Optical module packaging structure

Through the soft and hard combination of plate structure and tungsten and copper upper cover design, the problem of insufficient strength and flexibility of PCB board in traditional optical modules is solved, the reliability and heat dissipation of optical modules are improved, and the electrical connection performance is ensured.

CN223182465UActive Publication Date: 2025-08-01武汉钧恒科技有限公司
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Patent Information

Application Number
CN202422393750.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-08-01
Estimated Expiration
2034-09-30

AI Technical Summary

Technical Problem

The PCB board in traditional optical modules has poor strength and flexibility, resulting in poor impact vibration reliability and temperature impact reliability, affecting optical power and heat dissipation.

Method used

Using a soft and hard-to-bond plate structure, the first PCB board is bonded to the tungsten copper upper cover and locked on the partition of the half-assembly by screws. The bottom cover is equipped with an electrical connector, and is fixed with a tungsten copper upper cover and screws to achieve high strength and high heat dissipation.

Benefits of technology

It improves the impact vibration and temperature impact reliability of the optical module, ensures electrical connection performance and heat dissipation effect, and enhances the overall reliability of the optical module.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an optical module packaging structure, which comprises a rigid-flex board, a semi-assembly, an upper cover and a bottom cover, the upper cover and the bottom cover are covered on two opening ends of the semi-assembly, the upper cover is made of tungsten copper, a first PCB (printed circuit board) in the rigid-flex board is adhered on a surface of the upper cover facing the semi-assembly, a through hole is arranged on the first PCB at a corresponding position, and the through hole is communicated with the semi-assembly. Bosses for arranging optical devices and / or chips are arranged at the positions, corresponding to the through holes, of the face, facing the half assembly, of the upper cover, a second PCB in the rigid-flex board is arranged on a partition plate in the half assembly and locked on the partition plate through screws for fixing the bottom cover and the half assembly, and the face, facing the first PCB, of the second PCB is a TOP face. An electric connector electrically connected with the second PCB is embedded in the bottom cover. The electric connector has the advantages that high strength, high reliability and high heat dissipation performance are achieved through the upper cover made of tungsten copper materials, the second PCB is locked through the screws, and the high electric connection performance of the electric connector can be effectively guaranteed.
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Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, in particular to an optical module packaging structure. Background Art

[0002] Traditional optical modules use a single PCB board and a COB (Chip on Board) solution, with the chip placed on the PCB. Since the PCB material is a resin laminate, its strength and flexibility are poor. When subjected to shock and vibration, the chip on the PCB will creep, affecting shock and vibration reliability and optical power. In addition, the thermal expansion coefficient of the PCB material differs significantly from that of the chip, resulting in poor heat dissipation in the thickness direction of the PCB. When the temperature changes from high temperature (85°C) to low temperature (-45°C) or from low temperature (-45°C) to high temperature (85°C), the temperature accumulates in the chip and cannot dissipate, affecting temperature shock reliability and posing a serious risk. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide an optical module packaging structure to overcome the deficiencies in the above-mentioned prior art.

[0004] The utility model provides a technical solution for solving the above-mentioned technical problems as follows: an optical module packaging structure, comprising: a flexible and rigid combination board, a semi-assembly, and an upper cover and a bottom cover covering the two open ends of the semi-assembly, the upper cover being made of tungsten copper, the first PCB board in the flexible and rigid combination board being bonded to the surface of the upper cover facing the semi-assembly, through holes being provided at corresponding positions on the first PCB board, the surface of the upper cover facing the semi-assembly having a boss corresponding to each through hole for arranging optical devices and / or chips, the second PCB board in the flexible and rigid combination board being arranged on a partition in the semi-assembly, and being locked on the partition by screws for fixing the bottom cover to the semi-assembly, the surface of the second PCB board facing the first PCB board being the TOP surface, and an electrical connector electrically connected to the second PCB board being embedded on the bottom cover.

[0005] On the basis of the above technical solution, the present invention can also be improved as follows.

[0006] Furthermore, a plurality of limiting posts are provided on the surface of the upper cover facing the semi-assembly, and limiting holes are provided on the first PCB board at positions corresponding to the limiting posts, and the limiting posts extend into the limiting holes.

[0007] Furthermore, a protective cover for covering the optical device and the chip is provided on the surface of the first PCB board facing the second PCB board, and a gap for the optical fiber to pass through is provided on the side of the protective cover facing the fiber outlet.

