Thermal management unit
By setting up a cleaning part on the outer shell of the heat management unit, the problem of the condenser being easily blocked by contaminants is solved, the rapid cleaning and heat dissipation efficiency of the condenser are achieved, and the working efficiency and availability of the unit are improved.
Patent Information
- Application Number
- CN202422053600.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-08-22
AI Technical Summary
The existing heat management unit is prone to blockage of the condenser by pollutants in harsh environments, resulting in a decrease in heat dissipation capacity, affecting the refrigeration effect, and the cleaning process is cumbersome and consuming manpower and material resources.
A cleaning part, such as a cleaning tank or a cleaning through hole, is provided on the shell of the heat management unit, to cooperate with the cleaning device, directly clean the condenser and improve heat dissipation efficiency.
It realizes fast and convenient cleaning of the condenser, improves the heat dissipation capacity and the working efficiency of the heat management unit, and reduces downtime and maintenance costs.
Smart Images
Figure CN223179083U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of thermal management, and particularly to a thermal management unit. Background Art
[0002] With the continuous development of the new energy vehicle industry, the working conditions of new energy vehicles are gradually increasing, and the environmental conditions faced by vehicle thermal management units are also gradually deteriorating. The use environments of some thermal management units include mines, and the pollutants in the use environment include dust, coal powder, oil stains, sand, and catkins. These pollutants will block the condenser in the thermal management unit, affecting the heat dissipation of the condenser, and then reducing the refrigeration capacity of the thermal management unit, affecting the use of users. Currently, the methods for cleaning the condenser include directly cleaning the condenser by disassembling the outer shell of the thermal management unit, but the cleaning process is cumbersome and wastes a lot of manpower and material resources. Utility Model Content
[0003] In order to solve the problems existing in the above-mentioned prior art, this application provides a thermal management unit, which can quickly and conveniently clean the condenser, improve the heat dissipation capacity of the condenser, and then improve the working efficiency of the thermal management unit.
[0004] This application provides a thermal management unit, which includes a condenser and an outer shell. The condenser is accommodated in the inner cavity of the outer shell.
[0005] The outer shell includes a first panel and a second panel. The condenser is arranged in the direction close to the first panel. The second panel is adjacent to the first panel. The second panel is provided with at least one cleaning part, and the cleaning part is used to cooperate with a cleaning device to enable the cleaning device to communicate with the inner cavity of the outer shell.
[0006] In a possible implementation manner, one cleaning part is arranged on the second panel, and the cleaning part is a cleaning groove.
[0007] In a possible implementation manner, a plurality of cleaning parts are arranged on the second panel, and the cleaning parts are cleaning through holes.
[0008] In a possible implementation manner, the width of the cleaning groove is 10 mm - 30 mm, and the length of the cleaning groove is less than or equal to 300 mm.
[0009] In a possible implementation manner, the diameter of the cleaning through hole is 10 mm - 30 mm.
[0010] In a possible implementation manner, the cleaning part is arranged on the second panel in the direction close to the first panel.
[0011] In a possible implementation, the thermal management unit further includes a third panel, which is arranged adjacent to the first panel, the third panel is arranged opposite to the second panel, and cleaning parts are arranged on both the third panel and the first panel.
[0012] In a possible implementation, the thermal management unit further includes a baffle, and the baffle is elastically connected to the cleaning part.
[0013] In a possible implementation, the area of the baffle is greater than or equal to the area of the cleaning part.
[0014] In a possible implementation, at least one rounded corner is provided on the cleaning tank.
[0015] A thermal management unit provided by the present application has at least the following beneficial effects:
[0016] A thermal management unit provided by the present application, the thermal management unit includes a condenser and a housing, the condenser is accommodated in the inner cavity of the housing, the housing includes a first panel and a second panel, the condenser is arranged in the direction close to the first panel, the second panel is arranged adjacent to the first panel, and the second panel is provided with at least one cleaning part, and the cleaning part is used to cooperate with a cleaning device so that the cleaning device communicates with the inner cavity of the housing. Through the cooperation of the cleaning part and the cleaning device, the cleaning device can directly clean the condenser to improve the heat dissipation efficiency of the condenser, and further improve the working efficiency of the thermal management unit. Description of the Drawings
[0017] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.
