Communicating type heat transfer device

Abstract

The utility model relates to a communication type heat transfer device, which belongs to the technical field of heat transfer devices, and comprises a uniform temperature plate, a plurality of first capillary structures and a plurality of second capillary structures, the uniform temperature plate comprises a heat conduction cavity and at least one first capillary structure, the side edge of the heat conduction cavity is provided with a bridging concave part, and the at least one first capillary structure is stacked in the heat conduction cavity and extends to the bridging concave part; the heat pipe comprises a heat pipe body and at least one second capillary structure, the heat pipe body is stacked on the at least one first capillary structure on the bridging concave part of the heat conduction cavity, the at least one second capillary structure is stacked in the heat pipe body, and the at least one second capillary structure is connected to the at least one first capillary structure; and one side of the bonding layer is connected to the first capillary structure in a metal key bonding manner. The utility model has the beneficial effects that the capillary structure of the heat pipe is communicated with the capillary structure of the vapor chamber, so that the purpose of integral heat transfer is achieved, and the heat dissipation effect of the vapor chamber and the heat pipe is fully exerted.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer devices, in particular to a connected heat transfer device. Background Art

[0002] Regarding heat transfer, in order to dissipate the heat generated by a heating element, existing heat transfer devices all use a heat conducting plate in combination with a heat pipe for heat transfer, and use a radiator for heat dissipation. The general description is as follows: The heat conducting plate contacts the heating element, and the heat pipe is connected between the heat conducting plate and the radiator, so as to first transfer the heat generated by the heating element to the heat conducting plate, and then the heat conducting plate transfers the heat to the radiator through the heat pipe for heat dissipation.

[0003] In the existing heat transfer device, the heat conducting plate and the heat pipe operate independently. The capillary structure of the heat conducting plate is not connected to the capillary structure of the heat pipe. As a result, for the heat conducting plate or the heat pipe individually, only the heat conducting plate and the heat pipe transfer heat individually, rather than in an integral manner. In other words, the heat dissipation effect has not been fully exerted, and it is difficult to effectively increase the return speed of the liquid working fluid. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a connected heat transfer device, so that the capillary structure of the heat pipe can be connected to the capillary structure of the heat spreader, thereby achieving the purpose of integral heat transfer and fully exerting the heat dissipation effect that the heat spreader plus the heat pipe should have.

[0005] The purpose of the utility model can be realized by the following technical solutions:

[0006] The connected heat transfer device includes:

[0007] A heat spreader, including a heat conducting cavity and at least one first capillary structure. A bridging recess is provided on the side of the heat conducting cavity, and the at least one first capillary structure is stacked in the heat conducting cavity and extends to the bridging recess;

[0008] A heat pipe, including a heat pipe body and at least one second capillary structure. The heat pipe body is stacked on the at least one first capillary structure in the bridging recess of the heat conducting cavity, the at least one second capillary structure is stacked in the heat pipe body, and the at least one second capillary structure is connected to the at least one first capillary structure;

[0009] The connected heat transfer device further includes a bonding layer. One side of the bonding layer is bonded to the first capillary structure by metal bonding, and the other side of the bonding layer is bonded to the second capillary structure by metal bonding.

[0010] Furthermore, the bonding layer is a pre-sintered powder corner.

[0011] Further, the at least one capillary structure is stacked on the bridging recess and has a groove, the heat pipe body of the heat pipe is located in the groove, and the at least one second capillary structure is connected to the at least one first capillary structure through the bonding layer.

[0012] Further, the heat pipe body of the heat pipe has an upper notch, and the upper notch is located on a side of the heat pipe body away from the at least one first capillary structure.

[0013] Further, the heat pipe body of the heat pipe has a lower notch, and the lower notch is located on a side of the heat pipe body close to the at least one first capillary structure.

[0014] Further, the first capillary structure is selected from: microgrooves, metal meshes, powder sintered bodies, ceramic sintered bodies, or any combination of any two or more of the foregoing.

[0015] Further, the second capillary structure is selected from: microgrooves, metal meshes, powder sintered bodies, ceramic sintered bodies, or any combination of any two or more of the foregoing.

[0016] Further, the long axis of the heat pipe is perpendicular to a bearing surface of the bridging recess.

