Heat dissipation system

Abstract

The utility model discloses a heat dissipation system. The heat dissipation system comprises an installation substrate, a heat dissipation device and a heating piece. The radiating device comprises a radiator substrate and a floating radiator, the heating element is arranged between the mounting substrate and the radiator substrate, the floating radiator is arranged on the surface, deviating from the mounting substrate, of the radiator substrate, the radiator substrate is provided with a heat exchange window, and the floating radiator is connected with the heating element through the heat exchange window. The system can reduce the possibility of damage to the heating element, reduce heat exchange heat resistance and ensure normal heat dissipation of the heating element.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to a heat dissipation system. Background Art

[0002] When a chip is soldered onto a Printed Circuit Board (PCB), the mismatch in the coefficient of thermal expansion between the chip and the PCB causes the middle area of the chip to bulge upward, resulting in warping.

[0003] In the related art, a heat sink can be used to dissipate heat from the chip. However, chip warping not only degrades the heat dissipation performance of the chip but also makes the chip prone to damage. Summary of the Utility Model

[0004] To solve the above problems, this application provides a heat dissipation system to improve the heat dissipation efficiency of heat-generating components such as chips while reducing the likelihood of damage to these components.

[0005] This application provides a heat dissipation system, including: a mounting substrate, a heat dissipation device, and a heat-generating component. The heat dissipation device includes a heat sink substrate and a floating heat sink. The heat-generating component is disposed between the mounting substrate and the heat sink substrate, and the floating heat sink is disposed on the surface of the heat sink substrate facing away from the mounting substrate. The heat sink substrate has a heat exchange window, and the floating heat sink is connected to the heat-generating component through the heat exchange window.

[0006] In the case of adopting the above technical solution, the floating heat sink is disposed on the surface of the heat sink substrate facing away from the mounting substrate, and the heat sink substrate has a heat exchange window, enabling the floating heat sink to be connected to the heat-generating component through the heat exchange window. The floating heat sink can move away from or closer to the heat-generating component according to the magnitude of the surface stress of the heat-generating component it contacts. Therefore, when the heat-generating component warps, the surface of the heat-generating component connected to the floating heat sink bulges, resulting in an increase in the surface stress of the heat-generating component, causing the floating heat sink to move away from the heat-generating component. This can not only reduce the contact stress between the floating heat sink and the heat-generating component, lowering the likelihood of damage to the heat-generating component, but also alleviate the problem of excessive contact gaps between the heat-generating component and the floating heat sink caused by the warping of the heat-generating component, ensuring normal heat dissipation of the heat-generating component.

[0007] In a possible implementation, the above heat-generating component includes a printed circuit board, a package substrate, and a chip. The printed circuit board is disposed on the mounting substrate. The package substrate is disposed on the surface of the printed circuit board facing away from the mounting substrate, and the chip is disposed on the surface of the package substrate facing away from the printed circuit board. The floating heat sink is connected to the chip through the heat exchange window.

[0008] In the technical solution disclosed in the present application, during the soldering process of the chip to the packaging substrate and the printed circuit board, due to the material mismatch between the chip and the packaging substrate and the printed circuit board, the chip warps. When the floating heat sink is connected to the chip through the heat exchange window, on the one hand, it can reduce chip damage, and on the other hand, it can reduce the problem of poor heat dissipation caused by chip warping, thereby ensuring chip reliability.

[0009] In a possible implementation, the above heat dissipation system further includes a reinforcing ring. The reinforcing ring is provided on the surface of the packaging substrate facing away from the printed circuit board. The chip is located in the inner area of the ring of the reinforcing ring, and the reinforcing ring is located between the packaging substrate and the heat sink substrate.

[0010] In the technical solution disclosed in the present application, the reinforcing ring is located between the packaging substrate and the heat sink substrate, and the chip is located in the inner area of the ring of the reinforcing ring, so that the reinforcing ring can support the heat sink substrate and relieve the extrusion force of the heat sink substrate on the chip under the action of gravity.

[0011] In a possible implementation, the above heat dissipation system further includes a thermal interface connection structure. The thermal interface connection structure corresponds to the chip, and each chip is connected to the floating heat sink through the thermal interface connection structure. At this time, the heat transfer thermal resistance between the chip and the floating heat sink can be reduced through the thermal interface connection structure, and the chip heat dissipation capacity can be improved.

[0012] In a possible implementation, the above floating heat sink has a plurality of floating heat conducting members. The number of heat exchange windows and chips is also a plurality. The heat exchange windows, chips, and floating heat conducting members correspond to each other, and each floating heat conducting member is connected to the corresponding chip through the corresponding heat exchange window. At this time, the heat sink substrate can provide a heat exchange channel for the plurality of floating heat conducting members of the floating heat sink, so that one floating heat sink can dissipate heat for a plurality of chips.

[0013] In a possible implementation, the above heat dissipation system further includes a plurality of connecting members. The plurality of connecting members are distributed along the circumference of the mounting substrate, and the mounting substrate is connected to the heat sink substrate through the plurality of connecting members.

[0014] In the technical solution disclosed in the present application, when the floating heat sink can be connected to the heat generating component through the heat exchange window, the plurality of connecting members can connect the mounting substrate and the heat sink substrate with a relatively low alignment accuracy. Therefore, the heat dissipation system disclosed in the present application is simple to install and has a relatively low installation accuracy.

[0015] In a possible implementation, the above mounting substrate has a plurality of first mounting holes distributed along the circumference of the mounting substrate, and the heat sink substrate has a plurality of second mounting holes distributed along the circumference of the heat sink substrate. The first mounting holes correspond to the second mounting holes, and each connecting member connects the corresponding first mounting hole and the second mounting hole.

[0016] In a possible implementation, the floating heat sink includes a heat sink and a floating heat conductor. The floating heat conductor is connected to the heating element through a heat exchange window. The heat sink is provided on a side of the floating heat conductor away from the heating element.