[0018] Figure 1 It is a schematic structural diagram of a thermal management unit provided by an embodiment of the present application;
[0019] Figure 2 It is a schematic structural diagram of a second panel provided by an embodiment of the present application;
[0020] Figure 3 It is a schematic structural diagram of a thermal management unit provided by an embodiment of the present application;
[0021] Figure 4 It is a schematic structural diagram of a second panel provided by an embodiment of the present application.
[0022] Among them, the corresponding reference numerals in the drawings are:
[0023] 1. Housing; 11. First panel; 12. Second panel; 121. Cleaning groove; 122. Cleaning through hole; 2. Condenser; 3. Fan. Specific embodiments
[0024] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.
[0025] As used herein, the term "one embodiment" or "embodiment" refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present application. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined by "first" and "second" may explicitly or implicitly include one or more of such features. Moreover, the terms "first", "second", etc. are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.
[0026] The following introduces a thermal management unit provided by an embodiment of the present application with reference to the accompanying drawings. The thermal management unit of the present application is particularly applicable to the scenario of cleaning the condenser 2.
[0027] Please refer to Figure 1 , an embodiment of the present application provides a thermal management unit. The thermal management unit includes a condenser 2 and a housing 1. The condenser 2 is accommodated in the inner cavity of the housing 1. The housing 1 includes a first panel 11 and a second panel 12. The condenser 2 is arranged in the direction close to the first panel 11. The second panel 12 is adjacent to the first panel 11. The second panel 12 is provided with at least one cleaning part, and the cleaning part is used to cooperate with a cleaning device to enable the cleaning device to communicate with the inner cavity of the housing 1. By cooperating the cleaning device with the cleaning part, the cleaning device can directly clean the condenser 2 to improve the heat dissipation efficiency of the condenser 2, thereby improving the working efficiency of the condenser 2, reducing the downtime of the thermal management unit, and improving the working efficiency and availability of the thermal management unit.
[0028] Understandably, the environmental conditions of some current vehicle thermal management units are relatively harsh. Especially in harsh environments such as mines, dust, coal powder, oil stains, sand, and catkins can cause various blockages to the condenser 2 in the thermal management unit, which in turn affects the heat dissipation of the condenser 2 in the thermal management unit, resulting in a reduction in the refrigeration capacity of the thermal management unit and thus affecting the user's driving. In the current thermal management unit, the condenser 2 is generally built-in. When the condenser 2 is blocked or needs to be cleaned regularly, the operator cannot effectively clean the air inlet surface of the condenser 2. The cleaning process of the thermal management unit is cumbersome and the operator is difficult to observe the cleaning status of the condenser 2, resulting in a reduction in the refrigeration capacity of the thermal management unit and shortening the life of the thermal management unit, which has a greater negative impact on users.
[0029] Specifically, the cleaning process of the existing condenser 2 includes: the operator first needs to disassemble the vehicle frame, and then disassemble the skin of the thermal management unit. After the condenser 2 is exposed to the operator's view, the operator cleans the condenser 2. After the cleaning is completed, first install the skin of the thermal management unit, and then install the vehicle frame.
[0030] In this embodiment, the housing 1 of the thermal management unit includes a plurality of panels. The first panel 11 is located between the upper top plate and the lower bottom plate. Both the fan 3 and the condenser 2 are arranged on one side close to the first panel 11. The fan 3 is arranged on the side of the first panel 11 facing the outside, and the condenser 2 is arranged on the side of the first panel 11 away from the outside. The cleaning part is arranged on the second panel 12, where the second panel 12 is the upper top plate. The upper top plate is adjacent to the first panel 11, and the first panel 11 is detachably connected to the upper top plate. The upper top plate is provided with a cleaning part. In the case where the condenser 2 needs to be cleaned, the cleaning device cooperates with the cleaning part to form a cleaning channel. The cleaning device is communicated with the inner cavity of the housing 1, and the cleaning agent reaches the condenser 2 to be cleaned through the cleaning channel, so as to achieve the effect of cleaning the condenser 2.