[0017] Further, the heat conduction cavity includes a base and a cover plate. The base has a base portion and a surrounding portion. The surrounding portion is connected around the base portion, and the bridging recess is located in the surrounding portion. The cover plate is installed on the surrounding portion of the base to form a cavity between the base and the cover plate.

[0018] Further, there are a plurality of support structures on the base, and the plurality of support structures are connected in a limiting manner with the through holes on the at least one capillary structure.

[0019] Further, the base and the cover plate are of a combined structure or an integrally formed structure.

[0020] Further, the cover plate has a stamping recess, and the heat pipe is clamped between the stamping recess and the bridging recess.

[0021] The beneficial effects of the present utility model are as follows:

[0022] In addition to the first capillary structure and the second capillary structure being connected by metal bonding through the bonding layer, the heat pipe body is in thermal contact with the first capillary structure. Therefore, in addition to enabling the first capillary structure and the second capillary structure to form an integral heat transfer to increase the speed of transferring the fluid from the second capillary structure to the first capillary structure, another heat conduction path can be formed between the heat pipe body and the first capillary structure, thereby improving the heat dissipation efficiency of the communication type heat transfer device and the reflux speed of the liquid working fluid. Description of the Drawings

[0023] The present utility model will be further described below in conjunction with the accompanying drawings;

[0024] Figure 1 It is an exploded schematic view of the connected heat transfer device according to the first embodiment of the present utility model;

[0025] Figure 2 It is Figure 1 a partial cross-sectional schematic view of

[0026] Figure 3 It is a three-dimensional schematic view of the connected heat transfer device according to the second embodiment of the present utility model;

[0027] Figure 4 It is Figure 3 a partial exploded schematic view of

[0028] Figure 5 It is Figure 3 a partial cross-sectional schematic view of

[0029] Figure 6 It is Figure 3 a cross-sectional schematic view of the manufacturing method of the connected heat transfer device Figure 1 ;

[0030] Figure 7 It is Figure 3 a cross-sectional schematic view of the manufacturing method of the connected heat transfer device Figure 2 ;

[0031] Figure 8 It is Figure 3 a cross-sectional schematic view of the manufacturing method of the connected heat transfer device Figure 3 ;

[0032] Figure 9 It is a partial cross-sectional schematic view of the connected heat transfer device according to the third embodiment of the present utility model;

[0033] Figure 10 It is a partial exploded schematic view of the connected heat transfer device according to the fourth embodiment of the present utility model;

[0034] Figure 11 It is Figure 10 a partial cross-sectional schematic view of Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0036] Embodiment 1

[0037] Refer to the attached specification Figure 1 - Figure 2 as shown Figure 1 is an exploded view of the connected heat transfer device according to the first embodiment of the present utility model. Figure 2 is Figure 1 a partial cross-sectional view. The heat pipe 200 is placed horizontally, and the second capillary structure 220 is connected to the first capillary structure 120 by means of powder sintering, but not limited thereto.

[0038] The connected heat transfer device 10 of this embodiment includes a vapor chamber 100 and a heat pipe 200. The vapor chamber 100 includes a heat conducting cavity 110 and a first capillary structure 120. Specifically, the heat conducting cavity 110 includes a base 111 and a cover plate 112. The base 111 has a base portion 1111, a peripheral portion 1112 and a bridging recess 1113. The peripheral portion 1112 is connected around the base portion 1111 to make the base portion 1111 and the peripheral portion 1112 surround a recessed space S. The bridging recess 1113 is located in the peripheral portion 1112. The bridging recess 1113 is the part of the peripheral portion 1112 that is recessed downward. The bridging recess 1113 has a bearing surface 1114. The cover plate 112 is installed on the peripheral portion 1112 of the base 111 to form a chamber between the base 111 and the cover plate 112. The chamber is used to accommodate the working fluid. In this embodiment, the base 111 and the cover plate 112 are of a combined structure, but not limited thereto. In other embodiments, the base 111 and the cover plate 112 may also be of an integrally formed structure.

