X-axis direction on the machine base 2 along the X-axis slide rail 21 with the X-axis slide table 22. A workpiece limiting and fixing assembly is arranged on the workbench 3 for limiting and fixing the workpiece. The workpiece to be processed can be clamped and fixed by a plurality of workpiece clamping assemblies 8 arranged circumferentially on the workbench 3. At the same time, a jig using vacuum adsorption can also be used to fix the workpiece by vacuum adsorption, effectively enhancing the work efficiency of workpiece clamping. There are two ways to clamp the workpiece on the workbench of this automatic dicing machine. One is to use the workpiece clamping assembly 8 to clamp and process the steel ring film. The other is to position and clamp through the PCB jig. There is no need to film, and the workpiece is directly adsorbed and clamped by vacuum adsorption, enhancing the work efficiency.

[0033] In this embodiment, a machine frame 41 is fixedly arranged on the machine base 2. A Y-axis slide table 44 is slidably connected to the machine frame 41 through a Y-axis slide rail 42. A Z-axis slide table 45 is slidably connected to the Y-axis slide table 44 through a Z-axis slide rail 46. A first linear module is fixedly connected to the Y-axis slide table 44 and drives the Z-axis slide table 45 to slide through the first linear module. The two Y-axis slide tables 44 are symmetrically arranged on the Y-axis slide rail 42. A cutting spindle 48 is fixedly connected to the Z-axis slide table 45 through a connecting frame. A cutting edge 49 and a cooling water assembly 410 for cooling and cooling the cutting edge 49 are fixedly connected to the cutting spindle 48.

[0034] Refer to Figure 4As shown, in this embodiment, a Y-axis guide rail 43 is fixedly arranged on the upper end surface of the frame 41. The Y-axis slide 44 is slidably connected to the Y-axis guide rail 43. Two Y-axis slides 44 are arranged on the Y-axis slide rail 42. One side of the connecting frame is fixedly connected with a vision module 6 for observing the cutting appearance of the workpiece to be processed on the workbench after cutting. By providing the Y-axis guide rail 43, it can cooperate with the Y-axis slide rail 42 to jointly support the entire Y-axis slide 44, improving the stability of the long-term operation of the Y-axis slide 44. At the same time, by providing the vision module 6 that matches the cutting spindle 48, it is used to accurately identify and align the workpiece or the workbench before cutting, and observe the cutting appearance of the workpiece to be processed on the workbench after cutting, effectively ensuring the scribing accuracy and efficiency of the cutting edge 49 on the cutting spindle 48, enhancing the flexibility of the equipment, improving the product quality, enhancing the automation level, and improving the production flexibility.

[0035] Referring to Figure 6 As shown, in this embodiment, the loading and unloading manipulator 5 includes a mounting base 51 fixedly arranged on the frame 41. Two manipulator sliding blocks 52 with opposite strokes are linearly driven and connected on the mounting base 51. An X-shaped member 56 is installed on the manipulator sliding block 52 through a fitting frame 55. A lifting cylinder 54 for driving the X-shaped member 56 to lift is fixedly connected to the fitting frame 55. A vacuum suction nozzle 57 is adjustably installed on the X-shaped member 56. By providing the X-shaped member 56 and the vacuum suction nozzle 57, the workpiece before and after processing can be vacuum adsorbed, and then transported to the workbench 3 or the loading station in a directional manner along with the manipulator slider. By providing the lifting cylinder 54, it can drive the entire X-shaped member 56 to lift, thereby meeting the function of stable feeding or material taking.

[0036] Referring to Figure 4 As shown, in this embodiment, the manipulator slider is linearly driven by a second linear drive module 53 on the mounting base 51. A non-contact height measurement module 7 is arranged on the machine base 2 for detecting the wear condition of the maximum outer diameter of the cutting edge. By providing the non-contact height measurement module 7, the wear degree of the cutting edge 49 can be directly detected during the automatic cutting process, and a compensation value can be set according to the wear condition. Different from the contact height measurement, the non-contact height measurement can detect the tool wear condition during the cutting task, which can greatly improve the cutting efficiency. The first linear drive module 47 and the second linear drive module 53 adopted can be a linear module composed of a motor and a lead screw or a linear motor module.