[0017] In the technical solution disclosed in the present application, after the floating heat conductive member absorbs the heat generated by the heating element, the heat generated by the heating element can be quickly discharged through the radiator, so that the floating heat conductive member can be quickly cooled down, thereby increasing the heat difference between the floating heat conductive member and the heating element, and improving the thermal conductivity efficiency of the floating heat conductive member.

[0018] In one possible implementation, the heat sink has multiple fins distributed in a direction away from the floating heat conductor, and the heat dissipation system also includes multiple groups of support structures, each group of support structures is provided on the floating heat conductor, and the multiple groups of support structures are connected to each fin.

[0019] In the technical solution disclosed in this application, each set of support structures is provided on a floating heat conducting member, and multiple sets of support structures are connected to each fin. In this case, the floating heat conducting member can be used as a fixed structure of the support structure, so that the floating heat conducting member and the multiple fins form an integral whole, which is convenient for installation.

[0020] In a possible implementation, the heat sink has integrated fins, and the integrated fins include folded fins or shovel-shaped fins.

[0021] In a possible implementation, the heat sink has a plurality of split fins, and the plurality of split fins are all arranged on a side of the floating heat conductive element away from the heat generating element. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0023] Figures 1 to 4 Four structural schematic diagrams of the heat dissipation system according to the embodiment of the present application are shown;

[0024] Figure 5 A schematic structural diagram of a floating heat dissipation device disclosed in an embodiment of the present application is shown;

[0025] Figure 6 Another structural schematic diagram of the floating heat dissipation device disclosed in an embodiment of the present application is shown;

[0026] Figure 7Shows another schematic structural diagram of the floating heat dissipation device disclosed in the embodiments of the present application;

[0027] Figure 8 Shows still another schematic structural diagram of the floating heat dissipation device disclosed in the embodiments of the present application

[0028] Figures 9A to 11A Shows a schematic diagram of the installation process of a heat conduction structure in the X-Z plane in the embodiments of the present application;

[0029] Figures 9B to 11B Shows a schematic diagram of the installation process of a heat conduction structure in the X-Y plane in the embodiments of the present application

[0030] Figures 12A to 14A Shows a schematic diagram of the installation process of a heat conduction structure in the X-Z plane in the embodiments of the present application;

[0031] Figures 12B to 14B Shows a schematic diagram of the installation process of a heat conduction structure in the X-Y plane in the embodiments of the present application Detailed implementation manners

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0033] During the chip packaging process, the chip needs to be soldered to the printed circuit through the packaging substrate to form a packaged device. Since the chip generates heat during operation, the protective cover of the packaged device needs to be removed, and then a heat sink is arranged on the chip surface to conduct the heat generated by the chip. During the process of soldering the chip to the printed circuit through the packaging substrate, the material thermal expansion coefficients between the chip, the packaging substrate and the printed circuit do not match, resulting in chip warping.

[0034] The inventors found that when the chip warps, the middle area of the chip bulges upward. After the protective cover of the packaged device is removed, it is difficult to suppress chip warping. Therefore, the gaps at different regions of the contact interface between the chip and the heat sink are different, and the maximum can reach more than 300 μm, resulting in an increase in the heat transfer thermal resistance between the chip and the heat sink, and a sharp deterioration in the heat dissipation performance of the chip. If the chip warps and a uniform design is adopted for the contact surface between the chip and the heat sink, the stress at the convex part of the chip is relatively large, which is likely to cause chip damage.

[0035] In view of the above problems, the embodiments of the present application provide a heat dissipation system to reduce the thermal resistance between the heat generating component and the heat sink, improve the heat transfer efficiency of the heat sink, and avoid damage to the heat generating component when the contact gap between the heat sink and the heat generating component is large.

[0036] Figures 1 to 4 Shows four schematic structural diagrams of the heat dissipation system according to the embodiments of the present application. As Figures 1 to 4 shown, the heat dissipation system 100 according to the embodiments of the present application includes a mounting substrate 101 and a heat dissipation device. The heat dissipation device includes a radiator substrate 102 and a floating radiator 103. The heat dissipation system further includes a heat generating component 104, and the heat generating component 104 is disposed between the mounting substrate 101 and the radiator substrate 102. Here, the mounting substrate 101 can be a metal substrate or a non-metal substrate, and can be specifically selected according to actual situations.

[0037] In practical applications, as Figures 1 to 4 shown, the above-mentioned floating radiator 103 has a plurality of floating heat conducting members 103A, the mounting substrate 101 has a plurality of heat exchange windows H, and the floating heat conducting members 103A correspond to the heat exchange windows H. Each floating heat conducting member 103A can be connected to the same heat generating component 104 or different heat generating components 104 through the corresponding heat exchange window H. At this time, the radiator substrate 102 can provide heat exchange channels for the plurality of floating heat conducting members 103A of the floating radiator 103, so that one floating radiator 103 can dissipate heat for the heat generating component 104 through a plurality of heat exchange channels.

[0038] As Figures 1 to 4 shown, the above-mentioned floating radiator 103 is disposed on the surface of the radiator substrate 102 facing away from the mounting substrate 101, and the radiator substrate 102 has a heat exchange window H. At this time, the floating radiator 103 is connected to the heat generating component 104 through the heat exchange window H. The floating radiator 103 can move away from or close to the heat generating component 104 according to the magnitude of the surface stress of the heat generating component 104 it contacts, so that the contact between the floating radiator 103 and the heat generating component 104 presents a flexible contact. Therefore, when the surface of the heat generating component 104 is convex and connected to the floating radiator 103, although the surface stress of the heat generating component 104 increases, the floating radiator 103 can move away from the heat generating component 104. This can not only reduce the contact stress between the floating radiator 103 and the heat generating component 104, reduce the possibility of damage to the heat generating component 104, but also alleviate the problem of excessive contact gap between the heat generating component 104 and the floating radiator 103 caused by warping of the heat generating component 104, and ensure normal heat dissipation of the heat generating component 104.