[0039] The first capillary structure 120 is stacked on the side of the base portion 1111 of the base 111 facing the cover plate 112 and has an extension portion 121. The extension portion 121 is stacked on the bearing surface 1114 of the bridging recess 1113 and has a groove 1211. The first capillary structure 120 is, for example, a ceramic sintered body, but not limited thereto. In other embodiments, the first capillary structure 120 may also be selected from: micro-grooves, metal meshes, powder sintered bodies, ceramic sintered bodies or any combination of any two or more of the foregoing. For example, the first capillary structure 120 may be a composite body of a ceramic powder sintered body and micro-grooves. In addition, in this embodiment, the vapor chamber 100 only has the first capillary structure 120 stacked on the base 111, but not limited thereto. In other embodiments, the vapor chamber 100 may include another capillary structure. The other capillary structure is stacked on the side of the cover plate 112 facing the base 111.

[0040] The heat pipe 200 includes a heat pipe body 210 and a second capillary structure 220. The material of the heat pipe body 210 is, for example, a heat-conducting metal such as gold, silver, copper, or aluminum, and is stacked on the first capillary structure 120 on the bridging recess 1113 of the heat-conducting cavity 110. The long axis of the heat pipe body 210 of the heat pipe 200 is perpendicular to the bearing surface 1114 and is located in the groove 1211. That is to say, the heat pipe 200 is placed upright. The upright heat pipe 200 can reduce the flow resistance to improve the heat dissipation efficiency.

[0041] In this embodiment, the second capillary structure 220 is stacked on the bottom of the heat pipe body 210. That is to say, the second capillary structure 220 is only offset to one side of the heat pipe body 210, but it is not limited thereto. In other embodiments, the second capillary structure 220 can also be formed in a surrounding manner within the heat pipe body 210.

[0042] The second capillary structure 220 of this embodiment is, for example, a powder sintered body, but it is not limited thereto. In other embodiments, the second capillary structure 220 can also be selected from: micro-grooves, metal meshes, powder sintered bodies, ceramic sintered bodies, or any combination of any two or more of the foregoing. For example, the second capillary structure 220 can be a composite body of a powder sintered body and a metal mesh.

[0043] The connected heat transfer device 10 further includes a bonding layer 300, and the bonding layer 300 is a pre-sintered powder corner and is stacked on the second capillary structure 220. The second capillary structure 220 is connected to the extension 121 of the first capillary structure 120 in a manner of metal bonding through the pre-sintered bonding layer 300. Specifically, the material of the bonding layer 300 is a pre-sintered powder block of gold, silver, copper, or iron and has a porous structure. And one side of the bonding layer 300 is pre-connected to the second capillary structure 220 in a manner of metal bonding, and the other side of the bonding layer 300 is then connected to the extension 121 of the first capillary structure 120 in a manner of metal bonding.

[0044] In addition, there are a number of support structures 1115 on the base 111, and the number of support structures 1115 is limit-connected to the through holes 122 on the first capillary structure 120. Specifically, the base 111 more preferably has a plurality of support structures 1115. The support structures 1115 are, for example, support columns and protrude from the base 1111 of the base 111. The first capillary structure 120 has a plurality of through holes 122. The first capillary structure 120 is located in the chamber, and these support structures 1115 respectively pass through these through holes 122 and support the cover plate 112, so as to prevent the heat pipe 100 from deforming during vacuum pumping.

[0045] In this embodiment, in addition to the first capillary structure 120 and the second capillary structure 220 being connected by metal bonding through the bonding layer 300, the heat pipe body 210 is in thermal contact with the first capillary structure 120. Therefore, in addition to enabling the first capillary structure 120 and the second capillary structure 220 to form an integral heat transfer to enhance the speed of transferring the fluid from the second capillary structure 220 to the first capillary structure 120, another heat conduction path can be formed between the heat pipe body 210 and the first capillary structure 120, thereby enhancing the heat dissipation efficiency of the connected heat transfer device and the return speed of the liquid working fluid.

[0046] Embodiment 2

[0047] Please refer to the attached Figure 3 - Figure 5 , Figure 3 is a three-dimensional schematic diagram of the connected heat transfer device according to the second embodiment of the present invention. Figure 4 is Figure 3 a partial exploded schematic diagram of Figure 5 is Figure 3 a partial cross-sectional schematic diagram of

