Circuit board suitable for SMT mounting and circuit assembly

Abstract

The utility model discloses a circuit board suitable for SMT mounting and a circuit assembly. The circuit board suitable for SMT mounting comprises a circuit board body, bonding pads and alignment lines. The bonding pad is arranged on the circuit board body; the alignment lines are arranged on the two sides of the bonding pad and are formed in an etching mode; the width edge of the alignment line is aligned with the edge of the bonding pad, and the width of the alignment line is equal to the absolute value of a preset tolerance requirement; according to the utility model, the alignment lines formed by etching are arranged on the circuit board body, and the widths of the alignment lines are designed based on tolerance precision, so that the alignment lines can be used as CCD identification targets during SMT mounting, quantitative reference is provided for deviation precision data, and the SMT mounting precision is further effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board components, and particularly relates to a circuit board and a circuit assembly suitable for SMT mounting. Background Art

[0002] With the continuous and vigorous development of the intelligent application of electronic devices, the demand for high-density interconnection of circuit boards is becoming more and more extensive, and the density of components carried on the circuit board is continuously increasing.

[0003] With the boost of the development of small-sized components, the SMT mounting alignment accuracy tolerance of ±0.2mm can no longer meet the existing requirements, and the requirement of SMT patch alignment tolerance of ±0.1mm is increasing.

[0004] Under such a background, how to improve the accuracy of SMT patching to meet the market demand is a technical bottleneck that each SMT patching factory urgently needs to break through. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is to provide a circuit board and a circuit assembly suitable for SMT mounting, and improve the accuracy of SMT mounting.

[0006] To solve the above technical problem, the technical scheme adopted by the utility model is as follows:

[0007] A circuit board suitable for SMT mounting includes a circuit board body, pads and alignment lines;

[0008] The pads are arranged on the circuit board body;

[0009] The alignment lines are arranged on both sides of the pads and are formed by etching;

[0010] The width side of the alignment line is aligned with the edge of the pad, and the width of the alignment line is equal to the absolute value of the preset tolerance requirement.

[0011] Further, the number of the pads is multiple and arranged in a row;

[0012] The alignment lines are arranged on the left side of the leftmost pad and on the right side of the rightmost pad.

[0013] Further, the alignment line has electrical conductivity and the width meets the requirement of electrical signal transmission.

[0014] Further, a printed circuit is also arranged on the circuit board body;

[0015] The pads are electrically connected to the printed circuit through the alignment lines.

[0016] Further, the specific manner in which the pad is electrically connected to the printed circuit through the alignment line is as follows:

[0017] One width side of the alignment line is aligned with the edge of the pad and electrically connected to the pad;

[0018] The other width side of the alignment line is electrically connected to the printed circuit.

[0019] Further, the absolute value of the preset tolerance requirement is less than the side length of the pad.

[0020] Further, the absolute value of the tolerance requirement is less than 0.1 mm.

[0021] Further, the tolerance requirement is ±0.075 mm.

[0022] Further, the size of the pad is 0.2 mm × 0.2 mm.

[0023] To solve the above technical problems, another technical solution adopted by the present utility model is as follows:

[0024] A circuit component includes a circuit board and circuit components. The circuit board adopts the above-mentioned circuit board suitable for SMT mounting;

[0025] The circuit components are fixedly connected to the positions of the pads by means of SMT mounting.

[0026] The beneficial effects of the present utility model are as follows: For the circuit board suitable for SMT mounting and the circuit component of the present utility model, etching-formed alignment lines are provided on the circuit board body, and the width of the alignment lines is designed based on the tolerance accuracy, which can be used as the CCD recognition target during SMT patching, providing a quantitative reference for the off-position accuracy data, and thus effectively improving the accuracy of SMT mounting. Description of the Drawings

[0027] Figure 1 It is a partial area schematic diagram of a circuit board suitable for SMT mounting according to an embodiment of the present utility model;

[0028] Figure 2 It is a partial area schematic diagram of a circuit board suitable for SMT mounting according to an embodiment of the present utility model;

[0029] Figure 3 It is a partial area schematic diagram of a circuit component according to an embodiment of the present utility model;

[0030] Label Description:

[0031] 1. Circuit board body; 2. Pad; ¾ Alignment line; 4. Printed circuit; 5. Circuit component. Detailed implementation mode

[0032] To describe in detail the technical content, achieved purpose and effects of the present utility model, the following is described in conjunction with the implementation mode and with reference to the accompanying drawings.