[0039] In practical applications, as Figures 1 to 4 shown, the heat dissipation system 100 disclosed in the embodiments of the present application further includes a thermal interface connection structure ( Figures 1 to 4 not shown), and the floating radiator 103 is connected to the heat generating component 104 through the thermal interface connection structure. Through the thermal interface connection structure, the heat transfer between the heat generating component 104 and the floating heat dissipation member can be promoted, and the heat dissipation effect of the heat generating component 104 can be ensured.

[0040] Exemplarily, in the technical solution disclosed in the embodiments of the present application, as Figures 1 to 4 shown, a heat-conducting resin such as silicone grease is filled between the heating element 104 and the floating heat sink 103, so that the contact surface between the heating element 104 and the floating heat sink 103 adopts a uniform design. When there is a protrusion on the surface of the heating element 104, the floating heat sink 103 can move away from the surface of the heating element 104 to absorb the problems caused by the protrusion on the surface of the heating element 104, thereby improving the heat transfer efficiency of the floating heat sink 103 and avoiding damage to the heating element 104.

[0041] For example, as Figures 1 to 4 shown, the thickness of the thermal interface connection structure formed by the thermal interface material can be controlled so that the thermal interface connection structure is equal to the protrusion height (such as 300 μm) on the surface of the heating element 104. In this way, the protrusion on the surface of the heating element 104 can be filled, and the gap width (for example, the gap width can be controlled within 0.1 mm) between the surface of the heating element 104 and the floating heat sink 103 can be made close to or uniform.

[0042] In an alternative manner, as Figures 1 to 4 shown, the heating element 104 disclosed in the embodiments of the present application may include a packaged device, or may be other electronic devices or structural components with a heating function. For example, when the heating element 104 is a packaged device, the heating element 104 includes a printed circuit board 1041, a packaging substrate 1042, and a chip 1043. The printed circuit board 1041 is provided on the mounting substrate 101. The packaging substrate 1042 is provided on the surface of the printed circuit board 1041 facing away from the mounting substrate 101. For example, the packaging substrate 1042 can be connected to the printed circuit board 1041 through a ball grid array; the chip 1043 is provided on the surface of the packaging substrate 1042 facing away from the printed circuit board 1041, and the floating heat sink 103 is connected to the chip 1043 through a heat exchange window H.

[0043] As Figures 1 to 4 shown, when the chip 1043 is soldered to the packaging substrate 1042 and the printed circuit board 1041, the chip 1043 warps due to the material mismatch between the chip 1043 and the packaging substrate 1042 and the printed circuit board 1041. When the floating heat sink 103 is connected to the chip 1043 through the heat exchange window H, on the one hand, the damage to the chip 1043 can be reduced, and on the other hand, the problem of poor heat dissipation caused by the warping of the chip 1043 can be reduced, thereby ensuring the reliability of the chip 1043.

[0044] Exemplarily, as Figures 1 to 4As shown, in the technical solution disclosed in the embodiment of the present application, the heat dissipation system 100 further includes a reinforcing ring 105. The reinforcing ring 105 is disposed on the surface of the packaging substrate 1042 facing away from the printed circuit board 1041. The chip 1043 is located in the inner region of the reinforcing ring 105, and the reinforcing ring 105 is located between the packaging substrate 1042 and the radiator substrate 102.

[0045] As Figures 1 to 4 shown, when the reinforcing ring 105 is located between the packaging substrate 1042 and the radiator substrate 102, the chip 1043 is located in the inner region of the reinforcing ring 105, so that the reinforcing ring 105 can support the radiator substrate 102, relieve the extrusion force of the radiator substrate 102 on the chip 1043 under the action of gravity, and avoid the chip 1043 being extruded by the radiator substrate 102.

[0046] Exemplarily, as Figures 1 to 4 shown, when the heat dissipation system 100 further includes a thermal interface connection structure, the thermal interface connection structure corresponds to the chip 1043, and each chip 1043 is connected to the floating radiator 103 through the thermal interface connection structure. At this time, the heat transfer thermal resistance between the chip 1043 and the floating radiator 103 can be reduced through the thermal interface connection structure, and the heat dissipation capacity of the chip 1043 can be improved.

[0047] In practical applications, as Figures 1 to 4 shown, when the floating radiator 103 has a plurality of floating heat conducting members 103A, the number of heat exchange windows H and chips 1043 are both multiple, the heat exchange windows H, chips 1043 and floating heat conducting members 103A correspond to each other, and each floating heat conducting member 103A is connected to the corresponding chip 1043 through the corresponding heat exchange window H. It should be understood that Figures 1 to 4 only two chips 1043 are shown, but actually there may be one or more than two chips 1043.

[0048] As Figures 1 to 4 shown, when each floating heat conducting member 103A can extend out of the heat exchange window H to be connected to the corresponding chip 1043, the radiator substrate 102 can provide a heat exchange channel for the plurality of floating heat conducting members 103A of the floating radiator 103, so that the floating radiator 103 can dissipate heat for a plurality of chips 1043.

[0049] Exemplarily, as Figures 1 to 4As shown, the heat dissipation system 100 further includes a plurality of connectors 106, which are distributed along the circumference of the mounting substrate 101. The mounting substrate 101 and the heat sink substrate 102 are connected via the plurality of connectors 106. When the floating heat sink 103 can be connected to the heat generating element 104 via the heat exchange window H, the plurality of connectors 106 can be connected to the mounting substrate 101 and the heat sink substrate 102 with relatively low alignment accuracy. Therefore, the heat dissipation system 100 disclosed in the embodiment of the present application is simple to install and has relatively low installation accuracy.