[0048] The connected heat transfer device 10A of this embodiment includes a vapor chamber 100A and a heat pipe 200A. The vapor chamber 100A includes a heat conduction cavity 110A and a first capillary structure 120A. Specifically, the heat conduction cavity 110A includes a base 111A and a cover plate 112A. The base 111A has a base portion 1111A, a surrounding portion 1112A, and a bridging recess 1113A. The surrounding portion 1112A is connected around the base portion 1111A so that the base portion 1111A and the surrounding portion 1112A surround a recessed space S. The bridging recess 1113A is located in the surrounding portion 1112A. The bridging recess 1113A is the portion of the surrounding portion 1112A that is recessed downward. The bridging recess 1113A has a bearing surface 1114A. The cover plate 112A is installed on the surrounding portion 1112A of the base 111A to form a chamber (not shown) between the base 111A and the cover plate 112A. The chamber is used to accommodate the working fluid (not shown). In this embodiment, the base 111A and the cover plate 112A are of a combined structure, but this is not limiting. In other embodiments, the base 111A and the cover plate 112A may also be of an integrally formed structure.

[0049] The first capillary structure 120A is stacked on the side of the base 111A of the base 111A facing the cover plate 112A and has an extension portion 121A. The extension portion 121A of the first capillary structure 120A is stacked on the bearing surface 1114A of the bridging recess 1113A. The first capillary structure 120A is, for example, a ceramic sintered body, but is not limited thereto. In other embodiments, the first capillary structure 120A may also be selected from: microgrooves, metal meshes, powder sintered bodies, ceramic sintered bodies, or any combination of any two or more of the foregoing. For example, the first capillary structure 120A may be a composite body of a ceramic powder sintered body and microgrooves. In addition, in this embodiment, the heat pipe 100A only has the first capillary structure 120A stacked on the base 111A, but is not limited thereto. In other embodiments, the heat pipe 100A may include another capillary structure. The other capillary structure is stacked on the side of the cover plate 112A facing the base 111A.

[0050] The cover plate 112A has a stamping recess 1121A corresponding to the bridging recess 1113A of the base 111A. The stamping recess 1121A is formed, for example, through a stamping process and is used to fix the heat pipe 200A to the heat conduction cavity 110A.

[0051] The heat pipe 200A includes a heat pipe body 210A and a second capillary structure 220A. The material of the heat pipe body 210 is, for example, a heat conductive metal such as gold, silver, copper, aluminum, etc., and is stacked on the first capillary structure 120A on the bridging recess 1113A of the heat conduction cavity 110A. The heat pipe body 210A has an upper notch 211A. The second capillary structure 220A is stacked in the heat pipe body 210A and is at least partially distributed within the range exposed by the upper notch 211A, so that at least part of the second capillary structure 220A can be exposed to the upper notch 211A of the heat pipe body 210A.

[0052] In this embodiment, the second capillary structure 220A is stacked on the bottom of the heat pipe body 210A. That is to say, the second capillary structure 220A is only offset to one side of the heat pipe body 210A, but is not limited thereto. In other embodiments, the second capillary structure may also be formed in a surrounding manner within the heat pipe body 210A.

[0053] The second capillary structure 220A of this embodiment is, for example, a powder sintered body, but is not limited thereto. In other embodiments, the second capillary structure 220A may also be selected from: microgrooves, metal meshes, powder sintered bodies, ceramic sintered bodies, or any combination of any two or more of the foregoing. For example, the second capillary structure 220A may be a composite body of a powder sintered body and a metal mesh.

[0054] The second capillary structure 220A is connected to the extension portion 121A of the first capillary structure 120A in a manner of metallic bonding. Specifically, the connected heat transfer device 10A further includes a bonding layer 300A. The material of the bonding layer �00A is powder of gold, silver, copper or iron, and the bonding layer 300A is formed into a porous structure by sintering or other means. One side of the bonding layer 300A is connected to the extension portion 121A of the first capillary structure 120A in a manner of metallic bonding, and the other side of the bonding layer 300A is connected to the second capillary structure 220A in a manner of metallic bonding.

[0055] In addition, the base 111A further has, for example, a plurality of support structures 1115A. The support structures 1115A are, for example, support columns and protrude from the base portion 1111A of the base 111A. The first capillary structure 120A has a plurality of through holes 122A. The first capillary structure 120A is located in the chamber, and these support structures 1115A respectively pass through these through holes 122A and support the cover plate 112A, so as to prevent the heat pipe 100A from deforming during evacuation. <

[0056] In this embodiment, in addition to the first capillary structure 120A and the second capillary structure 220A being connected in a manner of metallic bonding through the bonding layer 300A, the heat pipe body 210A is further in thermal contact with the first capillary structure 120A. Therefore, in addition to enabling the first capillary structure 120A and the second capillary structure 220A to form an integral heat transfer to improve the speed of transferring the fluid from the second capillary structure 220A to the first capillary structure 120A, another heat conduction path can be formed between the heat pipe body 210A and the first capillary structure 120A, thereby improving the heat dissipation efficiency of the connected heat transfer device and the return speed of the liquid working fluid.