[0033] A circuit board applicable to SMT mounting includes a circuit board body, solder pads and alignment lines;

[0034] The solder pads are arranged on the circuit board body;

[0035] The alignment lines are arranged on both sides of the solder pads and are formed by etching;

[0036] The width side of the alignment line is aligned with the edge of the solder pad, and the width of the alignment line is equal to the absolute value of the preset tolerance requirement.

[0037] As can be seen from the above description, the beneficial effect of the present utility model is that: a circuit board applicable to SMT mounting of the present utility model is provided with alignment lines formed by etching on the circuit board body, and the width of the alignment lines is designed based on the tolerance accuracy, which can be used as a CCD recognition target during SMT patching, providing a quantitative reference for the offset accuracy data, and thus effectively improving the accuracy of SMT mounting.

[0038] Further, the number of the solder pads is multiple and arranged in rows;

[0039] The alignment lines are arranged on the left side of the leftmost solder pad and on the right side of the rightmost solder pad.

[0040] As can be seen from the above description, when there are multiple solder pads arranged in rows, only by arranging alignment lines on the outer sides of the two outermost solder pads, the purpose of quantitative reference during patching can be achieved.

[0041] Further, the alignment line has electrical conductivity and the width meets the requirements of electrical signal transmission.

[0042] As can be seen from the above description, the alignment line has electrical conductivity and meets the requirements of electrical signal transmission, so that the function of electrical signal transmission can be simultaneously realized when the circuit is conducting.

[0043] Further, a printed circuit is also arranged on the circuit board body;

[0044] The solder pads are electrically connected to the printed circuit through the alignment lines.

[0045] As can be seen from the above description, the electrical signal transmission with the printed circuit is realized by electrically connecting the printed circuit and the solder pads through the alignment lines.

[0046] Further, the specific manner in which the solder pads are electrically connected to the printed circuit through the alignment lines is:

[0047] One width side of the alignment line is aligned with the edge of the pad and electrically connected to the pad;

[0048] The other width side of the alignment line is electrically connected to the printed circuit.

[0049] As can be seen from the above description, the printed circuit and the pad are electrically connected through the alignment line, and are specifically realized in the above manner.

[0050] Furthermore, the absolute value of the preset tolerance requirement is less than the side length of the pad.

[0051] As can be seen from the above description, the accuracy requirement for misalignment is generally less than the side length of the pad.

[0052] Furthermore, the absolute value of the tolerance requirement is less than 0.1 mm.

[0053] As can be seen from the above description, the tolerance requirement is less than ±0.1 mm to meet the market demand.

[0054] Furthermore, the tolerance requirement is ±0.075 mm.

[0055] As can be seen from the above description, the accuracy requirement is increased to a tolerance of 0.075 mm, and the alignment line is set accordingly, effectively improving the SMT mounting accuracy.

[0056] Furthermore, the size of the pad is 0.2 mm × 0.2 mm.

[0057] As can be seen from the above description, the size of the pad being 0.2 mm × 0.2 mm is a specific embodiment of the present utility model.

[0058] Please refer to Figure 2 , a circuit component, including a circuit board and circuit components, wherein the circuit board adopts the above-mentioned circuit board suitable for SMT mounting;

[0059] The circuit components are fixedly connected to the positions of the pads by means of SMT mounting.

[0060] As can be seen from the above description, the beneficial effect of the present utility model lies in that: in a circuit component of the present utility model, an alignment line formed by etching is provided on the circuit board body, and the width of the alignment line is designed based on the tolerance accuracy, which can be used as a CCD recognition target during SMT patching, providing a quantitative reference for the misalignment accuracy data, and thus effectively improving the SMT mounting accuracy.

[0061] A circuit board suitable for SMT mounting and a circuit component of the present utility model are applicable to the circuit board design of electronic devices, especially applicable to the circuit board design using SMT mounting and having high accuracy requirements.

[0062] Please refer to Figure 1 and Figure 2 , Example 1 of the present utility model is as follows:

[0063] A circuit board applicable to SMT mounting, comprising a circuit board body, solder pads and alignment lines;

[0064] The solder pads are arranged on the circuit board body;

[0065] The alignment lines are arranged on both sides of the solder pads and are formed by etching.

[0066] In this embodiment, on the basis of the existing solder pad design, two etching alignment lines are added on the outermost sides of the solder pads and are formed synchronously with the patch solder pads by etching.