[0050] In some embodiments, as Figures 1 to 4 As shown, the mounting substrate 101 has a plurality of first mounting holes distributed along the circumference of the mounting substrate 101, and the heat sink substrate 102 has a plurality of second mounting holes distributed along the circumference of the heat sink substrate 102. The first mounting holes correspond to the second mounting holes, and each connector 106 connects the corresponding first mounting hole and the second mounting hole. For example, the connector 106 may include a columnar member such as a connecting column, bolt, or screw. Each columnar member can be passed through the first mounting hole and the corresponding second mounting hole to achieve a connection between the mounting substrate 101 and the printed circuit board 1041.

[0051] In an alternative approach, Figures 1 to 4 As shown, the floating heat sink 103 disclosed in the embodiment of the present application includes a heat sink 103B and a floating heat conductor 103A. The floating heat conductor 103A is connected to the heating element 104 through a heat exchange window H. The heat sink 103B is arranged on the side of the floating heat conductor 103A away from the heating element 104, and is used to increase the overall heat dissipation area of the floating large heat element.

[0052] like Figures 1 to 4 As shown, when heat sink 103B is positioned on the side of floating thermal conductor 103A facing away from heating element 104, heat sink substrate 102 can serve as a support plate for heat sink 103B. Heat sink 103B can be soldered to heat sink substrate 102. When heat dissipation system 100 includes reinforcement ring 105, reinforcement ring 105 can support heat sink substrate 102, preventing the heat sink substrate 102 from squeezing heating element 104, such as chip 104, due to excessive weight of heat sink 103B.

[0053] like Figures 1 to 4 As shown, after the floating heat conductive member 103A absorbs the heat generated by the heating element 104, the heat generated by the heating element 104 can be quickly conducted away through the radiator 103B, so that the floating heat conductive member 103A can be quickly cooled down, thereby increasing the heat difference between the floating heat conductive member 103A and the heating element 104, and improving the heat conduction efficiency of the floating heat conductive member 103A.

[0054] In practical applications, the radiator disclosed in the embodiments of the present application can be a finned radiator. The finned radiator can be an integrated or split fin radiator, which will be described separately below. It should be understood that the following description is only for illustration and not for limitation.

[0055] As Figure 1 shown, when the above-mentioned radiator 103B can be a split fin radiator, it has a plurality of fins distributed along the direction away from the floating heat conducting member 103A. Each fin can be a horizontally placed sheet fin, and the plurality of sheet fins are arranged in parallel. The heat dissipation system 100 further includes multiple groups of support structures 107. Each group of support structures 107 can be provided on the floating heat conducting member 103A. Each group of support structures can include one or more support members, and the support member can be a columnar support member.

[0056] As Figure 1 shown, when each group of support structures 107 is provided on the floating heat conducting member 103A, multiple groups of support structures 107 are all connected to each fin. At this time, the floating heat conducting member 103A can be used as a fixing structure of the support structure, so that the floating heat conducting member 103A and the multiple fins form an integral body, which is convenient for installation.

[0057] Exemplarily, as Figure 1 shown, the support member included in each group of support structures 107 can be a heat-conducting support member. For example, the heat-conducting support member can include a heat pipe, a heat-conducting pipe made of a heat-conducting material, such as a metal pipe, etc. Through the heat-conducting support member, not only can the floating heat conducting member 103A and the multiple fins be combined together, but also the heat conducted by the heat conduction path between the floating heat conducting member 103A and the radiator 103B can be quickly transferred to the multiple fins.

[0058] As Figure 2 shown, when the above-mentioned radiator 103B has a plurality of split fins, the plurality of split fins are all provided on the side of the floating heat conducting member 103A facing away from the heat generating member 104. For example, each split fin can be a U-shaped fin, the openings of the respective U-shaped fins face the same direction, and among two adjacent U-shaped fins, the open end of one U-shaped fin abuts against the back of the other U-shaped fin.

[0059] The above-mentioned radiator 103B has an integrated fin, and the integrated fin can be a folded fin as Figure 3 shown, or a shovel-tooth fin as Figure 4 shown.

[0060] When the integrated fin is a folded fin, the flat fin can be folded repeatedly to form a folded fin, and the folded portion of the folded fin is arranged on the radiator substrate; when the integrated fin is a shovel-toothed fin, the shovel-toothed fin has multiple openings on the same side, and there are shovel teeth between two adjacent openings, and the side of the shovel-toothed fin facing away from the multiple openings is arranged on the radiator substrate.

[0061] It can be seen that the heat dissipation system disclosed in the embodiment of the present application can be applicable to the heat dissipation of single-chip packaged devices or multi-chip packaged devices. The floating heat conductor of the floating heat sink has good resilience, which absorbs the problems caused by chip warping by rebounding, reduces the contact stress borne by the chip, improves the packaging reliability and heat dissipation performance, and reduces the installation complexity and heat dissipation cost.

[0062] Furthermore, when the heat dissipation system disclosed in the embodiments of this application is applied to a multi-chip package, even if the multiple chips have different sizes, the same or similar structure can be used to cool the different chips. For example, for a multi-chip package, the heat sink substrate can be designed with multiple heat exchange windows, with the size of the heat exchange window corresponding to each chip matching the chip size to provide maximum heat exchange channels for the corresponding chip.

[0063] The embodiment of the present application also provides a floating heat sink, which can be used as a heat sink in the heat dissipation system of the embodiment of the present application. The floating heat sink can achieve flexible contact with the heating element, reduce the thermal resistance between the chip and the floating heat sink, improve the heat transfer efficiency of the floating heat sink, reduce the heat dissipation cost, reduce the contact stress on the heating element, and avoid damage to the heating element.