[0057] Refer to the attached Figure 6 - Figure 8 , Figure 6 - Figure 8 for Figure 3 a schematic cross-sectional view of the manufacturing method of the connected heat transfer device 10A. As Figure 6 shown, the heat pipe body 210A of the heat pipe 200A is stacked on the extension portion 121A of the first capillary structure 120A. Then, as Figure 7 shown, a metal powder 300' is covered on a partial extension portion 121A of the first capillary structure 120A and a partial second capillary structure 220A. Then, as Figure 8 shown, a sintering process is performed to solidify the metal powder into a bonding layer 300A, which is connected to the first capillary structure 120A and the second capillary structure 220A respectively in a manner of metallic bonding. In the above embodiment, the second capillary structure 220 of the heat pipe 200 is connected to the first capillary structure 120 through a pre-sintered powder corner.

[0058] Embodiment 3

[0059] Refer to the attached specification Figure 9 , Figure 9 which is a partial cross-sectional view of the connected heat transfer device according to the third embodiment of the present utility model. Since the connected heat transfer device of this embodiment is similar to the connected heat transfer device of the above-mentioned first embodiment, the following only describes the differences, and the same parts are described in detail in the first embodiment, such as Figure 9 the presented base 1111B, support structure 1115B, first capillary structure 120B, extension 121B, and perforation 122B.

[0060] In this embodiment, the extension 121B of the first capillary structure 120B is stacked on the bearing surface 1114B of the bridging recess 1113B and has a groove 1211B. The long axis of the heat pipe body 210B of the heat pipe 200B is perpendicular to the bearing surface 1114B and is located in the groove 1211B. The second capillary structure 220B is, for example, a mesh capillary or a fibrous capillary and extends outside the heat pipe body 210B. The second capillary structure 220B is directly bonded to the first capillary structure 120B, for example, by sintering or spot welding. In addition, the second capillary structure 220B can be directly connected to the first capillary structure 120B, or can be additionally connected to the first capillary structure 120B through a bonding layer as in the above embodiment.

[0061] Embodiment 4

[0062] Refer to the attached specification Figure 10 and Figure 11 , Figure 10 which is a partial exploded view of the connected heat transfer device according to the embodiment of the present utility model, Figure 11 and Figure 10 is a partial cross-sectional view of

[0063] Since the connected heat transfer device of this embodiment is similar to the connected heat transfer device in the first embodiment of the above-mentioned embodiment, the following only describes the differences, and the same parts are described in detail in the first embodiment, such as Figure 10 and Figure 11 the presented base 111C, base 1111C, surrounding part 1112C, bridging recess 1113C, bearing surface 1114C, support structure 1115C, first capillary structure 120C, extension 121C, and perforation 122C.

[0064] In this embodiment, the extension portion 121C of the first capillary structure 120C is stacked on the bearing surface 1114C of the bridging recess 1113C. The heat pipe body 210C has a lower notch 211C to expose a part of the second capillary structure 220C. The heat pipe body 210C of the heat pipe 200C is stacked on the bearing surface 1114C so that a part of the second capillary structure 220C faces the extension portion 121C of the first capillary structure 120C. The second capillary structure 220C is connected to the first capillary structure 120C through a bonding layer 300C, for example, but not limited thereto. In other embodiments, if the extension portion has a groove, the second capillary structure 220C can also be directly connected to the first capillary structure 120C.

[0065] For the connected heat transfer device according to the above embodiment, in addition to the first capillary structure 120C and the second capillary structure 220C being connected through a bonding layer in a metal bonding manner, the heat pipe body is in thermal contact with the first capillary structure 120C. Therefore, in addition to enabling the first capillary structure 120C and the second capillary structure 220C to form an integral heat transfer to increase the speed of transferring the fluid from the second capillary structure 220C to the first capillary structure 120C, another heat conduction path can be formed between the heat pipe body 210C and the first capillary structure 120C, thereby improving the heat dissipation efficiency of the connected heat transfer device and the reflux speed of the liquid working fluid.