[0067] Generally speaking, the absolute value of the tolerance requirement is less than the side length of the solder pad. In the current environmental background, the tolerance is generally required to be less than 0.1 mm. In this embodiment, the designed tolerance requirement is ±0.075 mm.

[0068] In this embodiment, the size of the solder pad is 0.2 mm × 0.2 mm.

[0069] The width side of the alignment line is aligned with the edge of the solder pad, and the width of the alignment line is equal to the absolute value of the preset tolerance requirement;

[0070] The alignment line has electrical conductivity and the width meets the requirements for electrical signal transmission.

[0071] Specifically, a printed circuit is provided on the circuit board. One width side of the alignment line is aligned with the edge of the solder pad and is electrically connected to the solder pad, and the other width side is electrically connected to the printed circuit.

[0072] Based on the circuit board designed above, during SMT patching, the alignment line serves as the CCD recognition target of the patching equipment, enabling the patching machine to accurately position and identify, thereby avoiding abnormal component misalignment caused by irregular deformation of the alignment pattern, and can be used as a reference for quantifying the offset data, so that the SMT alignment accuracy is improved from the original ±0.2 mm to ±0.075 mm, greatly improving the SMT alignment accuracy process ability, and at the same time meeting the needs of customers with higher alignment accuracy requirements.

[0073] Please refer to Figure 2 , Example 2 of the present utility model is as follows:

[0074] A circuit board applicable to SMT mounting, different from Example 1 in that the number of solder pads in this embodiment is multiple and arranged in rows; the alignment lines are arranged on the left side of the leftmost solder pad and on the right side of the rightmost solder pad.

[0075] Please refer toFigure 3 , Embodiment 2 of the present utility model is as follows:

[0076] A circuit component includes a circuit board and circuit components. The circuit board adopts the circuit board applicable to SMT mounting described in Embodiment 1 above.

[0077] The circuit components are fixedly connected to the positions of the pads by means of SMT mounting.

[0078] In this embodiment, the circuit components are LED devices.

[0079] In summary, for the circuit board applicable to SMT mounting and the circuit component provided by the present utility model, alignment lines formed by etching are provided on the circuit board body, and the width of the alignment lines is designed based on tolerance accuracy, which can be used as the CCD recognition target during SMT chip mounting, providing a quantitative reference for the offset accuracy data, and thus effectively improving the accuracy of SMT mounting.

[0080] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model. All equivalent transformations made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in related technical fields, are equally included in the patent protection scope of the present utility model.

Claims

1. A circuit board applicable to SMT mounting, characterized in that, It includes a circuit board body, pads, and alignment lines; The pads are arranged on the circuit board body; The alignment lines are arranged on both sides of the pads and are formed by etching; The width side of the alignment line is aligned with the edge of the pad, and the width of the alignment line is equal to the absolute value of the preset tolerance requirement.

2. A circuit board suitable for SMT mounting according to claim 1, characterized in that: The number of the pads is multiple and they are arranged in rows; The alignment lines are arranged on the left side of the leftmost pad and on the right side of the rightmost pad.

3. A circuit board applicable to SMT mounting according to claim 1, characterized in that, The alignment lines have electrical conductivity and the width meets the requirements for electrical signal transmission.

4. A circuit board applicable to SMT mounting according to claim 3, characterized in that, A printed circuit is also arranged on the circuit board body; The pads are electrically connected to the printed circuit through the alignment lines.

5. A circuit board suitable for SMT mounting according to claim 4, characterized in that: The specific way that the pads are electrically connected to the printed circuit through the alignment lines is as follows: One width side of the alignment line is aligned with the edge of the pad and is electrically connected to the pad; The other width side of the alignment line is electrically connected to the printed circuit.

6. A circuit board applicable to SMT mounting according to claim 1, characterized in that, The absolute value of the preset tolerance requirement is less than the side length of the pad.

7. A circuit board applicable to SMT mounting according to claim 6, characterized in that, The absolute value of the tolerance requirement is less than 0.1 mm.

8. A circuit board applicable to SMT mounting according to claim 7, characterized in that, The tolerance requirement is ±0.075 mm.

9. A circuit board applicable to SMT mounting according to claim 1, characterized in that, The size of the pad is 0.2 mm × 0.2 mm.

10. A circuit component, comprising a circuit board and circuit components, characterized in that, The circuit board adopts a circuit board applicable to SMT mounting according to any one of claims 1-9 above; The circuit components are fixedly connected to the positions of the pads by SMT mounting.

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