Electronic device
By designing a combined structure of grooves and covers on the carrier, guiding the connecting material layer and setting the grooves and barriers, the problem of UV glue overflow interference is solved, and the yield of fiber alignment and the efficiency of optical packaging is improved.
Patent Information
- Application Number
- CN202422359110.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-26
AI Technical Summary
In the prior art, the UV glue overflow interference during the optical fiber alignment process due to the shrinkage of the groove distance, which affects the smoothness of the optical fiber insertion into the second part of the groove and reduces the yield of the electronic device.
The designed carrier has a first and a second set of grooves, respectively, and accommodating the optical fibers, and a slope is formed with the carrier through the first and second covers, guiding the connecting material layer to the receiving space, and trenches and barriers are provided to block overflow, ensuring smooth fixation and docking of the optical fibers.
The yield of fiber alignment is improved, UV glue overflow interference is avoided, the connection strength between the optical fiber and the optical channel is enhanced, the process is simplified and the yield of optical passive packaging is improved.
Smart Images
Figure CN223180446U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an electronic device. Background Art
[0002] In an optical component, the preliminary alignment (PA) process often uses grooves as alignment aids to assist the alignment of an optical fiber. The prior art uses a way of digging holes to assist in bubble evacuation. For an embodiment in which a PIC chip has multiple FAU slots for assembly, due to the limitation of chip miniaturization, the distance between two sets of grooves is getting smaller and smaller, so special designs are needed to avoid interference between the two sets of grooves after dispensing glue.
[0003] Figures 1 to 5 The formation process of an optical component in the prior art is shown.
[0004] Figure 1 It shows that the optical fiber of the fiber array unit (FAU) 1 is preliminarily aligned in the first part of the grooves 3 of the photonic integrated circuit (PIC) 2, and a multi-fiber ferrule 8 is arranged at the lower end of the FAU 1.
[0005] Figure 2 It shows that UV (ultraviolet) glue 4 is dispensed in the grooves 3.
[0006] Figure 3 It shows that the optical fiber of the FAU 1 is inserted into the first part of the grooves 3.
[0007] Figure 4 It shows that a lid 5 is pressed on the UV glue 4, and at this time, the excess UV glue 4 overflows from between the lid 5 and the PIC 2 and even overflows into the second part of the grooves 6.
[0008] Figure 5 It shows that the UV glue 4 is cured using a UV lamp 7, and then when docking in the second part of the grooves 6, the residual glue will cause the optical fiber to be unable to be smoothly inserted into the second part of the grooves (slots) 6. Summary of the Utility Model
[0009] Aiming at the problems existing in the related art, the purpose of the utility model is to provide an electronic device to at least improve the yield of the electronic device.
[0010] To achieve the above object, the present utility model provides an electronic device, comprising: a carrier having a first set of grooves; a first set of optical fibers received in the first set of grooves; a first cover covering the first set of optical fibers and the first set of grooves, the first cover having an inclined surface that together with the carrier defines a receiving space; and a first connection material layer for fixing the first set of optical fibers to the first set of grooves, the inclined surface of the first cover being used to guide the first connection material layer into the receiving space.
[0011] In some embodiments, the electronic device further comprises: a second set of optical fibers, the carrier having a second set of grooves beside the first set of grooves, the second set of optical fibers being received in the second set of grooves; a second cover covering the second set of grooves, the second cover being spaced apart from the first cover.
[0012] In some embodiments, the electronic device further comprises: a second connection material layer for fixing the second set of optical fibers to the second set of grooves.
[0013] In some embodiments, the first connection material layer is spaced apart from the second set of grooves, and the second connection material layer is spaced apart from the first set of grooves.
[0014] In some embodiments, the first cover has a first groove for spacing the receiving space, the first groove being used to prevent the first connection material layer from overflowing into the second set of grooves.
[0015] In some embodiments, the first groove is located in the peripheral area of the first cover.
[0016] In some embodiments, the first cover has a first blocking member extending towards the carrier, the first blocking member being used to prevent the first connection material layer from overflowing into the second set of grooves.
[0017] In some embodiments, the surface of the first cover facing the carrier has a second groove, the extending direction of the second groove being perpendicular to the extending direction of the first set of grooves, the second groove receiving the first connection material layer.
[0018] In some embodiments, the first blocking member is located at the end of the second groove.