[0066] In addition, compared with the situation where the first capillary structure 120C simply abuts against the second capillary structure 220C, since the first capillary structure 120C and the second capillary structure 220C that simply abut are not substantially connected together, the fluid will have an adhesion force to the second capillary structure 220C greater than the gravity, resulting in the first capillary structure 120C and the second capillary structure 220C operating independently, causing the fluid to be adsorbed inside the second capillary structure 220C and generating a transfer hysteresis phenomenon. The first capillary structure 120C and the second capillary structure 220C in this embodiment are connected through a metal bonding manner, which improves the defect that the first capillary structure 120C and the second capillary structure 220C simply abut but are not substantially connected, so the fluid transfer speed between the first capillary structure 120C and the second capillary structure 220C can be increased, and further the heat dissipation efficiency of the connected heat transfer device and the reflux speed of the liquid working fluid can be improved.

[0067] In addition, in some embodiments, the heat pipe is placed upright to reduce the flow resistance, so as to further improve the heat dissipation performance.

[0068] The above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

[0069] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to only the specific implementation manners. Obviously, according to the content of this specification, many modifications and variations can be made. These embodiments are selected and specifically described in this specification in order to better explain the principle and practical application of the present utility model, so that those skilled in the art can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A connected heat transfer device, characterized in that, Comprising: A heat pipe, including a heat conduction cavity and at least one first capillary structure. A bridging recess is provided on the side of the heat conduction cavity, and the at least one first capillary structure is stacked in the heat conduction cavity and extends to the bridging recess; A heat pipe, including a heat pipe body and at least one second capillary structure. The heat pipe body is stacked on the at least one first capillary structure on the bridging recess of the heat conduction cavity, the at least one second capillary structure is stacked in the heat pipe body, and the at least one second capillary structure is connected to the at least one first capillary structure; The connected heat transfer device further includes a bonding layer. One side of the bonding layer is connected to the first capillary structure in a way of metal bonding, and the other side of the bonding layer is connected to the second capillary structure in a way of metal bonding.

2. The connected heat transfer device according to claim 1, characterized in that The bonding layer is a pre-sintered powder corner.

3. The connected heat transfer device according to claim 2, wherein The at least one capillary structure is stacked on the bridging recess and has a groove. The heat pipe body of the heat pipe is located in the groove, and the at least one second capillary structure is connected to the at least one first capillary structure through the bonding layer.

4. The connected heat transfer device according to claim 1, wherein The heat pipe body of the heat pipe has an upper notch, and the upper notch is located on the side of the heat pipe body away from the at least one first capillary structure.

5. The connected heat transfer device according to claim 1, wherein, The heat pipe body of the heat pipe has a lower notch, and the lower notch is located on the side of the heat pipe body close to the at least one first capillary structure.

6. The connected heat transfer device according to claim 1, wherein The first capillary structure is selected from: microgrooves, metal mesh, powder sintered body, ceramic sintered body or any combination of any two or more of the foregoing.

7. The connected heat transfer device according to claim 1, characterized in that The second capillary structure is selected from: microgrooves, metal mesh, powder sintered body, ceramic sintered body or any combination of any two or more of the foregoing.

8. The connected heat transfer device according to claim 1, characterized in that The long axis of the heat pipe is perpendicular to a bearing surface of the bridging recess.

9. The connected heat transfer device according to claim 1, wherein The heat conduction cavity includes a base and a cover plate. The base has a base portion and a surrounding portion. The surrounding portion is connected around the base portion, and the bridging recess is located in the surrounding portion. The cover plate is installed on the surrounding portion of the base to form a cavity between the base and the cover plate.

10. The connected heat transfer device according to claim 9, characterized in that, A plurality of support structures are provided on the base, and the plurality of support structures are connected to the through holes on the at least one capillary structure in a limiting manner.

11. The connected heat transfer device according to claim 9, characterized in that, The base and the cover plate are of a combined structure or an integrally formed structure.

12. The connected heat transfer device according to claim 9, wherein, The cover plate has a stamping recess, and the heat pipe is clamped between the stamping recess and the bridging recess.

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