[0031] In one possible implementation, the cleaning part is arranged on the lower bottom plate; in another possible implementation, the cleaning part is arranged on the side plates adjacent to and connected to the first panel 11.
[0032] Specifically, the cleaning agent includes high-pressure gas or water. In the case where the cleaning agent is high-pressure gas, the cleaning device includes an air compressor and a high-pressure nozzle; in the case where the cleaning agent is water, the cleaning device includes a high-pressure water pump and a sprayer or nozzle.
[0033] In one possible implementation, cleaning parts are arranged on the four panels adjacent to the first panel, which improves the heat dissipation efficiency of the thermal management unit.
[0034] Further, a cleaning part is arranged on the second panel 12, and the cleaning part is a cleaning groove 121. In this way, the cleaning groove 121 facilitates the cleaning device to extend to the surface of the condenser 2 for cleaning operations, which is conducive to the free movement of the cleaning device. The cleaning device can adjust the angle and direction more flexibly to ensure that the cleaning components can fully contact various parts of the condenser 2 and improve the cleaning effect.
[0035] Specifically, as Figure 2 shown, the second panel 12 is provided with a cleaning groove 121 with a uniform width, and the cleaning groove 121 is a rectangular groove. The length of the cleaning groove 121 is greater than or equal to the length of the condenser 2, and the cleaning part can communicate the inner cavity of the housing 1 with the outside. Before the second panel 12 and the first panel 11 are assembled, the cleaning groove 121 is opened on the second panel 12.
[0036] Specifically, the width of the cleaning groove 121 is 10 mm - 30 mm, and the length of the cleaning groove 121 is less than or equal to 300 mm. In this way, the cleaning groove 121 can adapt to a variety of cleaning tools, and the cleaning groove 121 enables the cleaning agent or air flow to be evenly distributed to ensure the cleaning effect of the condenser 2.
[0037] In one embodiment, the length of the cleaning groove 121 is 300 mm, the width of the cleaning groove 121 is 20 mm, and the outer diameter of the high-pressure nozzle of the cleaning device is less than 20 mm, so that the cleaning device can be engaged with the cleaning groove 121.
[0038] Specifically, at least one rounded corner is arranged on the cleaning groove 121. By setting the rounded corner, the stress concentration degree at the edge of the cleaning groove 121 is reduced, thereby improving the durability and structural stability of the thermal management unit; it also reduces the processing difficulty of the cleaning part, improves production efficiency, and reduces manufacturing costs.
[0039] Specifically, in this embodiment, the edges of the cleaning groove 121 are all rounded, and the radius of the rounded corner is set to 1 mm - 3 mm.
[0040] In a possible implementation manner, a plurality of cleaning parts are arranged on the second panel 12, and the cleaning parts are cleaning through holes 122. In this way, the plurality of cleaning through holes 122 are distributed at different positions on the second panel 12, so that the cleaning tool can enter different areas of the condenser 2 from multiple angles and positions, improving the cleaning efficiency of the condenser 2. The plurality of cleaning through holes 122 can also reduce the noise leakage of the thermal management unit during operation.
[0041] Specifically, as Figure 4 shown, the plurality of cleaning through holes 122 are arranged on the side of the second panel 12 close to the first panel 11, the relative distances between the plurality of cleaning through holes 122 and the first panel 11 are the same, and the plurality of cleaning through holes 122 are evenly arranged on the second panel 12.
[0042] Specifically, the diameter of the cleaning through-hole 122 is 10 mm - 30 mm. In this way, the cleaning through-hole 122 can adapt to various types of cleaning devices, and also helps to maintain the thermal management performance of the housing 1, reduce the impact on the temperature regulation inside the condenser 2, and while ensuring the cleaning function, maintain the overall mechanical strength and durability of the housing 1.
[0043] Specifically, the cleaning through-hole 122 is set to be circular, and the apertures of the multiple cleaning through-holes 122 are the same.
[0044] In a possible implementation, the cleaning through-hole is rectangular; in a possible implementation, the cleaning through-hole is polygonal.
