PFC integrated module

Abstract

The utility model discloses a PFC (Power Factor Correction) integrated module, which belongs to the technical field of semiconductors and comprises a plastic package body and a DBC (Direct Bonding Copper) plate, the DBC plate comprises a ceramic plate, a conducting layer and a heat conducting layer, the conducting layer comprises a copper foil area, the DBC plate is respectively provided with a rectifier bridge unit, an IGBT (Insulated Gate Bipolar Translator) unit and an FRD (Fast Recovery Diode) unit through the copper foil area, and the rectifier bridge unit, the IGBT unit and the FRD unit are respectively connected with a rectifier bridge pin, an IGBT pin and an FRD pin. The IGBT unit and the FRD unit share a pin, the DBC board, the rectifier bridge unit, the IGBT unit and the FRD unit are wrapped in the plastic package body to form an integrated module, a heat conduction hole is formed in the back face of the plastic package body, the heat conduction layer is located in the heat conduction hole, and the heat conduction layer and the back face of the plastic package body are located on the same plane. According to the utility model, the integration level of the module is higher, the module is convenient to assemble, and the technical problems of large volume, high cost, low assembly efficiency and resource waste caused by respective packaging of each module in the prior art are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a PFC integrated module. Background Art

[0002] Existing air conditioners usually use a PFC circuit. The main components of the PFC circuit include key semiconductor devices such as an insulated gate bipolar transistor (IGBT), a fast recovery diode (FRD), and a rectifier bridge. However, the semiconductor devices such as IGBT, FRD, and rectifier bridge used in the existing PFC circuit are discrete devices, and these discrete devices are respectively packaged on a PCB board to form independent modules, such as the IGBT packaging structure disclosed in the patent document with the publication number CN222106688U, the fast recovery diode disclosed in the patent document with the publication number CN202405247U, and the semiconductor rectifier flat bridge disclosed in the patent document with the publication number CN212750862U. On the one hand, it not only results in poor integration of the PFC circuit, making it difficult to miniaturize the device, but also wastes resources such as heat sinks and PCB boards. On the other hand, during production and assembly, it is necessary to respectively form the pins of each independent module, and it also needs to be assembled onto the circuit board multiple times, resulting in high costs and low assembly efficiency.

[0003] Therefore, it is necessary to develop a PFC integrated module with high integration and easy assembly to solve the above technical problems. Summary of the Utility Model

[0004] In order to overcome the above problems existing in the prior art, the utility model provides a PFC integrated module. By integrating a rectifier bridge unit, an IGBT unit, and an FRD unit into one body, the integration degree of the module is higher and it is easy to assemble, solving the technical problems of large volume, high cost, low assembly efficiency, and waste of resources caused by the separate packaging of each semiconductor device in the prior art.

[0005] To achieve the above object, the technical solution adopted by the utility model is as follows:

[0006] A PFC integrated module includes a plastic package and a DBC board. The DBC board includes a ceramic board, with a conductive layer and a heat-conducting layer fixed on both sides of the ceramic board respectively. The conductive layer includes multiple copper foil areas. The DBC board is provided with a rectifier bridge unit, an IGBT unit and an FRD unit through the copper foil areas respectively. The rectifier bridge unit, the IGBT unit and the FRD unit are electrically connected to a rectifier bridge pin, an IGBT pin and an FRD pin through the copper foil areas respectively, and the IGBT unit and the FRD unit have a common pin. The plastic package fixes and wraps the DBC board, the rectifier bridge unit, the IGBT unit and the FRD unit inside to form an integrated module. The back of the plastic package is provided with heat-conducting holes, the heat-conducting layer is located in the heat-conducting holes, and the heat-conducting layer is in the same plane as the back of the plastic package.