[0008] Furthermore, a fiber outlet is provided at the junction between the upper cover and the half assembly, wherein a BOOT is built in the fiber outlet, and the optical fiber in the optical device on the first PCB board extends to the outside of the half assembly through the BOOT.

[0009] Further, glue is injected into the BOOT to fix the optical fiber.

[0010] Further, the fiber outlet includes: a first fiber outlet cover on the side of the upper cover and a second fiber outlet cover on the side of the semi-component. Both the first fiber outlet cover and the second fiber outlet cover have through grooves. The BOOT is located in the through grooves on the first fiber outlet cover and the second fiber outlet cover. A positioning hole communicating with the through groove is opened on the surface of the first fiber outlet cover facing away from the second fiber outlet cover. The positioning protrusion on the BOOT is located in the positioning hole. A first glue injection hole communicating with the through groove is opened on the surface of the second fiber outlet cover facing away from the first fiber outlet cover. A second glue injection hole communicating with its inner cavity is opened on the BOOT at the position corresponding to the first glue injection hole.

[0011] Further, a tail sleeve is sleeved on the fiber outlet and the optical fiber together.

[0012] Further, a plurality of pins are fixed on the surface of the partition plate facing away from the upper cover, and the pins sequentially penetrate through the bottom cover and the electrical connector.

[0013] Further, the upper cover is fixed to the semi-component by multiple screws.

[0014] The beneficial effects of the present utility model are as follows: A rigid-flex board is adopted, and the first PCB board in the rigid-flex board is bonded to the surface of the upper cover facing the semi-component. Through holes are opened at corresponding positions on the first PCB board. On the surface of the upper cover facing the semi-component, there are bosses for arranging optical devices and / or chips at positions corresponding to each through hole, which can effectively dissipate heat from the chips. The second PCB board in the rigid-flex board is arranged on the partition plate in the semi-component and is locked on the partition plate by screws for fixing the bottom cover and the semi-component. An electrical connector electrically connected to the second PCB board is embedded in the bottom cover. The upper cover made of tungsten copper material realizes high strength, high reliability, and high heat dissipation. By locking the second PCB board with screws, the high electrical connection performance of the electrical connector can be effectively ensured. Description of the Drawings

[0015] Figure 1 is an exploded view of the optical module packaging structure in the present utility model;

[0016] Figure 2 is a stepped sectional view of the optical module packaging structure in the present utility model;

[0017] Figure 3 is a plan view of the cooperation between the rigid-flex board and the upper cover in the present utility model;

[0018] Figure 4 is a three-dimensional view of the cooperation among the rigid-flex board, the upper cover, and the protective cover in the present utility model;

[0019] Figure 5 is a structural diagram of the upper cover in the present utility model;

[0020] Figure 6 This is a front view of a half assembly of the present invention;

[0021] Figure 7 This is a reverse view of a half assembly in the present invention;

[0022] Figure 8 It is the front view of BOOT in this utility model;

[0023] Figure 9 This is the reverse side view of the BOOT in the present utility model;

[0024] Figure 10 This is a structural diagram of the protective cover in the utility model;

[0025] Figure 11 It is a front view of part of the structure of the utility model;

[0026] Figure 12 It is the reverse side view of part of the structure of the utility model.

[0027] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0028] 1. Rigid-flex board, 110. First PCB board, 111. Through hole, 112. Optical device, 113. Limiting hole, 114. Chip, 115. Optical fiber, 120. Second PCB board, 130. FPC board, 2. Half assembly, 210. Partition, 211. Pin, 220. Second fiber outlet cover, 221. First glue hole, 3. Upper cover, 310. Boss, 320. Limiting column, 330. First fiber outlet cover, 331. Positioning hole, 4. Bottom cover, 5. Screw, 6. Electrical connector, 7. Protective cover, 710. Notch, 8. Boot, 810. Positioning protrusion, 820. Second glue hole, 9. Tail sleeve, 10. Screw. DETAILED DESCRIPTION

[0029] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0030] Example 1

[0031] like Figures 1 to 5 As shown, an optical module packaging structure includes: a rigid-flex board 1, a half assembly 2, an upper cover 3, and a bottom cover 4. The upper cover 3 is made of tungsten copper. A transversely distributed partition 210 is provided in the inner cavity of the half assembly 2. The half assembly 2 has upper and lower ports. The upper cover 3 and the bottom cover 4 respectively cover the two open ends of the half assembly 2.

