Tool for chamfering multilayer chip ceramic capacitor
By using elastic grinding tanks and support ball tooling during chamfering of multi-layer sheet ceramic capacitors, the problem of dents or defects during chamfering of ceramic capacitors is solved, and the integrity and reliability of the product are improved.
Patent Information
- Application Number
- CN202422367762.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-27
AI Technical Summary
Multi-layer chip ceramic capacitors are prone to dents or defects during the chamfering process of planetary chamfering machines, resulting in performance and reliability problems.
Using a tooling with elastic grinding tanks and multiple supporting balls, the support balls are laid on the inner wall of the grinding tank to form an isolation layer to support the ceramic capacitors, avoid contact with the inner wall of the grinding tank, and use hard-hard contact instead of soft-hard contact.
It effectively avoids the problem of dents or defects in the chamfering process of ceramic capacitors, ensuring product quality and performance stability.
Smart Images
Figure CN223172688U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chamfering of multilayer ceramic capacitors, and particularly relates to a tooling for chamfering multilayer ceramic capacitors. Background Art
[0002] At present, planetary chamfering machines are generally used for chamfering multilayer ceramic capacitors, mainly to achieve a smooth surface of the chip, full exposure of the inner electrode at the end face, and to avoid defects caused by sharp edges during subsequent turnover. Chamfering is to place a grinding tank filled with chamfering medium in a planetary chamfering machine, and drive the objects in the grinding tank to rotate through the rotation of the equipment itself, so as to achieve the chamfering treatment of the chips of multilayer ceramic capacitors.
[0003] However, chamfering with a planetary chamfering machine is likely to cause dents or defects in the products of multilayer ceramic capacitors. The main reason is that the mass of a single multilayer ceramic capacitor is large and the thickness is thick during the chamfering process, and the grinding tank is generally made of rubber with a high friction coefficient on its inner wall, making the product unable to rotate effectively in the grinding tank, or even adsorbed on the inner wall of the grinding tank and unable to move. The chamfering medium grinds around the product, which may cause dents or defects on the surface of the chip. In the subsequent production process, it is difficult to fully discharge the air at the dented or defective part, which may form defects such as bubbles and holes at the end electrode, and these defects affect the performance and reliability of the chip. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a tooling for chamfering multilayer ceramic capacitors, so as to solve the problem that dents or defects are easily generated during the chamfering of multilayer ceramic capacitors by using a planetary chamfering machine.
[0005] The utility model is realized by the following technical solutions:
[0006] A tooling for chamfering multilayer ceramic capacitors includes a grinding tank, the grinding tank is an elastic tank, and the grinding tank is used to accommodate chamfering medium and the multilayer ceramic capacitors to be chamfered; a plurality of supporting balls, the supporting balls are arranged in the grinding tank, and the supporting balls are used to support the multilayer ceramic capacitors to be chamfered to avoid contact between the multilayer ceramic capacitors and the inner wall of the grinding tank; all the supporting balls are evenly distributed on the inner wall of the grinding tank and are fixedly connected to the inner wall of the grinding tank.
[0007] Optionally, all the supporting balls are evenly distributed on the inner bottom wall of the grinding tank.
[0008] Optionally, all the supporting balls are uniformly distributed on the inner bottom wall of the grinding tank.
[0009] Optionally, any one of the support balls abuts against at least two adjacent support balls.
[0010] Optionally, the outermost ring of the support balls is the outer ring balls, and the remaining support balls are the inner ring balls; any one of the inner ring balls abuts against n support balls, where: n≥4, and n is a natural number.
[0011] Optionally, all the support balls have the same diameter.
[0012] Optionally, any one of the inner ring balls abuts against n support balls, where: n = 4, or n = 6.
[0013] Optionally, the shortest distance between the ball wall of the outer ring ball and the inner side wall of the grinding tank is m, where: 0≤m<M, and M is the diameter of the support ball.
[0014] Optionally, 1mm≤M≤3mm; the diameter of the grinding tank is 20 cm; the height of the grinding tank is 20 cm; the thickness of the bottom of the grinding tank is 2 cm.
[0015] Optionally, the grinding tank is an elastic tank made of rubber material, and the support balls are hard balls made of zirconia material.