[0007] The rectifier bridge unit includes a first rectifier chip, a second rectifier chip, a third rectifier chip and a fourth rectifier chip. The negative electrodes of the first rectifier chip, the second rectifier chip, the third rectifier chip and the fourth rectifier chip are all welded and fixed on the copper foil area. The positive electrode of the first rectifier chip is electrically connected to the positive electrode of the second rectifier chip through a connecting piece. The negative electrode of the first rectifier chip is electrically connected to the positive electrode of the third rectifier chip through a connecting piece. The negative electrode of the second rectifier chip is electrically connected to the positive electrode of the fourth rectifier chip through a connecting piece. The negative electrode of the third rectifier chip and the negative electrode of the fourth rectifier chip are electrically connected through the copper foil area. The rectifier bridge pins include a first AC input pin, a second AC input pin, a rectifier bridge positive output pin and a rectifier bridge negative output pin. The first AC input pin and the second AC input pin are electrically connected to the negative electrode of the first rectifier chip and the negative electrode of the second rectifier chip respectively. The rectifier bridge positive output pin and the rectifier bridge negative output pin are electrically connected to the negative electrode of the third rectifier chip and the positive electrode of the second rectifier chip respectively.

[0008] The IGBT unit includes an IGBT chip and a diode chip, the FRD unit includes an FRD chip, the IGBT pins include a C pole pin, an E pole pin and a control pole pin, the FRD pins include an FRD positive input pin and an FRD negative input pin, and the FRD positive input pin and the C pole pin are common pins. The negative electrode of the diode chip is welded and fixed on the copper foil area and is electrically connected to the C pole pin. The positive electrode of the diode chip is electrically connected to the E pole pin. The IGBT chip is electrically connected to the C pole pin, the E pole pin and the control pole pin respectively. The negative electrode of the FRD chip is welded and fixed on the copper foil area and is electrically connected to the FRD negative input pin. The positive electrode of the FRD chip is electrically connected to the FRD positive input pin through a connecting piece.

[0009] The first AC input pin, the second AC input pin, the rectifier bridge negative output pin, the E pole pin and the control pole pin are arranged on one side of the plastic package in sequence. The rectifier bridge positive output pin, the C pole pin and the FRD negative input pin are arranged on the other side of the plastic package in sequence.

[0010] The rectifier bridge unit is located on the left side of the conductive layer, and the IGBT unit and the FRD unit are respectively located at the upper and lower parts on the right side of the conductive layer.

[0011] The area of the ceramic plate is larger than the areas of the conductive layer and the heat-conducting layer, and the encapsulant body is provided with embedding holes for the four peripheral edges of the ceramic plate to be embedded and fixed.

[0012] The DBC board is located in the middle of the encapsulant body, and fastening holes are symmetrically formed on both sides of the encapsulant body.

[0013] The length of the encapsulant body is 24 - 28 mm, and the width is 17 - 21 mm.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. The PFC integrated module provided by the present utility model integrates the rectifier bridge unit, the IGBT unit and the FRD unit into one body, and the IGBT unit and the FRD unit are arranged with shared pins, so that the integration degree of the module is greatly improved. Compared with the prior art, the volume of the module and the number of pins are effectively reduced, which is more conducive to the assembly of the module, and has the advantages of improving the assembly efficiency, reducing the production cost, saving the radiator material, PCB board material and pin material, etc.

[0016] 2. The DBC board of the present utility model fixes the conductive layer and the heat-conducting layer on both sides of the ceramic plate respectively, which can form a stable connection structure between the ceramic plate and the conductive layer and the heat-conducting layer respectively. It is not only convenient to improve the physical structure performance of the module, but also can make the heat generated by each unit be uniformly dissipated through the ceramic plate and the heat-conducting layer in time, and can avoid the situation that the multi-layer heat-conducting structure increases the thermal resistance due to the existence of gaps at the contact surface caused by physical contact, so as to be conducive to improving the structural performance, product performance and heat dissipation performance of the module.

[0017] 3. The present utility model arranges the heat-conducting layer in the heat-conducting holes and makes the heat-conducting layer be in the same plane as the back surface of the encapsulant body. This structure can not only make the module directly contact with the radiator for rapid heat dissipation, but also make the DBC board be stably and reliably embedded and fixed in the encapsulant body, which is beneficial to improving the structural strength and stability reliability of the module.

[0018] 4. The present utility model arranges the rectifier bridge unit on the left side of the conductive layer, and arranges the IGBT unit and the FRD unit at the upper and lower parts on the right side of the conductive layer respectively, which has the advantages of maximizing the reduction of the module volume and improving the integration degree. Finally, the length of the PFC integrated module can be only 24 - 28 mm, and the width can be only 17 - 21 mm. Compared with the structure of discrete devices independently packaged, the volume of the PFC integrated module of the present utility model is greatly reduced, and the integration degree is higher.