[0064] Figure 5 A structural diagram of a floating heat dissipation device disclosed in an embodiment of the present application is shown. Figure 6 Another structural diagram of the floating heat dissipation device disclosed in the embodiment of the present application is shown. Figure 7 FIG. 1 shows another structural diagram of the floating heat dissipation device disclosed in an embodiment of the present application. Figure 8 FIG. 1 shows another structural diagram of the floating heat dissipation device disclosed in the embodiment of the present application. Figures 5 to 8 As shown, the floating heat dissipation device 200 disclosed in the embodiment of the present application includes: a heat sink substrate 201 and a heat conducting structure 202A and a heat sink 202B both located on the front surface of the heat sink substrate 201 , and the heat conducting structure 202A is located between the heat sink 202B and the front surface of the heat sink substrate 201 .

[0065] like Figure 5 and Figure 6As shown, the above-mentioned heat conduction structure 202A includes a heat conduction main body 2021 and an auxiliary heat conduction member 2022. The heat sink substrate 201 has a heat exchange window 2011. The heat conduction main body 2021 is arranged on the front surface of the heat sink substrate 201 and extends along the extending direction of the plate surface of the heat sink substrate 201 to the area corresponding to the heat exchange window 2011. The heat conduction main body 2021 has a suspended portion extending to the heat exchange window 2011. At this time, one end of the heat conduction main body 2021 extending to the heat exchange window 2011 is a free end, and this free end can be suspended above the heat exchange window 2011. Therefore, when an upward force acts on the heat conduction main body 2021, this free end can move upward without restraint. When a downward force acts on the heat conduction main body 2021, this free end can move downward without restraint.

[0066] As Figures 5 to 8 shown, the above-mentioned auxiliary heat conduction member 2022 can be arranged on the surface of the suspended portion facing away from the heat sink 202B, and the auxiliary heat conduction member 2022 is in clearance fit with the inner side wall of the heat exchange window 2011. That is to say, there is a gap between the outer side wall of the auxiliary heat conduction member 2022 and the inner side wall of the heat exchange window 2011, and the value of the width of this gap can be set according to the actual situation. For example, the width of this gap can be 0.5 mm to 1.5 mm (such as 1.0 mm). Therefore, the auxiliary heat conduction member 2022 can move freely in the heat exchange window 2011 along the axial direction of the heat exchange window 2011.

[0067] Exemplarily, as Figures 5 to 8 shown, the above-mentioned heat conduction main body 2021 can be welded and arranged on the front surface of the heat sink substrate 201, and the auxiliary heat conduction member 2022 can be welded on the surface of the suspended portion facing away from the heat sink 202B, so that the heat conduction main body 2021 and the auxiliary heat conduction member 2022 are integrated.

[0068] As Figures 5 to 8 shown, the above-mentioned auxiliary heat conduction member 2022 has a heat absorption surface extending out from the back surface of the heat sink substrate 201 through the heat exchange window 2011. Therefore, the heat absorption surface of the auxiliary heat conduction member 2022 is in contact with the surface of the heat generating component. Here, the length of the auxiliary heat conduction member 2022 extending out of the heat exchange window 2011 can be 0.1 mm to 0.3 mm.

[0069] As Figures 5 to 8 shown, when the heat generating component is a packaged device, the heat sink substrate 201 included in the floating heat dissipation device 200, the printed circuit board 1041 included in the packaged device, and the mounting substrate 101 can be fixed together by screws, so that the floating heat dissipation device 200 gradually approaches the packaged device.

[0070] As Figures 5 to 8As shown, during the process of soldering the chip to the printed circuit board 1041 through the packaging substrate 1042, the chip warps, resulting in protrusions on the chip surface. Therefore, when the floating heat dissipation device 200 gradually approaches the packaged device, the heat absorption surface of the auxiliary heat conduction member 2022 in the floating heat dissipation device 200 first contacts the protrusion of the chip. Since the auxiliary heat conduction member 2022 is arranged with a gap from the heat exchange window 2011, and one end of the heat conduction main body 2021 extending to the heat exchange window 2011 is a free end without constraint, when the heat absorption surface of the auxiliary heat conduction member 2022 first contacts the protrusion of the chip, the auxiliary heat conduction member 2022 will gradually move upward (away from the chip). In this way, the auxiliary heat conduction member 2022 can reduce the gap between the chip and the radiator 202B, reduce the heat transfer thermal resistance, and thus absorb the warping problem of the chip caused by the packaging process.

[0071] It can be seen that as Figures 5 to 8 shown, if there are protrusions on the surface of the heat generating component, the heat absorption surface of the auxiliary heat conduction member 2022 extends from the back surface of the radiator substrate 201 and contacts the protrusions on the surface of the heat generating component, so that the suspended part of the heat conduction main body 2021 and the auxiliary heat conduction member 2022 are upwardly offset along the direction away from the heat generating component under the action of the protrusions, thereby alleviating the problem of damage to the heat generating component caused by excessive contact stress between the heat absorption surface of the auxiliary heat conduction member 2022 and the surface of the heat generating component.

[0072] Moreover, as Figures 5 to 8 shown, since the contact between the auxiliary heat conduction member 2022 and the chip is a flexible contact, during the upward movement of the auxiliary heat dissipation member of the radiator 202B, the auxiliary heat conduction member 2022 can also alleviate the problem of excessive contact gap caused by chip warping, reduce the contact gap between the auxiliary heat conduction member 2022 and the surface of the heat generating component, thereby reducing the heat transfer thermal resistance and improving the heat transfer efficiency.

[0073] In an alternative manner, as Figures 5 to 8 shown, the auxiliary heat conduction member 2022 disclosed in the embodiment of the present application is also connected to the outer side surface of the suspended part, and the outer side surface of the suspended part is the surface of the suspended part opposite to the inner side wall of the heat exchange window 2011. At this time, the auxiliary heat conduction member 2022 can not only exchange heat through the surface of the suspended part facing away from the radiator 202B, but also conduct heat through the surface of the suspended part facing the inner side wall of the heat exchange window 2011. Therefore, when the auxiliary heat conduction member 2022 is also connected to the surface of the suspended part facing the inner side wall of the heat exchange window 2011, the heat conduction path between the auxiliary heat conduction member 2022 and the heat conduction main body 2021 can be increased, and the heat conduction efficiency can be improved.