[0032] The rigid-flex board 1 includes: a first PCB board 110, a second PCB board 120, and an FPC board 130. The first PCB board 110 and the second PCB board 120 are rigid boards, and the FPC board 130 is a flexible board. Both ends of the FPC board 130 are electrically connected to the first PCB board 110 and the second PCB board 120 respectively. The first PCB board 110 in the rigid-flex board 1 is bonded to the surface of the upper cover 3 facing the half-assembly 2. Through holes 111 are opened at corresponding positions on the first PCB board 110. On the surface of the upper cover 3 facing the half-assembly 2, there are bosses 310 for arranging optical devices 112 and / or chips 114 at positions corresponding to each through hole 111. Since the bosses 310 are part of the upper cover 3, the material of the upper cover 3 is also tungsten copper. The second PCB board 120 in the rigid-flex board 1 is arranged on the partition 210 inside the half-assembly 2 and is locked to the partition 210 by screws 5 for fixing the bottom cover 4 and the half-assembly 2 together, that is, the half-assembly 2, the bottom cover 4, and the half-assembly 2 are jointly locked by screws 5. The surface of the second PCB board 120 facing the first PCB board 110 is the TOP surface, and an electrical connector 6 electrically connected to the second PCB board 120 is embedded in the bottom cover 4.

[0033] Embodiment 2

[0034] As Figure 3 、 Figure 5 shown, this embodiment is a further improvement based on Embodiment 1, specifically as follows:

[0035] There are a plurality of limit posts 320 on the surface of the upper cover 3 facing the half-assembly 2. Limit holes 113 are provided on the first PCB board 110 at positions corresponding to the limit posts 320. The limit posts 320 extend into the limit holes 113, effectively ensuring the accuracy of the installation position of the first PCB board 110.

[0036] Embodiment 3

[0037] As Figure 1 、 Figure 4 、 Figure 10 shown, this embodiment is a further improvement based on Embodiment 1 or 2, specifically as follows:

[0038] A protective cover 7 covering the optical device 112 and the chip 114 is provided on the surface of the first PCB board 110 facing the second PCB board 120. A notch 710 for the optical fiber 115 to pass through is opened on the side of the protective cover 7 facing the fiber outlet. The protective cover 7 can prevent damage to the optical device 112 and the chip 114.

[0039] Embodiment 4

[0040] As Figure 1 、 Figure 2 、 Figure 5 、 Figure 6 、Figure 7 , Figure 8 , Figure 9 , Figure 11 , Figure 12 As shown in Figure 12 , this embodiment is a further improvement based on any one of Embodiments 1 to 3, and the specific details are as follows:

[0041] There is an optical fiber outlet at the junction between the upper cover 3 and the half-component 2. A BOOT 8 is built in the optical fiber outlet. The optical fiber 115 in the optical device 112 on the first PCB board 110 extends out of the half-component 2 through the BOOT 8. The BOOT is equivalent to putting a boot on the optical fiber 115, and at the same time it means guiding the optical fiber 115 to go in this direction. Glue is injected into the BOOT 8 to fix the optical fiber 115. Fixing the optical fiber 115 with glue ensures that the internal optical path is not affected when the pigtail is pulled or bent.

[0042] Furthermore, the optical fiber outlet includes: a first optical fiber outlet cover 330 on the side of the upper cover 3 and a second optical fiber outlet cover 220 on the side of the half-component 2. The first optical fiber outlet cover 330 has a through groove, and the second optical fiber outlet cover 220 has a through groove. When the upper cover 3 covers the half-component 2, the first optical fiber outlet cover 330 and the second optical fiber outlet cover 220 are combined to form the optical fiber outlet. The through groove on the first optical fiber outlet cover 330 and the through groove on the second optical fiber outlet cover 220 form an inner cavity through which the optical fiber 115 can pass, and the BOOT 8 is located in the through groove on the first optical fiber outlet cover 330 and the through groove on the second optical fiber outlet cover 220; a positioning hole 331 communicating with the through groove thereon is opened on the surface of the first optical fiber outlet cover 330 facing away from the second optical fiber outlet cover 220, and the positioning protrusion 810 on the BOOT 8 is located in the positioning hole 331; a first glue injection hole 221 communicating with the through groove thereon is opened on the surface of the second optical fiber outlet cover 220 facing away from the first optical fiber outlet cover 330, and a second glue injection hole 820 communicating with its inner cavity is opened on the BOOT 8 at a position corresponding to the first glue injection hole 221. Glue can be conveniently injected into the BOOT 8 through the second glue injection hole 820 and the first glue injection hole 221 to fix the optical fiber 115.