[0019] 5. The present utility model realizes the embedded fixation of the four peripheral edges of the ceramic plate through the embedded holes, which has the advantage of further improving the stability and reliability of the DBC board in the plastic package.

[0020] 6. The present utility model is conducive to the rapid fixation of the module through the fastening holes symmetrically arranged on both sides of the plastic package. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front view plane structure schematic diagram of a PFC integrated module provided by the present utility model;

[0022] Figure 2 is Figure 1 left view sectional structure schematic diagram of;

[0023] Figure 3 is Figure 1 rear view plane structure schematic diagram of;

[0024] Figure 4 is Figure 1 three-dimensional structure schematic diagram (one) of;

[0025] Figure 5 is Figure 1 three-dimensional structure schematic diagram (two) of;

[0026] Figure 6 It is a front view plane structure schematic diagram of another PFC integrated module provided by the present utility model.

[0027] In the figure, the labels are: 1. Plastic package, 2. DBC board, 3. Ceramic plate, 4. Conductive layer, 5. Heat-conducting layer, 6. Rectifier bridge unit, 7. IGBT unit, 8. FRD unit, 9. Heat-conducting hole, 10. First rectifier chip, 11. Second rectifier chip, 12. Third rectifier chip, 13. Fourth rectifier chip, 14. First AC input pin, 15. Second AC input pin, 16. Rectifier bridge positive output pin, 17. Rectifier bridge negative output pin, 18. IGBT chip, 19. Diode chip, 20. FRD chip, 21. C-pole pin, 22. E-pole pin, 23. Control pole pin, 24. FRD positive input pin, 25. FRD negative input pin, 26. Fastening hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] Such as Figures 1-5As shown in the figure, the utility model provides a PFC integrated module, which is particularly applicable to air conditioners. The PFC integrated module includes a plastic package 1 and a DBC board 2. The DBC board 2 includes a ceramic board 3. Conductive layers 4 and heat-conducting layers 5 are respectively fixed on two sides of the ceramic board 3. The conductive layer 4 includes a plurality of copper foil areas, and the plurality of copper foil areas are arranged at intervals. The DBC board 2 is provided with a rectifier bridge unit 6, an IGBT unit 7 and an FRD unit 8 respectively through the copper foil areas. The rectifier bridge unit 6, the IGBT unit 7 and the FRD unit 8 are respectively electrically connected with a rectifier bridge pin, an IGBT pin and an FRD pin through the copper foil areas, and the IGBT unit 7 and the FRD unit 8 have a common pin. The plastic package 1 fixes and wraps the DBC board 2, the rectifier bridge unit 6, the IGBT unit 7 and the FRD unit 8 inside to form an integrated module. A heat-conducting hole 9 adapted to the heat-conducting layer 5 is provided on the back of the plastic package 1. The heat-conducting layer 5 is located in the heat-conducting hole 9, and the heat-conducting layer 5 and the back of the plastic package 1 are on the same plane.

[0029] In this embodiment, as Figure 1 shown, the rectifier bridge unit 6 is located on the left side of the conductive layer 4, and the IGBT unit 7 and the FRD unit 8 are respectively located in the upper and lower parts on the right side of the conductive layer 4. Through reasonable layout, the volume of the module can be smaller and the integration degree can be higher.

[0030] In this embodiment, as Figure 1 、 3 -5 shown, the DBC board 2 is located in the middle of the plastic package 1. Fastening holes 26 are symmetrically opened on both sides of the plastic package 1, which is convenient for the assembly and use of the module.

[0031] The PFC integrated module provided in this embodiment has the advantages of high integration degree, small module volume, convenient assembly, reduced production cost, saved radiator materials, PCB board materials and pin materials, etc. by fixing the rectifier bridge unit 6, the IGBT unit 7 and the FRD unit 8 on the same conductive layer 4. In actual application, after fixing the module to the radiator by directly welding the heat-conducting layer 5 to the radiator, the heat generated by the rectifier bridge unit 6, the IGBT unit 7 and the FRD unit 8 can be timely and uniformly dissipated through the ceramic board 3 and the heat-conducting layer 5, which is more beneficial to improving the heat dissipation performance of the module.