[0074] As Figures 5 to 8As shown, when there is a first gap between the outer side surface of the suspended portion and the inner side wall of the heat exchange window 2011, the outer side surface of the suspended portion is the surface of the suspended portion opposite to the inner side wall of the heat exchange window 2011. The auxiliary heat conducting member 2022 includes a first heat conducting structure and a second heat conducting structure provided on the first heat conducting structure. The first heat conducting structure is provided on the surface of the suspended portion facing away from the radiator 202B, and the second heat conducting structure is located in the first gap. There is a second gap between the second heat conducting structure and the inner side wall of the heat exchange window 2011. At this time, when the auxiliary heat conducting member 2022 moves upward under the action of the protrusion of the heat generating member, the heat exchange window 2011 will not impose a constraint on the auxiliary heat conducting member 2022, thereby ensuring that the auxiliary heat conducting member 2022 can be in flexible contact with the heat generating member.

[0075] Exemplarily, as Figures 5 to 8 shown, when there is a third gap between the surface of the second heat conducting structure facing away from the inner side wall of the heat exchange window 2011 and the outer side wall of the suspended portion, they can also be in contact. When the surface of the second heat conducting structure facing away from the inner side wall of the heat exchange window 2011 is in contact with the outer side wall of the suspended portion, the heat exchange effect between the second heat conducting structure and the suspended portion is better, which can further improve the heat conduction efficiency between the auxiliary heat conducting member 2022 and the heat conducting main body 2021.

[0076] In an alternative manner, as Figure 5 and Figure 6 shown, the heat conducting structure 202A of the embodiment of the present application further includes a reinforcing plate 2023, and the reinforcing plate 2023 is provided on the surface of the heat conducting main body 2021 close to the radiator 202B. At this time, the reinforcing plate 2023 can enhance the overall strength of the heat conducting main body 2021 and the auxiliary heat conducting member 2022, and prevent the heat conducting main body 2021 from being damaged. For example, when the heat conducting main body 2021 is a heat pipe, if the heat pipe is subjected to a large pressure, it is not conducive to heat conduction of the heat pipe.

[0077] Exemplarily, as Figures 5 to 8 shown, the reinforcing plate 2023 can be welded to the heat conducting main body 2021, and the auxiliary heat conducting member 2022 is welded to the heat conducting main body 2021. At this time, the reinforcing plate 2023, the heat conducting main body 2021 and the auxiliary heat conducting member 2022 form an integral heat conducting device. When installing the floating heat dissipation device 200, the radiator 202B can be directly welded to the front surface of the radiator substrate 201. This installation method is simple, fast, and has a low operation difficulty.

[0078] As Figures 5 to 8 shown, the thickness of the above-mentioned reinforcing plate 2023 can be greater than 0.2 mm, and the materials of the reinforcing plate 2023, the heat conducting main body 2021 and the auxiliary heat conducting member 2022 can be selected from metal materials such as copper and iron, but not limited thereto. The material of the radiator substrate 201 can be selected from metal materials such as copper and aluminum, but not limited thereto.

[0079] In an alternative manner, as Figures 5 to 8 shown, the front surface of the above-mentioned radiator substrate 201 has a mounting groove 2012, and the inner side wall of the mounting groove 2012 has an opening. The mounting groove 2012 communicates with the heat exchange window 2011 through the opening. The heat conduction body 2021 is arranged in the mounting groove 2012, and the heat conduction body 2021 extends into the heat exchange window 2011 through the opening. By providing the mounting groove 2012 on the front surface of the radiator substrate 201 for the heat conduction body 2021 to be arranged in the mounting groove 2012, the extrusion of the heat conduction body 2021 by the radiator 202B can be reduced, ensuring that the heat conduction body 2021 can conduct heat normally.

[0080] Exemplarily, the above-mentioned heat conduction body 2021 includes at least one first heat pipe, and the mounting groove 2012 includes at least one first mounting groove. The side wall of each first mounting groove has an opening, the first heat pipe is arranged in the corresponding first mounting groove, and the first heat pipe extends into the heat exchange window 2011 through the opening.

[0081] As Figure 8 shown, when the heat conduction body 2021 further includes at least one second heat pipe, each second heat pipe is arranged on the corresponding first heat pipe. For example, the first heat pipe is communicated with the second heat pipe, and the radiator 202B is arranged on the second heat pipe. At this time, the second heat pipe can not only timely export the heat absorbed by the first heat pipe, but also act as a support structure to support the radiator 202B. For example, when the end of the first heat pipe away from the suspended portion is close to the opening, the first heat pipe is a straight heat pipe. At this time, the second heat pipe can be arranged at the end of the corresponding first heat pipe away from the opening.

[0082] When the distance between the end of the first heat pipe away from the suspended portion and the opening is relatively close, the heat dissipation effect of the first heat pipe is not good. However, since the second heat pipe is arranged on the corresponding first heat pipe and the second heat pipe can extend along the height direction into the radiator, the second heat pipe can quickly conduct the heat of the first heat pipe to the radiator.

[0083] Exemplarily, the end of the above-mentioned first heat pipe away from the suspended portion is far from the opening, the mounting groove further includes at least one second mounting groove, and the end of the first heat pipe away from the suspended portion is close to the second mounting groove. The heat conduction body further includes at least one third heat pipe, each third heat pipe is arranged in the corresponding second mounting groove, and each second heat pipe is arranged on the corresponding group of third heat pipes.