[0019] In some embodiments, the carrier has a third groove located between the first set of grooves and the second set of grooves, the third groove being used to receive the first connection material.
[0020] In some embodiments, the carrier has a plurality of third grooves located between the first set of grooves and the second set of grooves for preventing the first connection material layer from overflowing into the second set of grooves.
[0021] In some embodiments, the carrier has a third blocking member at least partially located between the first set of grooves and the second set of grooves, the third blocking member being used to prevent the first connection material layer from overflowing into the second set of grooves.
[0022] In some embodiments, the third barrier surrounds the first set of grooves.
[0023] In some embodiments, the third barrier has an opening for the first set of optical fibers to pass through.
[0024] In some embodiments, the carrier is a photonic integrated circuit and has an optical channel for coupling with the first set of optical fibers.
[0025] In some embodiments, the first set of grooves has a V-shaped cross-section.
[0026] In some embodiments, the first set of optical fibers forms an optical fiber array.
[0027] An electronic device includes: a carrier having adjacent first and second sets of grooves; a first set of optical fibers and a second set of optical fibers respectively received in the first and second sets of grooves; a first cover and a second cover, the first cover covering the first set of optical fibers and the first set of grooves, the second cover covering the second set of optical fibers and the second set of grooves, the first cover having an inclined surface that defines a receiving space together with the carrier; and a first connecting material layer and a second connecting material layer, the first connecting material layer for fixing the first set of optical fibers to the first set of grooves, the second connecting material layer for fixing the second set of optical fibers to the second set of grooves, and the inclined surface of the first cover for guiding the first connecting material layer into the receiving space.
[0028] In some embodiments, a plurality of optical fibers in the first set of optical fibers correspond one-to-one with a plurality of grooves in the first set of grooves, and a plurality of optical fibers in the second set of optical fibers correspond one-to-one with a plurality of grooves in the second set of grooves.
[0029] In some embodiments, the first connecting material layer and the second connecting material layer are separated.
[0030] The beneficial technical effects of the present utility model are as follows:
[0031] Embodiments of the present application provide an additional receiving space for the first connecting material layer, or provide a blocking structure (groove or barrier / wall) to facilitate the installation of the FAU. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. It should be noted that, according to the standard practice of the industry, the components are not drawn to scale and are only for illustrative purposes. In fact, for the sake of clarity in discussion, the sizes of the components can be increased or decreased arbitrarily.
[0033] Figure 1 It shows the pre - alignment of the optical fibers of the fiber array unit.
[0034] Figure 2 It shows the application of dot UV glue.
[0035] Figure 3 It shows the insertion of the optical fibers of the FAU into the first - part grooves.
[0036] Figure 4 It shows the pressing of the cover onto the UV glue.
[0037] Figure 5 It shows the curing of the UV glue using a UV lamp.
[0038] Figure 6 It shows a top view of the intermediate formation step of the electronic device according to the first embodiment of the present application.
[0039] Figure 7 It shows the first cover according to the first embodiment of the present application.
[0040] Figure 8 It shows a front view of the cooperation of the carrier, the first / second groups of optical fibers, and the first / second covers in the first embodiment.
[0041] Figure 9 It shows a top view of the intermediate formation step of the electronic device according to the second embodiment of the present application.
[0042] Figure 10 It shows the first cover according to the second embodiment of the present application.
[0043] Figure 11 It shows a front view of the cooperation of the carrier, the first / second groups of optical fibers, and the first / second covers in the first embodiment.
[0044] Figure 12 It shows a top view of the intermediate formation step of the electronic device according to the third embodiment of the present application.
[0045] Figure 13 It shows an embodiment in which the cross - section of the third groove is V - shaped.
[0046] Figure 14 It shows an embodiment in which the cross - section of the third groove is U - shaped / rectangular.
[0047] Figure 15 It shows an embodiment in which the cross - section of the third groove is diamond - shaped.
[0048] Figure 16 It shows an embodiment including two third grooves.
[0049] Figure 17 It shows an embodiment including three third grooves.
[0050] Figure 18 An embodiment including two pairs of third grooves is shown.
[0051] Figure 19 A perspective view of a carrier board according to the fourth embodiment of the present application is shown.
[0052] Figure 20 A perspective view of a third barrier according to the fourth embodiment is shown.
[0053] Figure 21 It shows that the facing side walls of the third barrier and the fourth barrier are combined together.