[0016] Compared with the prior art, the present invention has the following advantages and beneficial effects:
[0017] The tooling for chamfering multilayer ceramic capacitors provided by the present invention is provided with an elastic grinding tank to contain the chamfering medium, provide a chamfering space, and be connected and cooperate with a planetary chamfering machine; on this basis, by arranging a plurality of support balls and laying them on the inner wall of the grinding tank, an isolation layer is formed between the inner wall of the grinding tank and the multilayer ceramic capacitors, and the multilayer ceramic capacitors are structurally supported to avoid the direct contact between the multilayer ceramic capacitors and the inner wall of the grinding tank, thereby avoiding the problems that the multilayer ceramic capacitors cannot rotate effectively in the grinding tank or even adsorb on the inner wall of the grinding tank and cannot move. The support balls replace the grinding tank to replace the soft-hard contact between the grinding tank and the multilayer ceramic capacitors with hard-hard contact, thereby effectively solving the problems that the multilayer ceramic capacitors are prone to generate indentations or defects during the chamfering process using a planetary chamfering machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, form a part of this application, and do not limit the embodiments of the present invention. In the drawings:
[0019] Figure 1 is a top view schematic diagram of the tooling for chamfering multilayer ceramic capacitors provided by the embodiment of the present invention;
[0020] Figure 2 The first layout schematic diagram of the inner ring balls of the tooling for chamfering multi-layer ceramic capacitors provided by the embodiment of the present utility model;
[0021] Figure 3 The second layout schematic diagram of the inner ring balls of the tooling for chamfering multi-layer ceramic capacitors provided by the embodiment of the present utility model;
[0022] Figure 4 The partial enlarged view at the outer ring balls of the tooling for chamfering multi-layer ceramic capacitors provided by the embodiment of the present utility model.
[0023] Marks in the attached drawings and corresponding component names:
[0024] 10 - grinding tank; 20 - supporting ball. Detailed implementation manners
[0025] To make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the embodiments and the attached drawings. The illustrative embodiments of the present utility model and their descriptions are only used to explain the present utility model and do not limit the present utility model.
[0026] Embodiment
[0027] Please refer to Figures 1 to 4 , this embodiment provides a tooling for chamfering multi-layer ceramic capacitors, including a grinding tank 10. The grinding tank 10 is an elastic tank, and the grinding tank 10 is used to accommodate the chamfering medium and the multi-layer ceramic capacitors to be chamfered. Secondly, it includes a plurality of supporting balls 20. The supporting balls 20 are arranged in the grinding tank 10, and the supporting balls 20 are used to support the multi-layer ceramic capacitors to be chamfered to prevent the multi-layer ceramic capacitors from contacting the inner wall of the grinding tank 10. All the supporting balls 20 are evenly arranged on the inner wall of the grinding tank 10 and are fixedly connected to the inner wall of the grinding tank 10.
[0028] The tooling for chamfering multilayer ceramic capacitors provided in this embodiment is equipped with an elastic grinding tank 10 to contain chamfering medium, provide a chamfering space, and be connected and cooperated with a planetary chamfering machine. On this basis, by arranging multiple support balls 20 and laying them on the inner wall of the grinding tank 10, an isolation layer is formed between the inner wall of the grinding tank 10 and the multilayer ceramic capacitor, and the structure of the multilayer ceramic capacitor is supported to prevent the multilayer ceramic capacitor from directly contacting the inner wall of the grinding tank 10, thus avoiding the problems that the multilayer ceramic capacitor cannot rotate effectively in the grinding tank 10 or even adsorb on the inner wall of the grinding tank 10 and cannot move. The support balls 20 replace the grinding tank 10 to replace the soft-hard contact between the grinding tank 10 and the multilayer ceramic capacitor with hard-hard contact, thereby effectively solving the problem that the multilayer ceramic capacitor is prone to indentation or damage during the chamfering process using a planetary chamfering machine.
[0029] It should be noted that in this embodiment, the grinding tank 10 is an elastic tank made of rubber, and the support balls 20 are hard balls made of zirconia.
[0030] It should be noted that in this embodiment, the surface of the support balls 20 needs to be polished to ensure high hardness, high wear resistance, and low friction characteristics to meet the chamfering requirements of multilayer ceramic capacitor products.
[0031] It should be noted that in this embodiment, a high-performance AB glue is used as the adhesive to ensure that the support balls 20 can be firmly adhered to the inner wall of the grinding tank 10, with good adhesive strength and durability.
[0032] It should be noted that in this embodiment, the inner wall of the grinding tank 10 needs to be appropriately pretreated to enhance the adhesion of the adhesive and ensure that the support balls 20 will not fall off during use.
[0033] It should be noted that after the grinding tank 10 fixes the support balls 20, appropriate curing and aging treatments are carried out to ensure the bonding stability of the support balls 20.
[0034] To effectively support the multilayer ceramic capacitor to be chamfered on the premise of ensuring the elastic performance of the grinding tank 10, all the support balls 20 are evenly distributed on the inner bottom wall of the grinding tank 10.
[0035] To initially prevent the multilayer ceramic capacitor to be chamfered from inserting into the gaps between the support balls 20, all the support balls 20 are evenly distributed on the inner bottom wall of the grinding tank 10.
[0036] Through the above settings, the gap width between the support balls 20 is effectively controlled, avoiding the possibility of larger-width gaps when the support balls 20 are arranged disorderly, which may cause the multilayer ceramic capacitor to insert into such gaps.