[0043] In addition, a tail sleeve 9 is sleeved on the optical fiber outlet and the optical fiber 115 together.

[0044] Embodiment 5

[0045] As Figure 7 shown, this embodiment is a further improvement based on any one of Embodiments 1 to 4, and the specific details are as follows:

[0046] A plurality of pins 211 are fixed on the surface of the semi-component 2 facing away from the upper cover 3. The pins 211 sequentially penetrate through the bottom cover 4 and the electrical connector 6. The upper cover 3 is fixed to the semi-component 2 by a plurality of screws 10. For example, one screw 10 is arranged at each corner of the upper cover 3. Then, the upper cover 3 is fixed to the semi-component 2 by four screws 10.

[0047] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. An optical module packaging structure, characterized in that, Including: A rigid-flex board (1), a semi-component (2), an upper cover (3) and a bottom cover (4) covering the two open ends of the semi-component (2). The material of the upper cover (3) is tungsten copper. The first PCB board (110) in the rigid-flex board (1) is bonded to the surface of the upper cover (3) facing the semi-component (2). Through holes (111) are formed at corresponding positions on the first PCB board (110). On the surface of the upper cover (3) facing the semi-component (2), bosses (310) for arranging optical devices (112) and / or chips (114) are provided at positions corresponding to each through hole (111). The second PCB board (120) in the rigid-flex board (1) is arranged on a partition (210) inside the semi-component (2) and is locked on the partition (210) by screws (5) for fixing the bottom cover (4) to the semi-component (2). The surface of the second PCB board (120) facing the first PCB board (110) is the TOP surface. An electrical connector (6) electrically connected to the second PCB board (120) is embedded in the bottom cover (4).

2. The optical module packaging structure according to claim 1, characterized in that A plurality of limit posts (320) are provided on the surface of the upper cover (3) facing the semi-component (2). Limit holes (113) are provided on the first PCB board (110) at positions corresponding to the limit posts (320), and the limit posts (320) extend into the limit holes (113).

3. The optical module packaging structure according to claim 1, characterized in that, A protective cover (7) covering the optical device (112) and the chip (114) is provided on the surface of the first PCB board (110) facing the second PCB board (120). A notch (710) for the optical fiber (115) to pass through is formed on the side surface of the protective cover (7) facing the fiber outlet.

4. A light module packaging structure according to claim 1, characterized in that, There is a fiber outlet at the junction between the upper cover (3) and the semi-component (2). A BOOT (8) is built in the fiber outlet. The optical fiber (115) in the optical device (112) on the first PCB board (110) extends out of the semi-component (2) through the BOOT (8).

5. A light module packaging structure according to claim 4, wherein Glue is injected into the BOOT (8) to fix the optical fiber (115).

6. The optical module packaging structure according to claim 5, wherein, The fiber outlet includes: a first fiber outlet cover (330) on the side surface of the upper cover (3) and a second fiber outlet cover (220) on the side surface of the semi-component (2). Through grooves are provided on both the first fiber outlet cover (330) and the second fiber outlet cover (220). The BOOT (8) is located in the through grooves on the first fiber outlet cover (330) and the second fiber outlet cover (220). A positioning hole (331) communicating with the through groove is formed on the surface of the first fiber outlet cover (330) facing away from the second fiber outlet cover (220), and a positioning protrusion (810) on the BOOT (8) is located in the positioning hole (331). A first glue injection hole (221) communicating with the through groove is formed on the surface of the second fiber outlet cover (220) facing away from the first fiber outlet cover (330), and a second glue injection hole (820) communicating with its inner cavity is formed on the BOOT (8) at a position corresponding to the first glue injection hole (221).

7. A light module packaging structure according to claim 4, wherein A tail sleeve (9) is sleeved on the fiber outlet and the optical fiber (115) together.

8. A light module packaging structure according to claim 1, wherein A plurality of pins (211) are fixed on the surface of the partition plate (210) facing away from the upper cover (3), and the pins (211) sequentially penetrate through the bottom cover (4) and the electrical connector (6).

9. A light module packaging structure according to claim 1, characterized in that, The upper cover (3) is fixed to the semi-assembly (2) by a plurality of screws (10).