[0032] In a preferred specific embodiment, as Figures 1-5As shown in the figure, the rectifier bridge unit 6 includes a first rectifier chip 10, a second rectifier chip 11, a third rectifier chip 12, and a fourth rectifier chip 13. The negative electrodes of the first rectifier chip 10, the second rectifier chip 11, the third rectifier chip 12, and the fourth rectifier chip 13 are all welded and fixed on the copper foil area. The positive electrode of the first rectifier chip 10 is electrically connected to the positive electrode of the second rectifier chip 11 through a connecting piece. The negative electrode of the first rectifier chip 10 is electrically connected to the positive electrode of the third rectifier chip 12 through a connecting piece. The negative electrode of the second rectifier chip 11 is electrically connected to the positive electrode of the fourth rectifier chip 13 through a connecting piece. The negative electrodes of the third rectifier chip 12 and the fourth rectifier chip 13 are electrically connected through the copper foil area. Correspondingly, the rectifier bridge pins include a first AC input pin 14, a second AC input pin 15, a rectifier bridge positive output pin 16, and a rectifier bridge negative output pin 17. The first AC input pin 14 and the second AC input pin 15 are respectively electrically connected to the negative electrode of the first rectifier chip 10 and the negative electrode of the second rectifier chip 11. The rectifier bridge positive output pin 16 and the rectifier bridge negative output pin 17 are respectively electrically connected to the negative electrode of the third rectifier chip 12 and the positive electrode of the second rectifier chip 11.

[0033] In this embodiment, as Figures 1-5 shown, the IGBT unit 7 includes an IGBT chip 18 and a diode chip 19. The FRD unit 8 includes an FRD chip 20. The IGBT pins include a C pole pin 21, an E pole pin 22, and a control pole pin 23. The FRD pins include an FRD positive input pin 24 and an FRD negative input pin 25. The FRD positive input pin 24 and the C pole pin 21 are common pins. The negative electrode of the diode chip 19 is welded and fixed on the copper foil area and is electrically connected to the C pole pin 21. The positive electrode of the diode chip 19 is electrically connected to the E pole pin 22. The IGBT chip 18 is respectively electrically connected to the C pole pin 21, the E pole pin 22, and the control pole pin 23. The negative electrode of the FRD chip 20 is welded and fixed on the copper foil area and is electrically connected to the FRD negative input pin 25. The positive electrode of the FRD chip 20 is electrically connected to the FRD positive input pin 24 through a connecting piece.

[0034] In this embodiment, the first AC input pin 14, the second AC input pin 15, the rectifier bridge negative output pin 17, the E pole pin 22, and the control pole pin 23 are sequentially arranged on one side of the plastic package 1. The rectifier bridge positive output pin 16, the C pole pin 21, and the FRD negative input pin 25 are sequentially arranged on the other side of the plastic package 1.

[0035] In this embodiment, the rectifier bridge unit 6 converts the alternating current input from the mains into direct current. The specific process is as follows: The alternating current enters the rectifier bridge through the first AC input pin 14 and the second AC input pin 15. By utilizing the unidirectional conductivity of the first rectifier chip 10, the second rectifier chip 11, the third rectifier chip 12, and the fourth rectifier chip 13, the alternating current is converted into direct current, and the current is output through the positive output pin 16 of the rectifier bridge, and a loop is formed through the negative output pin 17 of the rectifier bridge.

[0036] In this embodiment, in combination with the existing conventional PFC circuit, the working principles of the IGBT unit 7 and the FRD unit 8 are as follows: When a positive voltage signal is applied to the control pin 23 of the IGBT unit 7, it conducts. The input power supply charges the energy storage inductor in the circuit through the rectifier bridge unit 6, and then forms a loop through the C pin 21 and the E pin 22 of the IGBT unit 7, and the inductor stores energy. At this time, the FRD chip 20 is cut off due to reverse bias. After the signal of the control pin 23 of the IGBT unit 7 is withdrawn, it turns off. The current in the inductor in the circuit cannot change suddenly, generating a reverse electromotive force, causing the FRD chip 20 to conduct forward. The energy stored in the inductor flows to the load through the FRD chip 20 to maintain the stability of the output voltage. In addition, the FRD unit 8 also has the function of suppressing voltage spikes and protecting the module.