[0037] In order to further prevent the multi-layer ceramic capacitor to be chamfered from being inserted into the gap between the supporting balls 20 , any one of the supporting balls 20 is in contact with at least two adjacent supporting balls 20 .
[0038] Through the above arrangement, on the one hand, the adjacent supporting balls 20 support each other to improve the integrity and stability of the overall structure, and on the other hand, the possibility of gaps between adjacent supporting balls 20 is further reduced, further avoiding the situation where the multi-layer ceramic capacitor to be chamfered is inserted into the gap between the supporting balls 20.
[0039] In order to further explain the arrangement of the support balls 20, the support balls 20 located in the outermost circle are outer circle balls, and the remaining support balls 20 are inner circle balls; any one of the inner circle balls is in contact with n support balls 20, where: n≥4, n is a natural number.
[0040] Through the above arrangement, the inner ring balls are all in contact with the adjacent support balls 20 , so that the circumferential force is balanced, thereby further improving the stability of the overall structure.
[0041] In order to ensure the supporting effect of the isolation layer formed by the supporting balls 20 , the diameters of all the supporting balls 20 are the same.
[0042] Preferably, please refer to Figure 2 and Figure 3 , any one of the inner circle balls abuts against n of the supporting balls 20 , where: n=4, or n=6.
[0043] Both of the above methods can ensure the uniform distribution, structure and stress stability of the inner ring balls.
[0044] In order to avoid the multilayer ceramic capacitor to be chamfered from being inserted into the gap between the outer ball and the inner wall of the grinding jar 10 as much as possible, the shortest distance between the ball wall of the outer ball and the inner wall of the grinding jar 10 is m, where: 0≤m<M, M is the diameter of the support ball 20.
[0045] Preferably, the diameter of the supporting ball 20 is 1 mm ≤ M ≤ 3 mm; the diameter of the grinding jar 10 is 20 cm; the height of the grinding jar 10 is 20 cm; and the thickness of the bottom of the grinding jar 10 is 2 cm.
[0046] The specific embodiments described above have further elaborated on the purpose, technical solutions, and beneficial effects of the present utility model. It should be understood that the above are only specific embodiments of the present utility model and are not used to limit the protection scope of the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A tooling for chamfering of multilayer ceramic capacitors, characterized in that, Comprising: A grinding tank (10), the grinding tank (10) being an elastic tank, and the grinding tank (10) being used for accommodating chamfering medium and multi-layer ceramic capacitors to be chamfered; A plurality of support balls (20), the support balls (20) being arranged in the grinding tank (10), and the support balls (20) being used for supporting the multi-layer ceramic capacitors to be chamfered so as to avoid the multi-layer ceramic capacitors from contacting the inner wall of the grinding tank (10); All the support balls (20) are evenly distributed on the inner wall of the grinding tank (10) and are fixedly connected to the inner wall of the grinding tank (10).
2. The tooling for chamfering a multi-layer ceramic capacitor according to claim 1, wherein, All the support balls (20) are evenly distributed on the inner bottom wall of the grinding tank (10).
3. The tooling for chamfering a multi-layer ceramic capacitor according to claim 2, wherein All the support balls (20) are uniformly distributed on the inner bottom wall of the grinding tank (10).
4. The tooling for chamfering a multi-layer ceramic capacitor according to claim 3, characterized in that, Any one of the support balls (20) is in contact with at least two adjacent support balls (20).
5. The tooling for chamfering a multi-layer ceramic capacitor according to claim 4, wherein The outermost ring of the support balls (20) is the outer ring balls, and the remaining support balls (20) are the inner ring balls; Any one of the inner ring balls is in contact with n support balls (20), where: n≥4, and n is a natural number.
6. The tooling for chamfering a multi-layer ceramic capacitor according to claim 5, characterized in that, All the support balls (20) have the same diameter.
7. The tooling for chamfering of the multilayer ceramic capacitor according to claim 6, characterized in that, Any one of the inner ring balls is in contact with n support balls (20), where: n = 4, or n = 6.
8. The tooling for chamfering a multi-layer ceramic capacitor according to claim 6, wherein, The shortest distance between the ball wall of the outer ring ball and the inner side wall of the grinding tank (10) is m, where: 0≤m<M, and M is the diameter of the support ball (20).
9. The tooling for chamfering a multilayer ceramic capacitor according to claim 8, characterized in that, 1mm≤M≤3mm; The diameter of the grinding tank (10) is 20 cm; The height of the grinding tank (10) is 20 cm; The thickness of the bottom of the grinding tank (10) is 2 cm.
10. The tooling for chamfering a multi-layer ceramic capacitor according to claim 1, characterized in that, The grinding tank (10) is an elastic tank made of rubber, and the support balls (20) are hard balls made of zirconia.