[0045] Furthermore, the cleaning part is arranged in the direction of the second panel 12 close to the first panel 11. In this way, the length of the cleaning path from the cleaning device to the condenser 2 is reduced, unnecessary gaps are reduced, and too many redundant channels are avoided in the inner cavity of the housing 1, facilitating the cleaning device to quickly reach the area to be cleaned, thereby improving the cleaning efficiency.
[0046] Specifically, the relative distance between the cleaning part and the first panel 11 is less than or equal to the relative distance between the cleaning part and the panel parallel to the first panel 11.
[0047] In an embodiment, the relative distance between the cleaning part and the first panel 11 is less than or equal to 30 mm.
[0048] In a possible implementation, the thermal management unit further includes a third panel, the third panel is arranged adjacent to the first panel 11, the third panel is arranged opposite to the second panel 12, and cleaning parts are arranged on both the third panel and the first panel 11. By arranging cleaning parts on both the first panel 11 and the third panel, the condenser 2 can be cleaned from multiple angles; the third panel being arranged opposite to the second panel 12 can effectively remove dust and dirt on the surface and surrounding area of the condenser 2, reducing the accumulation of dust and dirt inside the thermal management unit.
[0049] Specifically, the third panel is the lower bottom plate, that is, a first cleaning part is arranged on the upper top plate, and a second cleaning part is arranged on the lower bottom plate; during the cleaning process, the cleaning device can clean the condenser 2 through the first cleaning part and / or the second cleaning part, and the dust and dirt on the surface and surrounding area of the condenser 2 are discharged from the second cleaning part or the first cleaning part.
[0050] Furthermore, the thermal management unit further includes a baffle, and the baffle is elastically connected to the cleaning part. In this way, the elastically connected baffle can automatically cover the cleaning part when cleaning is not being carried out, preventing other foreign objects from entering the interior of the thermal management unit. This can keep the interior of the device clean and prevent the accumulation of debris from affecting the heat dissipation performance and operating efficiency of the device.
[0051] Specifically, under normal circumstances, the elastic mechanism keeps the baffle tightly against the cleaning part, and the baffle abuts against the cleaning part to form a seal; when cleaning is required, an external force is applied to push or pull the baffle, causing the elastic mechanism to compress or stretch, and the cleaning part communicates with the inner cavity of the housing 1; after cleaning, the elastic mechanism returns to its original state, and the baffle rebounds to the sealing position to be in sealing cooperation with the cleaning part.
[0052] In another embodiment, a hinge made of an elastic material is used to connect the baffle and the cleaning part, and this hinge allows the baffle to move flexibly within a certain range and can automatically reset after cleaning is completed.
[0053] Specifically, the area of the baffle is greater than or equal to the area of the cleaning part. In this way, the baffle can completely cover the cleaning part, ensuring that there is no gap between the baffle and the cleaning part. The baffle can not only prevent tiny particles from entering, but also resist external physical damage, further protecting components such as the cleaning part and the condenser 2.
[0054] Specifically, when the cleaning part is the cleaning tank 121, the length of the baffle is greater than the length of the cleaning part, and the width of the baffle is greater than the width of the cleaning part; when the cleaning part is the cleaning through-hole 122, the diameter of the baffle is greater than the diameter of the cleaning through-hole 122.
[0055] The cleaning process of the thermal management unit in the embodiments of the present application is introduced below in combination with specific application scenarios, as follows:
[0056] First, in the case where the condenser 2 needs to be cleaned, turn off the power of the thermal management unit, engage the cleaning device with the cleaning part and adjust the angle of the nozzle in the cleaning device;
[0057] After that, turn on the power of the cleaning device, and high-pressure gas or water reaches the area to be cleaned of the condenser 2 from the nozzle, and adjust the angle of the nozzle to clean different positions of the condenser 2;
[0058] Finally, turn off the power of the cleaning device and put away the cleaning device, sweep and collect the dust and dirt of the condenser 2, and turn on the power of the thermal management unit.
[0059] Through the above steps, the user can complete the cleaning process of the thermal management unit and improve the cleaning efficiency of the condenser 2.
[0060] The specific embodiments of the present application are introduced below based on the above technical solutions.