[0054] Figure 22 A perspective view of an electronic device according to an embodiment of the present application is shown.
[0055] Figure 23 It shows along Figure 22 The cross-sectional view according to the fifth embodiment of the present application taken along line AA is shown.
[0056] Figure 24 The first cover according to the sixth embodiment of the present application is shown.
[0057] Figure 25 It shows that the FAU includes both the first group of optical fibers and the second group of optical fibers.
[0058] Figure 26 It shows the formation of the first connection material layer 51 and the second connection material layer.
[0059] Figure 27 It shows inserting the optical fiber into the groove.
[0060] Figure 28 It shows the formation of the first cover.
[0061] Figure 29 It shows curing the first connection material layer and the second connection material layer.
[0062] Figure 30 An electronic device according to the seventh embodiment of the present application is shown. Detailed implementation manners
[0063] To better understand the spirit of the embodiments of the present application, the following further describes it in combination with some preferred embodiments of the present application.
[0064] Embodiments of the present application will be described in detail hereinafter. Throughout the specification of the present application, components that are the same or similar and components having the same or similar functions are denoted by like reference numerals. The embodiments of the drawings described herein are illustrative and diagrammatic and are provided to provide a basic understanding of the present application. The embodiments of the present application should not be construed as limiting the present application.
[0065] As used herein, the terms "substantially", "essentially", "substantially" and "about" are used to describe and account for minor variations. When used in conjunction with an event or circumstance, such terms can refer to instances where the event or circumstance occurs exactly and instances where the event or circumstance occurs very nearly.
[0066] In this specification, unless specifically specified or limited otherwise, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivatives (such as "horizontally", "downwardly", "upwardly", etc.) should be construed as referring to the directions described in the discussion or depicted in the drawings. These relative terms are for convenience of description only and do not require the present application to be constructed or operated in a particular direction.
[0067] For convenience of description, "first", "second", "third", etc. may be used herein to distinguish different components of one figure or a series of figures. "First", "second", "third", etc. are not intended to describe corresponding components.
[0068] Figure 6 A top view showing an intermediate forming step of an electronic device 100 according to a first embodiment of the present application, Figure 7 A front view showing a first cover 41 according to a first embodiment of the present application, Figure 8The front view of the cooperation of the carrier 10, the first / second groups of optical fibers 31 / 32, and the first / second covers 41 / 42 in the first embodiment is shown. The second cover 42 is spaced apart from the first cover 41. The first cover 41 and the second cover 42 respectively have a first stopper 71 and a second stopper 72 extending towards the carrier 10 as mechanical stoppers at their facing ends. During fabrication, first, the first group of optical fibers 31 is pre-aligned (Preliminary Align, PA) with the first group of grooves 21, then the first connection material layer 51 is dotted, the first group of optical fibers 31 is inserted into the first group of grooves 21 to dock with the carrier 10, the first cover 41 is pressed onto the first connection material layer 51, and then the first connection material layer 51 is cured. Next, the second group of optical fibers 32 is pre-aligned with the second group of grooves 22, then the second connection material layer 52 is dotted, the second group of optical fibers 32 is inserted into the second group of grooves 22 to dock with the carrier 10, the second cover 42 is pressed onto the second connection material layer 52, and then the second connection material layer 52 is cured. Due to the lateral blocking of the first stopper 71, the excess first connection material layer 51 will not overflow into the second group of grooves 22 to cause contamination, thereby restricting the flow direction of the first connection material layer 51. The second connection material layer 52 is used to fix the second group of optical fibers 32 in the second group of grooves 22. The first connection material layer 51 is separated from the second group of grooves 22, and the second connection material layer 52 is separated from the first group of grooves 21. Since the overflow of the second connection material 52 will not interfere with the docking of the carrier 10 and the first group of optical fibers 31 when operating the second group of optical fibers 32 and the second group of grooves 22, the second stopper 72 is optional. The first group of optical fibers 31 forms an optical fiber array and is part of the optical fiber array unit (FAU) 81. The FAU 81 further includes a multi-fiber ferrule (MT ferrule) 810 at the lower end. The MT-Ferrule 810 is used to connect the multiple optical channels outside the electronic device 100 to the first group of optical fibers 31 to achieve the coupling and transmission of optical signals between the two.