[0084] When one end of the first heat pipe away from the suspended part is far from the opening, the first heat pipe can conduct the absorbed heat to the area far from the opening, and the temperature of this area is relatively low, which is conducive to heat dissipation. Therefore, when the second installation groove is close to the end of the first heat pipe away from the suspended part, the second installation groove is in the area with a relatively low temperature. At this time, after the third heat pipe is arranged in the second installation groove, on the one hand, the third heat pipe is relatively close to the end of the first heat pipe away from the suspended end, and on the other hand, the temperature difference between the internal heat transfer fluid of the third heat pipe and the internal fluid at the end of the first heat pipe away from the suspended end is relatively large, and its heat transfer efficiency is relatively high. Therefore, through the heat exchange between the first heat pipe and the third heat pipe, the third heat pipe can quickly export the heat of the first heat pipe, so that the first heat pipe can conduct the heat of the heat generating component faster.

[0085] To further improve the heat dissipation effect, each second heat pipe can also be arranged on the corresponding third heat pipe, so that the heat absorbed by the third heat pipe is transferred to the second heat pipe, and the radiator is arranged on the second heat pipe. Therefore, the radiator can not only absorb heat through heat exchange with the first heat pipe, but also absorb heat through heat exchange with the second heat pipe, thereby increasing the heat absorption path and achieving a better heat dissipation effect.

[0086] As Figures 5 to 7 shown, when the heat conduction main body 2021 includes the first heat pipe, the radiator 202B can be set with reference to Figures 2 to 4 ; as Figure 8 shown, when the heat conduction main body 2021 includes the first heat pipe, the second heat pipe and the third heat pipe, the radiator 202B can be set with reference to Figure 1 .

[0087] Figures 9A to 11A shows a schematic diagram of the installation process of a heat conduction structure according to an embodiment of the present application in the X-Z plane; Figures 9B to 11B [[ID=W20]]shows a schematic diagram of the installation process of a heat conduction structure according to an embodiment of the present application in the X-Y plane. Taking the packaged device as an example, the schematic diagram of the conductive structure will be described in combination with Figures 9A to 11A and Figures 9B to 11B . Here, the number of chips encapsulated by the packaged device is taken as two as an example, but it can also be more or fewer packaged chips.

[0088] The first step, as Figure 9A and Figure 9B shown, through the chip size encapsulated by the packaged device, the spacing between chips, and the size of the auxiliary heat conduction member, two heat exchange windows 3011 and the corresponding first installation grooves 3012 for each heat exchange window 3011 are processed on the metal substrate 301, so as to obtain the radiator substrate. Here, the first installation groove 3012 is located on the front surface of the metal substrate 301, and the metal substrate 301 can be made of high thermal conductivity materials such as copper and aluminum, but not limited thereto.

[0089] FromFigure 9A and Figure 9B It can be seen that the heat exchange window 3011 communicates with the first installation groove 3012, and the first installation groove 3012 extends along the outer extension of the heat exchange window 3011. For each heat exchange window 3011, the heat exchange window 3011 can communicate with two first installation grooves 3012. For the convenience of processing, the two first installation grooves 3012 can be penetrated. For the two heat exchange windows 3011, the first installation grooves 3012 corresponding to the two heat exchange windows 3011 can be in an interdigitated shape to facilitate space saving.

[0090] The second step, as Figure 10A and Figure 10B shown, the first heat pipe 3021A can be welded in the first installation groove 3012. The first heat pipe 3021A extends to the area where the heat exchange window 3011 is located and has a certain gap with the inner side wall of the heat exchange window 3011, so that the part of the first heat pipe 3021A extending into the area where the heat exchange window 3011 is located forms a suspended part. The first heat pipe 3021A can be made of copper material, which is welded to the first heat pipe 3021A, and the auxiliary heat conducting member 3022 can extend from the back of the metal substrate 301, and its extension length can be 0.1 mm to 0.3 mm.

[0091] The third step, as Figure 11A and Figure 11B shown, a reinforcing plate 3023 is welded on the side of the first heat pipe 3021A facing away from the auxiliary heat conducting member 2022. It can be made of copper plate with a thickness of not less than 0.1 mm. For one heat exchange window 3011, one reinforcing plate 3023 can be used to weld on the first heat pipes 3021A placed in the two first installation grooves 3012 connected to the heat exchange window 3011 to enhance the strength of the first heat pipe 3021A. Finally, referring to Figures 5 to 7 the radiator type shown, on Figure 11A and Figure 11B shown, a radiator is arranged on the metal substrate 301.

[0092] From Figures 9A to 11A and Figures 9B to 11B it can be seen that the radiator substrate can be configured with four first heat pipes 3021A. Each heat exchange window 3011 corresponds to two first heat pipes 3021A, and the first heat pipes 3021A corresponding to the two heat exchange windows 3011 are in an interdigitated distribution, so as to quickly conduct the heat of the chip to the four sides of the radiator substrate to meet the heat dissipation requirements of high-power chips and reduce the interface thermal resistance between the chip and the radiator.

[0093] Figures 12A to 14A shows a schematic diagram of the installation process of a heat conduction structure according to an embodiment of the present application in the X-Z plane; Figures 12B to 14BThe figure shows a schematic diagram of the installation process of a heat conduction structure according to an embodiment of the present application in the X-Y plane. Taking a packaged device as an example below, in combination with Figures 12A to 14A and Figures 12B to 14B the schematic diagram of the conductive structure is described. Here, the number of chips encapsulated in the packaged device is taken as two as an example, but it can also be more or fewer packaged chips.

[0094] The first step is as shown in Figure 12A and Figure 12B . Referring to the processing methods of the metal substrate 301 in Figure 9A and Figure 9B , a heat sink substrate is obtained. Different from Figure 9A and Figure 9B , a second installation groove 3013 can also be processed on the metal substrate 301 here, which is close to one end of the first installation groove 3012 away from the heat exchange window 3011.

[0095] As shown in Figure 12A and Figure 12B , for each heat exchange window 3011, one of its corresponding first heat pipes 3021A is a straight heat pipe, and the other first heat pipe 3021A is a bent heat pipe, extending along the extension of the heat exchange window 3011. For the two heat exchange windows 3011, the straight heat pipes corresponding to the two heat exchange windows 3011 are centrosymmetrically distributed, and the two bent heat pipes are centrosymmetrically distributed.