[0061] Embodiment 1
[0062] Please refer to Figures 1-3, embodiments of the present application provide a thermal management unit. The thermal management unit includes a condenser 2 and a housing 1. The condenser 2 is accommodated in the inner cavity of the housing 1. The housing 1 includes a first panel 11 and a second panel 12. The condenser 2 is arranged in the direction close to the first panel 11. The second panel 12 is adjacent to the first panel 11. At least one cleaning part is provided on the second panel 12. The cleaning part is used to cooperate with a cleaning device to communicate the cleaning device with the inner cavity of the housing 1.
[0063] The housing 1 of the thermal management unit includes a plurality of panels. The first panel 11 is located between the upper top plate and the lower bottom plate. Both the fan 3 and the condenser 2 are arranged on the side close to the first panel 11. The fan 3 is arranged on the side of the first panel 11 facing the outside world, and the condenser 2 is arranged on the side of the first panel 11 away from the outside world. The cleaning part is arranged in the direction of the second panel 12 close to the first panel 11.
[0064] One cleaning part is provided on the second panel 12. The cleaning part is a cleaning groove 121. The cleaning groove 121 is a rectangular groove. The second panel 12 is provided with cleaning grooves 121 with the same width. The width of the cleaning groove 121 is 20 mm, and the length of the cleaning groove 121 is equal to 300 mm. The edge of the cleaning groove 121 is provided with a fillet. The fillet radius is set to 3 mm.
[0065] Embodiment 2
[0066] The difference between Embodiment 2 and Embodiment 1 lies in the cleaning part. A plurality of cleaning parts are provided on the second panel 12. The cleaning parts are cleaning through holes 122. The plurality of cleaning through holes 122 are arranged on the side of the second panel 12 close to the first panel 11. The relative distances of the plurality of cleaning through holes 122 from the first panel 11 are the same. The plurality of cleaning through holes 122 are evenly distributed on the second panel 12.
[0067] The diameter of the cleaning through hole 122 is 10 mm - 30 mm. The cleaning through hole 122 is set to be circular, and the apertures of the plurality of cleaning through holes 122 are the same. The cleaning part is arranged in the direction of the second panel 12 close to the first panel 11. The relative distance between the cleaning part and the first panel 11 is less than or equal to 30 mm.
[0068] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A thermal management unit, characterized in that, The thermal management unit includes a condenser (2) and a housing (1), and the condenser (2) is accommodated in the inner cavity of the housing (1). The housing (1) includes a first panel (11) and a second panel (12). The condenser (2) is arranged in the direction close to the first panel (11). The second panel (12) is arranged adjacent to the first panel (11). At least one cleaning part is arranged on the second panel (12), and the cleaning part is used to cooperate with a cleaning device to communicate the cleaning device with the inner cavity of the housing (1).
2. The thermal management unit according to claim 1, characterized in that, One cleaning part is arranged on the second panel (12), and the cleaning part is a cleaning groove (121).
3. The thermal management unit according to claim 1, characterized in that, A plurality of cleaning parts are arranged on the second panel (12), and the cleaning parts are cleaning through holes (122).
4. The thermal management unit according to claim 2, wherein, The width of the cleaning groove (121) is 10 mm - 30 mm, and the length of the cleaning groove (121) is less than or equal to 300 mm.
5. The thermal management unit according to claim 3, characterized in that, The diameter of the cleaning through hole (122) is 10 mm - 30 mm.
6. The thermal management unit according to any one of claims 1 to 3, characterized in that, The cleaning part is arranged on the second panel (12) in the direction close to the first panel (11).
7. The thermal management unit according to any one of claims 1-3, characterized in that, The thermal management unit further includes a third panel. The third panel is arranged adjacent to the first panel (11), the third panel is arranged opposite to the second panel (12), and cleaning parts are arranged on both the third panel and the first panel (11).
8. The thermal management unit according to any one of claims 1-3, characterized in that, The thermal management unit further includes a baffle, and the baffle is elastically connected to the cleaning part.
9. The thermal management unit according to claim 8, characterized in that, The area of the baffle is greater than or equal to the area of the cleaning part.
10. The thermal management unit according to claim 2, characterized in that, At least one rounded corner is arranged on the cleaning groove (121).