[0069] Figure 9 The top view of the intermediate forming step of the electronic device 100 according to the second embodiment of the present application is shown, Figure 10 The front view of the first cover 41 according to the second embodiment of the present application is shown, Figure 11The front view of the cooperation of the carrier 10, the first / second groups of optical fibers 31 / 32, and the first / second covers 41 / 42 in the first embodiment is shown. The first cover 41 has first grooves 61 extending in the extending direction of the first group of grooves 21 on the left and right sides (peripheral regions). The first grooves 61 are used to space the accommodation space of the first connection material layer 51. After forming the first connection material layer 51 and inserting the first group of optical fibers 31 into the first group of grooves 21 one by one, the first cover 41 is pressed on the first connection material layer 51. Since the first cover 41 includes the first grooves 61, it can accommodate the excess first connection material layer 51 that overflows laterally, avoiding or reducing the overflow of the first connection material layer 51 into the second group of grooves 22 to limit the flow direction of the first connection material layer 51. Figure 10 The first groove 61 on the right side of the shown first cover 41 is essential, and the first groove 61 on the left side is optional because the possibility of the first connection material layer 51 overflowing to the left and then into the second group of grooves 22 is relatively small. Since when operating the second group of optical fibers 32 and the second group of grooves 22, the overflow of the second connection material 52 will not contaminate the docking of the carrier 10 and the first group of optical fibers 31, the second cover 42 may or may not include grooves that are the same as or similar to the first grooves 61.
[0070] Figure 12 The top view of the intermediate formation step of the electronic device 100 according to the third embodiment of the present application is shown. Figure 13 An embodiment in which the cross-section of the third groove 63 is V-shaped is shown. Figure 14 An embodiment in which the cross-section of the third groove 63 is U-shaped / rectangular is shown. Figure 15 An embodiment in which the cross-section of the third groove 63 is polygonal is shown. Figure 16 An embodiment including two third grooves 63 is shown. Figure 17 An embodiment including three third grooves 63 is shown. Figure 18An embodiment including two pairs of third grooves 63 is shown. After forming the first connection material layer 51 and inserting the first group of optical fibers 31 into the first group of grooves 21 one by one, the first cover 41 is pressed on the first connection material layer 51. Since the carrier 10 includes a third groove 61 located between the first group of grooves 21 and the second group of grooves 22, it can accommodate the excess first connection material layer 51 that overflows laterally, preventing the first connection material layer 51 from overflowing into the second group of grooves 22 to restrict the flow direction of the first connection material layer 51. Among them, the V shape is the most commonly used, and the cross-sections of the first group of grooves 21 and the second group of grooves 22 are also V-shaped. The first group of grooves 21, the second group of grooves 22, and the third groove 61 can be formed simultaneously to save the manufacturing process. Three pairs or more of third grooves 63 can be provided, and the number of third grooves 63 can be designed according to the actual requirements during production so that the third grooves 63 can sufficiently accommodate the overflowing first connection material layer 51.
[0071] Figure 19 A perspective view of the carrier 10 according to the fourth embodiment of the present application is shown. Figure 20 A perspective view of the third blocking member 73 according to the fourth embodiment is shown. The third blocking member 73 has an opening 720 for the first group of optical fibers 31 to pass through. The carrier 10 is disposed on the glass interposer 190. The carrier 10 has a third blocking member 73 disposed around the first group of grooves 21 and a fourth blocking member 74 disposed around the second group of grooves 22. After forming the first connection material layer 51 and inserting the first group of optical fibers 31 into the first group of grooves 21 one by one, the first cover 41 is pressed on the first connection material layer 51 and the third blocking member 73. Since the carrier 10 includes a third blocking member 74 surrounding the second group of grooves 21, it can prevent the excess first connection material layer 51 from overflowing outside the third blocking member 73, and further prevent the first connection material layer 51 from overflowing into the second group of grooves 22 to restrict the flow direction of the first connection material layer 51. Since when operating the second group of optical fibers 32 and the second group of grooves 22, the overflow of the second connection material 52 will not interfere with the docking of the carrier 10 and the first group of optical fibers 31, the fourth blocking member 74 is optional. It can also be as Figure 21 shown, the mutually facing side walls of the third blocking member 73 and the fourth blocking member 74 are merged together.