[0037] In an alternative embodiment, as Figure 6 shown, the IGBT unit 7 includes two IGBT chips 18 and one diode chip 19, and the FRD unit 8 includes two FRD chips 20. Among them, after the two IGBT chips 18 are welded on the copper foil area, the two IGBT chips 18 are electrically connected through a connecting piece, and both of the two IGBT chips 18 are electrically connected to the C pin 21, the E pin 22, and the control pin 23. The negative electrodes of the two FRD chips 20 are both welded and fixed on the copper foil area, the positive electrodes of the two FRD chips 20 are electrically connected through a connecting piece, the negative electrodes of the two FRD chips 20 are both electrically connected to the FRD negative input pin 25, and the positive electrodes of the two FRD chips 20 are both electrically connected to the FRD positive input pin 24 through a connecting piece.

[0038] In this embodiment, the IGBT unit 7 uses two IGBT chips 18 and the FRD unit 8 uses two FRD chips 20. The purpose is to increase the current-carrying capacity, and their working logics are the same as those of a single IGBT chip 18 and a single FRD chip 20 respectively, and will not be elaborated here.

[0039] In a preferred specific embodiment, as Figure 1 、 2As shown, the area of the ceramic plate 3 is larger than the areas of the conductive layer 4 and the heat-conductive layer 5. An embedding hole adapted to the four peripheral edges of the ceramic plate 3 is provided in the plastic package 1. This embedding hole serves to embed and fix the four peripheral edges of the ceramic plate 3. The ceramic plate 3 is embedded and fixed in the embedding hole through its four peripheral edges, which has the advantage of improving the stability and reliability of the DBC board 2 within the plastic package 1. In the present utility model, the length of the plastic package 1 after module packaging is only 24 - 28 mm, and the width is only 17 - 21 mm. Specifically, Figure 1 After module packaging as shown, the length of the plastic package 1 is only 24.15 mm, and the width is only 17.8 mm. Figure 6 After module packaging as shown, the length of the plastic package 1 is only 27.5 mm, and the width is only 21 mm.

[0040] In the prior art, the length and width of the plastic package 1 after packaging a single rectifier bridge unit 6 are 30×20 mm, the length and width of the plastic package 1 after packaging a single IGBT unit 7 are 20×16 mm, and the length and width of the plastic package 1 after packaging a single FRD unit 8 are 15×10 mm. By comparison, relative to the prior art split packaging modules, the PFC integrated module provided by the present utility model significantly reduces the volume of the module, which is more conducive to improving the assembly efficiency, simplifying the assembly process, reducing the assembly cost, saving assembly resources, etc.

[0041] In addition, temperature tests conducted under the same operating conditions show that the operating temperature of the PFC integrated module provided by the present utility model is basically the same as that of the existing single independent module. This benefits from the good heat dissipation ability of the DBC board 2. Therefore, the present utility model also has the advantage of good heat dissipation effect after integration.

[0042] In addition, based on the structure of adopting the DBC board 2 and embedding and fixing the DBC board 2 in the embedding hole of the plastic package 1, the applicant also conducted a drop test on the PFC integrated module. The test process is as follows: 50 PFC integrated modules were selected and freely dropped 10 times from a height of 1.5 meters. After testing, there were no cracks or missing corners on the outer surface of the plastic package of all PFC integrated modules, and the electrical parameters did not change. This proves that the PFC integrated module provided by the present utility model also has higher mechanical strength and better stability and reliability.

[0043] The above is only the specific implementation manner of the present utility model. Any feature disclosed in this specification, unless specifically described, can be replaced by other equivalent or similar-purpose alternative features; all the features disclosed, or all the steps in any method or process, except for mutually exclusive features and / or steps, can be combined in any way.