[0096] The second step is as shown in Figure 13A and Figure 13B . Referring to Figure 10A and Figure 10B , the first heat pipe 3021A can be welded in the first installation groove 3012, and the first heat pipe 3021A extends to the area where the heat exchange window 3011 is located and has a certain gap with the inner side wall of the heat exchange window 3011, so that the part of the first heat pipe 3021A extending into the area where the heat exchange window 3011 is located forms a suspended part. The auxiliary heat conducting member 3022 can be made of copper, which is welded on the first heat pipe 3021A, and the auxiliary heat conducting member 3022 can extend out from the back of the metal substrate 301, and its extension length can be 0.1 mm to 0.3 mm.

[0097] As shown in Figure 13A and Figure 13B , the above-mentioned first heat pipe 3021A is divided into two types, one is a straight heat pipe and the other is a bent heat pipe. For the straight heat pipe, a second heat pipe 3021B is also provided on the straight heat pipe; for the bent heat pipe, a third heat pipe 3021C is provided at one end of the bent heat pipe away from the heat exchange window 3011, and the third heat pipe 3021C is located in the second installation groove 3013. At the same time, a second heat pipe 3021B can also be provided on the third heat pipe 3021C.

[0098] From Figure 13A and Figure 13B It can be seen that in the solution disclosed in the embodiments of the present application, different heat dissipation methods can be designed for the first heat pipe 3021A according to the shape of the first heat pipe 3021A and the heat dissipation environment. For example, for a linear heat pipe with a poor heat dissipation environment, a second heat pipe 3021B can be directly arranged thereon to quickly export the heat of the linear heat pipe; for a bent heat pipe with a good heat dissipation environment, a linear heat pipe can be configured first, and then a second heat pipe 3021B is arranged on the linear heat pipe to export the heat.

[0099] The third step, as Figure 14A and Figure 14B shown, a reinforcing plate 3023 is welded to the side of the first heat pipe 3021A facing away from the auxiliary heat conducting member 3022, and it can be a copper plate with a thickness of not less than 0.1 mm. For one heat exchange window 3011, one reinforcing plate 3023 can be used to weld to the first heat pipes 3021A placed in the two first installation grooves 3012 connected to the heat exchange window 3011 to improve the strength of the first heat pipe 3021A. Finally, the radiator form shown in Figure 8 can be referred to, and a radiator is arranged on the metal substrate 301.

[0100] It should be noted that when an element is referred to as being "fixed to" or "arranged on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0101] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined. The meaning of "several" is one or more unless otherwise specifically defined.

[0102] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application.

[0103] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0104] In the description of the above embodiments, the specific features, structures, materials, or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

[0105] The above is only the specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation system, characterized in that, Comprising: An installation substrate, a heat dissipation device, and a heating element. The heat dissipation device includes a radiator substrate and a floating radiator. The heating element is disposed between the installation substrate and the radiator substrate. The floating radiator is disposed on the surface of the radiator substrate facing away from the installation substrate. The radiator substrate has a heat exchange window, and the floating radiator is connected to the heating element through the heat exchange window.

2. The heat dissipation system according to claim 1, wherein The heating element includes a printed circuit board, a package substrate, and a chip. The printed circuit board is disposed on the installation substrate; The package substrate is disposed on the surface of the printed circuit board facing away from the installation substrate. The chip is disposed on the surface of the package substrate facing away from the printed circuit board. The floating radiator is connected to the chip through the heat exchange window.

3. The heat dissipation system according to claim 2, wherein The heat dissipation system further includes a reinforcing ring. The reinforcing ring is disposed on the surface of the package substrate facing away from the printed circuit board. The chip is located in the inner region of the ring of the reinforcing ring. The reinforcing ring is located between the package substrate and the radiator substrate.

4. The heat dissipation system according to claim 2, wherein The heat dissipation system further includes a thermal interface connection structure corresponding to the chip. Each chip is connected to the floating radiator through the thermal interface connection structure.

5. The heat dissipation system according to claim 2, wherein The floating radiator has a plurality of floating heat conducting members. The number of the heat exchange windows and the chips are both plural; The heat exchange windows, the chips, and the floating heat conducting members correspond to each other. Each floating heat conducting member is connected to the corresponding chip through the corresponding heat exchange window.

6. The heat dissipation system according to claim 1, characterized in that The heat dissipation system further includes a plurality of connecting members. The plurality of connecting members are distributed along the circumference of the installation substrate. The installation substrate and the radiator substrate are connected through the plurality of connecting members.

7. The heat dissipation system according to claim 6, characterized in that, The installation substrate has a plurality of first mounting holes distributed along the circumference of the installation substrate. The radiator substrate has a plurality of second mounting holes distributed along the circumference of the radiator substrate. The first mounting holes and the second mounting holes correspond to each other. Each connecting member connects the corresponding first mounting hole and the second mounting hole.

8. The heat dissipation system according to any one of claims 1 to 7, characterized in that The floating radiator includes a radiator and a floating heat conducting member. The floating heat conducting member is connected to the heating element through the heat exchange window. The radiator is disposed on the side of the floating heat conducting member facing away from the heating element.

9. The heat dissipation system according to claim 8, wherein The radiator has a plurality of fins distributed along the direction away from the floating heat conducting member. The heat dissipation system further includes a plurality of groups of support structures. Each group of support structures is disposed on the floating heat conducting member. The plurality of groups of support structures are all connected to each fin.

10. The heat dissipation system according to claim 8, characterized in that, The radiator includes an integral fin, and the integral fin includes a folded fin or a shovel-shaped fin; or; The radiator includes a plurality of split fins, and the plurality of split fins are all disposed on the side of the floating heat conducting member facing away from the heating element.

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