[0072] Figure 22A perspective view of an electronic device 100 according to an embodiment of the present application is shown. The electronic device 100 includes: a carrier 10 having adjacent first and second sets of grooves 21 and 22; a first set of optical fibers 31 and a second set of optical fibers 32 respectively received in the first and second sets of grooves 21 and 22, a plurality of optical fibers of the first set of optical fibers 31 corresponding one-to-one to a plurality of grooves of the first set of grooves 21, and a plurality of optical fibers of the second set of optical fibers 32 corresponding one-to-one to a plurality of grooves of the second set of grooves 22; a first cover 41 covering the first set of optical fibers 31 and the first set of grooves 21, and a second cover 42 covering the second set of optical fibers 32 and the second set of grooves 22; a first connection material layer 51 for fixing the first set of optical fibers 31 to the first set of grooves 21, and a second connection material layer 52 for fixing the second set of optical fibers 32 to the second set of grooves 22, and the first connection material layer 51 and the second connection material layer 52 may be separated or connected together, wherein the first cover 41 may be designed in the shape of the first or second embodiment, and at the same time the carrier may be in the shape of the third or fourth embodiment, or may be a planar shape without grooves or blocking members. When the carrier is in the shape of the third or fourth embodiment, the first cover 41 may be designed in the shape of the first or second embodiment, or may be a planar shape without grooves or blocking members.
[0073] Figure 23 Shows a cross-sectional view taken along Figure 22 line AA of the fifth embodiment of the present application, wherein the first cover 41 has an inclined surface 410 that together with the carrier 10 defines a receiving space for the first connection material 51, and the inclined surface 410 is used to guide the first connection material layer 51 into the receiving space. The carrier 10 is a PIC and has an optical channel coupled to the first set of optical fibers 31 at a position where it is docked with the first set of optical fibers 31 (i.e., at the end wall of the first set of grooves 21), for example, a spot size converter (SSC) 102. The inclined surface 410 of the first cover 41 pushes the first connection material layer 51 towards the rear section of the first set of optical fibers 31, i.e., towards the SSC 102, to enhance the connection strength at the position where the first set of optical fibers 31 and the SSC 102 are docked. At the same time, the receiving space inside the first cover 41 at the rear section position of the first set of optical fibers 31 is enlarged, which can accommodate the excess first connection material layer 51 and prevent overflow. Moreover, the inclined surface 410 of the first cover 41 in the fifth embodiment can be combined with the first to fourth embodiments, that is, in the first to fourth embodiments, the first cover 41 can also be provided with this inclined surface 410 at the position where the first set of optical fibers 31 and the SSC 102 are docked.
[0074] Figure 24Shows a first cover 41 according to the sixth embodiment of the present application. Based on the first embodiment, the surface of the first cover 41 facing the carrier 10 has a second groove 62. The extending direction of the second groove 62 is perpendicular to the extending direction of the first set of grooves 21. The second groove 62 accommodates the first connection material layer 51, and a first blocking member 71 is located at the end of the second groove 62. The second groove 62 is used to accommodate the excess first connection material layer 51 and serves as a diversion groove to drain the first connection material layer 51 to the Figure 6 left side shown, to prevent the first connection material layer 51 from overflowing into the second set of grooves 22. Similarly to the fifth embodiment, at the position where the first set of optical fibers 31 is docked with the SSC 102, it corresponds to the second groove 62, so that the inclined surface of the second groove 62 is also used to push the first connection material layer 51 towards the SSC 102 to enhance the connection strength at the docking position of the first set of optical fibers 31 and the SSC 102.
[0075] Figures 25 to 30 Shows the formation process of the electronic device 100 according to the seventh embodiment of the present application. Figure 25 Shows that the FAU 81 includes both the first set of optical fibers 31 and the second set of optical fibers 21. The first set of optical fibers 31 and the second set of optical fibers 32 are respectively pre-aligned in the first set of grooves 21 and the second set of grooves 22.
[0076] Figure 26 Shows that a first connection material layer 51 is formed on the first set of grooves 21 and a second connection material layer 52 is formed on the second set of grooves 22. The first connection material layer 51 and the second connection material layer 52 are, for example, UV glue.
[0077] Figure 27 Shows that the first set of optical fibers 31 and the second set of optical fibers 32 are respectively inserted into the first set of grooves 21 and the second set of grooves 22 and docked with the carrier 10.