[0037] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0038] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A double-axis grinding wheel dicing machine with automatic loading and unloading, characterized in that, Including: A loading and unloading machine, which is used to transport the workpieces in the cartridge to the loading station when loading, and to transport the processed workpieces on the loading station to the cartridge when unloading; a workbench for limiting and fixing the workpieces; a loading and unloading manipulator for transporting the workpieces on the loading station to the workbench; a cutting assembly for cutting and slicing the workpieces limited and fixed on the workbench; one side of the connecting frame is fixedly connected with a vision module for accurately identifying and aligning the workpieces or the worktable before cutting, and observing the cutting appearance of the processed workpieces on the workbench after cutting; a non-contact height measurement module is arranged on the machine base for detecting the wear condition of the maximum outer diameter of the cutting edge; the loading and unloading manipulators are symmetrically arranged above the workbench, and one of the loading and unloading manipulators is used to transport the cut and sliced workpieces from the workbench back to the loading station, and the loading and unloading machine is used for unloading.

2. The automatic loading and unloading double-axis grinding wheel dicing machine according to claim 1, wherein: The loading and unloading machine includes a support base and a lifting platform arranged on the support base that can move vertically up and down. A synchronous belt guide rail for temporarily storing cartridges is arranged vertically on one side of the support base. The synchronous belt guide rail can transport the cartridge to the lifting platform. A guide rail and a mechanical pusher are arranged at the loading station on the support base. A pushing cylinder is arranged on one side of the support base for pushing the workpieces in the cartridge to the guide rail at the loading station. The mechanical pusher is used to push the base workpieces placed on the guide rail by the loading and unloading manipulator into the cartridge on the lifting platform.

3. The automatic loading and unloading double-axis grinding wheel dicing machine according to claim 2, characterized in that: A connecting shell is fixedly connected to one side of the support base. An installation groove for installing the pushing cylinder is arranged on the connecting shell. A driving lead screw is rotatably connected to the support base. The driving lead screw is in transmission connection with the lifting platform, and the lower end of the driving lead screw is in transmission connection with a driving component.

4. A double-axis grinding wheel dicing machine with automatic loading and unloading according to claim 1 or 2, characterized in that: The workbench is arranged on the machine base through an X-axis slide rail and an X-axis slide table. A DD motor is fixedly connected to the X-axis slide table, and the workbench is fixedly installed on the DD motor. The workbench can move along the X-axis direction on the machine base along the X-axis slide rail with the X-axis slide table. A workpiece limiting and fixing component is arranged on the workbench for limiting and fixing the workpieces.

5. The automatic loading and unloading double-axis grinding wheel dicing machine according to claim 4, wherein: A machine frame is fixedly arranged on the machine base. A Y-axis slide table is slidably connected to the machine frame through a Y-axis slide rail. A Z-axis slide table is slidably connected to the Y-axis slide table through a Z-axis slide rail. A first linear module is fixedly connected to the Y-axis slide table and drives the Z-axis slide table to slide through the first linear module. The two Y-axis slide tables are symmetrically arranged on the Y-axis slide rail. A cutting spindle is fixedly connected to the Z-axis slide table through a connecting frame. A cutting edge and a cooling water component for cooling and lowering the temperature of the cutting edge are fixedly connected to the cutting spindle.

6. The automatic loading and unloading double-shaft grinding wheel dicing machine according to claim 5, characterized in that: A Y-axis guide rail is fixedly arranged on the upper end surface of the machine frame. The Y-axis slide table is slidably connected to the Y-axis guide rail. The two Y-axis slide tables are arranged on the Y-axis slide rail.

7. An automatic loading and unloading double-axis grinding wheel dicing machine according to claim 5 or 6, characterized in that: The loading and unloading manipulator includes a mounting base fixedly arranged on the frame. Two manipulator sliders with opposite strokes are linearly driven and connected to the mounting base. An X-shaped part is installed on the manipulator slider through a fitting frame. A lifting cylinder for driving the X-shaped part to lift is fixedly connected to the fitting frame. A vacuum suction nozzle is adjustably installed on the X-shaped part.

8. The automatic loading and unloading two-axis grinding wheel dicing machine according to claim 7, characterized in that: The manipulator slider is linearly driven by a second linear drive module arranged on the mounting base.

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