Claims

1. A PFC integrated module, comprising a plastic package (1) and a DBC board (2), the DBC board (2) comprising a ceramic board (3), with a conductive layer (4) and a heat-conducting layer (5) respectively fixed on two sides of the ceramic board (3), characterized in that: The conductive layer (4) includes a plurality of copper foil regions. The DBC board (2) is provided with a rectifier bridge unit (6), an IGBT unit (7), and an FRD unit (8) through the copper foil regions respectively. The rectifier bridge unit (6), the IGBT unit (7), and the FRD unit (8) are electrically connected to a rectifier bridge pin, an IGBT pin, and an FRD pin through the copper foil regions respectively. And the IGBT unit (7) and the FRD unit (8) have a common pin. The plastic package (1) fixes and wraps the DBC board (2), the rectifier bridge unit (6), the IGBT unit (7), and the FRD unit (8) inside and forms an integrated module. The back surface of the plastic package (1) is provided with heat conduction holes (9). The heat conduction layer (5) is located in the heat conduction holes (9), and the heat conduction layer (5) is in the same plane as the back surface of the plastic package (1).

2. The PFC integrated module according to claim 1, wherein: The rectifier bridge unit (6) includes a first rectifier chip (10), a second rectifier chip (11), a third rectifier chip (12), and a fourth rectifier chip (13). The negative electrodes of the first rectifier chip (10), the second rectifier chip (11), the third rectifier chip (12), and the fourth rectifier chip (13) are all welded and fixed on the copper foil region. The positive electrode of the first rectifier chip (10) is electrically connected to the positive electrode of the second rectifier chip (11) through a connecting piece. The negative electrode of the first rectifier chip (10) is electrically connected to the positive electrode of the third rectifier chip (12) through a connecting piece. The negative electrode of the second rectifier chip (11) is electrically connected to the positive electrode of the fourth rectifier chip (13) through a connecting piece. The negative electrode of the third rectifier chip (12) and the negative electrode of the fourth rectifier chip (13) are electrically connected through the copper foil region. The rectifier bridge pins include a first AC input pin (14), a second AC input pin (15), a rectifier bridge positive output pin (16), and a rectifier bridge negative output pin (17). The first AC input pin (14) and the second AC input pin (15) are respectively electrically connected to the negative electrode of the first rectifier chip (10) and the negative electrode of the second rectifier chip (11). The rectifier bridge positive output pin (16) and the rectifier bridge negative output pin (17) are respectively electrically connected to the negative electrode of the third rectifier chip (12) and the positive electrode of the second rectifier chip (11).

3. The PFC integrated module according to claim 2, wherein: The IGBT unit (7) includes an IGBT chip (18) and a diode chip (19), the FRD unit (8) includes an FRD chip (20), the IGBT pins include a C-pin (21), an E-pin (22) and a control pin (23), the FRD pins include an FRD positive input pin (24) and an FRD negative input pin (25), and the FRD positive input pin (24) and the C-pin (21) are common pins; the negative electrode of the diode chip (19) is welded and fixed on the copper foil area and electrically connected to the C-pin (21), the positive electrode of the diode chip (19) is electrically connected to the E-pin (22), and the IGBT chip (18) is electrically connected to the C-pin (21), the E-pin (22) and the control pin (23) respectively; the negative electrode of the FRD chip (20) is welded and fixed on the copper foil area and electrically connected to the FRD negative input pin (25), and the positive electrode of the FRD chip (20) is electrically connected to the FRD positive input pin (24) through a connecting piece.

4. A PFC integrated module according to claim 3, wherein: The first AC input pin (14), the second AC input pin (15), the rectifier bridge negative output pin (17), the E-pin (22) and the control pin (23) are sequentially arranged on one side of the plastic package (1), and the rectifier bridge positive output pin (16), the C-pin (21) and the FRD negative input pin (25) are sequentially arranged on the other side of the plastic package (1).

5. A PFC integrated module according to claim 1, characterized in that: The rectifier bridge unit (6) is located on the left side of the conductive layer (4), and the IGBT unit (7) and the FRD unit (8) are respectively located in the upper and lower parts on the right side of the conductive layer (4).

6. The PFC integrated module according to claim 1, characterized in that: The area of the ceramic plate (3) is larger than the areas of the conductive layer (4) and the heat-conducting layer (5), and the plastic package (1) is provided with embedding holes for the four peripheral edges of the ceramic plate (3) to be embedded and fixed.

7. A PFC integrated module according to claim 1, characterized in that: The DBC board (2) is located in the middle of the plastic package (1), and fastening holes (26) are symmetrically arranged on both sides of the plastic package (1).

8. A PFC integrated module according to claim 1, characterized in that: The length of the plastic package (1) is 24 - 28 mm, and the width is 17 - 21 mm.

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