[0078] Figure 28 Shows the formation of the first cover 41 that simultaneously covers the first set of grooves 21 and the second set of grooves 22. The first connection material layer 51 and the second connection material layer 52 overflow in the direction shown by the arrows. However, since the first connection material layer 51 and the second connection material layer 52 are formed simultaneously, there is no problem of one of them curing first, so there is no problem of interference with the adjacent groove group due to overflow.
[0079] Figure 29 Shows the curing of the first connection material layer 51 and the second connection material layer 52 using a UV lamp 7.
[0080] Figure 30 Shows the electronic device 100 according to the seventh embodiment of the present application. It can be understood that starting from Figure 25 , the carrier 10 is formed on the glass interposer 190. Figures 25 to 29 It is omitted. In the seventh embodiment, through the specially designed double-row protruding FAU 80, it is directly inserted into the first set of grooves 21 and the second set of grooves 22 in two rows, and the first set of grooves 21 and the second set of grooves 22 in two rows are dispensed with glue at one time. Subsequently, the first set of grooves 21 and the second set of grooves 22 are directly covered with a first cover 41, achieving the process of completing the double-row docking at one time. This process can also avoid the problem that the residual glue curing in one set of grooves caused by two UV curings leads to the failure of the second docking process.
[0081] In addition, in addition to the passive alignment method of designing the first set of grooves 21 and the second set of grooves 22, optical coupling can also be achieved by edge coupling and in the way of active alignment, and an optical communication network can also be achieved. However, since the active alignment finds the best position by passing light, it takes more time.
[0082] The embodiment of the present application provides an electronic device 100 for the passive alignment process of PIC and FAU. The technical solution of the present application can be applied to a variety of application scenarios, such as CPO (Co-Packaged Optics) active alignment, optical interconnection, assembly process, V-groove, passive alignment and other technologies, and can be used in graphics processing unit (GPU), data center, central processing unit (CPU), etc. By means of optical signals, the transmission speed and operation efficiency are increased. Since the viscosities of the first / second connection material layers 51 / 52 with low refractive index are low, the flow direction of the colloid is restricted by the physical blocking structure, improving the bleeding tolerance of the process (for example, less than 500 μm), or by changing the process steps, avoiding the colloid from affecting the adjacent set of grooves, and it can be implemented using existing machines, with high feasibility, improving the yield of optical passive packaging, and saving the process and materials, in line with the spirit of environmental protection (ESG).
[0083] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, various changes and modifications can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. An electronic device, characterized in that, Comprising: A carrier having a first set of grooves; A first set of optical fibers accommodated in the first set of grooves; A first cover covering the first set of optical fibers and the first set of grooves, the first cover having an inclined surface that defines an accommodation space together with the carrier; And A first connection material layer for fixing the first set of optical fibers to the first set of grooves, and the inclined surface of the first cover is used to guide the first connection material layer into the accommodation space.
2. The electronic device according to claim 1, wherein Further comprising: A second set of optical fibers, the carrier having a second set of grooves beside the first set of grooves, and the second set of optical fibers are accommodated in the second set of grooves; A second cover covering the second set of grooves, the second cover being spaced apart from the first cover.
3. The electronic device according to claim 2, wherein Further comprising: A second connection material layer for fixing the second set of optical fibers to the second set of grooves.
4. The electronic device according to claim 3, wherein, The first connection material layer is spaced apart from the second set of grooves, and the second connection material layer is spaced apart from the first set of grooves.
5. The electronic device according to claim 2, characterized in that, The first cover has a first groove for spacing the accommodation space, and the first groove is used to prevent the first connection material layer from overflowing into the second set of grooves.
6. The electronic device according to claim 5, wherein The first groove is located in the peripheral area of the first cover.
7. The electronic device according to claim 2, characterized in that, The first cover has a first blocking member extending towards the carrier, and the first blocking member is used to prevent the first connection material layer from overflowing into the second set of grooves.
8. The electronic device according to claim 7, wherein The surface of the first cover facing the carrier has a second groove, the extending direction of the second groove is perpendicular to the extending direction of the first set of grooves, and the second groove accommodates the first connection material layer.
9. The electronic device according to claim 8, characterized in that, The first blocking member is located at the end of the second groove.
10. The electronic device according to claim 2, characterized in that, The carrier has a third groove located between the first set of grooves and the second set of grooves, and the third groove is used to accommodate the first connection material.